DATA SH EET
Product Specification 1996 Jul 25
INTEGRATED CIRCUITS
P32P4911A
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo
1996 Jul 25 2 853-1850 17093
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
GENERAL DESCRIPTION
The Philips Semiconductors P32P4911A is a high performance BiCMOS read channel IC that provides all of the
functions needed to implement an entire Partial Response Class 4 (PR4) read channel for zoned recording hard disk
drive systems with data rates from 42 to 125 Mbit/s or 33 to 100 Mbit/s. Functional blocks include AGC, programmable
filter, adaptive transversal filter, Viterbi qualifier, 8,9 GCR ENDEC, data synchronizer, time base generator, and FWR
servo.
Programmable functions such as data rate, filter cutoff, filter boost, etc., are controlled by writing to the serial port
registers so no external component changes are required to change zones.
The part requires a single +5V power supply. The Philips Semiconductors P32P4911A utilizes an advanced BiCMOS
process technology along with advanced circuit design techniques which result in high performance devices with low
power consumption.
FEATURES
General:
Register programmable data rates from 42 to 125 Mbit/s or 33 to 100 Mbit/s
Sampled data read channel with Viterbi qualification
Programmable filter for PR4 equalization
Five tap transversal filter with adaptive PR4 equalization
8/9 GCR ENDEC
Data Scrambler/Descrambler
Presettable Precoder State
Programmable write precompensation
Low operating power (0.925 W typical at 5V)
Register programmable power management (<5 mW power down mode)
4-bit nibble and byte-wide bi-directional NRZ data interfaces
8-bit Direct Write mode automatically configured for RCLK = VCO/8
Serial interface port for access to internal program storage registers
Single power supply (5V ± 10%)
Small footprint, 100-lead LQFP package
1996 Jul 25 3
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
BLOCK DIAGRAM
SM00061
Philips Semiconductors P32P4911A
DSCLK
SSBYP
VIA+
VIA– ON+
ON–
OD+
OD– CP
CN
DP
DN
LEVEL OR
HYSTERESIS
PULSE
QUAL
PARALLEL
INTERFACE
BYP
HOLD
LOWZ
FASTREC
CONV
AGC
CHARGE
PUMP
MUX
TEST
POINY
MUX
DECISION
DIRECTED
PHASE
DETECTOR
CHARGE
PUMP
CODE WORD
BOUNDRY
DETECTOR
DAMPING
CONTROL
RCLK
SBD
NRZ0–7
NRZP
VCO SYNC
PATTERN
GEN
WRITE
PRECOMP WD
WD
DWR
DWI
DWI
WCLK
MUX MUX
SG
POWER
DOWN
CONTROL
SDEN
SCLK
SDATA
BYPS
PARALLEL
TO
SERIAL
MUX
DATA SYNCHRONIZER
RG
WG/WG
ATO
DSCLK
DSCLK
1/(N+1)
1/(M+1)
TIME BASE GENERATOR
RCLK
RCLK
SYNC
FIELD
COUNTER
To SFC
TBGOUT
CWBD
CWBD
WRITE
FLIP-FLOP
TBGOUT
CHANQUAL
CHANQUAL
TBGOUT
ASYMM FACTOR
LOW
ASYMM FACTOR
DACs
SG
SQUELCH
VMIN
SFC
DC
OFFSET
CANCEL
LOWZ
SFC
TPD
MUX
EN
AGCRST
UFDC
VCC
AGCDEL
WRDEL LZTO
FDTO
HOLD
HOLD
LOWZ
SQUELCH
UFDC
SFC
MAXREF/2
SERVO
FASTREC
DUAL
“OR” TYPE
SYNC BYTE
DETECTOR
PARITY
GEN/CHK
FULLWAVE
RECTIFIER
VITERBI
DETECTOR
5–TAP
EQUALIZER
2-ADAPTIVE
2-PROG
AGC
CONTROL
LOGIC
SAMPLED
AGC
CHARGE
PUMP
PROGRAMMABLE
7TH-ORDER
LOW-PASS
FILTER
ASYMMETRIC 0’S
SERIAL
PORT
&
CONTROL
REGISTERS
AUTOMATIC
TRAINING & SYNC BYTE
GENERATOR
DESCRAMBLER
SCRAMBLER
PRECODER
9,8
((0,4/4)
DECODER
ATO
TEST
MUX
RCLK
CLOCK
GEN
AGC
AMP
DAC
FROM LEVEL
QUAL
VCO
VCO
CONTROL
LOGIC
2–BR
DAC
AGCREF
VRC
SREF
SDIEN
SEROUT
VPA
VPA
SG
0.2V
2.3V WRT
VPA
REFERENCE
SELVRC
3.2V
REFERENCE
NCLK
TPC
MUX TPE
MUX
PARALLEL
TO
SERIAL
9,8
((0,4/4)
ENCODER NIBBLE
INTERFACE
CHARGE
PUMP
PHASE/
FREQ
DETECTOR
PHASE/
FREQ
DETECTOR
VRDT
TPB–
TPB+
TPA–
TPA+
EQHOLD
PPOL
RDS/RDS
TPE
TPC–
TPC+
TPD–
TPD+
VRX
UFDC
FASTREC
LOWZ
SFWR
AGND3
AGND2
AGND1
DGND2
DGND1
PDWN
VPA3
VPA2
VPA1
VPD2
VPD1
FLTR2–
FLTR2+
FLTR1–
FLTR1+
RR
FREF
MAXREF
TPE
1996 Jul 25 4
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Automatic Gain Control:
Dual mode AGC, analog during acquisition, sampled during data reads
Separate AGC level storage pins for data and servo
Dual rate attack and decay charge pump for rapid AGC recovery (analog)
Programmable, symmetric, charge pump currents for data reads (sampled)
Charge pump currents track programmable data rate during data reads (sampled)
Low drift AGC hold circuitry
Low-Z circuitry at AGC input provides for rapid external coupling capacitor recovery
AGC Amplifier squelch during Low-Z
Wide bandwidth, precision full-wave rectifier
Programmable AGC controls
Separate external input pins for AGC hold, fast recovery, and Low-Z control
or Internal Low-Z and fast decay timing for rapid transient recovery and AGC acquisition. Timing set with external
resistors (2). Ultra fast decay current set with external resistor. AGC input impedance vs LOWZ = 5:1.
2-bit DAC to control AGC voltage in servo mode between 1.1 and 1.4 V
Filter/Equalizer:
Programmable, 7-pole, continuous time filter provides:
Channel filter and pulse slimming equalization for equalization to PR4
Programmable cutoff frequency from 4 to 34 MHz
Programmable boost /equalization of 0 to 13 dB
Programmable "zeros" equalization provides time asymmetry compensation
±0.5 ns group delay variation from 0.3ƒc to ƒc, with ƒc = 34 MHz
Minimizes size and power
Low-Z switch at filter output for fast offset recovery
No external coupling capacitors required
DC offset compensation provided at filter output
Five tap transversal filter for fine equalization to PR4
Self adapting inner taps (symmetric)
Programmable outer taps (symmetric, 4-bits)
Equalization hold input
"Zeros" channel quality output
Amplitude asymmetry factor output
Pulse Qualification:
Sampled Viterbi qualification of signal equalized to PR4
Register programmable window or hysteresis pulse qualifier for servo reads
Selectable RDS pulse width and polarity for servo gray code reads
1996 Jul 25 5
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Time Base Generator:
Less than 1% frequency resolution
Up to 141 MHz frequency output
Independent M and N divide-by registers
No active external components required
Data Separator:
Fully integrated data separator includes data synchronizer and 8,9 GCR ENDEC
Register programmable to 125 Mbit/s operation
Fast Acquisition, sampled data phase lock loop
Decision directed clock recovery from data samples
Adaptive clock recovery thresholds
Programmable damping ratio for data synchronizer PLL is constant for all data rates
Data scrambler/descrambler to reduce fixed pattern effects
4-bit nibble and byte-wide NRZ data interfaces
Nibble clock is available during byte-wide mode
Time base tracking, programmable write precompensation
Differential PECL write data output
Integrated sync byte detection, single byte or dual ("or" type)
Semi-auto training and sync byte generation available for single sync byte operation
Surface defect scan mode
Servo:
Wide bandwidth, precision full-wave rectifier
Separate, automatically selected, registers for servo ƒc, boost, and threshold
SEROUT and SREF pins to provide a differential full-wave rectified servo signal
SELVRC and SDIEN control pins for dc gain and offset calibration
AGCREF output to provide 2-bit DAC-controlled voltage for applications requiring a fixed gain in servo mode
1996 Jul 25 6
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
FUNCTIONAL DESCRIPTION
The Philips Semiconductors P32P4911A implements a complete high performance PR4 read channel, including an
AGC, programmable filter/equalizer, adaptive transversal filter, Viterbi pulse qualifier, time base generator, data
separator with 8,9 ENDEC and scrambler/descrambler, and FWR servo, that supports data rates from 42 to 125 Mbit/s.
Data rates from 33 to 100 Mbit/s are supported by changing a single resistor.
A serial port is provided to write control data to the 17 internal program storage registers.
AGC Circuit Description
The automatic gain control (AGC) circuit is used to maintain a constant signal amplitude at the input of the pulse detector
and sampled data processor while the input to the amplifier varies. The circuit consists of an AGC loop that includes an
AGC amplifier, charge pump, programmable continuous time filter, and a precision, wide band, full wave rectifier.
Depending on whether the read is of servo or data type, the specific blocks utilized in the loop are slightly different. Both
loop paths are fully differential to minimize susceptibility to noise. AGC control can be programmably selected between
direct and timed modes.
AGC OPERATION IN SERVO READ MODE
During servo reads the loop consists of the AGC amplifier with a continuous dual rate charge pump, the programmable
continuous time filter, and the full wave rectifier. The gain of the AGC amplifier is controlled by the voltage stored on the
BYPS hold capacitor (CBYPS). The dual rate charge pump drives CBYPS with currents that drive the differential voltage
at DP/DN (internal nodes) to the value programmed by the 2 SAGCLVL bits in the LDS register. These 2 bits allow
adjustment of the filter's normal output voltage from 1.10 to 1.40 Vppd. Attack currents lower the voltage at the BYPS
pin which reduces the amplifier gain. Decay currents raise the voltage at the BYPS pin which increases the amplifier
gain. The sensitivity of the amplifier gain to changes in the BYPS voltage is approximately 38 dB/V. When the voltage
at BYPS is equal to VRC, the gain from the AGC input to DP/DN will be about 24.9 dB. The charge pump is continuously
driven by the instantaneous voltage at DP/DN. When the signal at DP/DN is greater than 100% of the programmed AGC
level, the normal attack current (ICH) of 416.5 µA is used to reduce the amplifier gain. If the signal is greater than 125%
of the programmed level, the fast attack current (ICHF) of 3.5 mA is used to reduce the gain very quickly. This dual rate
approach allows the AGC gain to be quickly decreased when it is too high and minimizes distortion when the proper AGC
level has been acquired. The 100% and 125% levels are relative to the selected AGC level in servo mode.
A constant normal decay current (ID) of 24.5 µA acts to increase the amplifier gain when the signal at DP/DN is less than
100% of the programmed AGC level. The large ratio (416.5 µA:24.5 µA) of the normal attack and normal decay currents
enables the AGC loop to respond to the peak amplitudes of the incoming read signal rather than the average value. As
a result the AGC loop will not be able to quickly increase its gain if required to do so. A fast recovery mode is provided
to allow the gain to be rapidly increased to reduce recovery time between mode switches. In the fast recovery mode, the
decay current is increased by a factor of 8 to 196 µA (IDFR) and the attack current is increased by a factor of 4.18 to
1.74 mA (ICHFR). This has the effect of speeding up the AGC loop between 4 and 8 times.
It is recommended that the fast recovery mode be asserted when the AGC fields from a sector are being read. Typically,
this will be just after each transition of SG (Servo Gate), after powerup, and after WG/WG is de-asserted. For example,
if CBYPS is 500 pF and FASTREC is asserted for 0.5 µs in servo mode, the voltage at BYPS can increase at most by
0.5 µs * 196µA/500 pF = 196 mV, which will allow the gain to increase by 6 dB in that time. If FASTREC is asserted for
0.5 µs in non-servo mode and CBYP is 1000 pF, then the voltage at BYP can increase at most by 0.5 µs * 196 µA/
1000 pF = 98 mV, which will allow the gain to increase by 3 dB in that time. It is recommended that LOWZ be asserted
for 0.5µs just prior to any assertion of FASTREC in order to null any internal DC offsets. However, it is possible to assert
both LOWZ and FASTREC simultaneously to reduce sector overhead. This method should be evaluated under the
actual system operating conditions.
