Datasheet CMOS LDO Regulator Series for Automotive Ultra-Small Package FULL CMOS LDO Regulator BUxxJA2MNVX-C series General Description Key Specifications BUxxJA2MNVX-C series are high-performance FULL CMOS regulators with 200mA output, which are mounted on versatile package SSON004R1010 (1.00mm x 1.00 mm x 0.60mm). These devices have excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 35A. They are most appropriate for various applications such as power supplies for radar and camera of the automotive. Input Voltage Range: 1.7V to 6.0V Output Voltage: 1.0V to 3.4V Output Voltage Accuracy: 2.0%(Ta=-40C to 125C) Output Current: 200mA(Max) Standby Current: 35A (Typ) Operating Temperature Range: -40C to +125C Package Features SSON004R1010 : W(Typ) x D(Typ) x H(Max) 1.00mm x 1.00mm x 0.60mm AEC-Q100 Qualified(Note 1) High Accuracy Output Low Current Consumption Compatible With Small Ceramic Capacitor(CIN=CO=0.47F) With Built-in Output Discharge Circuit High Ripple Rejection ON/OFF Control of Output Voltage Built-in Over Current Protection Circuit Built-in Thermal Shutdown Circuit (Note 1) Grade1 SSON004R1010 Applications Radar and camera for automotive, etc. Typical Application Circuit STBY VIN CIN 0.47F STBY VOUT VIN VOUT CO 0.47F GND GND GND Figure 1. Application Circuit Product structure : Silicon monolithic integrated circuit .www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 This product has no designed protection against radioactive rays 1/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Ordering Information B U Part Number x x J A 2 M Output Voltage Output Current Category 10 : 1.0V 200mA M:Automotive 11 : 1.1V 12 : 1.2V 1C : 1.25V 15 : 1.5V 18 : 1.8V 25 : 2.5V 28 : 2.8V 2J : 2.85V 29 : 2.9V 30 : 3.0V 33 : 3.3V 34 : 3.4V N V X - Package C TL Product Rank C:for Automotive Packaging and forming specification TL: Embossed tape and reel NVX:SSON004R1010 Block Diagram Figure 2. Block Diagram Pin Descriptions Pin Configurations 4 VIN Pin No. Pin name 1 VOUT Output Voltage 2 GND Ground 3 STBY ON/OFF control of output voltage (High: ON, Low: OFF) 4 VIN Back side EXP-PAD 3 STBY Pin Function EXP-PAD Power Supply Voltage Connect to GND 1 VOUT 2 GND SSON004R1010 (TOP VIEW)(Note1) (Note1)The dashed line is the electrode position of the back side. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Absolute Maximum Ratings Parameter Symbol Rating Unit VIN -0.3 to +6.5 V STBY Voltage VSTBY -0.3 to +6.5 V Operating Temperature Range Topr -40 to +125 C Storage Temperature Range Tstg -55 to +150 C Tjmax +150 C Power Supply Voltage Maximum junction temperature Recommended Operating Range Parameter Power Supply Voltage STBY Voltage Maximum Output Current Symbol Min Max Unit VIN 1.7 6.0 V VSTBY 0.0 6.0 V IOUT - 200 mA Recommended Operating Conditions Parameter Symbol Min Input Capacitor CIN (Note 1) Output Capacitor CO (Note 1) 0.22 0.22 Typ Max Unit Conditions 0.47 - F Ceramic capacitor recommended 0.47 - F Ceramic capacitor recommended (Note 1) Caution that the capacitance to be kept higher than this specified values under all conditions considering temperature, DC bias, etc. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) 1s(Note 3) 2s2p(Note 4) Unit SSON004R1010 Junction to Ambient JA 450.2 97.1 C/W Junction to Top Characterization Parameter (Note 2) JT 99 22 C/W (Note 1) Based on JESD51-2A(Still-Air). (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 m Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Thermal Via(Note 5) Pitch Diameter 1.20 mm 0.30 mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 m 74.2 mm x 74.2 mm 35 m 74.2 mm x 74.2 mm 70 m (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 4/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Electrical Characteristics (Ta= -40C to 125C, VIN=VOUT+1.0V (Note 1), STBY=VIN, CIN=0.47F, CO=0.47F, unless