○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
. 1/26
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
04. Dec. 2015 Rev.004
TSZ22111・14・001
www.rohm.co
m
Advanced 12 Channel
Constant Current LED Driver IC
BD18378EFV-M
General Description
The BD18378EFV-M is a serial input controlled constant
current LED driver with 8 V output rating. 6 bit current
calibration is available for each output while a selected
PWM input performs dimming on the corresponding
output. The BD18378EFV-M is able to perform diagnostic
(open / short / temperature) checks to detect LED failure
and over temperature on chip. Fault detection is
performed also during LED deactivated state. The
settings of all internal registers can be read out to verify
written information at any time.
Features
AEC-Q100 Qualified (Note1)
Current capability: 50mA per output channel.
4-line SPI Control.
External resistor current setting.
Limp Home capability.
PWM dimming 0.2-99.2% at 200Hz
Diagnostic of all PWM inputs.
Programmable output mapping to each PWM input.
6 Bit LED brightness adjustment on each channel.
Diagnostic output on LED OPEN and SHORT for
each channel during PWM on & off time.
True LED voltage measurement.
Over Temperature Protection and Thermal
Feedback.
Open Drain Fault indicator.
Read-back of all register settings.
Outputs can be connected in parallel to achieve
more than 50mA into the load.
Slew Rate limited switching reduces
radiated Noise (EMI).
Daisy chain compatible.
(Note1: Operating Temperature Grade 2)
Key Specifications
Input voltage range: 3V to 5.5V
Output voltage range: 0.5V to 8V
Output Current range: 10mA to 50mA
Output Current accuracy 3.5%
Maximum clock frequency: 1.25MHz
Operating current: 4mA (Typ.)
Operating temperature range: - 40°C to +105°C
Package L(Typ.) x W(Typ.) x H(Max.)
HTSSOP-B28 9.70mm x 6.40mm x 1.00mm
Applications
Automotive illumination & ambient light
Consumer electronics illumination
Typical Application Circuit Diagram
Figure 1. Typical application diagram
to Controller
BD18378EFV-M
Heat Sink
AGND IREF
ERR
VCC
PGND
VLED
8V max
5.5V max
VCC CIN
REXT
CLED
PWM
0 1 2 3 4 5 SDI CLK SDO LATCH
CHANNEL
0 1 2 3 4 10
56 7 8 9 11 SENSE
RP
LEDs
Quiet
ground line
Noisy
ground line
to Controller
2/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Pin Configuration
Figure 2. Pin Configuration
Pin Description
Pin
No.
Symbol
Function
Pin
No.
Symbol
Function
1
AGND
Analog ground terminal
28
PGND
Power ground terminal
2
IREF
Current setting terminal
27
VCC
Power supply terminal
3
ERR
Open drain fault indicator
26
SDO
Serial data output terminal
4
PWM0
PWM 0 input terminal
25
PWM5
PWM 5 input terminal
5
CH0
Output channel 0
24
CH11
Output channel 11
6
CH1
Output channel 1
23
CH10
Output channel 10
7
CH2
Output channel 2
22
CH9
Output channel 9
8
CH3
Output channel 3
21
CH8
Output channel 8
9
CH4
Output channel 4
20
CH7
Output channel 7
10
CH5
Output channel 5
19
CH6
Output channel 6
11
PWM1
PWM 1 input terminal
18
SENSE
LED supply sensing terminal
12
PWM2
PWM 2 input terminal
17
PWM4
PWM 4 input terminal
13
SDI
Serial data input terminal
16
PWM3
PWM 3 input terminal
14
CLK
Serial communication clock
15
LATCH
Latch signal input terminal
HTSSOP-B28
(TOP VIEW)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Heat Sink
Bottom
Side
AGND
IREF
ERR
PWM0
CH0
CH1
CH2
CH3
CH4
CH5
PWM1
PWM2
SDI
CLK
PGND
VCC
SDO
PWM5
CH11
CH10
CH9
CH8
CH7
CH6
SENSE
PWM4
PWM3
LATCH
3/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Absolute Maximum Ratings
Item
Symbol
Absolute Maximum value
Unit
Power Supply Voltage(Pin No: 27)
VCC
7
V
Output Voltage (Pin No: 5 to 9, 19 to 24)
VDmax
10
V
Input Voltage (Pin No: 4,11 to 17, 25)
VIN
-0.3 to VCC
V
Open Drain Fault Indicator(Pin No: 3)
VERR
7
V
Operating Temperature Range
TOPR
-40 to +105
°C
Storage Temperature Range
TSTG
-55 to +150
°C
Junction Temperature
TJmax
150
°C
LED Voltage(Pin No: 18)
VSENSE
10
V
Electrostatic-Discharge Capability Human
Body Model
ESD HBM
2000
V
Electrostatic-Discharge Capability
Machine Model
ESD MM
200
V
PWM duty cycle
PWM
100
%
Recommended Operating Ratings
*1 Check Power de-rating curves of the package before applying maximum values.
*2 99.2% max and 0.2% min duty cycle at a 200Hz PWM frequency is recommended in order to have complete diagnostic capability;
please note that the PWM signal is active LOW.
*3 Please make sure the VSENSE voltage is always connected to the LEDs supply voltage - at a higher potential than VD. (see also the I/O
equivalent circuits)
Thermal Information*4
Item
Symbol
Value
Unit
Junction to Ambient Thermal Resistance
(1 layer Board)
ƟJA
107
°C/W
Junction to TOP Thermal characterization
Parameter (1 layer Board)
ΨJT
6
°C/W
Junction to Ambient Thermal Resistance
(4 layer Board)
ƟJA
26
°C/W
Junction to TOP Thermal characterization
Parameter (4 layer Board)
ΨJT
3
°C/W
Junction to Case Thermal Resistance
ƟJC-TOP
13
°C/W
Junction to Case Thermal Resistance
ƟJC-BOT
4
°C/W
*4 Measured as per JEDEC Standard
Board as per JESD51-3/-5/-7
Environment as per JESD51-2A
The above mentioned data is measurement data to be used only as reference not guaranteed values.
Item
Symbol
Standard Value
Unit
Min
Typ
Max
Power Supply Voltage
VCC
3.0
-
5.5
V
Drive Current at full brightness*1
ID
10
30
50
mA
Output Voltage*1
VD
-
-
8
V
LED Voltage*1*3
VSENSE
-
-
8
V
Open Drain Fault Indicator
VERR
-
-
5.5
V
PWM duty cycle*2
PWM
0.2
-
99.2
%
4/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Block Diagram
Figure 3. Block diagram
Description of Blocks Functionality
Constant current driver
The chip uses a constant current output driver with a provision for individual calibration per channel.
The constant current ID is derived from referring an internal reference voltage over the external resistor REXT.
The resistor is chosen to set the reference current IREF.
The global reference current, IREF, is mirrored into the channel current to generate a local reference.
The output device is scaled to give 6 bit output range.
where VREF is the reference voltage measured at the IREF pin.
Output currents are timed by the assigned PWM input.
The drivers have a low leakage current to keep the LED in firm OFF condition when the channel is inactive.
Full Scale current setting example table:
REXT
IDmax
12kΩ
50mA
20kΩ
30mA
30kΩ
20mA
60kΩ
10mA
Active pull up circuit
A pull up current can be activated to avoid LED flicker during activated and deactivated state. This can be done by
changing the corresponding bit in the EN_PULL_UP@ON and EN_PULL_UP@OFF registers. Please see also the
description of the WRITE_EN_PULL_UP commands.