The programmable AGC level in servo mode is provided to allow the servo demodulator dynamic range to be adjusted
over a narrow range.
1996 Jul 25 7
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
AGC OPERATION IN DATA READ MODE
For data reads, the loop described above is used until the data synchronizer is locked to the incoming VCO preamble,
except that the BYP hold capacitor (CBYP) is used instead of BYPS and (CBYPS). The normal decay current is 24.5 µA,
the normal attack current is 416.5 µA, and the fast attack current is 3.5 mA. The fast recovery mode decay current is
196 µA and the fast recovery mode attack current is 1.74 mA. The above mentioned attack and decay currents are not
scaled with the data rate setting. After the data synchronizer PLL is locked (SFC), the AGC loop is switched to include
the AGC amplifier with a sampled charge pump, the programmable continuous time filter, full wave rectifier, and the
sampling 5-tap equalizer to more accurately control the signal amplitude into the Viterbi qualifier. In this sampled AGC
mode, a symmetrical attack and decay charge pump is used. The "1" sample amplitudes are sampled and held and
compared to the ideal "1" value of 500 mV to generate the error current. The maximum charge pump current value can
be programmed from the Sample Loop Control Register to 0, 34, 68, or 102 µA for maximum data rate and will scale
downward with reduced Data Rate Register values.
AGC Control Modes
The AGC control mode is determined by the state of bit 6 (AGCSEL) of the Control Operating Register #1. If this bit is
0, then the direct, external AGC control method is selected, i.e., AGC uses external signals provided to the FASTREC,
LOWZ, and HOLD input pins. If bit 6 is a 1, the timed AGC control method is selected for generating the internal hold,
fast recovery, squelch, and Low-Z signals.
DIRECT AGC CONTROL MODE
For maximum application flexibility, all AGC mode control inputs are to be externally provided. When the LOWZ input is
High, Low-Z mode is activated. In the Low-Z mode, the AGC amplifier input resistance is reduced to allow quick recovery
of the AGC amplifier input AC coupling capacitors. The ratio of Low-Z to Non Low-Z resistance can be selected as either
15:1 or 5:1 by programming the LZTC bit in the Data Boost Register. During Low-Z mode, the time constant of the
internal AC coupling networks at the filter outputs are also reduced by the ratio determined by the LZTC bit. This time
constant is 300 ns in Low-Z and either 5 µs or 1.5 µs when not in Low-Z mode, depending on the state of the LZTC bit.
Low-Z also forces the AGC amplifier gain to be reduced to near 0 V/V. This mode should be activated during and for a
short time after a write operation. It should also be activated for a short time after each transition of the SG input and on
initial power up.
When theHOLD input is Low, the charge pumps are disabled. This de-activates the AGC loop. The AGC amplifier gain
will be held constant at a level set by the voltage at the BYP or BYPS pins. The value of the capacitor placed at these
pins should be selected to give adequate droop performance when in hold mode as well as to insure stability of the AGC
loop when it is active.
The signal provided to the FASTREC input pin determines if the AGC is in fast recovery mode. During the fast recovery
(FASTREC=1), the attack and decay currents are increased to allow faster recovery to the proper AGC level. If faster
recovery than is provided by FASTREC alone is desired, an ultra fast recovery can be effected by connecting a resistor
between the AGCRST pin and the positive supply VPA. If this resistor is present, whenever FASTREC is entered, the
voltage on the BYP or BYPS capacitor will be pulled up. This causes an extremely rapid increase in the AGC amplifier
gain. The ultra fast current will be disabled the first time that the signal at DP/DN reaches the 125% point. The FASTREC
attack and decay currents are used as long as the FASTREC pin is held High.
TIMED AGC CONTROL MODE
This timed AGC control mode differs from the direct control mode in that the external control inputs LOWZ, FASTREC,
and HOLD, are typically not used, and therefore, must be deasserted. The equivalent signals are generated internal to
the P32P4911A. These internal signals are generated by one-shots that are triggered by various conditions of the
WG/WG, SG, and PDWN inputs. The one-shot timings for the Low-Z and fastrec signals are set by the resistors
connected to the WRDEL and AGCDEL input pins, respectively and analog ground. The time Low-Z period = 0.1 µs *
(RWRDEL + 0.5) k and the fast recovery period = 0.1 µs * (RAGCDEL + 0.5) k.The current for the ultra fast decay mode
is set by the resistor connected between the AGCRST input pin and VPA. In the timed mode, the AGC shall use the
CBYP and CBYPS for non-servo and servo modes respectively. The nominal and fast attack and decay currents are the
1996 Jul 25 8
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
same in both of the P32P4911A's AGC control modes. In internally timed mode, the LOWZ, FASTREC, and HOLD input
pins are logically OR'ed with their respective internal control signals but do not affect the internal sequencing of the
one-shot generated AGC control signals.
Figure 1: AGC Timing (Internal) Diagrams - Power-On Mode
PDWN
AGC
INPUT
AGC LOWZ
FAST FILTER
OFFSET RECOVERY
AGC HOLD
AGC SQUELCH
AGC FAST RECOVERY
(ATTACK & DECAY)
AGC ULTRA
FAST RECOVERY
(DECAY)
tLZ
Power-on gain recovery
AGC
OUTPUT
100%
125%
NORMAL
ATTACK
+
-ULTRA
FAST
DECAY
tLZ
tLZ
tFR
tLZ
POWERED UP
FAST
ATTACK
Ultra fast decay current is disabled when signal is greater
than 125% of nominal.
1996 Jul 25 9
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Figure 2: AGC Timing Diagrams - Servo Mode
Servo mode gain recovery
SG
AGC
INPUT
AGC OUTPUT
100%
125%
ULTRA
FAST
DECAY
+
-
AGC LOWZ
FAST FILTER
OFFSET RECOVERY
AGC HOLD
SQUELCH
AGC FAST RECOVERY
(ATTACK & DECAY)
AGC ULTRA
FAST RECOVERY
(DECAY)
tLZ
tFR
tLZ
tLZ
FAST
ATTACK
tFR
Ultra fast decay current is disabled when
signal is greater than 125% of nominal.
1996 Jul 25 10
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Figure 3: AGC Timing Diagrams - Write Mode
Write mode gain recovery
SG
AGC
INPUT
AGC
OUTPUT
100%
125%
ULTRA
FAST
DECAY
NORMAL
ATTACK
+
-
AGC LOWZ
FAST FILTER
AGC HOLD
AGC SQUELCH
AGC FAST RECOVERY
OFFSET RECOVERY
AGC ULTRA
FAST RECOVERY
tLZ
tLZ
(ATTACK & DECAY)
(DECAY)
FAST
ATTACK
tFR
Ultra fast decay current is disabled when
signal is greater than 125% of nominal.
1996 Jul 25 11
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Pulse Qualification Circuit Descriptions
This device utilizes three different types of pulse qualification, one exclusively for servo reads, one primarily for servo
reads, and the other for data reads.
SERVO READ MODE
For servo gray code reads, either a dual level (window type) qualifier or a hysteresis type level qualifier may be selected.
If the PDM bit in the Servo Filter Cutoff Register is set to 0, then the window qualifier is selected, and if the PDM bit is a
1, the hysteresis qualifier is selected. The polarity of the RDS/RDS is selected by the SMS bit (Servo Mode Select) in
the Data Rate Register. If SMS=0 then RDS is active-Low and if SMS=1 then RDS is active-High.
DUAL LEVEL (WINDOW) QUALIFIER
During servo reads (SG High) a dual level type of pulse qualifier is used. The level qualification thresholds are set by a
6-bit DAC which is controlled by the Servo Level Threshold Register (LDS). The register value is relative to the peak
voltage at the output of the continuous time filter, derived off of the same reference voltage internal to the chip. The
positive and negative thresholds are equal in magnitude. The state of the adaptive threshold level enable (ALE) bit in
the WP/LT Register does not affect this DAC's reference. The RDS/RDS and the PPOL outputs of the level qualifier
indicate a qualified servo pulse and the polarity of the pulse, respectively. The RDS/RDS and PPOL outputs are only
active when the SG input is High.
HYSTERESIS QUALIFIER
The hysteresis qualifier performs the same as the window qualifier except that the hysteresis qualifier guarantees that
the second of two consecutive pulses of the same polarity will not be qualified. The hysteresis qualifier will only qualify
pulses of alternating polarity.
DATA READ MODE
In data read mode (RG High), the dual level qualifier used for servo reads, is used during VCO sync field counting. Its
qualification thresholds are set by a 6-bit DAC which is controlled by the Data Level Threshold Register (LD). The
register value is relative to the peak voltage at output of the continuous time filter and the DAC both referenced to band
gap voltage. The positive and negative thresholds are equal in magnitude. The state of the adaptive threshold level
enable (ALE) bit in the WP/LT Register does not affect the DAC's reference until the sync field count has been achieved.
The RDS/RDS and the PPOL outputs of the level qualifier are not active in data read mode.
VITERBI QUALIFIER
The second type of pulse qualification, the Viterbi qualifier, is only used during data read mode after the sync field count
has been achieved. The Viterbi qualifier has two significant blocks, one that feeds the other. The first block is the
sampled pulse detector and the second is the survival sequence register.
The sampled pulse detector performs the pulse acquisition/detection in the sampled domain. It acquires pulses by
comparing the code clock sampled analog waveform to the positive and negative thresholds established by the
programmable Viterbi threshold window. The threshold window is defined to be the difference between the positive and
negative threshold levels. The threshold window, Vth, is set by a 7-bit DAC which is controlled by the Viterbi Detector
Threshold Register (VDT). While the window size is fixed by the programmed Vth value, the actual positive and negative
thresholds track the most positive and the most negative samples of the equalized input signal. For example, the Viterbi
positive signal threshold, Vpt = Vpeak (+) max if the previous detected level was (+). If the previous detect level was (-),
Vpt = Vpeak(-)max + Vth, where Vpeak(-)max is the maximum amplitude of the previously detected negative signal.
Normally Vth is set to equal Vpeak (approx. 500 mV).
After the pulses have been detected they must be further qualified by the survival sequence registers and associated
logic. This logic guarantees that for sequential pulses of the same polarity within the maximum run length, only the latest
is qualified. In this way, only the pulse of greatest amplitude will be qualified.
1996 Jul 25 12
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
The Viterbi qualifier is implemented as two parallel qualifiers that operate on interleaved samples. Each qualifier has a
survival sequence register length of 5.
To facilitate media scan testing, the Viterbi survival sequence register may be bypassed by setting the BYPSR bit in the
Viterbi Detector Threshold (VDT) register.
Programmable Filter Circuit Description
The on-chip, continuous time, low pass filter has register programmable cutoff and boost settings, and provides both
normal and differentiated outputs. It is a 7th order filter that provides a 0.05°phase equiripple response. The group delay
is relatively constant up to twice the cutoff frequency. For pulse slimming two zero programmable boost equalization is
provided with no degradation to the group delay performance. The differentiated output is created by a single-pole,
single-zero differentiator. Both the boost and the filter cutoff frequency for data reads and the filter cutoff frequency for
servo reads are programmed through internal 7-bit DACs, which are accessed via the serial port logic. The nominal
boost range at the cutoff frequency is 0 to 13 dB for data reads and is controlled by the Data Boost Register. In servo
mode, the boost can be programmed in 2 dB steps from 0 to 6 dB by programming the two FBS bits (bits 6 and 7) in the
Filter Boost Servo register. The cutoff frequency, ƒc is variable from 4 to 34 MHz and controlled by the Data Cutoff
Register or Servo Cutoff Register in the servo mode. The cutoff and boost values for servo reads are automatically
switched when servo mode is entered.
The filter zero locations can be programmed asymmetrically about zero to compensate for MR head time asymmetry.
The asymmetry is adjusted by programming the 6 FGD bits (bits 0-5) in the Filter Boost Servo register. The asymmetric
zeros are not usable while in servo mode.
The normal low pass filter is of a seven-pole two-real-zero type. Figure 5 illustrates the transfer function normalized to
1 rad/s. The response can be denormalized to the cutoff frequency of ƒc (Hz) by replacing s by s/2πƒc, while the boost
and group delay equalization are controlled by varying the α and β.