otherwise specified.) Parameter Symbol Min Limit Typ Max Unit Conditions [Regulator Block] VOUT x0.98 - VOUT x1.02 VOUT -36mV - VOUT +36mV IOUT=0.01mA, VOUT<1.8V VOUT x0.97 - VOUT x1.03 IOUT=0.01mA to 200mA VOUT1.8V VOUT -54mV - VOUT +54mV IIN - 35 90 A IOUT=0mA Circuit Current (STBY) ISTBY - - 2.0 A STBY=0V Ripple Rejection Ratio RR 45 70 - dB VRR=-20dBV, fRR=1kHz IOUT=10mA, Ta=25C - 800 1100 mV 1.0V VOUT < 1.2V(IOUT=200mA) - 600 900 mV 1.2V VOUT < 1.5V(IOUT=200mA) - 440 830 mV 1.5V VOUT < 1.8V(IOUT=200mA) - 380 710 mV 1.8V VOUT < 2.5(IOUT=200mA) - 280 620 mV 2.5V VOUT 2.6(IOUT=200mA) - 260 580 mV 2.7V VOUT 2.85(IOUT=200mA) - 240 530 mV 2.9V VOUT 3.1V(IOUT=200mA) - 220 490 mV 3.2V VOUT 3.4V(IOUT=200mA) Output Voltage 1 VOUT1 Output Voltage 2 V VOUT2 Circuit Current Dropout Voltage IOUT=0.01mA, VOUT1.8V V IOUT=0.01mA to 200mA VOUT<1.8V VSAT VIN=VOUT+1.0V to 5.5V (Note 2) IOUT=0.01mA Line Regulation VDL - 2 20 mV Load Regulation VDLO - 10 80 mV IOUT=0.01mA to 100mA [Over Current Protection (OCP) Block] Limit Current ILMAX 220 400 700 mA ILMAX@VOUTx0.95, Ta=25C Short Current ISHORT 20 70 150 mA VOUT=0V, Ta=25C Discharge Resistor RDSC 20 50 80 VIN=4.0V, STBY=0V VOUT=4.0V, Ta=25C STBY Pin Pull-down Current ISTB 0.1 0.6 2.0 A STBY=1.5V ON VSTBH 1.2 - 6.0 V OFF VSTBL 0 - 0.3 V [Standby Block] STBY Control Voltage (Note 1) VIN=2.5V for VOUT1.5V (Note 2) VIN=2.5V to 3.6V for VOUT1.5V www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 5/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Reference data BU33JA2MNVX-C (Ta=25C unless otherwise specified.) Ta=25C Ta=25C IOUT=0mA IOUT=50mA IOUT=200mA IOUT=0mA IOUT=0.1mA IOUT=50mA IOUT=200mA VIN=STBY VIN=STBY VIN (V) VIN (V) Figure 3. Output Voltage Figure 4. Output Voltage Ta=-40C Ta=25C Ta=125C Ta=-40C Ta=25C Ta=125C Circuit Current (A) IOUT=0mA VIN=STBY VIN=STBY VIN (V) VIN (V) Figure 5. Circuit Current www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Figure 6. VSTBY - ISTB 6/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Reference data BU33JA2MNVX-C (Ta=25C unless otherwise specified.) VIN=4.3V VSTBY=1.5V Ta=25C Ta=-40C Ta=25C Ta=125C Ta=-40C Ta=125C VIN=4.3V VSTBY=1.5V Figure 8. Load Regulation Figure 7. IOUT - IGND VIN=0.98xVOUT VSTBY=1.5V VIN=3.8V Ta=125C VIN=4.3V Ta=25C VIN=5.5V Ta=-40C Temp=25C VSTBY=1.5V Figure 10. OCP Threshold Figure 9. Dropout Voltage www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 7/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Reference data BU33JA2MNVX-C (Ta=25C unless otherwise specified.) VIN=4.3V VSTBY=1.5V IOUT=0.1mA Ta=-40C Ta=25C Ta=125C VIN=4.3V Figure 11. STBY Threshold Figure 12. VOUT - Temp Circuit Current (STBY) (A) VIN=4.3V VSTBY=1.5V IOUT=0.1mA Figure 13. IGND - Temp www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 VIN=4.3V VSTBY=0.0V Figure 14. Circuit Current (STBY) - Temp 8/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Reference data BU33JA2MNVX-C (Ta=25C unless otherwise specified.) 100 Output Voltage (V) 0 3.3 0 3.1 0 Ta=-40C Ta=25C Ta=125C VIN=4.3V VSTBY=1.5V CO=0.47F 0 3.5 0 3.3 0 3.1 0 200 IOUT=100mA 0mA VIN=4.3V VSTBY=1.5V CO=0.47F Figure 17. Load Response 100 0 Output Voltage (V) Output Voltage (V) 0 www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 VIN=4.3V VSTBY=1.5V CO=0.47F 3.5 0 3.3 0 3.1 0 Ta=-40C Ta=25C Ta=125C Output Current (mA) 100 Output Current (mA) 200 IOUT=0mA 100mA Ta=-40C Ta=25C Ta=125C Ta=-40C Ta=25C Ta=125C Figure 16. Load Response Figure 15. Load Response 3.5 0 3.3 0 3.1 0 100 IOUT=50mA 0mA Output Voltage (V) 3.5 0 200 Output Current (mA) IOUT=0mA 50mA Output Current (mA) 200 VIN=4.3V VSTBY=1.5V CO=0.47F Figure 18. Load Response 9/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Reference data BU33JA2MNVX-C (Ta=25C unless otherwise specified.) 