Shift Register
Control Logic
PWM Maping/
PWM Fault Detection
16 Over
Temperature
LED Open/
Short
Short to GND
Pull up
IREF Diag/
Current Mirror
UVLO
BandGap
Weak LED
Supply
48
x12
SDI
CLK
LATCH
SDO
PGNDIREF
CH0-11
SENSE
VCC
PWM0-5
ERR
Iref
CAL
PWM
12
12
6
72
AGND
Constant Current
Driver
5/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Protection circuitry and diagnostic
o LED Short Detection
A short event is detected when the voltage across the LED falls below the short detection threshold
VSCth. The SHORT detection current which is flowing during LED active (PWM =”LOW”), will cause a typical
output current offset of 20µA. After a detected LED short event, the corresponding bit of the Gen_SHORT
detection register and the ANY_SHORT_OPEN_FLAG from the STATUS register remain high until cleared by
the controller. The SHORT detection is also performed, when the LED is not activated, using small sink
currents for small time intervals (20us) to avoid LED flicker. In order for the detection to be available at
non-activated LED state the PWM duty cycle must be <99.2% at a frequency of 200Hz.
o LED Open Detection
During an open event the output device will be fully ON, pulling VDx low. An open event is detected when
voltage VDx at the output pin falls below VOth. The OPEN detection current, Ipulldown which is flowing during LED
active (PWM = “LOW”), will cause a typical output current offset of 20µA. After a LED open event has been
detected the corresponding bit of the Gen_OPEN detection register and ANY_SHORT_OPEN_FLAG from the
STATUS register remain high until cleared by the controller. The OPEN detection is also performed, when the
LED is not activated, using small sink currents for small time intervals (20us) to avoid LED flicker. In order for
the detection to be available at non-activated LED state the PWM duty cycle must be <99.2% at a frequency of
200Hz.
Note: In order to distinguish between diagnostics (LED Short Detection and LED Open Detection) at ON and
OFF, the corresponding detection must be enabled and corresponding state of the channel must be checked
(enabled/disabled).
o Short to Ground Detection
The chip can perform output short to ground diagnosis during non-activated LED state. After LED short and
open at channel off diagnosis, a short to ground can be also detected. In order for the detection to be available
at non-activated LED state the PWM duty cycle must be <99.2% at a frequency of 200Hz.
The diagnostic is activated or deactivated by the EN_SHORT_TO_GND register.
After an output short to ground has been detected the corresponding bit of the SHORT_TO_GND detection
register and ANY_SHORT_TO_GND_FLAG from the STATUS register remain high until cleared by the
controller.
Note: In case both the Open Detection and Short to GND Detection are active at the same time and the voltage
VDx at the output pin falls below VSGth also the corresponding bit of the Gen_OPEN detection register and
ANY_SHORT_OPEN_FLAG from the STATUS register remain high until cleared by the controller.
Figure 4. Diagnostic diagram
o IREF Fault Detection (Limp Home functionality)
The chip can perform IREF short and open diagnostic on the external resistor. In case of an error the
REXT_FAULT flag is set and latched and an internal current reference is used to set a typical output current of
IREF_LH. If the fault condition is removed the chip can be reset to the normal operating state by a POR event.
EN_CHANNEL
PWM
Diagnostic
CHANNEL ACTIVE CHANNEL NOT ACTIVE
PWM ACTIVE PWM NOT ACTIVE
tdiag_off
20us
SHORT/OPEN
@ON PULL_UP@ON PULL_UP@OFF SHORT/
OPEN
@OFF SHORT
TO GND
6/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
o PWM Fault Detection
PWM fault diagnostic can be performed at startup to test for wire connectivity. The chip is initialized with a
PWM fault condition that changes to PWM_OK immediately after the first falling edge on the PWM input(s).
o UVLO Under Voltage LockOut
By monitoring the Vcc pin an UVLO event can be detected. If Vcc is below UVLO_L then the chip is turned
off. If the Vcc voltage increases over the UVLO_H threshold then the chip is turned back on.
o Weak LED Supply Voltage Detection
By monitoring VSENSE pin, a low LED supply voltage can be detected.
After a Weak LED Supply voltage has been detected a corresponding one bit register flag is set and remains
high until cleared by the controller. The detection has its own status bit and is mapped to Open Drain Fault
Indicator. Note that this circuit is always active. A masking command that can be locked and read back is
implemented.
Figure 5. Startup diagram
Note: In Case II when the MASK_WLS will be activated a Weak LED Supply event will be signaled to the
internal logic. This is because the detection circuit itself is not disabled by the MASK_WLS command but only
the diagnostic is masked.
o Open Drain Fault Indicator
An emergency warning pin is available (ERR) to signal to the controller the most important faults of the
system. The ERR output is activated (active=”LOW”) when a fault flag in the STATUS register or a flag in the
UNLOCK register is set. The flags can be masked using the WRITE_EN_ERR_PIN command. The content of
the EN_ERR_PIN register shows the flags that will activate the Open Drain Fault Indicator (ERR). The picture
below shows the ERR pin functionality:
Figure 6. Open Drain fault indicator (ERR)
ERR
All STATUS
and UNLOCK
bits
VLED
VCC
UVLO_H
realease
POINT
WLS detect
POINT
VCC = VLED
UVLO_H
realease
POINT
WLS detect
POINT
Case II
Case I
V
V
time
time
UVLO_L
Lockout
POINT
UVLO_L
Lockout
POINT
7/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
o Over temperature
TSD130°C:
When the die temperature exceeds 130°C a warning flag is set and latched. The controller can take action
to reduce power. A hysteresis of 10°C is implemented from the point where the warning flag is set until the
warning is released.
The chip functionality is not changed.
TSD180°C:
When the die temperature exceeds 180°C, the driver disables the output currents. The logic remains
functional and the controller is still able to read the status. This allows the controller to take action and avoid a
repeated thermal shutdown.
A hysteresis of 10°C is implemented from the point where the warning flag is set until the warning is
released. If the temperature drops below the hysteresis value then the device will resume its previously set
functionality.
POR (Power ON Reset)
A POR event can occur in one of the following situations:
1. Low supply voltage at Startup or UVLO (Under Voltage LockOut).
2. When the controller sends a command SOFTWARE_POR (Software Reset)
o POR at Startup or UVLO
At startup, which is defined here as first application of supply voltage VCC, or when VCC recovers from an
under voltage event, a POR will occur.
The ERR pin will be set to LOW and the POR_FLAG is set HIGH. All registers are set to default values.
o POR SWR (SPOR)
The controller can send a reset command SOFTWARE_POR.
The POR flag in the STATUS register is set HIGH. All registers are set to default values. The ERR pin will be
set LOW.
Description of Commands
Command [WRITE_PWM_MAPx] is used to assign for each channel output one single PWM input.
Command [READ_PWM_MAPx] is used to read back the data and ensure it was received correctly.
Command [WRITE_CALx] is used to set the calibration of each output during operation.
Command [READ_CALx] is used to read back the data and ensure it was received correctly.
Command [WRITE_EN_CHANNEL] is used to enable/disable the output channels.
Command [READ_EN_CHANNEL] is used to read back the data to ensure it was received correctly.
Command [WRITE_EN_SHORT@ON] is used to enable/disable the short detection at channel on.
Command [READ_EN_SHORT@ON] is used to read back the data to ensure it was received correctly.
Command [WRITE_EN_OPEN@ON] is used to enable/disable the open detection at channel on.
Command [READ_EN_OPEN@ON] is used to read back the data to ensure it was received correctly.
Command [WRITE_EN_SHORT@OFF] is used to enable/disable the short detection at channel off.
Command [READ_EN_SHORT@OFF] is used to read back the data to ensure it was received correctly.
Command [WRITE_EN_OPEN@OFF] is used to enable/disable the open detection at channel off.
Command [READ_EN_OPEN@OFF] is used to read back the data to ensure it was received correctly.
Command [WRITE_EN_SHORT_TO_GND] is used to enable/disable the short to ground fault detection.
Command [READ_EN_SHORT_TO_GND] is used to read back the data to ensure it was received correctly.
Command [WRITE_EN_PULL_UP@ON] is used to enable/disable the pull up current at channel on.
Command [READ_EN_PULL_UP@ON] is used to read back the data to ensure it was received correctly.
Command [WRITE_EN_PULL_UP@OFF] is used to enable/disable the pull up current at channel off.
Command [READ_EN_PULL_UP@OFF] is used to read back the data to ensure it was received correctly.
Command [WRITE_EN_ERR] is used to enable/disable the bits that activate the emergency warning pin.
Command [READ_EN_ERR] is used to read back the data to ensure it was received correctly.
Command [WRITE_MASK_WLS] is used to mask/unmask the weak LED supply detection.
8/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Command [READ_MASK_WLS] is used to read back data to ensure it was received correctly.
Command [WRITE_LOCK] is used to lock the important registers.
Command [WRITE_UNLOCK] is used to unlock the important registers.
Command [READ_UNLOCK] is used to read back the data to ensure it was received correctly.
