PC725V0NSZXF Series PC725V0NSZXF Series DIP 6 pin Darlington Phototransistor output, High Collector-emitter Voltage, High Power Photocoupler Description Agency approvals/Compliance PC725V0NSZXF Series contains an IRED optically coupled to a phototransistor. It is packaged in a 6 pin DIP, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 300V, CTR is MIN. 1 000% at input current of 1mA and collector power dissipation is 300mW. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC725V) 2. Approved by VDE, DIN EN60747-5-2 () (as an option), file No. 40008189 (as model No. PC725V) 3. Package resin : UL flammability grade (94V-0) () DIN EN60747-5-2 : successor standard of DIN VDE0884 Applications Features 1. Home appliances 2. Programmable controllers 3. Personal computer peripherals 1. 6 pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High collector-emitter voltage (VCEO:300V) 4. Darlington phototransistor output (CTR : MIN. 1 000% at IF=1mA, VCE=2V) 5. Large collector power dissipation (PC:300mW) 6. High isolation voltage between input and output (Viso(rms) : 5.0kV) 7. RoHS directive compliant Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A04502FEN Date Jun. 30. 2005 (c) SHARP Corporation PC725V0NSZXF Series Internal Connection Diagram 1 1 6 2 5 2 3 4 3 5 4 6 Anode Cathode NC Emitter Collector Base Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC725V0NSZXF] 2. Through-Hole (VDE option) [ex. PC725V0YSZXF] 1.20.3 1.20.3 0.2 0.2 0.6 Factory identification mark 4 6.50.5 PC725V Anode mark 1 2 SHARP mark "S" 6 VDE Identification mark 4 Factory identification mark PC725V 4 Anode mark Date code 3 5 1 2 Date code 3 0.3 0.5 7.12 7.12 7.620.3 2.90.5 0.5TYP. 2.90.5 3.50.5 7.620.3 0.5TYP. 5 3.50.5 6 6.50.5 0.6 SHARP mark "S" Epoxy resin : 0 to 13 Product mass : approx. 0.36g SHARP mark "S" 5 4 4 Anode mark Date code Date code 1 2 Factory identification mark PC725V 6.50.5 Anode mark 6 Factory identification mark 4 PC725V 1.20.3 0.60.2 6.50.5 5 : 0 to 13 4. SMT Gullwing Lead-Form (VDE option) [ex. PC725V0YIPXF] 1.20.3 6 SHARP mark "S" Product mass : approx. 0.36g 3. SMT Gullwing Lead-Form [ex. PC725V0NIPXF] 0.60.2 0.50.1 2.540.25 3.250.5 0.50.1 2.540.25 3.250.5 Epoxy resin 1 3 2 3 VDE Identification mark 7.120.5 0.3 2.540.25 1.0+0.4 -0 7.120.5 Epoxy resin 2.540.25 1.0+0.4 -0 0.260.1 0.350.25 7.620.3 3.50.5 0.350.25 0.260.1 3.50.5 7.62 1.0+0.4 -0 Epoxy resin 1.0+0.4 -0 10.0+0 -0.5 10.0+0 -0.5 Product mass : approx. 0.35g Product mass : approx. 0.35g Sheet No.: D2-A04502FEN 2 PC725V0NSZXF Series (Unit : mm) 5. Wide SMT Gullwing Lead-Form [ex. PC725V0NUZXF] 0.60.2 6. Wide SMT Gullwing Lead-Form (VDE option) [ex. PC725V0YUZXF] 0.60.2 1.20.3 1.20.3 Factory identification mark SHARP mark "S" SHARP mark "S" Factory identification mark 6.50.5 6.50.5 PC725V PC725V 4 Date code Date code Anode mark VDE Identification mark 0.750.25 10.160.5 0.250.25 0.26 2.540.25 3.50.5 0.250.25 Epoxy resin 7.620.3 0.1 7.120.5 7.62 0.26 2.540.25 0.3 0.1 7.12 3.50.5 Anode mark 0.5 0.750.25 0.750.25 Epoxy resin 10.160.5 0.750.25 MAX. 12.0 12.0MAX. Product mass : approx. 0.35g Product mass : approx. 