3.5 0 3.3 0 3.1 0 Ta=-40C Ta=25C Ta=125C VIN=4.3V VSTBY=1.5V CO=0.47F 3.5 0 3.3 0 3.1 0 Ta=-40C Ta=25C Ta=125C VIN=4.3V VSTBY=1.5V CO=0.47F Figure 20. Load Response Figure 19. Load Response 0 200 IOUT=100mA 50mA 100 0 Output Current (mA) 100 Output Current (mA) 200 IOUT=50mA 100mA 3.5 0 3.3 0 3.1 0 Ta=-40C Ta=25C Ta=125C VIN=4.3V VSTBY=1.5V CO=0.47F Output Voltage (V) Output Voltage (V) 100 0 Output Voltage (V) Output Voltage (V) 0 200 IOUT=200mA 0mA Output Current (mA) 100 Output Current (mA) 200 IOUT=0mA 200mA Figure 21. Load Response www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3.5 0 3.3 0 3.1 0 Ta=-40C Ta=25C Ta=125C VIN=4.3V VSTBY=1.5V CO=0.47F Figure 22. Load Response 10/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Reference data BU33JA2MNVX-C (Ta=25C unless otherwise specified.) 1.0 4.0 2.0 0.0 CO=0.47F CO=1.0F CO=2.2F 0.0 4.0 2.0 0.0 CO=0.47F CO=1.0F CO=2.2F VIN=4.3V IOUT=0mA Figure 23. Start Up Time IOUT=0mA 4.0 2.0 VIN=4.3V IOUT=0mA 2.0 0.0 Output Voltage (V) Output Voltage (V) 0.0 4.0 VSTBY=0V VIN Figure 25. Start Up Time (VIN=STBY) IOUT=0mA www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 STBY Voltage (V) 2.0 STBY Voltage (V) 4.0 CO=0.47F CO=1.0F CO=2.2F VIN=4.3V IOUT=200mA Figure 24. Start Up Time IOUT=200mA VSTBY=0V VIN 0.0 2.0 1.0 Output Voltage (V) Output Voltage (V) 0.0 VSTBY=0V 1.5V STBY Voltage (V) 2.0 STBY Voltage (V) VSTBY=0V 1.5V 4.0 2.0 0.0 CO=0.47F CO=1.0F CO=2.2F VIN=4.3V IOUT=200mA Figure 26. Start Up Time (VIN=STBY) IOUT=200mA 11/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Reference data BU33JA2MNVX-C (Ta=25C unless otherwise specified.) 4.0 2.0 5.3 Output Voltage (V) Output Voltage (V) 0.0 6.3 VIN=4.3V 5.3V 4.3V CO=0.47F CO=1.0F CO=2.2F 0.0 Ta=-40C Ta=25C Ta=125C 3.31 4.3 Input Voltage (V) 1.0 VSTBY=1.5V 0V STBY Voltage (V) 2.0 3.30 3.29 Ta=-40C Ta=25C Ta=125C VIN=4.3V IOUT=0mA Figure 28. VIN Response Figure 27. Discharge Time www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 12/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Power Dissipation SSON004R1010 IC mounted on ROHM standard board based on JEDEC. : 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm x 0 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.57 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 1.5 1.29W Power Dissipation : Pd [W] 1.2 0.9 0.6 0.3 0.28W 0.0 0 25 50 75 100 125 Ambient Temperature : Ta [C] Figure 29. SSON004R1010 Package Data (Reference Data) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 : 4-layer PCB (2 inner layers copper foil area of PCB, copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm) Board material: FR4 Board size: 114.3 mm x 76.2 mm x 1.6 mmt Mount condition: PCB and exposed pad are soldered. Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper. 2 inner layers copper foil area of PCB : 74.2 mm x 74.2 mm, 1 oz. copper. Copper foil area on the reverse side of PCB 150 : 74.2 mm x 74.2 mm, 2 oz. copper. Condition : JA = 450.2 C/W, JT (top center) = 99 C/W Condition : JA = 97.1 C/W, JT (top center) = 22 C/W 13/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Thermal Design Within this IC, the power consumption is decided by the dropout voltage condition, the load current and the circuit current. Refer to power dissipation curves illustrated in Figure 29 when using the IC in an environment of Ta 25 C. Even if the ambient temperature Ta is at 25 C, depending on the input voltage and the load current, chip junction temperature can be very high. Consider the design to be Tj Tjmax = 150 C in all possible operating temperature range. Should by any condition the maximum junction temperature Tjmax = 150 C rating be exceeded by the temperature increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in the thermal design by the following method is used to calculate the junction temperature Tj. Tj can be calculated by either of the two following methods. 