Figure 4: Viterbi Detection
Viterbi
Threshold
WIndow
Viterbi
Detector
Output
+ pulse detect
- pulse detect
For sequential pulses of the same
polarity, the latest is selected by the
survival sequence register logic since
it is always of greater magnitude.
+th
-th
1996 Jul 25 13
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
With a zero at the origin, the filter provides a time-differentiated filter output. This is used in time qualification of the peak
detection. To ease the timing requirement in peak detection of a signal slightly above the qualification threshold, the
time-differentiated output is purposely delayed by 1.2 ns relative to the normal low pass output.
The normal low pass output feeds the data qualifier (DP/DN), and the differentiated output feeds the clock comparator
(CP/CN).
Five definitions are introduced for the programmable filter control discussion (Figure 6):
Cutoff Frequency: The cutoff frequency is the -3 dB low pass bandwidth with no boost and group delay equalization, i.e.
α=0 and β=0.
Actual Boost: The amount of peaking in magnitude response at the cutoff frequency due to α≠0 and/or β≠0.
Alpha Boost: The amount of peaking in magnitude response at the cutoff frequency due to α≠0 and without group delay
equalization. In general, the actual boost with group delay equalization is higher than the alpha boost. However, with
>3 dB alpha boost, the difference is minimal. α=1.31703 x (10BOOST(dB)/20-1)
Group Delay %: The group delay % is the percentage change in absolute group delay at DC with respect to that
without equalization applied (β=0). β=0.04183 * GD%.
Group Delay Variation: The group delay variation is the change in group delay from DC to the cutoff frequency. This
can be expressed as a percentage defined as: (change in group delay ÷ absolute group delay with β=0) * 100%. An
alternative is to express the group delay variation in nanoseconds. Because the absolute group delay variation in
nanoseconds is scaled by the programmed cutoff frequency, the percentage expression is used in this specification.
SM00010
IN s2s+1.31703
s2+1.68495s+1.31703
2.95139
s2+1.54203s+2.95139
5.37034
s2+1.14558s+5.37034
0.86133
s+0.86133
s
s+0.86133
Normal
Differential
Figure 5: Programmable Filter Normalized Transfer Function
1996 Jul 25 14
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Figure 6: Filter Magnitude Response
Frequency (MHz)
Magnitude (dB)
SM00011
15
10
5
0
–5
–10
–15
–20 1 10 100
Cutoff = 10MHz (i) 0dB Alpha Boost & 0% Group Delay Change
(ii) 13dB Alpha Boost & +30% Group Delay Change
–3dB Cutoff Frequency
Actual Boost, same as Alpha Boost with 0%
Group Delay Change or Alpha Boost is large
Actual –3dB Bandwidth
with Boost & Group
Delay Equalization
(i)
(ii)
1996 Jul 25 15
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
FILTER OPERATION
Direct coupled differential signals from the AGC amplifier output are applied to the filter. The programmable bandwidth
and equalization characteristics of the filter are controlled by 3 internal DACs. The registers for these DACs (FC, FB,
and FGD) are programmed through the serial port. The current reference for the DACs is set using a single external
resistor connected from pin VRX to ground. The voltage at pin VRX is proportional to absolute temperature (PTAT),
hence the current for the DACs is a PTAT reference current. This establishes the excellent temperature stability for the
filter characteristics.
The cutoff frequency can be set independently in the servo mode and the data mode. In the data mode, the cutoff
frequency is controlled by the Data Cutoff Register. In the servo mode, the cutoff frequency is controlled by the Servo
Cutoff Register.
CUTOFF CONTROL
The programmable cutoff frequency from 4 to 34 MHz is set by the 7-bit linear FC DAC. The FC register holds the 7-bit
DAC control value. The cutoff frequency is set as:
ƒc (MHz) = 0.301 * FC - 1.142 44 FC 117
for servo zones
ƒc (MHz) = 0.277 * FCS + 0.08 14 FCS 43
The filter cutoff (ƒc) is defined as the -3 dB bandwidth with no boost applied. When boost/equalization is applied, the
actual -3 dB point will move out. The ratio of the actual -3 dB bandwidth to the programmed cutoff is tabulated in
Table 1 as a function of applied boost and group delay equalization.
Figure 7: Filter Group Delay Response
Frequency (MHz)
Absolute Group Delay (ns)
SM00012
70
1 10 100
Cutoff = 0MHz (i) 0dB Alpha Boost & 0% Group Delay Change
(ii) 13dB Alpha Boost & +30% Group Delay Change
DC Group Delay Change
Programmable from
–30% to +30%
(i)
(ii)
1
65
60
55
50
45
40
Group Delay Variation from
‘DC’ to Cutoff Frequency
1996 Jul 25 16
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
BOOST CONTROL
The programmable alpha boost from 0 to 13 dB is set by the 7-bit linear FB DAC in data mode or 2-bit linear FBS DAC
in servo mode. The FB register holds the 7-bit DAC control value and the FBS register holds the 2-bit control value. The
alpha boost in data mode is set as:
Alpha Boost (dB) = 20 log [0.021848 * FB + 0.000046 * FC * FB + 1] 0 FB 127
The alpha boost in servo mode is set as:
Alpha Boost (dB) = 2 * FBS 0 FBS 3
That is, the boost in servo mode can be changed in 2 dB steps from 0 to 6 dB.
The programmed alpha boost is the magnitude gain at the cutoff frequency with no group delay equalization. When finite
group delay equalization is applied, the actual boost is higher than the programmed alpha boost. However, the difference
becomes negligible when the programmed alpha boost is >3 dB. Table 2 tabulates the actual boost as a function of the
applied alpha boost and group delay equalization.
Table 1: Ratio of Actual -3dB Bandwidth to Cutoff Frequency
Alpha Boost Group Delay %
±30% ±25% ±20% ±15% ±10% ±5% ±0%
0 dB 1.62 1.47 1.31 1.16 1.06 1.01 1.00
1 1.74 1.62 1.50 1.38 1.28 1.21 1.19
2 1.87 1.79 1.71 1.63 1.56 1.51 1.49
3 2.01 1.96 1.91 1.87 1.83 1.80 1.79
4 2.14 2.11 2.09 2.07 2.05 2.04 2.03
5 2.25 2.24 2.23 2.22 2.21 2.20 2.20
6 2.35 2.34 2.34 2.33 2.33 2.32 2.32
7 2.44 2.44 2.43 2.43 2.42 2.42 2.42
8 2.52 2.52 2.51 2.51 2.51 2.51 2.51
9 2.59 2.59 2.59 2.59 2.59 2.59 2.59
10 2.67 2.66 2.66 2.66 2.66 2.66 2.66
11 2.73 2.73 2.73 2.73 2.73 2.73 2.73
12 2.80 2.80 2.80 2.80 2.80 2.80 2.80
13 2.87 2.87 2.86 2.86 2.86 2.86 2.86
1996 Jul 25 17
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
GROUP DELAY EQUALIZATION
The group delay% can be programmed between -30% to +30% by the 6-bit linear FGD DAC. The FGD register holds
the 6-bit DAC control value. The group delay % is set as:
Group Delay % = 0.9783 * (FGD4:0) - 0.665 0 FGD4:0 31 and FGD5 = sign bit
The group delay % is defined to be the percentage change of the absolute group delay due to equalization from the
absolute group delay without equalization at DC.
The current reference for the filter DACs is set using a single 12.1 k resistor, from the VRX pin to ground. The voltage
at VRX is proportional-to-absolute-temperature (PTAT).
The outputs of the filter are internally AC coupled to the qualifier inputs and buffers for the filter monitoring test points
TPC+/TPC- and TPD+/TPD-.
Internal AC Coupling
The conventional external ac coupling at the filter to qualifier interface has been replaced by a pair of feedback circuits,
one for the normal and one for the differentiated outputs of the filter. The offset of the filter outputs are sensed, integrated,
and fed back to the filter output stage. The feedback loop forces the filter offset nominally to zero. In the normal read
mode, (LOWZ=0), the integration time constant is set to 5 µs until the sync field counter reaches the programmed SFC
count. At the SFC count, the offset sensing is switched into sampled mode and the time constant is reduces to 300 ns.
In sampled mode the offset correction voltage is generated from the zeros qualified by the quantizer. This ensures that
the sampled voltage level, not DP/DN, will be offset free.
Table 2: Ratio of Actual -3dB Bandwidth to Cutoff Frequency
Alpha Boost Group Delays %
±30% ±25% ±20% ±15% ±10% ±5% ±0%
0 dB 2.81 2.12 1.47 .89 0.42 0.11 0.00
1 3.36 2.76 2.21 1.72 1.33 1.09 1.00
2 3.97 3.45 2.99 2.58 2.27 2.07 2.00
3 4.63 4.19 3.80 3.47 3.21 3.05 3.00
4 5.34 4.97 4.65 4.38 4.17 4.04 4.00
5 6.10 5.79 5.52 5.30 5.14 5.03 5.00
6 6.89 6.64 6.42 6.24 6.11 6.03 6.00
7 7.72 7.51 7.34 7.19 7.09 7.02 7.00
8 8.58 8.41 8.27 8.15 8.07 8.02 8.00
9 9.47 9.33 9.22 9.12 9.05 9.01 9.00
10 10.4 10.3 10.2 10.1 10.1 10.0 10.0
11 11.3 11.2 11.1 11.1 11.0 11.0 11.0
12 12.2 12.2 12.1 12.1 12.0 12.0 12.0
13 13.2 13.1 13.1 13.1 13.0 13.0 13.0
1996 Jul 25 18
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Amplitude Asymmetry Detection and Correction
In the presence of amplitude asymmetry, such as that generated by MR heads, the sampled data processor (SDP) will
be presented with zeros generated in one of two ways. The first is due the lack of a magnetic transition and will be
referred to as a "real" zero. The second is produced by the superposition of adjacent +1 and -1 magnetic transitions and
results in zero samples that shall be referred to as "cancelled" zeros. In the presence of amplitude asymmetry from an
MR head, the "real" zeros are zero, but the "cancelled" zeros are offset by the difference between the +1 and -1 samples.
The offset correction circuit forces the ground reference of the sampled data processor to the center of the "real" and
"cancelled" zero sample levels.
The integration time constant is increased by a factor of 4 to 1.0 µs, after the sync byte has been detected.
AMPLITUDE ASYMMETRY MONITOR POINT
An amplitude asymmetry quality factor "Qasym" may be selected to be output on the ATO output pin by programming
the ASEL bits in the Power Down Register. This signal is derived by computing the average distance of the "real" and
"canceled" zeros from the sampled data processor's system ground which was established between the two zeros levels
by the offset correction circuit. The average distance is a measure of the asymmetry present in the MR read back signal.
A gain of 4 from the sampled values is utilized and is low pass filtered with a time constant that is programmable to one
of four different values by programming the two QTC bits in the Control Operating Mode Register #2.
The signal is then buffered and differentially multiplexed to the ATO pin. The signal is referenced to MAXREF/2.
The asymmetry quality factor can be held at the value present at sync byte detect by setting the FREZQ bit in the WP/LT
Register. The value will be held for 10 ms and is NOT reset. The ATO output may also be externally filtered to provide
time constants that are appropriate for averaging over major portions of, or an entire sector. The capacitors on externally
added filters must be externally reset. Note that any external filtering added to ATO output pin will affect both the
amplitude asymmetry monitor signal and the equalization quality monitor signal since they are both muxed to the ATO
output pin.
Adaptive Equalizer Circuit Description
Up to 7 dB of equalization for fine shaping of the incoming read signal to the PR4 waveshape is provided by a 5 tap,
sampled analog, transversal filter. This filter provides a self adaptive multiplier coefficient for the inner taps and a
programmable coefficient for the outer taps. Both inner taps use the same coefficient (km1), and both outer taps use the
same coefficient (km2).
For the adaptive inner taps, the value of km1 is adjusted to force "zero" samples to zero volts. A special equalizer training
pattern, located after the VCO sync field in the sector format, is used to provide an optimum signal for the equalizer to
adapt to. The adaptive property of these taps is enabled or disabled by the AEE bit in the Sample Loop Register. If the
adaptive property is enabled, whether adaptation occurs only during the training pattern or both during the training
pattern and the user data is controlled by the AED bit in the Sample Loop Register.
The adaptation can be observed when the equalizer control voltage is selected as the TPA+/TPA- output. The equalizer
control voltage is approximately related to km1 by:
km1 = 0.009 * Date Rate (Mbit/s) * (TPA+ - TPA-)
The multiplier coefficients for the adaptive taps can be held for up to 10 ms if the EQHOLD input is brought High after
sync byte detect has occurred during a previous read in which proper training has occurred. The EQHOLD input pin may
be asserted at any time during a read cycle and the adaptive coefficient Km1 present at that time will be held, provided
no leakage occurs, until the EQHOLD input is de-asserted.
