Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge.
3 V, SUPER MINIMOLD SILICON MMIC
WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC2745TB,
PC2746TB
The mark shows major revised points.
Document No. PU10443EJ01V0DS (1st edition)
(Previous No. P11511EJ3V0DS00)
Date Published November 2003 CP(K)
DESCRIPTION
The
PC2745TB and
PC2746TB are silicon monolithic integrated circuits designed as buffer amplifier for mobile
communications. These low current amplifiers operate on 3.0 V (1.8 V MIN.).
These ICs are manufactured using our 20 GHz fT NESATIII silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability.
FEATURES
•Supply voltage : Recommended VCC = 2.7 to 3.3 V
Circuit operation VCC = 1.8 to 3.3 V
•Upper limit operating frequency :
PC2745TB; fu = 2.7 GHz TYP.@3 dB bandwidth
PC2746TB; fu = 1.5 GHz TYP.@3 dB bandwidth
•High isolation :
PC2745TB; ISL = 38 dB TYP.@f = 500 MHz
PC2746TB; ISL = 45 dB TYP.@f = 500 MHz
•Power gain :
PC2745TB; GP = 12 dB TYP.@f = 500 MHz
PC2746TB; GP = 19 dB TYP.@f = 500 MHz
•Saturated output power :
PC2745TB; PO(sat) = 1 dBm TYP.@f = 500 MHz
PC2746TB; PO(sat) = 0 dBm TYP.@f = 500 MHz
•High-density surface mounting : 6-pin super minimold package (2.0 1.25 0.9 mm)
APPLICATIONS
•1.5 GHz to 2.5 GHz communication system :
PC2745TB
•800 MHz to 900 MHz communication system :
PC2746TB
ORDERING INFORMATION
Part Number
Package
Marking
Supplying Form
PC2745TB-E3-A
6-pin super minimold
C1Q
•Embossed tape 8 mm wide
•1, 2, 3 pins face the perforation side of the tape
•Qty 3 kpcs/reel
PC2746TB-E3-A
C1R
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
PC2745TB-A,
PC2746TB-A
PHASE-OUT
Data Sheet PU10443EJ1V0DS
PC2745TB,
PC2746TB
PIN CONNECTION
Pin No.
Pin Name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
VCC
PRODUCT LINE-UP (TA = +25C, VCC = 3.0 V, ZS = ZL = 50 )
Part No.
fu
(GHz)
PO(sat)
(dBm)
GP
(dB)
NF
(dB)
ICC
(mA)
Package
Making
PC2745T
2.7
1.0
12
6.0
7.5
6-pin minimold
C1Q
PC2745TB
6-pin super minimold
PC2746T
1.5
0
19
4.0
7.5
6-pin minimold
C1R
PC2746TB
6-pin super minimold
PC2747T
1.8
7.0
12
3.3
5.0
6-pin minimold
C1S
PC2747TB
6-pin super minimold
PC2748T
0.2 to 1.5
3.5
19
2.8
6.0
6-pin minimold
C1T
PC2748TB
6-pin super minimold
PC2749T
2.9
6.0
16
4.0
6.0
6-pin minimold
C1U
PC2749TB
6-pin super minimold
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Caution The package size distinguish between minimold and super minimold.
SYSTEM APPLICATION EXAMPLE
DIGITAL CELLULAR SYSTEM BLOCK DIAGRAM
Marking is an example of
PC2745TB
PHASE-OUT
Data Sheet PU10443EJ1V0DS
PC2745TB,
PC2746TB
PIN EXPLANATION
Pin
No.
Pin Name
Applied
Voltage
(V)
Pin
Voltage
(V)Note
Function and Applications
Internal Equivalent Circuit
1
INPUT
0.87
Signal input pin. A internal matching
circuit, configured with resistors, enables
50 connection over a wide band. this
pin must be coupled to signal source with
capacitor for DC cut.
0.82
2
3
5
GND
0
Ground pin. This pin should be connected
to system ground with minimum
inductance. Ground pattern on the board
should be formed as wide as possible. All
the ground pins must be connected
together with wide ground pattern to
decrease impedance difference.
4
OUTPUT
1.95
Signal output pin. A internal matching
circuit, configured with resistors, enables
50 connection over a wide band. This
pin must be coupled to next stage with
capacitor for DC cut.
2.54
6
VCC
2.7 to
3.3
Power supply pin. This pin should be
externally equipped with bypass capacity to
minimize ground impedance.