1. The following method is used to calculate the junction temperature Tj. Tj = Ta + PC x JA Where: Tj Ta PC JA : Junction Temperature : Ambient Temperature : Power Consumption : Thermal Impedance (Junction to Ambient) 2. The following method is also used to calculate the junction temperature Tj. Tj = TT + PC x JT Where: Tj TT PC JT : Junction Temperature : Top Center of Case's (mold) Temperature : Power consumption : Thermal Impedance (Junction to Top Center of Case) The following method is used to calculate the power consumption Pc (W). Pc = (VIN - VOUT) x IOUT + VIN x IGND Where: PC VIN VOUT IOUT IGND : Power Consumption : Input Voltage : Output Voltage : Load Current : Circuit Current www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 14/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Calculation Example (SSON004R1010) If VIN = 3.0 V, VOUT = 1.8 V, IOUT = 50 mA, IGND = 35 A, the power consumption Pc can be calculated as follows: PC = (VIN - VOUT) x IOUT + VIN x IGND = (3.0 V - 1.8 V) x 50 mA + 3.0 V x 35 A = 0.06 W At the ambient temperature Tamax = 125C, the thermal Impedance (Junction to Ambient)JA = 97.1 C / W ( 4-layer PCB ), Tj = Tamax + PC x JA = 125 C + 0.06 W x 97.1 C / W = 130.8 C When operating the IC, the top center of case's (mold) temperature TT = 100 C, JT = 22 C / W (4-layer PCB), Tj = TT + PC x JT = 100 C + 0.06 W x 22 C / W = 101.3C For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and thermal via between thermal land pad. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 15/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Linear Regulators Surge Voltage Protection The following provides instructions on surge voltage overs absolute maximum ratings polarity protection for ICs. 1. Applying positive surge to the input If the possibility exists that surges higher than absolute maximum ratings 6.5 V will be applied to the input, a Zener Diode should be placed to protect the device in between the VIN and the GND as shown in the figure 30. IN VIN D1 OUT GND CIN VOUT COUT Figure 30. Surges Higher than 6.5 V will be Applied to the Input 2. Applying negative surge to the input If the possibility exists that surges lower than absolute maximum ratings -0.3 V will be applied to the input, a Schottky Diode should be place to protect the device in between the VIN and the GND as shown in the figure 31. IN VIN D1 OUT GND CIN VOUT COUT Figure 31. Surges Lower than -0.3 V will be Applied to the Input Linear Regulators Reverse Voltage Protection A linear regulator integrated circuit (IC) requires that the input voltage is always higher than the regulated voltage. Output voltage, however, may become higher than the input voltage under specific situations or circuit configurations, and that reverse voltage and current may cause damage to the IC. A reverse polarity connection or certain inductor components can also cause a polarity reversal between the input and output pins. The following provides instructions on reversed voltage polarity protection for ICs. 1. about Input /Output Voltage Reversal In an MOS linear regulator, a parasitic element exists as a body diode in the drain-source junction portion of its power MOSFET. Reverse input/output voltage triggers the current flow from the output to the input through the body diode. The inverted current may damage or destroy the semiconductor elements of the regulator since the effect of the parasitic body diode is usually disregarded for the regulator behavior (Figure 32). IR VOUT VIN Error AMP. VREF Figure 32. Reverse Current Path in an MOS Linear Regulator www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 16/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series An effective solution to this is an external bypass diode connected in-between the input and output to prevent the reverse