The multiplier coefficient, km2, for the outer taps is programmable between +0.117 and -0.135 by the 4 km bits (bits 4-7)
in the Control Operating Mode Register #2
.
1996 Jul 25 19
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
EQUALIZATION QUALITY MONITOR POINT
An equalization quality factor "Q" may be selected to be output on the ATO output pin by programming the ATOSEL bits
in the Power Down Register and should be used as a guide for selection of the appropriate value for km2. This signal is
derived by computing the absolute distance of the "real" and "canceled" zeros from the sampled data processor's system
ground which was established between the two zeros levels by the offset correction circuit. Then the asymmetry factor
(QASYM) is subtracted and the resulting signal is full wave rectified and low pass filtered using one of the four time
constants that may be programmed with the two QTC bits in the Control Operating Mode Register #2. The signal is then
buffered and differentially multiplexed to the ATO pin. The overall gain to the ATO pin is 4. The signal is referenced to
MAXREF/2.
The equalization quality factor can be held at the value present at sync byte detect by setting the FREZQ bit in the WP/LT
Register. The value will be held for approx. 10 ms and is NOT reset. The ATO output may also be externally filtered to
provide time constants that are appropriate for averaging over major portions of, or an entire sector. The capacitors on
externally added filters must be externally reset.
Time Base Generator Circuit Description
The time base generator (TBG) is a PLL based circuit, that provides a programmable reference frequency to the data
separator for constant density recording applications. This time base generator output frequency can be programmed
with a less than 1% accuracy via the M, N and DR Registers. The TBG output frequency, Fout, should be programmed
as close as possible to ((9/8) * NRZ Data Rate). The time base also supplies the timing reference for write
precompensation so that the precompensation tracks the reference time base period.
The time base generator requires an external passive loop filter to control its PLL locking characteristics. This filter is
fully-differential and balanced in order to reduce the effects of common mode noise.
In read, write and idle modes, the programmable time base generator is used to provide a stable reference frequency for
the data separator. In the write and idle modes, the Time Base Generator output, when selected by the Control Test
Mode Register, can be monitored at the TPB+ and TPB- test pins. In the read mode, the TBG output should not be
selected for output on the test pins so that the possibility of jitter in the data separator PLL is minimized.
yn = km2 xn + km1 xn-1 + xn-2 + km1 xn-3 + km2 xn-4
need more boost
decrease km need less boost
increase km
+1
+1
+1
+1
0
0
0V 0V
DDDD
S
xnxn-1 xn-2 xn-3 xn-4
km2 km1 km1 km2
yn
km1 coefficient adapts to force ’0’ samples to 0V
SM00026
1996 Jul 25 20
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
The reference frequency is programmed using the M and N registers of the time base generator via the serial port, and
is related to the external reference clock input, FREF, as follows:
FTBG = FREF * [(M + 1) ÷ (N + 1)]
The M and N values should be chosen with the consideration of phase detector update rate and the external passive
loop filter design. The Data Rate Register must be set to the correct VCO center frequency. The time base generator
PLL responds to any changes to the M and N registers, only after the DR register is updated.
The DR register value, directly affects the following:
center frequency of the time base generator VCO,
center frequency of the data separator VCO,
phase detector gain of the time base generator phase detector,
phase detector gain of the data separator phase detector,
write precompensation
The reference current for the DR DAC is set by an external resistor, RR, connected between the RR pin and ground.
RR = 10.0 k for 42 to 125 Mbit/s data rate range
RR = 12.1 k for 33 to 100 Mbit/s data rate range
Data Separator Circuit Description
The Data Separator circuit provides complete encoding, decoding, and synchronization for 8,9 (0,4,4) GCR data. In data
read mode, the circuit performs clock recovery, code word synchronization, decoding, sync byte detection, descrambling,
and NRZ interface conversion. In the write mode, the circuit generates the VCO sync field, scrambles and converts the
NRZ data into 8,9 (0,4,4) GCR format, precodes the data, and performs write precompensation.
The circuit consists of five major functional blocks; the data synchronizer, 8,9 ENDEC, NRZ scrambler/descrambler, NRZ
interface, and write precompensation.
DATA SYNCHRONIZER
The data synchronizer uses a fully integrated, fast acquisition, PLL to recover the code rate clock from the incoming read
data. To achieve fast acquisition, the data synchronizer PLL uses two separate phase detectors to drive the loop. A
decision-directed phase detector is used in the read mode and phase-frequency detector is used in the idle, servo, and
write modes.
Figure 9: Data Synchronizer Phase Locked Loop
A
VCO
CHARGE
PUMP
READ MODE
IDLE/WRITE
MODE
KDS
KDI
Gm
M
Cint
12pF Cext
KVCO
Sampled Read Data
from Adaptive Equalizer
Reference Frequency
from Time Base Generator
VCO
DS CLK
SAMPLED DATA
PHASE DETECTOR
PHASE/FREQUENCY
DETECTOR
1996 Jul 25 21
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
In the read mode the decision-directed timing recovery updates the PLL by comparing amplitudes of adjacent "one"
samples or comparing the "zero" sample magnitude to ground for the entire sample period. A special (non IBM) algorithm
is used to prevent "hang up" during the acquisition phase. The determination of whether a sample is a "one" or a "zero"
is performed by a dedicated, dual mode, threshold comparator. This comparator's threshold levels are determined by
the value, Lth, programmed in the Data Threshold Register. The fixed level threshold before the sync field count (SFC)
has been achieved will be 1.4 times the threshold level after SFC since this is the ratio of the peak signal to the sampled
"1" signal amplitude for PR4. The dual mode nature of this comparator allows the selection of either symmetric fixed or
independent self adapting (+) and (-) thresholds by programming the adaptive level enable (ALE) bit in the WP/LT
Register. Also at SFC, the gain of the phase detector is reduced by a factor of 6 or 10, selectable by the GS bit in the
Damping Ratio Control register. This gain shift increases the loop's noise immunity during data tracking by reducing its
bandwidth.
The adaptive reference allows the specification of the threshold value to be a percentage of an averaged peak value.
When adaptive mode is selected, the fixed thresholds are used until the sync field count (SFC) has been reached, then
the adaptive levels are internally enabled. The time constant of a single pole filter that controls the rate of adaptation, is
programmable by bits TC2-1 in the WP/LT Register.
In the write and idle modes the non-harmonic phase-frequency detector is continuously enabled, thus maintaining both
phase and frequency lock to the time base generator's VCO output signal, FTBG. The polarity and width of the detector's
output current pulses correspond to the direction and magnitude of the phase error.
The two phase detectors' outputs are muxed into a single differential charge pump which drives the loop filter directly.
The loop filter requires an external capacitor. The loop damping ratio is programmed by bits 6-0 in the Damping Ratio
Control Register. The programmed damping ratio is independent of data rate.
In write mode, the TBG output is used to clock the encoder, precoder, and write precompensation circuits. The output
of the precompensation circuit is then fed to the write data flip-flop which generates the write data (WD, WD) outputs.
ENDEC
The ENDEC implements an 8,9 (0,4,4) Group Coded Recording (GCR) algorithm. The code has a minimum of no zeros
between ones and a maximum of four zeros between ones for the interleaved samples. During write operations the
encoder portion of the ENDEC converts 8-bit parallel, scrambled or nonscrambled, data to 9-bit parallel code words that
are then converted to serial format. In data read operation, after the code word boundary has been detected in the Viterbi
qualified serial data stream, the data is converted to 9-bit parallel form and the decoder portion of the ENDEC converts
the 9-bit code words to 8-bit NRZ format.
SYNC BYTE DETECTION
The P32P4911A supports two types of sync byte detection, dual byte and single byte.
DUAL SYNC BYTE DETECTION
The P32P4911A implements a dual "or" type sync byte detection scheme to reduce the probability that a single bit error
will lead to the inability to synchronize. The two sync bytes are different and are spaced apart by one byte. The first sync
byte is 1FH and the second is 69H. Sync byte detection is considered to have occurred if either of the two sync bytes is
found but the sync byte detect output pin (SBD) is transitioned at the position in time when the second sync byte (69)
would have been detected. The data placed on the NRZ outputs when SBD goes Low is always the second sync byte
(69) regardless of which of the two was actually detected.
SINGLE SYNC BYTE DETECTION
Since the P32P4911A looks for either of the two sync bytes, the absence of the first sync byte is not an error. This allows
for only a single byte to be written and still be able to achieve synchronization. It is recommended that only the 69H be
written if single sync byte detection is desired so that when detection occurs, the data output on the NRZ pins at sync
byte detect will match the sync byte written.
1996 Jul 25 22
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
SINGLE SYNC BYTE DETECTION WHEN SEMI AUTOMATIC TRAINING ISENABLED
When the AUTOTR bit is set in the Control Operating Register, the training/sync byte sequence is generated with an
internal state machine. The internal state machine generates the 5-byte equalizer training pattern (93H) followed by the
second sync byte (69H); the first sync byte (1FH) is not written by the internal state machine. To initiate the writing of
the training pattern and sync byte in this mode, an FFH must be placed on the NRZ bus for 6 byte times prior to the user
data. This mode may be desirable if controller state machine space is very limited.
SCRAMBLER/DESCRAMBLER
The scrambler/descrambler circuit is provided to reduce fixed pattern effects on the channel's performance. It is enabled
or disabled by bit 2 (SD) of the Control Operating Register. In write mode, if enabled, the circuit scrambles the 8-bit
internal NRZ data before passing it to the encoder. Only user data, i.e., the NRZ data following the second sync byte
(69H), is scrambled. In data read mode, only the decoded NRZ data after the second sync byte (69H) is descrambled.
The scrambler polynomial is H(X)= 1 X7 X10. The scrambler block diagram is shown in Figure 10. The scrambler
contributes no delay in either the encode or decode paths and therefore there is no difference in path delays whether or
not the scrambler is enabled.
NRZ INTERFACE
The NRZ interface circuit provides the ability to interface with either a nibble or byte-wide controller. The NRZ interface
type is specified by the programming of bit 4 (NIB) of the Control Operating Register. If byte-wide mode is selected, the
circuit does not reformat the data before passing it to and from the internal 8-bit bus. If nibble mode is selected, the NRZ
interface circuit converts the 4 LSBs of the external 8-bit bus to the internal 8-bit bus. Only the selected NRZ interface
is enabled and the unused bits can be left floating. Both the byte-wide and nibble interfaces define the most significant
bit of the interface as the most significant bit of the data and the nibble interface defines the first nibble clocked in or out
as the most significant of the pair.
For both byte-wide and nibble operation, the NRZ write data is latched by the P32P4911A on the rising edge of the WCLK
input. The WCLK frequency must be appropriate for the data rate chosen or else overflow/underflow will occur. It is
recommended that WCLK be connected to RCLK to prevent this from occurring. In byte-wide mode, as each NRZ byte
is input to the P32P4911A, its parity is checked against the controller supplied parity bit NRZP.
In data read mode, the NRZ data will be presented to the controller near the falling edge of RCLK so that it can be latched
by the controller on the rising edge of RCLK. When RG goes High, the selected NRZ interface will output Low data until
the sync byte has been detected. The first non-zero data presented will be the sync byte (69H). The NRZ interface is
Figure 10: P32P4911A Scrambler Block Diagram
X0 X1 X2 X3 X4 X5 X6 X7 X8 X9
XOR
NRZ0-7
SCRAM0-7
XOR
1996 Jul 25 23
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
at a high impedance state when not in data read mode. In byte-wide mode, an even parity bit , NRZP, is generated for
each output byte.
WRITE PRECODER
The P32P4911A implements a 1/(1D2) write precoder which is used to precode the serialized encoder data for PR4.
The state of the precoder is preset to 0,0 upon exiting write mode. This guarantees that precoder will begin the next write
in the 0,0 state. The state of the precoder is not guaranteed when the write data (WD/WD) changes from sync field to
encoded data. The result is that one of 2 different write data patterns or their inverses may be written for a particular
write. All four of these patterns will decode properly upon read back. As a result of the fact that the write data toggle
flip-flop is utilized as part of the precoder, the read/write amplifier connected to the P32P4911A must not contain a T
flip-flop. The precoder block diagram is shown in Figure 12.