0.35g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A04502FEN 3 PC725V0NSZXF Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ** * repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia China * This factory marking is for identification purpose only. Please Contact the local SHARP sales reprsentative to see the actual status of the production. Rank mark There is no rank mark indicator. Sheet No.: D2-A04502FEN 4 PC725V0NSZXF Series Absolute Maximum Ratings Output Input Parameter Symbol Forward current IF *1 Peak forward current IFM VR Reverse voltage P Power dissipation Collector-emitter voltage VCEO Collector-base voltage VCBO Emitter-base voltage VEBO Collector current IC -IC Collector current (reverse) Collector power dissipation PC Total power dissipation Ptot Operating temperature Topr Tstg Storage temperature *2 Isolation voltage Viso (rms) *3 Soldering temperature Tsol Rating 50 1 6 70 300 300 6 150 10 300 350 -25 to +100 -40 to +125 5 260 (Ta=25C) Unit mA A V mW V V V mA mA mW mW C C kV C *1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1minute, f=60Hz *3 For 10s Electro-optical Characteristics Input Output Transfer characteristics Symbol Parameter VF Forward voltage Peak forward voltage VFM Reverse current IR Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Emitter-base breakdown voltage BVEBO Collector-base breakdown voltage BVCBO Current transfer ratio IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Floating capacitance Cf Cut-off frequency fC tr Rise time Response time tf Fall time Conditions IF=10mA IFM=0.5V VR=4V V=0, f=1kHz VCE=200V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IC=0.1mA, IF=0 IF=1mA, VCE=2V IF=20mA, IC=100mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=2V, IC=20mA, RL=100 -3dB VCE=2V, IC=20mA, RL=100 MIN. - - - - - 300 6 300 10 - 5x1010 - 1 - - TYP. 1.2 - - 30 - - - - 40 - 1x1011 0.6 7 100 20 MAX. 1.4 3.0 10 250 1 000 - - - 150 1.2 - 1.0 - 300 100 (Ta=25C) Unit V V A pF nA V V V mA V pF kHz s s Sheet No.: D2-A04502FEN 5 PC725V0NSZXF Series Model Line-up Lead Form Through-Hole Package DIN EN60747-5-2 SMT Gullwing Sleeve 50pcs/sleeve ------ Approved ------ Approved ------ Wide SMT Gullwing Taping 1 000pcs/reel Approved ------ Approved Model No. PC725V0NSZXF PC725V0YSZXF PC725V0NIZXF PC725V0YIZXF PC725V0NIPXF PC725V0YIPXF PC725V0NUZXF PC725V0YUZXF Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A04502FEN 6 PC725V0NSZXF Series Fig.2 Diode Power Dissipation vs. Ambient Temperature Fig.1 Forward Current vs. Ambient Temperature 60 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 -25 0 25 50 55 75 100 80 70 60 40 20 0 -25 125 0 Ambient temperature Ta (C) 500 350 Total power dissipation Ptot (mW) 300 250 200 150 100 400 300 200 100 50 0 -25 0 25 50 75 100 0 -25 125 0 Ambient temperature Ta (C) Fig.5 Peak Forward Current vs. Duty Ratio 25 50 75 100 Ambient temperature Ta (C) Ta=75C Pulse width100s Ta=25C Forward current IF (mA) 50C 1 0.1 0.01 10-3 10-2 10-1 125 Fig.6 Forward Current vs. Forward Voltage 10 Peak forward current IFM (A) 125 Fig.4 Total Power Dissipation vs. Ambient Temperature Fig.3 Collector Power Dissipation vs. Ambient Temperature Collector power dissipation PC (mW) 25 50 55 75 100 Ambient temperature Ta (C) 25C 0C 100 -25C 10 1 1 0 Duty ratio 0.5 1 1.5 2 2.5 3 3.5 Forward voltage VF (V) Sheet No.: D2-A04502FEN 7 PC725V0NSZXF Series Fig.7 Current Transfer