Command [RESET_STATUS] can reset all bits in the STATUS register except for the REXT_FAULT_FLAG, based on
command parameters, and resets the PWM_OK register (see RESET_STATUS command description).
Command [READ_STATUS] is used to access all bits in the STATUS register.
Command [SOFTWARE_POR] resets the chip and sets all registers to default values. POR_FLAG is set HIGH.
Command [READ_PWM_OK] is used to read the PWM detection.
Command [READ_Gen_SHORT] is used to read the LED short detection.
Command [READ_Gen_OPEN] is used to read the LED open detection.
Command [READ_SHORT_TO_GND] is used to read the short to ground detection.
WRITE_PWM_MAP command & READ_PWM_MAP command:
Register Name
Address
Data Code<7:0>
Comments
PWM_MAPk
40 to 45
b7
b6
b5
b4
b3
b2
b1
b0
Assign CH2k+1 and CH2k to PWMx,
k=0 to 5
PWM_MAPk
80 to 85
b7
b6
b5
b4
b3
b2
b1
b0
Read CH2k+1 and CH2k to PWMx,
k=0 to 5
o Code:
8bit CMD (for all channels)
Data<7:4>or<3:0>
PWM0
0000
PWM1
0001
PWM2
0010
PWM3
0011
PWM4
0100
PWM5
0101
PWM0
Default for invalid data
0110 to 1111
WRITE_CALx command & READ_CALx command (where x = 0 to 11):
Register Name
Address
Data Code<7:0>
Comments
CALx
48 to 53
x
x
b5
b4
b3
b2
b1
b0
Write calibration setting of CH0 to CH11
CALx
88 to 93
u
u
b5
b4
b3
b2
b1
b0
Read calibration setting of CH0 to CH11
o Code:
1=enable Cal bit
0=disable Cal bit
x=don’t care
u=unchanged
WRITE_EN_CHANNEL command & READ_EN_CHANNEL command:
Register Name
Address
Data Code<7:0>
Comments
EN_CHANNEL
56
x
x
b5
b4
b3
b2
b1
b0
Enable Channel CH5 to CH0
EN_CHANNEL
57
x
x
b11
b10
b9
b8
b7
b6
Enable Channel CH11 to CH6
EN_CHANNEL
96
u
u
b5
b4
b3
b2
b1
b0
Read Enable Channel CH5 to CH0
EN_CHANNEL
97
u
u
b11
b10
b9
b8
b7
b6
Read Enable Channel CH11 to CH6
o Code:
1=enable Channel
0=disable Channel
x=don’t care
u=unchanged
9/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
WRITE_EN_SHORT@ON command & READ_EN_SHORT@ON:
Register Name
Address
Data Code<7:0>
Comments
EN_SHORT@ON
58
x
x
b5
b4
b3
b2
b1
b0
Enable Short@on CH5 to CH0
EN_SHORT@ON
59
x
x
b11
b10
b9
b8
b7
b6
Enable Short@on CH11 to CH6
EN_SHORT@ON
98
u
u
b5
b4
b3
b2
b1
b0
Read Enable Short@on CH5 to CH0
EN_SHORT@ON
99
u
u
b11
b10
b9
b8
b7
b6
Read Enable Short@on CH11 to CH6
o Code:
1=enable Short
0=disable Short
x=don’t care
u=unchanged
WRITE_EN_OPEN@ON command & READ_EN_OPEN@ON command:
Register Name
Address
Data Code<7:0>
Comments
EN_OPEN@ON
5A
x
x
b5
b4
b3
b2
b1
b0
Enable Open@on CH5 to CH0
EN_OPEN@ON
5B
x
x
b11
b10
b9
b8
b7
b6
Enable Open@on CH11 to CH6
EN_OPEN@ON
9A
u
u
b5
b4
b3
b2
b1
b0
Read Enable Open@on CH5 to CH0
EN_OPEN@ON
9B
u
u
b11
b10
b9
b8
b7
b6
Read Enable Open@on CH11 to CH6
o Code:
1=enable Open
0=disable Open
x=don’t care
u=unchanged
WRITE_EN_SHORT@OFF command & READ_EN_SHORT@OFF command:
Register Name
Address
Data Code<7:0>
Comments
EN_SHORT@OFF
5C
x
x
b5
b4
b3
b2
b1
b0
Enable Short@off CH5 to CH0
EN_SHORT@OFF
5D
x
x
b11
b10
b9
b8
b7
b6
Enable Short@off CH11 to CH6
EN_SHORT@OFF
9C
u
u
b5
b4
b3
b2
b1
b0
Read Enable Short@off CH5 to CH0
EN_SHORT@OFF
9D
u
u
b11
b10
b9
b8
b7
b6
Read Enable Short@off CH11 to CH6
o Code:
1=enable Short
0=disable Short
x=don’t care
u=unchanged
WRITE_EN_OPEN@OFF command & READ_EN_OPEN@OFF command:
Register Name
Address
Data Code<7:0>
Comments
EN_OPEN@OFF
5E
x
x
b5
b4
b3
b2
b1
b0
Enable Open@off CH5 to CH0
EN_OPEN@OFF
5F
x
x
b11
b10
b9
b8
b7
b6
Enable Open@off CH11 to CH6
EN_OPEN@OFF
9E
u
u
b5
b4
b3
b2
b1
b0
Read Enable Open@off CH5 to CH0
EN_OPEN@OFF
9F
u
u
b11
b10
b9
b8
b7
b6
Read Enable Open@off CH11 to CH6
o Code:
1=enable Open
0=disable Open
x=don’t care
u=unchanged
WRITE_EN_SHORT_TO_GND command & READ_EN_SHORT_TO_GND command:
Register Name
Address
Data Code<7:0>
Comments
EN_SHORT_TO_
GND
60
x
x
b5
b4
b3
b2
b1
b0
Enable Short to gnd CH5 to CH0
EN_SHORT_TO_
GND
61
x
x
b11
b10
b9
b8
b7
b6
Enable Short to gnd CH11 to CH6
EN_SHORT_TO_
GND
A0
u
u
b5
b4
b3
b2
b1
b0
Read Enable Short to gnd CH5 to CH0
EN_SHORT_TO_
GND
A1
u
u
b11
b10
b9
b8
b7
b6
Read Enable Short to gnd CH11 to CH6
10/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
o Code:
1=enable Short to ground
0=disable Short to ground
x=don’t care
u=unchanged
WRITE_EN_PULL_UP@ON command & READ_EN_PULL_UP@ON command:
Register Name
Address
Data Code<7:0>
Comments
EN_PULL_UP@ON
62
x
x
b5
b4
b3
b2
b1
b0
Enable pull up@on CH5 to CH0
EN_PULL_UP@ON
63
x
x
b11
b10
b9
b8
b7
b6
Enable pull up@on CH11 to CH6
EN_PULL_UP@ON
A2
u
u
b5
b4
b3
b2
b1
b0
Read Enable pull up@on CH5 to CH0
EN_PULL_UP@ON
A3
u
u
b11
b10
b9
b8
b7
b6
Read Enable pull up@on CH11 to CH6
o Code:
1=enable pull up
0=disable pull up
x=don’t care
u=unchanged
WRITE_EN_PULL_UP@OFF command & READ_PULL_UP@OFF command:
Register Name
Address
Data Code<7:0>
Comments
EN_PULL_UP@
OFF
64
x
x
b5
b4
b3
b2
b1
b0
Enable pull up@off CH5 to CH0
EN_PULL_UP@
OFF
65
x
x
b11
b10
b9
b8
b7
b6
Enable pull up@off CH11 to CH6
EN_PULL_UP@
OFF
A4
u
u
b5
b4
b3
b2
b1
b0
Read Enable pull up@off CH5 to CH0
EN_PULL_UP@
OFF
A5
u
u
b11
b10
b9
b8
b7
b6
Read Enable pull up@off CH11 to CH6
o Code:
1=enable pull up
0=disable pull up
x=don’t care
u=unchanged
WRITE_EN_ERR_PIN command & READ_EN_ERR_PIN command:
Register Name
Address
Data Code<7:0>
Comments
EN_ERR_PIN
66
x
s6
s5
s4
s3
s2
s1
s0
En ERR pin for status bit6 to bit0
EN_ERR_PIN
67
x
x
x
u4
u3
u2
u1
u0
En ERR pin for unlock bit4 to bit0
EN_ERR_PIN
A6
u
s6
s5
s4
s3
s2
s1
s0
Read En ERR pin for status bit6 to bit0
EN_ERR_PIN
A7
u
u
u
u4
u3
u2
u1
u0
Read En ERR pin for unlock bit4 to bit0
o Code:
1=enable
0=disable
x= don’t care
u=unchanged
(see also STATUS/UNLOCK Register Flag Description)
WRITE_MASK_WLS command:
Register Name
Address
Data Code<7:0>
Comments
MASK_WLS
68
x
x
x
x
x
x
b1
b0
Make the WLS detection visible
o Code:
01=enable detection
10=disable detection
00=don’t touch
11=don’t touch
x=don’t care
(Note: b1 and b2 are used as code to change the 1bit MASK_WLS register)
READ_MASK_WLS command:
Register Name
Address
Data Code<7:0>
Comments
MASK_WLS
AB
u
u
u
u
u
u
u
b0
Read Make the WLS detection visible
o Code:
11/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
1=visible
0=not visible
u=unchanged
WRITE_LOCK command:
Register Name
Address
Data Code<7:0>
Comments
UNLOCK
69
x
x
x
EN_ERR
PWM_MAP
EN_CH
CAL
All DIAG
Lock
o Code: default “11111”=unlocked
1=lock
0=don’t touch
x=don’t care
o EN_ERR locks EN_ERR_PIN register
o CAL locks CALx registers
o EN_CH locks EN_CHANNEL register
o PWM MAP locks PWM_MAPx registers
o All DIAG locks EN_SHORT@ON, EN_OPEN@ON, EN_SHORT@OFF, EN_OPEN@OFF,
EN_SHORT_TO_GND, EN_PULL_UP@ON, EN_PULL_UP@OFF, EN_WLS registers
WRITE_UNLOCK command & READ_UNLOCK command:
Register Name
Address
Data Code<7:0>
Comments
UNLOCK
6A
x
x
x
EN_ERR
PWM_MAP
EN_CH
CAL
All DIAG
unlock reg.