Figure 11: NRZ Timing
RCLK
NRZ0-7 Read Mode-Byte Wide
byte 0 byte 1
WCLK
NRZ0-7 Write Mode-Byte Wide
byte 0 byte 1
RCLK
Read Mode-Nibble
NRZ1 bit 5
bit 4
bit 0
NRZ0
WCLK
NRZ1 bit 5
bit 4 bit 0
Write Mode-Nibble
bit 4
NRZ0
bit 7
bit 5
bit 3
bit 1
bit 7
NRZ3
bit 6 bit 2 bit 6
NRZ2
NRZ3 bit 7
bit 5
bit 3
bit 1
bit 7
bit 6
bit 4
bit 2 bit 6
NRZ2
byte 0 = MSN byte 0 = LSN byte 1 = MSN
byte 0 = MSN byte 0 = LSN byte 1 = MSN
Figure 12: Precoder Block Diagram
D
XOR
WRITE CURRENT
CODED DATA
D
1996 Jul 25 24
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
WRITE PRECOMPENSATION
The write precompensation circuitry is provided to compensate for media bit shift caused by magnetic nonlinearities. The
circuit recognizes specific write data patterns and can add delays in the time position of write data bits to counteract the
magnetic nonlinearity effect. The magnitude of the time shift, WPC, is programmable via the Write Precomp Register
and is made proportional to the time base generator's VCO period (i.e., data rate). The circuit performs write
precompensation only on the second of two consecutive "ones" and only shifts in the late direction. If more than two
consecutive "ones" are written, all but the first are precompensated in the late direction.
Servo Demodulator Circuit Description
Servo functionality is provided by two separate circuits: the servo full-wave rectifier circuit, and the previously described
dual level pulse qualifier circuit. To support embedded servo applications, P32P4911A provides separate programmable
registers for servo mode filter cutoff frequency, boost, and qualification threshold. The values programmed in these
registers are selected upon entry into servo mode (SG=1). The RDS pulse polarity is programmable via the Servo Mode
Select (SMS) bit in the Data Rate Register. This bit also determines the polarity of the RDS/RDS output. In addition, the
RDS/RDS pulse width is also programmable via the RDSPW bit in the sample Loop Control Register (SLC).
The servo demodulator circuit outputs a full wave rectified version of the signal at DP/DN to the SEROUT pin when SG=1.
The signal is referenced to the SREF output pin which is biased at about 3.1V below VPA. The SEROUT signal has a
gain of 0.6 V/Vppd so that a 1.4V signal at DP/DN will produce a 0.84V peak excursion at SEROUT. When SG=0, the
SEROUT pin outputs either SREF or SREF + 200 mV. The SELVRC input pin selects which DC voltage is output in this
mode. The 200 mV offset can be used to calibrate the gain of the A/D converter which is driven by the SEROUT signal.
Servo Timing Outputs
The dual level qualifier that was previously described is used to generate the RDS/RDS and PPOL timing signals. The
RDS/RDS output pin pulses Low for each positive or negative servo peak that is qualified by the dual level qualifier. The
pulse width of RDS/RDS may be selected as either 15 ns or 27 ns with the RDSPW bit in the Sample Loop Control
Register. The PPOL output pin provides the pulse polarity information for the qualified peaks, where PPOL=1 for a
positive peak and PPOL=0 for a negative peak. To reduce noise propagation, the RDS/RDS and PPOL outputs are only
active in servo mode.
Serial Port Circuit Description
The serial port interface is used to program the P32P4911A's seventeen internal registers. The serial port is enabled for
data transfer when the Serial Data Enable (SDEN) pin is High ("1"). SDEN must be asserted High prior to any
Figure 13: RDS/RDS and PPOL vs. DP/DN Relationship
DP/DN
+ Threshold
- Threshold
RDS
PPOL
(+LSth)
(-LSth)
1996 Jul 25 25
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
transmission and it should remain High until the completion of the transfer. At the end of each transfer SDEN should be
brought Low ("0").
When SDEN is High, the data presented to the Serial Data (SDATA) pin will be latched into the P32P4911A on each
rising edge of the Serial Clock (SCLK). Rising edges of SCLK should only occur when the desired bit of address or data
is being presented on the serial data line. Serial data transmissions must occur in 16-bit packets. If more than 16 rising
edges of SCLK are received during the time that SDEN is High, only the last 16 are considered valid. For all valid
transmissions, the data is latched into the internal register on the falling edge of SDEN.
Each 16-bit transmission consists of a read/write control bit (must always be reset, i.e., R/W = "0" for write only) followed
by 3 device select bits, 4 address bits and eight data bits. The device select and address bits select the internal register
to be written to. The device select, address and data fields are input LSB first, MSB last, where LSB is defined as Bit 0.
The three device select bits select the type of device on the Philips Semiconductors serial bus to be communicated with
and must be set to S0 = 0 or 1 (depending on register to be selected), S1 = 1, and S2 = 0 when communicating with the
P32P4911A. The figure below shows the serial interface timing diagram.
Description of Operating Modes
The fundamental operating modes of the P32P4911A are controlled by the Servo Gate (SG), Read Gate (RG), and Write
Gate (WG/WG) input pins. The exclusive assertion of any these inputs causes the device to enter that mode. If none of
these inputs is asserted, the device is in the idle mode. If more than one of the inputs is asserted, the mode is determined
by the following hierarchy: SG overrides RG which overrides WG/WG. The mode that is overriding takes effect
immediately.
RG and SG are asynchronous inputs and may be initiated or terminated at any position on the disk. WG/WG is also an
asynchronous input, but should not be terminated prior to the last output write data (WD/WD) pulse.
Figure 14: Serial Interface Timing
SDEN
SCLK
SDATA
t
C
t
SENS
t
CKL
t
CKH
t
DS
t
DH
t
SENH
t
SL
COMPLETE REGISTER STRING ID
R/W
“0” S0 S1 S2 A0 A3 D0 D7
SM00003
1996 Jul 25 26
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Mode Control
IDLE MODE OPERATION
If SG, RG, and WG/WG are not active, the P32P4911A is in idle mode. When in idle mode, the Time Base Generator
and the Data Separator PLL are running and the Data Separator PLL is phase-frequency locked to the TBG VCO output.
The AGC, continuous time filter, and pulse qualifiers are active but the outputs of the pulse qualifiers are disabled. The
continuous time filter is using its programmed values for cutoff frequency and boost determined by the data mode
registers. The AGC operation is the same as in the VCO preamble portion of a data read. Servo burst capture is
operational in idle mode but the filter and AGC settings are for data reads and not for servo reads as would be the case
if the device was in servo mode. The RDS/RDS and PPOL outputs are disabled in idle mode.
SERVO MODE OPERATION
If SG is High, the device is in the servo mode. This mode is the same as idle except that the filter cutoff and boost settings
are switched from those programmed for data read mode to those programmed for servo mode, the AGC is switched to
servo mode, and the RDS/RDS and PPOL and outputs are enabled. The assertion of SG causes read mode, write mode,
and the power down register settings for the front end to be overridden.
WRITE MODE OPERATION
The P32P4911A supports three different write modes; Normal write mode, direct write mode #1 and direct write mode
#2. The direct write modes require that either the direct write bit, bit 0 of the Control Operating Register, or the DWR pin
be active. All three write modes require that the Data Separator be powered on. The active polarity of write gate can be
selected by programming the WGP bit in the Control Operating Register. The PDWN input should be kept Low until all
registers are properly loaded to prevent an illegal write operation at power up.
NORMAL WRITE MODE
The P32P4911A is in the normal write mode if WG/WG is active, DWR is High, and the direct write bit in the Control
Operating Register is Low. A minimum of one NRZ time period must elapse after RG goes Low before WG/WG can be
set active. The Data Separator PLL is phase-frequency locked to the TBG VCO output in this mode.
In normal write mode, the circuit first autogenerates the VCO sync pattern, then scrambles the incoming NRZ data from
the controller, encodes it into 8,9 GCR formatted data, precodes it, precompensates it, feeds it to a write data toggle
flip-flop, and outputs it to the preamp for storage on the disk. When WG/WG goes inactive, the WD/WD outputs remain
enabled but the active pull down current is reduced by a factor of 7 to reduce power consumption and the write data
flip-flop is reset to guarantee that the WD/WD outputs represent a zero state.
In normal write operation, when the write gate (WG/WG) goes active, the VCO sync field generation begins, which
causes a continuous "2T" pattern at the WD/WD outputs {(1,1,-1,-1,1,1,-1,-1...) in the write current domain}. The NRZ
inputs must be Low and must be held Low for the duration of the VCO sync field generation. The minimum required sync
field is equivalent to 8 byte times.
WG/WG RG DEVICE MODE DESCRIPTION
0/1 0 Idle Mode DS VCO locked to FTBG. NRZ7-0 tri-stated.
0/1 1 Data Read
Mode DS PLL acquisition, adaptive equalizer training, code word boundary
search and detect, decode, sync byte detect, and NRZ data output. DS
VCO switched from FTBG to RD after preamble detect. RCLK gen. input
switched from FTBG to DS VCO. RCLK re-synchronized to RD at code
word boundary detect. NRZ7-0 active.
1/0 0 Data Write Mode Write mode preamble insertion and data write. DS VCO locked to FTBG.
RCLK synchronized to FTBG. WD and WD active. NRZ7-0 = inputs.
1/0 1 Read Override RG overrides WG/WG which causes any write in progress to cease and
Data Read Mode to be entered.
1996 Jul 25 27
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
The P32P4911A also allows the precoder to be preset when the first training byte arrives at the precoder. With Control
Operating Mode Register #2 bit 3 (TME) and bit 0 (PCSDIS) set to 0, the P32P4911A allows presetting of the precoder.
Bit 2 (PCSPOL) of the Control Operating Mode Register #2 allows the precoder to be preset if PFSPOL is set to 1 and
reset if set to 0.
TRAINING AND SYNC BYTE GENERATION
The P32P4911A supports two modes of sync byte detection, single byte and dual "or" byte, and two modes of training
and sync byte generation, manual and semi-automatic. The manual mode is generally recommended because it can be
used for either dual or single sync byte detection and provides more flexibility in altering the number of training bytes to
be written. The semi-automatic mode can only be used to generate an internally fixed number of training bytes and a
single sync byte, but saves controller state machine space.
MANUAL MODE
In the manual mode, the device will continue to autogenerate the sync field pattern until a 93H is latched at the NRZ
interface, and detected. The device encodes the 93H pattern and writes the result as the training pattern.
For the single sync byte detection mode, a recommended minimum of 5 bytes of 93H must be written to the NRZ interface
to write the 5 byte equalizer training pattern. Next, the NRZ data must be changed to 69H for 1 byte time to write the
single sync byte.
For the dual sync byte detection mode, a recommended minimum of 4 bytes of 93H must be written to the NRZ interface
to write the minimum 4 byte equalizer training pattern. The NRZ data must then be changed to 1FH for one byte time to
write the first sync byte. The NRZ data must then be changed to 93H for one byte time to write a training/propagation
byte. Next, the NRZ data must be changed to 69H for one byte time to write the second sync byte.
SEMI-AUTOMATIC MODE
In the semi-automatic mode, the device will continue to autogenerate the sync field pattern until a FFH is latched at the
NRZ interface, and detected. The device then internally generates the encoded the 93H pattern for 5 byte times and
writes the result as the training pattern. It then internally generates the encoded 69H pattern for 1 byte time to write the
single sync byte. To maintain proper controller synchronization, the FFH should be presented at the NRZ interface for
Figure 15: Hard Sector Write Sequence - Dual Sync
GAP
8 BYTES MIN. 4 BYTES MIN. 1 BYTE
NRZ DATA (WRITE) 00H 93H 69H USER DATA
WG
1 BYTE
1FH
1 BYTE
93H
VCO SYNC
FIELD TRAINING
SEQUENCE SYNC
BYTE#1 TRAIN
BYTE SYNC
BYTE#2 SCRAMBLED AND ENCODED
USER DATA
1996 Jul 25 28
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
a total of 6 byte times. Note that the semi-automatic mode can only be used to write single sync byte format and the
training pattern length is fixed at 5. This mode is useful if controller state machine space is extremely limited.
USER DATA
The user data must be presented at the NRZ interface immediately following the last NRZ sync byte written. Finally, after
the last byte of user data has been clocked in, the WG/WG must remain active for a minimum of 16 NRZ bit times in
byte-wide mode to ensure the that the device is flushed of data (The delay is 21 NRZ bit times in nibble mode). WG/WG
can then go inactive. WD/WD stops toggling a maximum of 2 NRZ (RCLK) time periods after WG/WG goes inactive.