current flow inside the IC (see Figure 33). Note that the bypass diode must be turned on before the internal circuit of the IC. Bypass diodes in the internal circuits of MOS linear regulators must have low forward voltage V F. Some ICs are configured with current-limit thresholds to shut down high reverse current even when the output is off, allowing large leakage current from the diode to flow from the input to the output; therefore, it is necessary to choose one that has a small reverse current. Specifically, select a diode with a rated peak inverse voltage greater than the input to output voltage differential and rated forward current greater than the reverse current during use. D1 IN VIN OUT VOUT GND CIN COUT Figure 33. Bypass Diode for Reverse Current Diversion The lower forward voltage (VF) of Schottky barrier diodes cater to requirements of MOS linear regulators, however the main drawback is found in the level of their reverse current (I R), which is relatively high. So, one with a low reverse current is recommended when choosing a Schottky diode. The VR-IR characteristics versus temperatures show increases at higher temperatures. If VIN is open in a circuit as shown in the following Figure 34 with its input/output voltage being reversed, the only current that flows in the reverse current path is the bias current of the IC. Because the amperage is too low to damage or destroy the parasitic element, a reverse current bypass diode is not required for this type of circuit. ONOFF IBIAS VIN IN VOUT OUT GND CIN COUT Figure 34. Open VIN 2. Protection against Input Reverse Voltage Accidental reverse polarity at the input connection flows a large current to the diode for electrostatic breakdown protection between the input pin of the IC and the GND pin, which may destroy the IC (see Figure 35). A Schottky barrier diode or rectifier diode connected in series with the power supply as shown in Figure 36 is the simplest solution to prevent this from happening. The solution, however, is unsuitable for a circuit powered by batteries because there is a power loss calculated as VF x IOUT, as the forward voltage VF of the diode drops in a correct connection. The lower VF of a Schottky barrier diode than that of a rectifier diode gives a slightly smaller power loss. Because diodes generate heat, care must be taken to select a diode that has enough allowance in power dissipation. A reverse connection allows a negligible reverse current to flow in the diode. VIN IN OUT VOUT D1 - VIN CIN GND COUT CIN + GND OUT GND VOUT COUT GND Figure 35. Current Path in Reverse Input Connection www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 IN 17/23 Figure 36. Protection against Reverse Polarity 1 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Figure 37 shows a circuit in which a P-channel MOSFET is connected in series with the power. The diode located in the drain-source junction portion of the MOSFET is a body diode (parasitic element). The voltage drop in a correct connection is calculated by multiplying the resistance of the MOSFET being turned on by the output current IOUT, therefore it is smaller than the voltage drop by the diode (see Figure 36) and results in less of a power loss. No current flows in a reverse connection where the MOSFET remains off. If the voltage taking account of derating is greater than the voltage rating of MOSFET gate-source junction, lower the gate-source junction voltage by connecting voltage dividing resistors as shown in Figure 38. Q1 VIN Q1 VIN IN CIN OUT GND VOUT VOUT IN R1 COUT R2 CIN OUT GND COUT Figure 38. Protection against Reverse Polarity 3 Figure 37. Protection against Reverse Polarity 2 3. Protection against Output Reverse Voltage when Output Connect to an Inductor If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground upon the output voltage