Note Pin voltage is measured at VCC = 3.0 V. Above:
PC2745TB, Below:
PC2746TB
PHASE-OUT
Data Sheet PU10443EJ1V0DS
PC2745TB,
PC2746TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25C
4.0
V
Circuit Current
ICC
TA = +25C
16
mA
Power Dissipation
PD
TA = +85C Note
270
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Input Power
Pin
TA = +25C
0
dBm
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
2.7
3.0
3.3
V
ELECTRICAL CHARACTERISTICS
(TA = +25C, VCC = 3.0 V, ZS = ZL = 50 , unless otherwise specified)
Parameter
Symbol
Test Conditions
PC2745TB
PC2746TB
Unit
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
Circuit Current
ICC
No signal
5.0
7.5
10.0
5.0
7.5
10.0
mA
Power Gain
GP
f = 500 MHz
9
12
14
16
19
21
dB
Noise Figure
NF
f = 500 MHz
6.0
7.5
4.0
5.5
dB
Upper Limit Operating Frequency
fu
3 dB down below
from gain at f =
0.1 GHz
2.3
2.7
1.1
1.5
GHz
Isolation
ISL
f = 500 MHz
33
38
40
45
dB
Input Return Loss
RLin
f = 500 MHz
8
11
10
13
dB
Output Return Loss
RLout
f = 500 MHz
2.5
5.5
5.5
8.5
dB
Saturated Output Power
PO(sat)
f = 500 MHz,
Pin = 6 dBm
4.0
1.0
3.0
0
dBm
PHASE-OUT
Data Sheet PU10443EJ1V0DS
PC2745TB,
PC2746TB
STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25C, VCC = 3.0 V, ZS = ZL = 50 )
Parameter
Symbol
Test Conditions
Reference Value
Unit
PC2745TB
PC2746TB
Circuit Current
ICC
VCC = 1.8 V, No signal
4.5
4.5
mA
Power Gain
GP
VCC = 3.0 V, f = 1.0 GHz
VCC = 3.0 V, f = 2.0 GHz
VCC = 1.8 V, f = 0.5 GHz
12.0
11.0
7.0
18.5
14.0
dB
Noise Figure
NF
VCC = 3.0 V, f = 1.0 GHz
VCC = 3.0 V, f = 2.0 GHz
VCC = 1.8 V, f = 0.5 GHz
5.5
5.7
8.0
4.2
5.0
dB
Upper Limit
Operating
Frequency
fu
VCC = 1.8 V, 3 dB down below from gain at f = 0.1 GHz
1.8
1.1
GHz
Isolation
ISL
VCC = 3.0 V, f = 1.0 GHz
VCC = 3.0 V, f = 2.0 GHz
VCC = 1.8 V, f = 0.5 GHz
33
30
35
38
37
dB
Input Return
Loss
RLin
VCC = 3.0 V, f = 1.0 GHz
VCC = 3.0 V, f = 2.0 GHz
VCC = 1.8 V, f = 0.5 GHz
13.0
14.0
6.5
10.0
10.0
dB
Output Return
Loss
RLout
VCC = 3.0 V, f = 1.0 GHz
VCC = 3.0 V, f = 2.0 GHz
VCC = 1.8 V, f = 0.5 GHz
6.5
8.5
6.0
8.5
9.5
dB
Saturated
Output Power
PO(sat)
VCC = 3.0 V, f = 1.0 GHz, Pin = 6 dBm
VCC = 3.0 V, f = 2.0 GHz, Pin = 6 dBm
VCC = 1.8 V, f = 0.5 GHz, Pin = 10 dBm
2.5
3.5
11.0
1.0
8.0
dBm
3rd Order
Intermodulation
Distortion
IM3
VCC = 3.0 V, Pout = 10 dBm, f1 = 500 MHz, f2 = 502 MHz
VCC = 1.8 V, Pout = 20 dBm, f1 = 500 MHz, f2 = 502 MHz
VCC = 3.0 V, Pout = 10 dBm, f1 = 1 000 MHz, f2 = 1 002 MHz
30.0
31.0
26.0
26.0
37.0
dBc
PHASE-OUT
Data Sheet PU10443EJ1V0DS
PC2745TB,
PC2746TB
TEST CIRCUIT
EXAMPLE OF APPLICATION CIRCUIT
The application circuits and their parameters are for references only and are not intended for use in actual design-ins.
CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS
Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors
for the input and output pins.
The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias
can be supplied against VCC fluctuation.
The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial
impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus
perform as high pass filters, suppressing low frequencies to DC.
To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of
under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling
capacitors are determined by equation, fc = 1/(2RC).
PHASE-OUT
Data Sheet PU10443EJ1V0DS
PC2745TB,
PC2746TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS
OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC
(P11976E).
COMPONENT LIST
Value
C
1 000 pF
PHASE-OUT
Data Sheet PU10443EJ1V0DS
PC2745TB,
PC2746TB
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
PC2745TB
Remark The graphs indicate nominal characteristics.
PHASE-OUT
Data Sheet PU10443EJ1V0DS
PC2745TB,
PC2746TB
PC2745TB
Remark The graphs indicate nominal characteristics.
PHASE-OUT
Data Sheet PU10443EJ1V0DS
10
PC2745TB,
PC2746TB
SMITH CHART (TA = +25C, VCC = 3.0 V)
PC2745TB
S11-FREQUENCY
S22-FREQUENCY
PHASE-OUT
Data Sheet PU10443EJ1V0DS
11
PC2745TB,
PC2746TB
S-PARAMETERS
PHASE-OUT
Data Sheet PU10443EJ1V0DS
12
PC2745TB,
PC2746TB
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
PC2746TB
Remark The graphs indicate nominal characteristics.
PHASE-OUT
Data Sheet PU10443EJ1V0DS
13
PC2745TB,
PC2746TB
PC2746TB
Remark The graphs indicate nominal characteristics.
PHASE-OUT
Data Sheet PU10443EJ1V0DS
14
PC2745TB,
PC2746TB
SMITH CHART (TA = +25C, VCC = 3.0 V)
PC2746TB
S11-FREQUENCY
S22-FREQUENCY
PHASE-OUT
Data Sheet PU10443EJ1V0DS
15
PC2745TB,
PC2746TB
S-PARAMETERS
PHASE-OUT
Data Sheet PU10443EJ1V0DS
16
PC2745TB,
PC2746TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
PHASE-OUT
Data Sheet PU10443EJ1V0DS
17
PC2745TB,
PC2746TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the VCC pin.
(4) The DC cut capacitor must be attached to input pin and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature) : 215C or below
Time at temperature of 200C or higher : 25 to 40 seconds
Preheating time at 120 to 150C : 30 to 60 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
PHASE-OUT
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PHASE-OUT
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Authorized Distributor
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UPC2746TB-A UPC2746TB-EVAL