DIRECT WRITE MODE #1
In this direct write mode, the NRZ data from the byte-wide interface bypasses the scrambler, the 8,9 encoder and the
precoder, but is precompensated before going to the write data flip-flop and then to the WD/WD output pins. The RCLK
output is changed from 9 VCO clock periods to 8 VCO clock periods with a 3/8 duty cycle. The purpose of routing the
signal to the precomp circuit is to generate a return to zero pulse every time a "1" occurs in the data so that the write data
flip-flop is toggled. WCLK is not required to latch the byte-wide NRZ data into the NRZ interface since the data is latched
by an internal version of RCLK, but the NRZ data must be valid no later than 12 ns after the rising edge of the RCLK
output pin. Direct write mode #1 is selected by setting the DW bit (bit 0) in the Control Operating Register. and is entered
when the WG/WG input is active. This mode is not valid when using the nibble NRZ interface. Note that Direct Write
Mode #2 will override Direct Write Mode #1.
DIRECT WRITE MODE #2
In this direct write mode, the data presented at the DWI/DWI input pins directly toggles the write data flip-flop which drives
the WD/WD output pins. No WCLK is required in this mode, and the WD/WD output is not resynchronized. Direct write
mode #2 is selected by driving the DWR input Low and is entered when the WG/WG input is active. Note that the Direct
Write Mode #2 will override Direct Write Mode #1.
DATA READ MODE OPERATION
Data read mode is initiated by setting the Read Gate (RG) input pin High. This action causes the data synchronizer to
begin acquisition of the clock from the incoming VCO sync pattern. To achieve this, the data synchronizer utilizes a fully
integrated fast acquisition PLL to accurately develop the sample clock. This PLL is normally locked to the time base
Figure 16: Hard Sector Semi-Auto Write Mode
GAP
8 BYTES MIN. 5 BYTES 1 BYTE
NRZ DATA (WRITTEN TO 4911A) 00H FFH FFH USER DATA
WG
NRZ DATA (WRITTEN BY 4911A) 00H 93H 69H USER DATA
VCO SYNC
FIELD TRAINING
SEQUENCE SYNC
BYTE SCRAMBLED AND ENCODED
USER DATA
1996 Jul 25 29
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
generator output, but when the Read Gate input (RG) goes High, the PLL's reference input is switched to the filtered
incoming read signal.
ACQUISITION OF DS VCO SYNC
When the Read Gate input is asserted, the read sequence is initiated. At this time an internal counter begins counting
the pulses that are qualified by the dual level pulse qualifier given the polarity changes of the incoming 1,1,-1,-1,1,1 read
back pattern defined by the VCO sync field. When the count reaches 4, the internal read gate is asserted and the DS
PLL input is switched from the TBG's VCO output to the sampled data input. This is also the point at which the DS PLL's
phase detector is switched from the phase-frequency detector to the decision directed phase detector. The counter is
also used to determine whether the selected sync field count, SFC, has been achieved. When the counter reaches the
value specified by SFC, the data synchronizer PLL is assumed to be locked and settled (VCO lock). Also at SFC, the
phase detector gain switch and the AGC mode switch occur. To allow for different preamble lengths, the SFC can be set
to 64, 80, 96 or 128 from the Sample Loop Control Register. These values for the SFC may be thought of as the number
of code clock periods in the sync field, but they actually represent twice the number of incoming polarity changes
required.
VCO LOCK, PD GAIN, AGC MODE SWITCH,AND CODE WORD BOUNDARY DETECTOR ENABLE
At SFC, one of two phase tracking methods will be chosen depending on the Enable Phase Detector Gain Switching
(GS) bit in the Control Operating Mode Register. When the GS bit is High, the phase detector gain is reduced by a factor
of 6 or 10 as dictated by the GS_10 bit after the SFC count is reached. When the GS bit is Low, no phase detector gain
switching takes place.
Also after SFC, the AGC feedback will be switched from the continuous time fullwave rectifier to sampled data feedback.
At SFC, the internal VCO lock signal activates the code word boundary detection circuitry to define the proper decode
boundaries. Also, at count SFC, the RCLK generator source switches from the TBG's VCO output to the DS VCO clock
signal which is phase locked to the incoming read data samples. The DS VCO is assumed locked to the incoming read
samples at this point. At SFC a maximum of 1 RCLK time period may occur for the RCLK transition, however, no short
duration glitches will occur. After the code word detection circuitry finds the proper code word boundary, the RCLK
generator is again resynchronized to guarantee that the RCLK is in sync with the data. The RCLK output will not glitch
and will not toggle during this RCLK generator resynchronization for up to 2 byte times maximum.
Also at the code word boundary detect, the internal 9-bit code words are allowed to pass to the ENDEC for decoding.
This decoding will occur until read gate is deasserted.
Figure 17: Read Sequence - Dual Sync Byte Modes
GAP
8 BYTES MIN. 5 BYTES MIN. 1 BYTE
NRZ DATA HIGH Z 00H 00H 00H USER DATA
RG
SBD
1 BYTE
69H
1 BYTE
00H
SYNC
BYTE#2
SYNC
BYTE#1 TRAIN
BYTE
TRAINING
SEQUENCE
VCO SYNC
FIELD SCRAMBLED AND ENCODED
USER DATA
1996 Jul 25 30
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
ADAPTIVE EQUALIZER TRAINING SEQUENCE
TRAINING SEQUENCE FOR SINGLE SYNC BYTE MODE
As was previously discussed, in a single sync byte type write sequence, a minimum of 5 bytes of NRZ 93H and one byte
of 69H must be written between the end of the VCO sync field and the beginning of the user data. The 5 bytes of 93H
are 8,9 encoded and precoded during write mode to produce the adaptive equalizer training pattern. During read mode,
the encoded 93H sequence (100110011 read data sequence) and the encoded 69H are used to adaptively train the inner
two taps of the five tap transversal filter in a zero forcing manner. The error at the filter output is integrated to derive the
tap weight multiplying coefficient, Km1. Both of these inner taps use the same Km1. It is anticipated that the continuous
time filter will be used for coarse equalization and that transversal filter will be used adaptively for fine tuning. This will
reduce Km’s range and accuracy requirements. Since there are encoded user data patterns that will not produce an
equalizer correction error, an equalization hold during data mode can be selected from the Sample Loop Control
Register. If the equalizer is programmed to adapt only during the training sequence, the sync byte detect signal is used
to hold the Km1 value. After the training pattern, if the loop is active during user data, the equalizer loop gain will be
reduced by 7. The loop’s integration time constant is made inversely proportional to the selected data rate.
The Km1 coefficient can be held at the present instantaneous value by asserting the EQHOLD input. If EQHOLD is
asserted, the Km1 value will not be changed by either exiting read mode, subsequent training patterns, or by subsequent
data patterns. When EQHOLD is deasserted, the equalizer will resume its normally programmed functionality. The Km1
value can be held with reasonable accuracy for up to 1 ms to make the number of code periods required for acquisition
data rate independent.
TRAINING SEQUENCE FOR DUAL SYNC BYTE MODE
The adaptive equalizer training used for the dual sync byte detection mode is the same as that used in the single sync
byte mode except that the adaptation occurs over the 4 encoded 93H bytes, sync byte #1 (1FH), another 93H and sync
byte #2 (69H). This occurs because the Sync Byte Detect (SBD) is what disables the adaptation if adaptation is enabled
only during the training sequence. The number of consecutive 93H training bytes may be reduced in dual sync byte
mode because the sync byte #1 has been chosen to have the same training properties as the 93H training byte.
SYNC BYTE DETECT AND NRZ OUTPUT
The P32P4911A implements a dual "OR" type sync byte detection which offers increased sync byte detection capability
while maintaining backward compatibility with the single sync byte format and detection. The two bytes of the dual sync
byte are separated by a training byte to allow for Viterbi error propagation that may be caused by an error in the first sync
byte. The training byte 93H was chosen to provide the adaptive equalizer an ideal training signal.
As the read data is 8,9 decoded, it is compared to one of two internally fixed sync bytes (1FH or 69H). If the 1FH byte
is found, the SBD output will go Low 18 code clocks (2 byte times) later and the 69H byte will be the first non-zero byte
presented at the NRZ interface. If a match of the 69H byte is the first found, the sync byte detect (SBD) pin goes Low
and the NRZ output data that until now was held Low, is changed to 69H. The next byte presented on the NRZ outputs
is the first byte of user data. SBD will remain Low and NRZ data will continue to be presented at the NRZ interface until
the read gate is deasserted at which point SBD goes High and the NRZ outputs go to a high impedance state.
SURFACE DEFECT SCAN MODE
The P32P4911A helps check for media defects using the surface defect scan mode. In order to use this mode the part
must have the byte-wide interface enabled. In write mode, all zeros are presented (written) at the NRZ interface. When
this pattern is to be read back, bit 7 (DSE bit) of the N Counter Register is enabled which enables the surface defect scan
mode. The survival sequence register must also be turned off (BYPSR bit). In this mode,SBD will transition Low at SFC.
The NRZ7 pin is monitored. If no defect occurs, the NRZ7 pin will stay Low. If a defect occurs, the NRZ7 pin will transition
1996 Jul 25 31
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
High on the falling edge of RCLK and stay high as long as the defect is present, transition back Low on the next falling
edge of RCLK when the defect is not present.
Power Down Operation
The power management modes of the P32P4911A are determined by the states of the Power Down Register bits and
the PDWN and SG inputs. The individual sections of the chip can be powered down or up using the Power Down
Register. A High level in a Power Down Register bit disables that section of the circuit. The power down information
from the Power Down Register takes effect immediately after the SDEN pin goes Low.
When the PDWN input is Low, the chip goes into full power down mode regardless of the power down register settings
or the state of the SG input.
When PDWN is High, SG will force the AGC, filter, and pulse qualifier circuits (front end) to be active by overriding the
front end register bit. The back end power down register bits, which include the Data Separator and Time Base Generator
are not affected by the SG input.
The serial port is active in all power down modes.
The time to restart from a full power down is dependent on the PLL loop filter and the data rate.
The truth table for the various modes of operation is shown below:
SG, PDWN : 1,1 1,0 0,1 0,0
Front End ON OFF R OFF
Data Separator R OFF R OFF
Time Base Generator R OFF R OFF
Serial Port ON ON ON ON
R = Controlled by register bit.
(Register bit =1 turns circuits OFF,
Register bit = 0 turns circuits ON)
Figure 18: Surface Defect Scan Mode
SFC
RG
SBD
RCLK
NRZ7 DEFECT
SM00002
1996 Jul 25 32
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
REGISTER DESCRIPTIONS
Serial Port Register Definitions
Complete Register ID String A3 A2 A1 A0 S2 S1 S0 R/W
Power Down Register (PD) 0 0 0 0 0 1 0 0 04H
Bits 7-6
TPC/1-0 Test point C/D control (TME = 0)
TPC+/TPC- TPD+/TPD- TPE
0X = disabled disabled disabled
1X = DP/DN CP/CN disabled SG = 1
1X = disabled disabled disabled SG = 0
TPC
/D1-0 Test Point C/D Control (TME = 1)
TPC+/TPC- TPD+/TPD- TPE(AGCSEL=0) TPE(AGSEL=1)
00* = disabled disabled disabled disabled
01 = DP/DN CP/CN disabled low-z oneshot
Servo calibration enabled
input mode to qualifiers, etc.
10 = DP/DN CP/CN full wave fastrec
rectifier out oneshot
output mode from filter/offset canceller
11 = filter filter full wave ultra fast
bypass bypass rectifier out decay ctrl.
Bits 5-4 ATOSEL Output select for ATO test point
00 = MAXREF/2
01 = DAC output enabled DAC test mode
10 = Amplitude Asymmetry Monitor output (QASYM) selected
11 = Channel Equalization Monitor output (Q) selected
Bit 3 ACCPL Internal AC coupling enable/disable (TME = 0)
0 = Internal AC coupling, AGC switched to sample mode at
SFC
1 = Internal AC coupling, AGC is always in continuous mode
Internal AC coupling enable/disable (TME = 1)
0 = Internal AC coupling is enabled
1 = Internal AC coupling is disabled
Bit 2 TB Time Base Generator power down
0 = power up
1 = power down;
Bit 1 DS Data Separator power down
0 = power up
1 = power down;
Bit 0 PD AGC, Filter, Pulse Detector, and Servo power down
0 = power up
1 = power down;
* Servo calibration mode enabled, strobing must occur for operation.