UNLOCK
A9
u
u
u
EN_ERR
PWM_MAP
EN_CH
CAL
All DIAG
Read Unlock
o Code for write: Code for read: default “11111”=unlocked
1=unlock 1=unlocked
0=don’t touch 0=locked
x=don’t care u=unchanged
o EN_ERR unlocks EN_ERR_PIN register
o CAL unlocks CALx registers
o EN_CH unlocks EN_CHANNEL register
o PWM MAP unlocks PWM_MAPx registers
o All DIAG unlocks EN_SHORT@ON, EN_OPEN@ON, EN_SHORT@OFF, EN_OPEN@OFF,
EN_SHORT_TO_GND, EN_PULL_UP@ON, EN_PULL_UP@OFF, EN_WLS registers
RESET_STATUS command:
Register Name
Address
Data Code<7:0>
Comments
RESET_STATUS
6B
x
x
SHORT
to
GND
ANY
SHORT
OPEN
WLS
PWM_OK
TSD
POR
Clear status
flags
o Code:
1=reset
0=don’t touch
x=don’t care
(Note1: TSD clears bot TSD130 and TSD180 flags)
(Note2: After clearing the flags with the RESET_STATUS command the registers will immediately reflect
the actual status)
SOFTWARE_POR command:
Register Name
Address
Data Code<7:0>
Comments
SOFTWARE_POR
6C
1
0
1
0
0
0
0
1
Resets all registers and sets
POR flag HIGH
Default Register setting:
Register
Default values after POR
Comments
CALIBRATION<5:0>
(of all channels)
<000000>
Set all currents to min value
12/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
STATUS / UNLOCK Register Flag Description:
NAME
STATUS
Default
Comment
POR_FLAG
0
<1>
POR flag (1 = POR detected)
TSD130_FLAG
1
<0>
Die temperature >130°C (1 = over temp)
TSD180_FLAG
2
<0>
Die temperature >180°C (1 = over temp)
WLS_FAULT_FLAG
3
<0>
Weak LED Supply (1 = below threshold)
REXT_FAULT_FLAG
4
<0>
Fault on external reference resistor (1 = out of range)
ANY_SHORT_OPEN_FLAG
5
<0>
At least one short/open detected at any output (1 =
short/open detected)
ANY_SHORT_TO_GND_FLAG
6
<0>
Short to GND(1=short to ground detected)
NAME
UNLOCK
Default
Comment
DIAG_UNLOCK_FLAG
0
<1>
DIAG UNLOCK (1 = unlocked)
CAL_UNLOCK_FLAG
1
<1>
CALIBRATION UNLOCK (1 =unlocked)
CH_EN_UNLOCK_FLAG
2
<1>
Channel Enable UNLOCK (1 = unlocked)
PWM_MAP_UNLOCK_FLAG
3
<1>
PWM MAP UNLOCK (1 = unlocked)
EN_ERR_PIN_UNLOCK_
FLAG
4
<1>
ERR PIN enable UNLOCK (1=unlocked)
{POR_FLAG} indicates that a POR event has happen (UVLO or Software POR).
{TSD130_FLAG} indicates the junction temperature is higher than 130°C.
{TSD180_FLAG} indicates the junction temperature is higher than 180°C.
{WLS_FAULT_FLAG} indicates a LED supply voltage less than normal.
{REXT_FAULT_FLAG} indicates either an open or short fault event at the IREF pin.
{ANY_SHORT_OPEN_FLAG} indicates that at least one output channel has detected a short/open event and
represents the result of a wired-OR function from Gen SHORT detection, Gen OPEN detection registers content.
{ANY_SHORT_TO_GND_FLAG} indicates that at least one output channel has detected a short to ground event and
represents the result of a wired-OR function from SHORT_TO_GND detection registers content.
{DIAG_UNLOCK_FLAG} indicates that the enabling of the diagnostics has been locked/unlocked.
{CAL_UNLOCK_FLAG} indicates that channel calibration settings have been locked/unlocked.
{CH_EN_UNLOCK_FLAG} indicates that channel enabling settings have been locked/unlocked.
{PWM_MAP_UNLOCK_FLAG} indicates that PWM _MAP settings have been locked/unlocked.
{EN_ERR_PIN_UNLOCK_FLAG} indicates that the error pin warning settings have been locked/unlocked.
Note: All flags in the STATUS register are asynchronous events. After clearing the flags with the RESET_STATUS
command the registers will immediately reflect the actual status.
PWM_MAP<3:0>
(of all channels)
<0000>
all channels assigned to PWM0
Assign all channels to PWM0
Gen_OPEN <11:0>
<000000000000>
Default: no fault.
Gen_SHORT <11:0>
<000000000000>
Default: no fault.
SHORT_TO_GND <11:0>
<000000000000>
Default: no fault.