turning off. In-between the IC output and ground pins is a diode for preventing electrostatic breakdown, in which a large current flows that could destroy the IC. To prevent this from happening, connect a Schottky barrier diode in parallel with the diode (see Figure 39). Further, if a long wire is in use for the connection between the output pin of the IC and the load, observe the waveform on an oscilloscope, since it is possible that the load becomes inductive. An additional diode is needed for a motor load that is affected by its counter electromotive force, as it produces an electrical current in a similar way. VIN IN VOUT OUT GND CIN COUT GND D1 XLL GND Figure 39. Current Path in Inductive Load (Output: Off) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 18/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Operation Notes 1. Absolute maximum ratings Use of the IC exceeding the absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the IC. Damage mode of the IC in such case cannot be assumed (e.g. short mode or open mode). If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. 2. GND potential The potential of the GND pin must be the minimum potential in the system in all operating conditions. Never connect a potential lower than GND to any pin, even if only transiently. 3. Thermal design Use a thermal design which ensure sufficient margin to the power dissipation rating (Pd) under actual operating conditions. 4. Inter-pin shorts and mounting errors Caution on the orientation and positioning of the IC for mounting on printed circuit boards. Improper mounting or shorts betw een pins may result in damage to the IC. 5. Common impedance Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a minimum. 6. Voltage of STBY pin To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Sett ing STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output dischar ge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 7. Over-current protection circuit (OCP) This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not be designed under the assumption th at this circuitry will engage. 8. Thermal shutdown circuit (TSD) This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds approximately 150C. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee operation or act as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry will engage. 9. Input/output capacitor Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as close to the IC pins as possible. The input capacitor helps to counteract increases in power supply impedance, and increases stability in applications with long or winding power supply traces. The output capacitance value is directly related to the overall stability and transient response of the regulator, and should be set to the largest possible value for the application to increase these characteristics. During design, keep in mind that in general, ceramic capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease over time. Confirm these details before choosing appropriate capacitors for your application. (Refer to the technical note of the intended ceramic capacitors.) 10. About the equivalent series resistance (ESR) of a ceramic capacitor Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the below. Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application. CIN=0.47F, CO=0.47F, Temp=25C Unstable region Stable region Figure 40. Stable region www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Input/Output Capacitor It is recommended that an input capacitor is placed near pins between the VIN pin and GND as well as an output capacitor between the VOUT pin and GND. The input is valid when the power supply impedance is high or when the PCB trace has significant length. For the output capacitor, the greater the capacitance, the more stable the output will be depending on the load and line voltage variations. However, please check the actual functionality of this capacitor by mounting it on a board for the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and may degrade gradually over continued use. For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application. 