Data Filter Cutoff Register (FC) 0 0 0 1 0 1 0 0 14H
Bit 7 3TAPEN 3 Tap equalizer enable
0 = enable 5 tap equalizer (Normal operation)
1 = enable only 3 tap equalizer (4901 mode)
Bits 6-0 FC6-0 Filter cutoff frequency setting in non-servo mode
ƒc (MHz) = 0.301 * FC - 1.142 44 < FC < 117dec
1996 Jul 25 33
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Servo Filter Cutoff Register
(FCS) 0 0 1 0 0 1 0 0 24H
Bit 7 PDM Servo Peak Detector Mode
0 = Window Qualifier
1 = Hysteresis Qualifier
Bits 6-0 FCS6-0 Filter cutoff frequency setting in servo mode
ƒc (MHz) = 0.277 * FC + 0.0802 14 < FC < 43dec
Data Filter Boost Register (FB) 0 0 1 1 0 1 0 0 34H
Bit 7 LZTC Non Low-Z vs. Low-Z time constant
0 = 15:1
1 = 5:1
Bits 6-0 FB6-0 Filter boost setting in data mode
Boost (dB) = 20 * log[0.021848 * FB + 0.000046 * FB * FC + 1]
0< FB < 127dec
Servo Filter Boost Register
(FBS) and Group Delay
Equalizer Register
0 1 0 0 0 1 0 0 44H
Bits 7-6 FBS 1-0 Filter boost setting in servo mode
00 = 0 dB
01 = 2 dB
10 = 4 dB
11 = 6 dB
Bits 5-0 FGD5-0 Filter Group Delay % In all modes
Group Delay % = 0.9783 * (FGD 4-0) - 0.665,
where FGD5 = 1 is positive, 0 is negative
0 FGD 31dec
Viterbi Detector Threshold
Register (VDT) 0 1 0 1 0 1 0 0 54H
Bit 7 BYPSR Survival Sequence Register Bypass/Write Precode Bypass
0 = bypass disabled (normal operation)
1 = bypass enabled
Bits 6-0 VD6-0 Viterbi qualification threshold voltage
Vth (mV) = 7.874 * VD
45 VD 127dec
Data Level Threshold Register
(LD) 0 1 1 0 0 1 0 0 64H
BIts 7-6 Not used
Bits 5-0 LD5-0 Data level qualification threshold voltage
if WP/LT Register : ALE = 0 (Fixed levels)
Prior to SFC : Lth (mV) = 10.47 * LD
After SFC : Lth (mV) = 7.44 * LD
16 LD 63dec
if WP/LT Register : ALE = 1 (Adaptive levels)
After SFC : Lth (%) = 1.574 * LD
Serial Port Register Definitions (Continued)
Complete Register ID String A3 A2 A1 A0 S2 S1 S0 R/W
1996 Jul 25 34
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Servo Level Threshold
Register (LDS) 0 1 1 1 0 1 0 0 74H
Bits 7-6 SAGC
LVL1-0 Servo mode AGC
level control
00 = 1.40 Vppd
01 = 1.30 Vppd
10 = 1.20 Vppd
11 = 1.10 Vppd
VRC-AGCREF output
voltage
128 mV
253 mV
378 mV
503 mV
Bits 5-0 LDS5-0 Servo level qualification threshold voltage
LSth (mV) = 10.47 * LDS
Serial Port Register Definitions (Continued)
Complete Register ID String A3 A2 A1 A0 S2 S1 S0 R/W
1996 Jul 25 35
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Serial Port Register Definitions (Continued)
Complete Register ID String A3 A2 A1 A0 S2 S1 S0 R/W
Control Test Mode Register
(CT) 1 0 0 0 0 1 0 0 84H
Bit 7 EFR Sample clock source
0 = sample clock is from the DS VCO, normal operation
1 = sample clock is from the TBG output, a test mode
Bit 6 ECP Factory reserved bit, must be set to 0 in application (enables
charge pump)
Bits 5-3 TP3-1 Multiplexed test point selection
TP3 TP2 TP1 Function TPA+, TPA- TPB+, TPB-
0 0 0 Test Points Off high impedance high impedance
0 0 1 Survival Out/In SSOUT A, B (sngl) SSIN A+, A- (sngl),
0 1 0 Eq Cont/Phase Det Equalizer Control (diff) Phase Detect Out (diff),
0 1 1 Viterbi Survival In SSIN B+,B- (sngl) SSIN A+, A- (sngl),
1 0 0 Equalizer Outputs Equalizer A (diff) Equalizer B (diff)
1 0 1 EQ out/Survival In Equalizer A (diff) SSIN A+, A- (sngl)
1 1 0 EQ out/Survival Out Equalizer A, B (sngl) SSOUT A, B (sngl)
1 1 1 EQ out/VCO/2 Equalizer A, B (sngl) DS VCO/2 (diff) for RG = 1
EQ out/TBG out Equalizer A, B (sngl) TBG out (diff) for RG = 0
Control Test Mode Register
(CT) 1 0 0 0 0 1 0 0 84H
Bit 2 RCK2X/
VRDT Enable double RCLK drive (TME = X)
0 = RCLK drive at 1x in byte wide mode, 2x in nibble mode
1 = RCLK drive at 2x in both byte wide and nibble mode
Enable VRDT input (TME=1)
0 = Viterbi survival outputs to the data decoder, normal use
1 = Digital input to the data decoder , fixed AGC filter gain =
24dB used in testing only.
Bit 1 DT Enable TBG pump down
0 = not in pump down test mode
1 = continuous pump down, for test only
Bit 0 FSB/UT Training Termination (TME = 0)
0 = termination training when SBD goes Low
1 = terminate training 4 bytes after framing
Enable TBG pump up (TME = 1)
0 = not in pump up test mode
1 = continuous pump up, for test use only
FLTR1+ sources current; FLTR1- sinks current
1996 Jul 25 36
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Serial Port Register Definitions (Continued)
Complete Register ID String A3 A2 A1 A0 S2 S1 S0 R/W
N Counter Register (N) 1 0 0 1 0 1 0 0 94
Bit 7 DSE Defect Scan Enable
0 = normal operation
1 = defect scan mode enabled
Bits 6-0 N6-0 N Counter
2 < N < 127
M Counter Register (M) 1 0 1 0 0 1 0 0 A4H
Bits 7-0 M7-0 M Counter
2 < M < 255
FTBG = FREF * [(M+1) ÷ (N+1)]
Data Rate Register (DR) 1 0 1 1 0 1 0 0 B4H
Bits 7 SMS Servo Mode Select
0 = RDS is active Low (normal operation)
1 = RDS is active High
Bits 6-0 DR6-0 Fvco (MHz) = 9/8 Data Rate = 1.143 * DR + 4.986 for
RR = 10 k
37 < DR < 127
1996 Jul 25 37
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Serial Port Register Definitions (Continued)
Complete Register ID String A3 A2 A1 A0 S2 S1 S0 R/W
Write Precomp / Level
Threshold Time Constant
Register (WPLT)
1 1 0 0 0 1 0 0 C4H
Bits 7-6 TC2-1 Adaptive Level qualification threshold time constant for
Decision Directed Phase Detector. (Valid After SFC)
TC2
0
0
1
1
TC1
0
1
0
1
Time Constant
200 ns
400 ns
600 ns
800 ns
Bit 5 ALE Enable adaptive level qualification in Decision Directed
Phase Detector
0 = fixed level qualification
1 = adaptive mode
Bit 4 FREZQ Freeze Channel Quality Factor and Asymmetry Factor at
Sync Byte Detect
0 = Update during read
1 = Freeze at SBD
Bits 3-0 WPC3-0 Write Precomp setting
WPC3 WPC2 WPC1 WPC0 Write Precomp Magnitude
0 0 0 0 No precomp
0 0 0 1 2.1% code period shift
0 0 1 0 4.2% code period shift
0 0 1 1 6.3% code period shift
0 1 0 0 8.4% code period shift
0 1 0 1 10.5% code period shift
0 1 1 0 12.6% code period shift
0 1 1 1 14.7% code period shift
1 0 0 0 16.8% code period shift
1 0 1 0 21.0% code period shift
1 0 1 1 23.1% code period shift
1 1 0 0 25.0% code period shift
1 1 0 1 27.3% code period shift
1 1 1 0 29.4% code period shift
1 1 1 1 31.5% code period shift
1996 Jul 25 38
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Serial Port Register Definitions (Continued)
Complete Register ID String A3 A2 A1 A0 S2 S1 S0 R/W
Control Operating Register
(CM1) 1 1 0 1 0 1 0 0 D4H
Bit 7 AUTOTR Enables Semi-Automatic training and sync byte generation
0 = disabled (normal operation)
1 = enabled (single sync byte only)
Bit 6 AGCSEL Selects AGC control mode
0 = Direct mode i.e., external control signals must be
provided
1 = Timed mode i.e., control provided by one shot timing
from SG and WG/WG
Bit 5 WGP Write gate polarity
0 = active High, (normal operation)
1 = active Low
Bit 4 NIB Enable Nibble interface
0 = Nibble interface disabled, i.e., byte-wide interface
enabled
1 = Nibble (NRZ3-0) interface enabled
Bit 3 BT Bypass Time Base Generator
0 = data synchronizer reference frequency is TBG output,
(normal operation)
1 = data synchronizer reference frequency is FREF input
Bit 2 SD Disable Data Scrambler/Descrambler
0 = enabled, (normal operation)
1 = disabled
Bit 1 GS DS Phase Detector gain switching
0 = enabled, (normal operation)
1 = disabled
Bit 0 DW Enable Direct Write From Byte-wide NRZ (Bypasses
scrambler and ENDEC)
0 = disabled; (normal operation)
1 = enabled,
1996 Jul 25 39
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Serial Port Register Definitions (Continued)
Complete Register ID String A3 A2 A1 A0 S2 S1 S0 R/W
Sample Loop Control
Register (SLC) 1 1 1 0 0 1 0 0 E4H
Bit 7 RDSPW RDS output pulse width
0 = 15 ns
1 = 27 ns
Bits 6-5 SFC1-0 Sync Field Count
SFC1
0
0
1
1
SFC0
0
1
0
1
Sync Field Count (code clocks)
64
80
96
128
Bit 4 AEGS Adaptive Equalizer Loop time constant shift
0 = equalizer loop time constant same in preamble and data
fields
1 = equalizer loop time constant is increased to 7X in the
data field elative to the preamble field, i.e. loop gain is
reduced to 1/7
Bit 3 AED Enable Adaptive Equalizer on Data Field
0 = adaptive equalizer disabled after preamble field
1 = adaptive equalizer in use after preamble field,
if AEE bit = 1
Bit 2 AEE Enable Adaptive Equalizer
0 = adaptive equalizer disabled
1 = adaptive equalizer enabled for use in preamble field,
and after the preamble field if AED bit = 1
Bits 1-0 AGC1-0 AGC charge pump current in Sampled AGC mode
AGC charge/discharge current (µA) = 2.66 * AGC * DR/RR
(k)
37 < DR < 127, e.g., RR = 10 ke.g., for DR = 100 and
AGC=10 =2dec charge pump current = 53 µA
Damping Ratio Control
Register (DRC) 1 1 1 1 0 1 0 0 F4H
Bit 7 GS_10 Data separator PLL gain shift factor
0 = 6
1 = 10
Bits 6-0 D6-0 Damping amplifier gain A = D * (0.7 / 127)
Damping Ratio = A KVCO 0.25×× 2ωn
--------------------------------------------
--
1996 Jul 25 40
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Serial Port Register Definitions (Continued)
Complete Register ID String A3 A2 A1 A0 S2 S1 S0 R/W
Control Operating Mode
Register #2 (CM2) 0 0 0 0 0 1 1 0 06H
Bits 7-4 KM3-0 Equalizer outer tap coefficient km2
km2 = 0.0168 * KM (KM is in 2's compliment)
0111 = +0.117
0110 = +0.101
0101 = +0.0840
0100 = +0.0672
0011 = +0.0504
0010 = +0.0336
0001 = +0.0168
0000 = 0
1111 = -0.0168
1110 = -0.0336
1101 = -0.0504
1100 = -0.0672
1011 = -0.0840
1010 = -0.1010
1001 = -0.1170
1000 = -0.1350
Bit 3 TME Test Mode Enable
0 = TPC and TPD active when SG = 1 and bit 7 of Power
Down Control Register is 1
1 = TPC and TPD as set by bits 6 and 7 of the Power Down
Control Register
Bit 2 PCSPOL Precoder Polarity State
0 = Precoder state set to 0
1 = Precoder state set to 1
Bits 1-0 QTC1-0 Qasym and Q Time Constant Control (TME = 1)
Qasym Q
00 = 100 ns 50 ns
01 = 200 ns 100 ns
10 = 400 ns 200 ns
11 = 800 ns 400 ns
Bit 0 PCSDIS Precoder Set Disabled (TME = 0)
0 = Precoder initialization enabled
1 = Precoder initialization disabled
1996 Jul 25 41
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
PIN DESCRIPTIONS
Power Supply Pins
Pin Name Type Pin Function
VPA - AGC / Filter analog circuit supply
VPF - Time Base Generator PLL ECL plus Write pre-comp supply (connect to analog supply)
VPT - Time Base Generator PLL analog circuit supply
VPP - Data Separator PLL analog circuit supply
VPD - TTL Buffer I/O digital supply
VPC - Internal ECL, CMOS logic digital supply
VPS - Sampled data processor supply
VNA - AGC / Filter analog circuit ground
VNF - Time Base Generator ECL ground (connect to analog ground)
VNT - Time Base Generator PLL analog circuit ground
VNP - Data Separator PLL analog circuit ground
VND - TTL Buffer I/O digital ground
VNC - Internal ECL, CMOS logic digital ground
VNS - Sampled data processor ground
VNRX - AGC/Filter analog ground
Analog Input Pins
Pin Name Type Pin Function
VIA+, VIA- I AGC AMPLIFIER INPUTS: Differential AGC amplifier input pins
Analog Output Pins
Pin Name Type Pin Function
TPA+, TPA- O TEST PINS: Emitter output test points. Various signals are multiplexed to these test
points by the Test Point Control Register . The signals include the equalizer control voltage
and output, various timing loop control signals and the Viterbi survival register outputs.