Ratio vs. Forward Current Current transfer ratio CTR (%) 7 000 160 VCE=2V Ta=25C 6 000 5 000 4 000 IF=5mA RBE= RBE=1M RBE=500k 3 000 RBE=200k 2 000 1 000 3mA 2mA 120 100 1.5mA 80 PC (MAX.) 60 1mA 40 0.7mA 20 RBE=100k 0.5mA 0 0 0.1 1 1 0 10 Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature Collector-emitter saturation voltage VCE(sat) (V) Relative current transfer ratio (%) 4 5 1.2 IF=1mA VCE=2V RBE= 100 50 0 25 50 6 7 75 100 1 0.8 0.6 0.4 0.2 0 -25 0 25 50 75 100 Ambient temperature Ta (C) Fig.11 Collector Dark Current vs. Ambient Temperature Fig.12 Response Time vs. Load Resistance 1 000 VCE=200V RBF= Response time (s) 10-5 10-6 10-7 VCE=2V IC=20mA RBE= Ta=25C tr td 100 tf 10 10-8 10-9 -25 8 IF=20mA IC=100mA RBE= Ambient temperature Ta (C) Collector dark current ICEO (A) 3 Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 150 10-4 2 Collector-emitter voltage VCE (V) Forward current IF (mA) 0 -25 RBE= Ta=25C 140 Collector current IC (mA) 8 000 Fig.8 Collector Current vs. Collector-emitter Voltage ts 0 25 50 75 1 0.01 100 0.1 1 Load resistance RL (k) Ambient temperature Ta (C) Sheet No.: D2-A04502FEN 8 PC725V0NSZXF Series Fig.13 Test Circuit for Response Time Fig.14 Frequency Response 5 VCC Input RD 0 Output Output VCE Voltage gain Av (dB) RL Input VCE=2V IC=20mA RBE= Ta=25C 10% 90% td ts tr tr Please refer to the conditions in Fig.12 -5 10 RL=1k -10 100 -15 -20 -25 0.1 1 10 100 Frequency f (kHz) Fig.15 Test Circuit for Frequency Response VCC RD RL Output VCE Please refer to the conditions in Fig.14 Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A04502FEN 9 PC725V0NSZXF Series Design Considerations Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Recommended Foot Print (reference) SMT Gullwing lead-form Wide SMT Gullwing lead-form 10.2 1.7 1.7 2.54 2.54 2.54 2.54 8.2 2.2 2.2 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A04502FEN 10 PC725V0NSZXF Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A04502FEN 11 PC725V0NSZXF Series Cleaning instructions Solvent cleaning: Solvent temperature should be 45C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A04502FEN 12 PC725V0NSZXF Series Package specification Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 2 5.8 10.8 520 6.7 (Unit : mm) (Unit : mm) Sheet No.: D2-A04502FEN 13 PC725V0NSZXF Series Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D J G I M 5 AX. H H A B C E K Dimensions List A B 0.3 16.0 7.50.1 H I 10.40.1 0.40.05 C 1.750.1 J 4.20.1 D 12.00.1 K 7.80.1 E 2.00.1 F 4.00.1 (Unit:mm) G +0.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 330 17.51.5 e f 231.0 2.00.5 f a b (Unit : mm) c d 1.0 100 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A04502FEN 14 PC725V0NSZXF Series 2. Wide SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F D G E I J MA X. H H A B C Dimensions List A B 24.00.3 11.50.1 H I 0.1 12.2 0.40.05 5 K C 1.750.1 J 4.10.1 D 12.00.1 K 7.60.1 E 2.00.1 (Unit : mm) F G +0.1 4.00.1 1.5-0 Reel structure and Dimensions e d c g a Dimensions List a b 330 25.51.5 e f 1.0 23 2.00.5 f b (Unit : mm) c d 1.0 100 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 1 000pcs/reel] Sheet No.: D2-A04502FEN 15 PC725V0NSZXF Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E221] Sheet No.: D2-A04502FEN 16