PWM_OK <5:0>
<000000>
Default: fault
EN_CHANNEL<11:0>
<000000000000>
All channels off
EN_OPEN@ON<11:0>
<000000000000>
Open @ on de-activated for all channels
EN_SHORT@ON<11:0>
<000000000000>
Short @ on de-activated for all channels
EN_OPEN@OFF<11:0>
<000000000000>
Open @ off de-activated for all channels
EN_SHORT@OFF<11:0>
<000000000000>
Short @ off de- activated for all channels
EN_SHORT_TO_GND <11:0>
<000000000000>
Short to ground detection de-activated
EN_PULL_UP@ON<11:0>
<000000000000>
All pull-ups de-activated
EN_PULL_UP@OFF<11:0>
<000000000000>
All pull-ups de-activated
EN_ERR_PIN <11:0>
<111111111111>
All warnings activated
UNLOCK<4:0>
<11111>
All groups unlocked
MASK_WLS
<0>
Default: Detection is not visible
STATUS<6:0>
<0000001>
Default: POR detected
13/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Electrical Characteristic(s)
(Unless otherwise specified, Ta=-40~+105°C VCC=3.0~5.5V)
Item
Symbol
Standard Value
Unit
Conditions
Min
Typ
Max
[Output D0~D11] (Pin No: 5 to 10, 19 to 24)
Output current accuracy,
Channel to Channel*1
ΔI
DxA
-
-
±15
%
Ta = 25°C
VCC = 3.3V
REXT = 60KΩ
VSENSE=5V
Measured across a
82ohm load resistor
Cal 63
±14
Cal 42
±16
Cal 20
-
-
±5
Ta = 25°C
VCC = 3.3V
REXT = 20KΩ
Cal 63
±3.5
Cal 42
±6
Cal 20
-
-
±6
Ta = 25°C
VCC = 3.3V
REXT = 12KΩ
Cal 63
±7
Cal 42
±7
Cal 20
Output current accuracy
Average to Nominal*2
ΔI
AN
-
-
±8
%
Ta = 25°C
VCC = 3.3V
REXT = 60KΩ
Cal 63
±8
Cal 42
±8
Cal 20
-
-
±3
Ta = 25°C
VCC = 3.3V
REXT = 20KΩ
Cal 63
±2.5
Cal 42
±3.5
Cal 20
-
-
±4
Ta = 25°C
VCC = 3.3V
REXT = 12KΩ
Cal 63
±4
Cal 42
±4
Cal 20
Output current accuracy
Channel to Nominal*3
ΔI
DxN
-
-
±16
%
Ta = 25°C
VCC = 3.3V
REXT = 60KΩ
Cal 63
±15
Cal 42
±17
Cal 20
-
-
±5
Ta = 25°C
VCC = 3.3V
REXT = 20KΩ
Cal 63
±4
Cal 42
±7
Cal 20
-
-
±7
Ta = 25°C
VCC = 3.3V
REXT = 12KΩ
Cal 63
±8
Cal 42
±8
Cal 20
Output current
temperature shift*8
ΔI
Dx
(Temp)
0
-
3.2
µA/C
VCC = 3.3V
REXT = 20KΩ
Cal 63
Output current supply
voltage shift
ΔI
Dx
(Vcc)
0
-
0.5
mA/V
Ta = 25°C
VCC=3.0-3.6V
REXT = 20KΩ
Cal 63
0
-
0.5
Ta = 25°C
VCC=4.5-5.5V
REXT = 20KΩ
Cal 63
Output leakage
Current
IDLeak
-
-
0.1
uA
VD = VSENSE =8V
Ta=25°C
Minimum output voltage
level
VDmin
-
-
-
-
0.75
V
ID drops to
80%IDmax,
REXT = 20KΩ
VCC=3.3V
Cal
63
0.51
VCC=5V
Rising time of ID
ST1
0.3
0.5
1.2
us
From 10% to 90% of IDmax,
REXT = 20KΩ
Cal
63
Falling time of ID
ST2
0.2
0.5
1.2
us
From 90% to 10% of IDmax,
REXT = 20KΩ
Cal
63
Ton error*4
RT
-1
0
1
us
Measured at 50% of IDmax,
REXT = 20KΩ
Cal
63
Delay time PWM to ID
DT
-
0.26
1
us
From PWM0=10% of VCC
to ID=10% of ID max (rising
edge), REXT = 20KΩ
Cal
63
*1
, where
*2
, this represents Device to Device accuracy
*3
*4 between pulse width of ID relative to the pulse width of PWM, this item represents
PWM duty cycle Linearity
14/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
[Logic input] (Pin No: 4, 11 to 17, 25) *9
High going threshold
voltage
VTH
0.35 x
VCC
-
0.45 x
VCC
V
Low going threshold
voltage
VTL
0.25 x
VCC
-
0.35 x
VCC
V
Hysteresis width
VHYS
-
0.1 x
VCC
-
V
Pull up resistance
Rpullup
100
200
300
kΩ
Only for Pins:4,11,12,16, 17,
25
Serial clock frequency
fCLK
-
-
1250
kHz
[Logic output] (Pin No: 26)
Output Voltage high
VOH
0.9 x
VCC
0.95 x
VCC
1 x
VCC
V
ISDO = -4mA
Output voltage Low
VOL
0
0.05 x
VCC
0.1 x
VCC
V
ISDO = 4mA
[Open Drain] (Pin No: 3)
HIGH LEVEL Output
Leakage Current
I
ODH_leak
-
-
0.2
uA
VCC = 3.3V
LOW LEVEL Output
Voltage
V
ODL
-
-
0.1x
VCC
V
IOD = 4mA
VCC = 3.3V
[DEVICE]
Circuit Current
ICC
-
4
7.5
mA
Pin 3 = OPEN
Pin 26 = OPEN
REXT = 20KΩ
Under voltage lockout
UVLO_L
2.2
2.5
2.8
V
Falling VCC
Under voltage release
UVLO_H
2.4
2.7
3.0
V
Rising VCC
SHORT detection
Threshold
VSCth
0.45
-
0.93
V
Measured across LED
VSENSE=5V
Diag. detection pull down
current
Ipulldown
14
20
30
uA
Measured at Channel OFF
SHORT_to_GND pull-up
current
Ipullup
14
20
30
uA
Measured at Channel OFF
Minimum glitch Reject*5*8
tglitch_reject
-
-
7.5
us
For OPEN / SHORT
detection
ON Time*6*7
tON
8
-
-
us
Minimum requirement for
OPEN/SHORT detection.
LED Short/Open detection
window
tdiag_off
12
20
31
us
At Channel OFF and
PWMY=”HIGH”
OPEN detection threshold
VOth
100
-
330
mV
Measured from Output to
AGND, VSENSE=5V
SHORT_to_GND
detection threshold
VSGth
100
-
330
mV
At Channel OFF and
PWMY=”HIGH”,
VSENSE=5V
Weak LED Supply
detection threshold
VWLSth_L
4.0
4.15
4.3
V
Measured at VSENSE
IREF short threshold
Ishort
116
-
220
uA
Measured at
IREF pin
VCC =
4.5~5.5V
116
-
300
uA
VCC =
3.0~3.6V *8
IREF open threshold
Iopen
2
-
16
uA
Measured at IREF pin
IREF Limp Home
IREF_LH
6
10
16
mA
Measured at Output in case
of short or open at IREF pin
Reference Voltage
VREF
1.17
1.2
1.23
V
REXT = 20kΩ connected to
IREF pin
Temperature monitoring
accuracy*8
TMON
-15
-
15
%
At 130°C and 180°C
Temperature hysteresis*8
Thyst
7
10
13
°C
At 130°C and 180°C
SENSE pin input current
ISENSE
-
18
-
uA
VSENSE=5V
*5 An OPEN or SHORT that lasts for less than this time will be rejected.
*6 Please note that the PWM signal is active LOW therefore, the tON time denotes the period when the signal is at LOW level.
*7 This period is derived from a PWM frequency of 200Hz and a minimum duty cycle of 0.2%.
*8 Guaranteed by design.
*9 The input circuitry operates as a Schmitt trigger and the operation is not affected by the rise and fall times of the input signals.
15/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Typical Performance Curve(s)
Figure 7. Circuit current vs. supply voltage Figure 8. Ref voltage vs. supply voltage
Figure 9. Output current vs. output voltage Figure 10. Output current linearity(RT) vs. PWM
3,5
3,7
3,9
4,1
4,3
4,5
4,7
4,9
2 3 4 5 6
Circuit Current Icc [mA]
Supply voltage Vcc [V]
Temp= 25 C
Temp= - 40 C
Temp= 125 C
1,17
1,18
1,18
1,19
1,19
1,20
1,20
1,21
1,21
1,22
1,22
2 3 4 5 6
Reference Voltage VIREF [V]
Supply Voltage Vcc [V]
Temp = 25 C
Temp = -40 C
Temp= 125 C
0
10
20
30
40
50
60
0 0,2 0,4 0,6 0,8 1 1,2
Output Curret ID [mA]
Output Voltage VD[V]
Vcc=3.3V
Temp = 25 C
Temp = - 40 C
Temp = 125 C
-20%
-15%
-10%
-5%
0%
5%
10%
15%
20%
0,1 1,0 10,0 100,0
Linearity [%]
PWM Duty Cycle Log[%]
Temp = 25 C
Temp = -40 C
Temp = 125 C
º
º
º
º
º
º
º
º
º
º
º
º
16/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
SPI Timing Chart
Figure 11. Write/access data for typical use case
Figure 12. Input signals timing diagram showing absolute minimal timing
INPUT SIGNAL’s TIMING RULE (Ta=-40~+105°C VCC=3.0~5.5V)
Parameter
Symbol
Min
Unit
CLK period
TCK
800
ns
CLK high pulse width
TCKH
300
ns
CLK low pulse width
TCKL
300
ns
SERIN high and low pulse width
TSEW
780
ns
SERIN setup time prior to CLK rise
TSEST
150
ns
SERIN hold time after CLK rise
TSEHD
150
ns
LATCH high pulse time
TLAH
380
ns
LAST CLK rise to LATCH rise
TLADZ
200
ns
The timings are valid for a 1.25MHz clock signal. The input High Going threshold voltage (VTH) is 0.4 VCC on the rising edge
and (VTH) 0.3 VCC on the falling edge for all digital pins. See electrical characteristics.