10V withstand voltage B1 characteristics GRM188B11A105KA61D 10 0 10V withstand voltage B characteristics Capacitance Change [%] -10 6.3V withstand voltage B characteristics -20 -30 10V withstand voltage F characteristics -40 -50 4V withstand voltage -60 X6S characteristics -70 -80 -90 -100 0 1 2 DC Bias Voltage [V] 3 4 Figure 41. Capacity-bias characteristics (Characteristics Example) I/O Equivalence Circuits 1pin (VOUT) xx Output Voltage [V] (Typ) R1 [k] (Typ) R2 [k] (Typ) 10 1.0 173 185 11 1.1 206 185 12 1.2 241 185 1C 1.25 260 185 15 1.5 352 185 18 1.8 463 185 25 2.5 716 185 28 2.8 821 185 VIN VOUT R1 R2 25 (Typ) 3pin (STBY) 2J 2.85 829 185 29 2.9 847 185 30 3.0 889 185 33 3.3 1001 185 34 3.4 1025 185 4pin (VIN) VIN VIN 2.6M (Typ) IC STBY 55k (Typ) Figure 42. Input / Output equivalent circuit www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 20/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Marking Diagram SSON004R1010 (TOP VIEW) LOT Number Part Number Marking 1PIN MARK Part Number Output Voltage [V] Part Number Marking BU10JA2MNVX-C 1.0 5 BU11JA2MNVX-C 1.1 6 BU12JA2MNVX-C 1.2 4 BU1CJA2MNVX-C 1.25 3 BU15JA2MNVX-C 1.5 2 BU18JA2MNVX-C 1.8 Q BU25JA2MNVX-C 2.5 1 BU28JA2MNVX-C 2.8 U BU2JJA2MNVX-C 2.85 0 BU29JA2MNVX-C 2.9 Ui BU30JA2MNVX-C 3.0 Y BU33JA2MNVX-C 3.3 R BU34JA2MNVX-C 3.4 Yi www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 21/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Physical Dimension and Packing Information Package Name www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 SSON004R1010 22/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 BUxxJA2MNVX-C series Revision History Date Revision 26.Dec.2014 001 New Release. 27.Aug.2015 002 P2 Add Lineup. 11.Apr.2016 003 Applied the ROHM Standard Style and improved understandability. Add Equivalence Circuits. 004 p.1-20 Update of the footer. (Applied the rule.) p.2 The voltage lineup is added. (Output Voltage:1.1V) p.4 Changed the expression from "Power dissipation" to "Thermal Resistance". (Based on the JEDEC standard) p.5 Temperature condition of "Electrical Characteristics" is added. Changed the expression from "Operating Current" to "Circuit Current". p.8 Unified the item name of figure 14 for the parameter name of "Electrical Characteristics". p.13 Changed the expression from "About power dissipation(Pd)" to "Power Dissipation". (Based on the change of p.4) p.14 The item of "Thermal Design" is added. (Based on the change of p.4) p.15 The item of "Calculation Example(SSON004R1010)" is added. (Based on the change of p.4) p.17 Item of VIN is added in I/O Equivalence Circuits and resistance value is listed in I/O Equivalence Circuits. p.18 The lineup of "Marking Diagram" is added. (Output Voltage:1.1V) p.19 Update "Physical Dimension Tape and Reel Information" to the latest version. 005 p.2 Add Lineup. Added the electrode position of the back side to "Pin Configurations" in a dashed line. p.16-18 Added of the operation notes about the use of general linear regulator. p.20 Add Lineup p.21 Add Lineup 006 p.2 Add Lineup p.5 Correction of conditions errors in Ripple Rejection Ratio. p.20 Add Lineup p.21 Add Lineup Others, correction of errors. 21.Mar.2017 12. Mar. 2018 9. Jul. 2018 www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Changes 23/23 TSZ02201-0G5G1AD00060-1-2 9.Jul.2018 Rev.006 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bu10ja2mnvx-c - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bu10ja2mnvx-c SSON004R1010 5000 5000 Taping inquiry Yes