17/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Figure 13. Timing diagram for output signal's delay time
OUTPUT SIGNAL’s DELAY TIME (Ta=-40~+105°C VCC=3.0~5.5V)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
LATCH switching delay
DT1
-
-
3000
ns
SEROUT propagation delay time(LH)
TDSOH
-
-
1300
ns
SEROUT propagation delay(HL)
TDSOL
-
-
1300
ns
Output signal's delay time
18/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
SPI Communication
The serial port is used to write data, read diagnostic status and configure settings of the chip by transferring the input
data to the desired address. During normal operation an 8-bit serial address and 8-bit serial data is written into the 16-bit shift
register. The clock idle state is zero and the data on the SDI and SDO lines must be stable while the clock is high and
can be changed when the clock is low. The data is sampled by on the clock’s rising edge and propagated on the clock’s
falling edge, converting the 16 most recent inputs to parallel signals on the LATCH rising edge.
At the rising edge on the LATCH input addresses are interpreted by a decoder which controls data transfer between
shift and storage registers. Depending on the address, valid data is conveyed from or to the appropriate latch or a command is
interpreted. When a read address is latched data is read out from a storage register and shifted out of SDO to the microcontroller
or daisy chained chips.
Since for each address the chip shifts out a fixed amount of data at the end of a write/read cycle it is possible to send
different address codes to each IC in a daisy chain.
During the exchange of information the LED outputs do not flicker or dim.
Command Set
X= don’t care
Address
IN<15:8>
Comments
HEX d7 d6 d5 d4 d3 d2 d1 d0
40 PWM_MAP01<3> PWM_MAP01<2> PWM_MAP01<1> PWM_MAP01<0> PWM_MAP00<3> PWM_MAP00<2> PWM_MAP00<1> PWM_MAP00<0> Configures Output Ch1&Ch0 to PWMy
41 PWM_MAP03<3> PWM_MAP03<2> PWM_MAP03<1> PWM_MAP03<0> PWM_MAP02<3> PWM_MAP02<2> PWM_MAP02<1> PWM_MAP02<0> Configures Output Ch3&Ch2 to PWMy
42 PWM_MAP05<3> PWM_MAP05<2> PWM_MAP05<1> PWM_MAP05<0> PWM_MAP04<3> PWM_MAP04<2> PWM_MAP04<1> PWM_MAP04<0> Configures Output Ch5&Ch4 to PWMy
43 PWM_MAP07<3> PWM_MAP07<2> PWM_MAP07<1> PWM_MAP07<0> PWM_MAP06<3> PWM_MAP06<2> PWM_MAP06<1> PWM_MAP06<0> Configures Output Ch7&Ch6 to PWMy
44 PWM_MAP09<3> PWM_MAP09<2> PWM_MAP09<1> PWM_MAP09<0> PWM_MAP08<3> PWM_MAP08<2> PWM_MAP08<1> PWM_MAP08<0> Configures Output Ch9&Ch8 to PWMy
45 PWM_MAP11<3> PWM_MAP11<2> PWM_MAP11<1> PWM_MAP11<0> PWM_MAP10<3> PWM_MAP10<2> PWM_MAP10<1> PWM_MAP10<0> Configures Output Ch11&Ch10 to PWMy
46 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
47 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
48 X X CAL0<5> CAL0<4> CAL0<3> CAL0<2> CAL0<1> CAL0<0> Current configuration Ch0
49 X X CAL1<5> CAL1<4> CAL1<3> CAL1<2> CAL1<1> CAL1<0> Current configuration Ch1
4A X X CAL2<5> CAL2<4> CAL2<3> CAL2<2> CAL2<1> CAL2<0> Current configuration Ch2
4B X X CAL3<5> CAL3<4> CAL3<3> CAL3<2> CAL3<1> CAL3<0> Current configuration Ch3
4C X X CAL4<5> CAL4<4> CAL4<3> CAL4<2> CAL4<1> CAL4<0> Current configuration Ch4
4D X X CAL5<5> CAL5<4> CAL5<3> CAL5<2> CAL5<1> CAL5<0> Current configuration Ch5
4E X X CAL6<5> CAL6<4> CAL6<3> CAL6<2> CAL6<1> CAL6<0> Current configuration Ch6
4F X X CAL7<5> CAL7<4> CAL7<3> CAL7<2> CAL7<1> CAL7<0> Current configuration Ch7
50 X X CAL8<5> CAL8<4> CAL8<3> CAL8<2> CAL8<1> CAL8<0> Current configuration Ch8
51 X X CAL9<5> CAL9<4> CAL9<3> CAL9<2> CAL9<1> CAL9<0> Current configuration Ch9
52 X X CAL10<5> CAL10<4> CAL10<3> CAL10<2> CAL10<1> CAL10<0> Current configuration Ch10
53 X X CAL11<5> CAL11<4> CAL11<3> CAL11<2> CAL11<1> CAL11<0> Current configuration Ch11
54 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
55 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
56 X X EN_CHANNEL<5> EN_CHANNEL<4> EN_CHANNEL<3> EN_CHANNEL<2> EN_CHANNEL<1> EN_CHANNEL<0> Configure enable channel register for Ch 5 to Ch0
57 X X EN_CHANNEL<11> EN_CHANNEL<10> EN_CHANNEL<9> EN_CHANNEL<8> EN_CHANNEL<7> EN_CHANNEL<6> Configure enable channel register for Ch 11 to Ch6
58 X X EN_SHORT@ON<5> EN_SHORT@ON<4> EN_SHORT@ON<3> EN_SHORT@ON<2> EN_SHORT@ON<1> EN_SHORT@ON<0> Configure enable short for activated Ch5 to Ch0
59 X X EN_SHORT@ON<11> EN_SHORT@ON<10> EN_SHORT@ON<9> EN_SHORT@ON<8> EN_SHORT@ON<7> EN_SHORT@ON<6> Configure enable short for activated Ch11 to Ch6
5A X X EN_OPEN@ON<5> EN_OPEN@ON<4> EN_OPEN@ON<3> EN_OPEN@ON<2> EN_OPEN@ON<1> EN_OPEN@ON<0> Configure enable open for activated Ch5 to Ch0
5B X X EN_OPEN@ON<11> EN_OPEN@ON<10> EN_OPEN@ON<9> EN_OPEN@ON<8> EN_OPEN@ON<7> EN_OPEN@ON<6> Configure enable open for activated Ch11 to Ch6
5C X X EN_SHORT@OFF<5> EN_SHORT@OFF<4> EN_SHORT@OFF<3> EN_SHORT@OFF<2> EN_SHORT@OFF<1> EN_SHORT@OFF<0> Configure enable short for unactivated Ch5 to Ch0
5D X X EN_SHORT@OFF<11> EN_SHORT@OFF<10> EN_SHORT@OFF<9> EN_SHORT@OFF<8> EN_SHORT@OFF<7> EN_SHORT@OFF<6> Configure enable short for unactivated Ch11 to Ch6
5E X X EN_OPEN@OFF<5> EN_OPEN@OFF<4> EN_OPEN@OFF<3> EN_OPEN@OFF<2> EN_OPEN@OFF<1> EN_OPEN@OFF<0> Configure enable open for unactivated Ch5 to Ch0
5F X X EN_OPEN@OFF<11> EN_OPEN@OFF<10> EN_OPEN@OFF<9> EN_OPEN@OFF<8> EN_OPEN@OFF<7> EN_OPEN@OFF<6> Configure enable open for unactivated Ch11 to Ch6
60 X X EN_SHORT_TO_GND<5> EN_SHORT_TO_GND<4> EN_SHORT_TO_GND<3> EN_SHORT_TO_GND<2> EN_SHORT_TO_GND<1> EN_SHORT_TO_GND<0> Enable short to GND for Ch5 to Ch0
61 X X EN_SHORT_TO_GND<11> EN_SHORT_TO_GND<10> EN_SHORT_TO_GND<9> EN_SHORT_TO_GND<8> EN_SHORT_TO_GND<7> EN_SHORT_TO_GND<6> Enable short to GND for Ch11 to Ch6
62 X X EN_PULL_UP@ON<5> EN_PULL_UP@ON<4> EN_PULL_UP@ON<3> EN_PULL_UP@ON<2> EN_PULL_UP@ON<1> EN_PULL_UP@ON<0> Enable pull up @ ON for Ch5 to Ch0
63 X X EN_PULL_UP@ON<11> EN_PULL_UP@ON<10> EN_PULL_UP@ON<9> EN_PULL_UP@ON<8> EN_PULL_UP@ON<7> EN_PULL_UP@ON<6> Enable pull up @ ON for Ch11 to Ch6
64 X X EN_PULL_UP@OFF<5> EN_PULL_UP@OFF<4> EN_PULL_UP@OFF<3> EN_PULL_UP@OFF<2> EN_PULL_UP@OFF<1> EN_PULL_UP@OFF<0> Enable pull up @ OFF for Ch5 to Ch0
65 X X EN_PULL_UP@OFF<11> EN_PULL_UP@OFF<10> EN_PULL_UP@OFF<9> EN_PULL_UP@OFF<8> EN_PULL_UP@OFF<7> EN_PULL_UP@OFF<6> Enable pull up @ OFF for Ch11 to Ch6
66 X s<6> s<5> s<4> s<3> s<2> s<1> s<0> Enable ERR PIN for STATUS bit6 to bit0
67 X X X u<4> u<3> u<2> u<1> u<0> Enable ERR PIN for UNLOCK bit4 to bit0
68 X X X X X X MASK_WLS<1> MASK_WLS<0> Mask WLS detection
69 X X X EN_ERR_PIN_LOCK<4> MAP_LOCK<3> CH_EN_LOCK<2> CAL_LOCK<1> DIAG_LOCK<0> LOCK
6A X X X EN_ERR_PIN_UNLOCK<4> MAP_UNLOCK<3> CH_EN_UNLOCK<2> CAL_UNLOCK<1> DIAG_UNLOCK<0> UNLOCK
6B X X RST_ANY_SHRT_GND<5> RST_ANY_SHRT_OPEN<4> RST_WLS<3> RST_PWM_OK<2> RST_TSD<1> RST_POR<0> Clear STATUS register flags
6C 1 0 1 0 0 0 0 1 Software reset (reset all and set POR flag)
6D Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
6E Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
6F Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
Data IN <7:0>
19/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
U=unchanged
Note: The IC has also reserved addresses for internal test modes not shown in the above register map. All test modes are digital
and are protected by security codes.
Adress
OUT <15:8>
Comments
HEX d7 d6 d5 d4 d3 d2 d1 d0
80 PWM_MAP01<3> PWM_MAP01<2> PWM_MAP01<1> PWM_MAP01<0> PWM_MAP00<3> PWM_MAP00<2> PWM_MAP00<1> PWM_MAP00<0> Read output Ch1&Ch0 to PWMy configuration
81 PWM_MAP03<3> PWM_MAP03<2> PWM_MAP03<1> PWM_MAP03<0> PWM_MAP02<3> PWM_MAP02<2> PWM_MAP02<1> PWM_MAP02<0> Read output Ch3&Ch2 to PWMy configuration
82 PWM_MAP05<3> PWM_MAP05<2> PWM_MAP05<1> PWM_MAP05<0> PWM_MAP04<3> PWM_MAP04<2> PWM_MAP04<1> PWM_MAP04<0> Read output Ch5&Ch4 to PWMy configuration
83 PWM_MAP07<3> PWM_MAP07<2> PWM_MAP07<1> PWM_MAP07<0> PWM_MAP06<3> PWM_MAP06<2> PWM_MAP06<1> PWM_MAP06<0> Read output Ch7&Ch6 to PWMy configuration
84 PWM_MAP09<3> PWM_MAP09<2> PWM_MAP09<1> PWM_MAP09<0> PWM_MAP08<3> PWM_MAP08<2> PWM_MAP08<1> PWM_MAP08<0> Read output Ch9&Ch8 to PWMy configuration
85 PWM_MAP11<3> PWM_MAP11<2> PWM_MAP11<1> PWM_MAP11<0> PWM_MAP10<3> PWM_MAP10<2> PWM_MAP10<1> PWM_MAP10<0> Read output Ch11&Ch10 to PWMy configuration
86 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
87 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
88 U U CAL0<5> CAL0<4> CAL0<3> CAL0<2> CAL0<1> CAL0<0> Read output configuration Ch0
89 U U CAL1<5> CAL1<4> CAL1<3> CAL1<2> CAL1<1> CAL1<0> Read output configuration Ch1
8A U U CAL2<5> CAL2<4> CAL2<3> CAL2<2> CAL2<1> CAL2<0> Read output configuration Ch2
8B U U CAL3<5> CAL3<4> CAL3<3> CAL3<2> CAL3<1> CAL3<0> Read output configuration Ch3
8C U U CAL4<5> CAL4<4> CAL4<3> CAL4<2> CAL4<1> CAL4<0> Read output configuration Ch4
8D U U CAL5<5> CAL5<4> CAL5<3> CAL5<2> CAL5<1> CAL5<0> Read output configuration Ch5
8E U U CAL6<5> CAL6<4> CAL6<3> CAL6<2> CAL6<1> CAL6<0> Read output configuration Ch6
8F U U CAL7<5> CAL7<4> CAL7<3> CAL7<2> CAL7<1> CAL7<0> Read output configuration Ch7
90 U U CAL8<5> CAL8<4> CAL8<3> CAL8<2> CAL8<1> CAL8<0> Read output configuration Ch8
91 U U CAL9<5> CAL9<4> CAL9<3> CAL9<2> CAL9<1> CAL9<0> Read output configuration Ch9
92 U U CAL10<5> CAL10<4> CAL10<3> CAL10<2> CAL10<1> CAL10<0> Read output configuration Ch10
93 U U CAL11<5> CAL11<4> CAL11<3> CAL11<2> CAL11<1> CAL11<0> Read output configuration Ch11
94 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
95 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
96 U U EN_CHANNEL<5> EN_CHANNEL<4> EN_CHANNEL<3> EN_CHANNEL<2> EN_CHANNEL<1> EN_CHANNEL<0> Read enable channel register for Ch 5 to Ch0
97 U U EN_CHANNEL<11> EN_CHANNEL<10> EN_CHANNEL<9> EN_CHANNEL<8> EN_CHANNEL<7> EN_CHANNEL<6> Read enable channel register for Ch 11 to Ch6
98 U U EN_SHORT@ON<5> EN_SHORT@ON<4> EN_SHORT@ON<3> EN_SHORT@ON<2> EN_SHORT@ON<1> EN_SHORT@ON<0> Read enable short for activated Ch5 to Ch0
99 U U EN_SHORT@ON<11> EN_SHORT@ON<10> EN_SHORT@ON<9> EN_SHORT@ON<8> EN_SHORT@ON<7> EN_SHORT@ON<6> Read enable short for activated Ch11 to Ch6
9A U U EN_OPEN@ON<5> EN_OPEN@ON<4> EN_OPEN@ON<3> EN_OPEN@ON<2> EN_OPEN@ON<1> EN_OPEN@ON<0> Read enable open for activated Ch5 to Ch0
9B U U EN_OPEN@ON<11> EN_OPEN@ON<10> EN_OPEN@ON<9> EN_OPEN@ON<8> EN_OPEN@ON<7> EN_OPEN@ON<6> Read enable open for activated Ch11 to Ch6
9C U U EN_SHORT@OFF<5> EN_SHORT@OFF<4> EN_SHORT@OFF<3> EN_SHORT@OFF<2> EN_SHORT@OFF<1> EN_SHORT@OFF<0> Read enable short for unactivated Ch5 to Ch0
9D U U EN_SHORT@OFF<11> EN_SHORT@OFF<10> EN_SHORT@OFF<9> EN_SHORT@OFF<8> EN_SHORT@OFF<7> EN_SHORT@OFF<6> Read enable short for unactivated Ch11 to Ch6
9E U U EN_OPEN@OFF<5> EN_OPEN@OFF<4> EN_OPEN@OFF<3> EN_OPEN@OFF<2> EN_OPEN@OFF<1> EN_OPEN@OFF<0> Read enable open for unactivated Ch5 to Ch0
9F U U EN_OPEN@OFF<11> EN_OPEN@OFF<10> EN_OPEN@OFF<9> EN_OPEN@OFF<8> EN_OPEN@OFF<7> EN_OPEN@OFF<6> Read enable open for unactivated Ch11 to Ch6
A0 U U EN_SHORT_TO_GND<5> EN_SHORT_TO_GND<4> EN_SHORT_TO_GND<3> EN_SHORT_TO_GND<2> EN_SHORT_TO_GND<1> EN_SHORT_TO_GND<0> Read enable short to GND for Ch5 to Ch0
A1 U U EN_SHORT_TO_GND<11> EN_SHORT_TO_GND<10> EN_SHORT_TO_GND<9> EN_SHORT_TO_GND<8> EN_SHORT_TO_GND<7> EN_SHORT_TO_GND<6> Read enable short to GND for Ch11 to Ch6
A2 U U EN_PULL_UP@ON<5> EN_PULL_UP@ON<4> EN_PULL_UP@ON<3> EN_PULL_UP@ON<2> EN_PULL_UP@ON<1> EN_PULL_UP@ON<0> Read enable pull up @ ON for Ch5 to Ch0
A3 U U EN_PULL_UP@ON<11> EN_PULL_UP@ON<10> EN_PULL_UP@ON<9> EN_PULL_UP@ON<8> EN_PULL_UP@ON<7> EN_PULL_UP@ON<6> read enable pull up @ ON for Ch11 to Ch6
A4 U U EN_PULL_UP@OFF<5> EN_PULL_UP@OFF<4> EN_PULL_UP@OFF<3> EN_PULL_UP@OFF<2> EN_PULL_UP@OFF<1> EN_PULL_UP@OFF<0> read enable pull up @ OFF for Ch5 to Ch0
A5 U U EN_PULL_UP@OFF<11> EN_PULL_UP@OFF<10> EN_PULL_UP@OFF<9> EN_PULL_UP@OFF<8> EN_PULL_UP@OFF<7> EN_PULL_UP@OFF<6> read enable pull up @ OFF for Ch11 to Ch6
A6 U s<6> s<5> s<4> s<3> s<2> s<1> s<0> read ERR PIN for STATUS bit6 to bit0
A7 U U U u<4> u<3> u<2> u<1> u<0> read ERR PIN for UNLOCK bit4 to bit0
A8 U AnyShortGND<6> AnyShortOpen<5> REXT<4> WLS<3> TSD180<2> TSD130<1> POR<0> Read STATUS register bits 6to 0
A9 U U U EN_ERR_PIN_UNLOCK<4> MAP_UNLOCK<3> CH_EN_UNLOCK<2> CAL_UNLOCK<1> DIAG_UNLOCK<0> Read UNLOCKED
AA U U PWM_OK<5> PWM_OK<4> PWM_OK<3> PWM_OK<2> PWM_OK<1> PWM_OK<0> Read PWM OK register for PWM5 to PWM0
AB U U U U U U U MASK_WLS<0> Read Mask WLS Detection
AC U U Gen_SHORT<5> Gen_SHORT<4> Gen_SHORT<3> Gen_SHORT<2> Gen_SHORT<1> Gen_SHORT<0> Read short register for Ch5 to Ch0
AD U U Gen_SHORT<11> Gen_SHORT<10> Gen_SHORT<9> Gen_SHORT<8> Gen_SHORT<7> Gen_SHORT<6> Read short register for Ch11 to Ch6
AE U U Gen_OPEN<5> Gen_OPEN<4> Gen_OPEN<3> Gen_OPEN<2> Gen_OPEN<1> Gen_OPEN<0> Read open register for Ch5 to Ch0
AF U U Gen_OPEN<11> Gen_OPEN<10> Gen_OPEN<9> Gen_OPEN<8> Gen_OPEN<7> Gen_OPEN<6> Read open register for Ch11 to Ch6
B0 U U SHORT_TO_GND<5> SHORT_TO_GND<4> SHORT_TO_GND<3> SHORT_TO_GND<2> SHORT_TO_GND<1> SHORT_TO_GND<0> Read Short to GND register for Ch5 to Ch0
B1 U U SHORT_TO_GND<11> SHORT_TO_GND<10> SHORT_TO_GND<9> SHORT_TO_GND<8> SHORT_TO_GND<7> SHORT_TO_GND<6> Read Short to GND register for Ch11 to Ch6
B2 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
B3 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
B4 Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED Not USED
Data OUT <7:0>
20/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Power Dissipation
The maximum current specification per output ID max = 50mA. However when all channels are sinking this maximum the
total power dissipation exceeds the value set by the package limit. The power dissipation can be estimated using Equation 1.
Maximum power dissipation. In case of high current and high voltage it is possible to exceed the maximum power dissipation
even at a single channel. Because these situations do not occur often the current limit per channel is set higher such that the
flexibility of the system is improved.
It is recommended to connect the LEDs to a 5V supply voltage (VLED) for an optimal thermal performance. If the LEDs
are connected to a higher voltage care should be taken because power dissipation will increase. LED series resistors ( RD )
may be added to reduce the voltage drop over the IC output. These resistors are an optional safeguard against exceeding the
dissipation limit of BD18378EFV-M. The maximum power rating of the BD18378EFV-M can be read from the figure below.
11
0,,
11
0,,,,
max,
)(
)(
iPWM
ON
iDiD
iPWM
ON
iDiDiDifLEDdiss
T
T
IV
T
T
IRIVVP
Equation 1. Maximum power dissipation
Pdiss,max: Maximum power dissipation of the package
VLED: Supply voltage of LEDs.
Vf: LED forward voltage
RD: Optional series resistance.
TPWM: Period of PWM
TON: ON time (duty) of PWM
Figure 14. Maximum power dissipation of HTSSOPB28
Note 1: Power dissipation calculated when mounted on 70mm X 70mm X 1.6mm glass epoxy substrate (1-layer
platform/copper thickness 18μm)
Note 2: Power dissipation changes with the copper foil density of the board. This value represents only observed values, not
guaranteed values.
HTSSOP-B28
Pd=1.85W (0.97W)： Board copper foil area 225m ㎡
Pd=3.30W (1.72W)： Board copper foil area 4900m㎡
Pd=4.70W (2.44W)： Board copper foil area 4900m㎡
(Value within parentheses represents power dissipation when Ta=85°C)
21/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
I/O equivalence circuit(s)
Input
Output
Pin: 4,11,12, 16, 17, 25
Pin: 26
Pin: 13,14,15
Pin: 3
Pin: 5 to 10, 19 to 24, Pin : 18
Figure 15. Input/output equivalent circuits
VCC
VCC
VCC
Pin 18
22/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
23/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 16. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be
within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
24/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Ordering Information
B D 1 8 3 7 8 E F V
-
ME2
Package
EFV: HTSSOP-B28
Packaging
M: High Reliability
E2: Embossed carrier tape
(HTSSOP-B28)
Figure 17. Ordering Information
Marking Diagram
Figure 18. Marking Diagram
1PIN MARK
HTSSOP-B28 (TOP VIEW)
BD18378EFV
Part Number Marking
LOT Number
26/26
BD18378EFV-M
TSZ02201-0W1W0C500020-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co
m
TSZ22111・15・001
04. Dec. 2015 Rev.004
Revision History
Date
Revision
Author / Comments
01.Dec.2014
003
Adrian Joita – Datasheet Release after AEC-Q100 Qualification
04.Dec.2015
004
Adrian Joita
-added note for AEC-Q100-Operating Temperature Grade <page 1>
-added note for VSENSE <page 3>
-added Thermal Information <page 3>
-added description of WRITE_CALx & READ_CALx commands <page 8>
-added ISENSE parameter <page 14>
-added note on input circuitry <page 14>
-corrected typo for propagation delay <page17>
-added Pin 18 to I/O equivalent circuits <page 21>
Status of this document
The English version of this document is formal specification. A customer may use the translation version only for a reference to
help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
Notice-PAA-E Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSϪ
CLASSϪ
CLASSϩb
CLASSϪ
CLASSϫ
CLASSϪ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2016 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