The test points are provided to show how the signal is being processed. Internal "pull
down" resistors to ground are provided. To save power when not in test mode, the control
test register bits 3-5 must be set to "0".
TPB+, TPB- O TEST PINS: Emitter output test points similar to TPA+ and TPA-. The pins are used to
look at the other phase of the interleaved signals.
TPC+, TPC- O TEST PINS: Bi-directional test points which provide emitter outputs similar to TPA+ and
TPA- and provide differential input capability. The pins are used to look at the normal
outputs of the continuous time filter or the AGC amplifier output. These pins can also be
driven with DP/DN like signals for back end testing.
TPD+, TPD- O TEST PINS: Bi-directional test points which provide emitter output test points similar to
TPA+ and TPA- and provide differential input capability. The pins are used to look at the
differentiated outputs of the continuous time filter or the AGC amplifier output. These pins
can also be driven with CP/CN like signals for back end testing.
TPE O TEST PIN: Emitter output test point similar to TPA+. Provides servo FWR out when
enabled.
1996 Jul 25 42
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Analog Output Pins (Continued)
Pin Name Type Pin Function
ATO O ANALOG TEST OUT: This test point output provides a monitor of one of three signals.
They are the equalizer quality signal, the amplitude asymmetry signal, and the DAC
outputs. The selected output is determined by the programming of the ATOSEL bits in
the Power Down Register . If the DAC outputs are selected, the last DAC written to by the
serial control register is the DAC monitored. Signal at ATO is referenced to MAXREF/2.
SEROUT O SERVO OUTPUT: This signal is a full-wave-rectified version of the differential signal at
DP/DN. It is referenced to the SREF output voltage. Open emitter output which requires
an external pull down current when SDIEN is high. When SDIEN is low, a 360 µA pull
down current is interally provided.
SREF O SERVO REFERENCE OUTPUT: Reference voltage for the SEROUT signal. It is set to
one Vbe below the VRC voltage. This is an open emitter output which requires an
external pull down current when SDIEN is high. When SDIEN is low, a 360 µA pull down
current is interally provided.
MAXREF ATO REFERENCE OUTPUT: +3.2V DC reference voltage which can be used as a
baseline for the ATO test point. Can be used for the reference for an external A/D
converter.
AGCREF AGC REFERENCE OUTPUT: Allows programmable fixed gain operation when connected
to either or both of the BYPD or BYPS pins.
Analog Control Pins
Pin Name Type Pin Function
BYP -The data AGC integrating capacitor, CBYP, is connected between BYP and VPA. This pin
is used when not in servo read mode (SG = 0).
BYPS -The servo AGC integrating capacitor , CBYPS, is connected between BYPS and VPA. This
pin is used when in servo read mode (SG = 1).
FLTR1+,
FLTR1- -TBG PLL LOOP FILTER: Differential connection points for the time base generator PLL
loop filter components.
FLTR2+,
FLTR2- -DS PLL LOOP FILTER: Differential connection points for the data separator PLL loop
filter capacitor.
RR -CURRENT REFERENCE RESISTOR INPUT: An external 1%, 10 k (for max data rate
of 125 Mbit/s) or 12.1 k (for max data rate of 100 Mbit/s) resistor is connected from this
pin to ground to establish a precise internal reference current for the data separator and
the time base generator DACs.
VRX -FILTER REFERENCE RESISTOR INPUT: An external 1%, 12.1 k resistor is connected
from this pin to ground to establish a precise PTAT (proportional to absolute temperature)
reference current for the filter DACs.
VRC - AGC REFERENCE VOLTAGE: VRC is derived by a bandgap reference from VPA.
WRDEL -LOWZ ONE-SHOT ADJUST: The resistor connected between this pin and GND
determines the length of the lowz period. tLZ = (RLZ + 0.5) * 0.1 µs/k.
AGCDEL -FAST RECOVERY ONE-SHOT ADJUST: The resistor connected between this pin and
GND determines the length of the fast decay period. tFR = (RFR + 0.5) * 0.1 µs/k.
AGCRST -ULTRA FAST DECAY CURRENT ADJUST: The resistor connected between this pin and
VPA determines the ultra fast decay current given by the equation I = (VP A - VBYP)/Rufd.
This pin may be left open if ultra fast decay action is not required.
1996 Jul 25 43
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Digital Input Pins
Pin Name Type Pin Function
LOWZ I Low-Z MODE INPUT: TTL compatible CMOS control pin which, when pulled High, the input
impedance is reduced to allow rapid recovery of the input coupling capacitor. When pulled
Low, keeps the AGC amplifier and filter input impedance high. An open pin is a logic High.
FASTREC I FAST RECOVERY: TTL compatible CMOS control pin which, when pulled High, puts the
AGC charge pump in the fast decay mode. An open pin is a logic High.
PDWN I POWER DOWN CONTROL: CMOS compatible power control pin. When set to logic
Low, the entire chip is in sleep mode with all circuitry, except serial port, shut down. This
pin must be set to logic High in normal operating mode. Selected circuitry can be shut
down by the Power Down Register. The PDWN pin must be either driven to a valid
CMOS High level or externally pulled up since it is not internally pulled up.
HOLD I AGC HOLD CONTROL INPUT: TTL compatible CMOS control pin which, when pulled
Low, holds the AGC amplifier gain constant by turning off the AGC charge pump. The
AGC loop is active when this pin is either at High or open.
EQHOLD I EQUALIZER HOLD CONTROL INPUT: TTL compatible control pin which, when pulled
High causes the present adaptive equalizer tap weights to be held until the input is set
Low. An open pin is at logic High.
FREF I REFERENCE FREQUENCY INPUT: Reference frequency for the time base generator.
FREF may be driven either by a direct coupled TTL signal or by an ac coupled ECL
signal. When bit 3 (BT) of the Control Operating Register (CM1) is set, FREF replaces
the VCO as the input to the data separator.
WCLK I WRITE CLOCK: TTL compatible CMOS input that latches in the data at the selected
NRZ interface on the rising edge. Must be synchronous with the write data NRZ input.
For short cable delays, WCLK may be connected directly to pin RCLK. For long cable
delays, WCLK should be connected to an RCLK return line matched to the NRZ data bus
line delay. An open pin is at logic High.
RG I READ GATE: TTL compatible CMOS input that, when pulled High, selects the PLL
reference input and initiates the PLL synchronization sequence. A High level selects the
RD input and enables the read mode/address detect sequences. A Low level selects the
time base generator output. An open pin is at logic High.
WG/WG I WRITE GATE: TTL compatible CMOS input that, when pulled High, enables the write
mode. The active state of WG/WG can be selected by the WGP bit in the control
operating register. An open pin is at logic High.
SG I SERVO GATE: TTL compatible CMOS input that, when pulled High, enables the servo
read mode. An open pin is at logic High.
VRDT I VITERBI READ DATA: A TTL or ac coupled PECL compatible input to the data separator
back end, for testing purposes only. This pin is controlled by the VRDT bit in the Control
Test Register (CT).
DWR I DIRECT WRITE MODE 2 ENABLE: Enables DWI, DWI inputs to the write data flip-flop
when input is Low. TTL compatible CMOS levels. Open pin is at logic High.
1996 Jul 25 44
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Digital Input Pins (Continued)
Pin Name Type Pin Function
DWI, DWI I DIRECT WRITE INPUTS: Inputs connect to the toggle input of the write data flip-flop
when DWR is Low. PECL input levels. Can be left open.
SELVRC I SERVO REFERENCE SELECT: TTL compatable input. When SG is low, this input
determines where SREF (SELVRC=high) or SREF + 200 mV (SELVRC = low) is
presented at SREF output. An open pin is logic high.
SDIEN I SERVO TEST MODE: TTL compatible input that enables an internal pulldown current at
the SREF and SEROUT pins. An open pin is logic high.
Digital Bi-directional Pins
Pin Name Type Pin Function
NRZ0-7 I/O BYTE WIDE NRZ DATA PORT: TTL compatible CMOS bi-directional input/output. Input
to the encoder when WG/WG is High. Output from the decoder when RG is High. The 4
LSBs are used in nibble mode. The 4 MSBs can be left open if not used.
NRZP I/O NRZ DATA PARITY BIT: Active when in Byte-Wide mode. TTL compatible CMOS
bi-directional input / output. Generates even read parity when RG is High, and accepts
even write parity when WG/WG is active. Can be left open if not used.
Digital Output Pins
Pin Name Type Pin Function
RCLK O READ REFERENCE CLOCK: A multiplexed clock source used by the controller. When
RG is Low, RCLK is synchronized to the time base generator output, FTBG. When RG goes
High, RCLK remains synchronized to FTBG until the SFC is reached. At that time, RCLK is
synchronized to the data separator VCO. During a mode change, no glitches are
generated and no more than one lost clock pulse will occur. Limited swing CMOS output
levels.
NCLK O NIBBLE MODE CLOCK: A half byte clock synchronized to RCLK. It runs at twice the
frequency of RCLK. Limited swing CMOS output levels. Signal present in byte-wide mode.
SBD O SYNC BYTE DETECT: Transitions Low upon detection of sync byte. This transition is
synchronous with the sync byte's placement on the NRZ lines. Once it transitions Low,
SBD remains Low until RG goes Low, at which point it returns High. CMOS output.
WD, WD O WRITE DATA: Write data flip-flop output. The data is automatically re-synchronized
(independent of the delay between RCLK and WCLK) to the reference clock FTBG, except
in Direct Write mode 2. Differential PECL output levels.
RDS/RDS O SERVO READ DATA: Read Data Pulse output for servo read data. Active Low limited
swing CMOS output. Output active when SG is High, and High when SG is Low. The
RDS/RDS output becomes active High if the Servo Mode Select bit (SMS) in the Data
Rate Register is set.
PPOL O SERVO READ DATA POLARITY: Read Data Pulse polarity output for servo read data.
Active High limited swing CMOS output. Negative pulse = Low, positive pulse = High.
Output active when SG is High.
1996 Jul 25 45
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Serial Port Pins
Pin Name Type Pin Function
SCLK I SERIAL DATA CLOCK: Positive edge triggered clock input for the serial data. CMOS
input levels.
SDATA ISERIAL DATA: Input pin for serial data; 8 register select bits first, followed by 8 data bits.
The register select bits and data bits are entered LSB first, MSB last. CMOS input levels.
SDEN I SERIAL DATA ENABLE: A High level input enables data loading. The data is internally
parallel latched when this input goes Low. CMOS input levels.
1996 Jul 25 46
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Unless otherwise specified, the recommended operating conditions are as follows:
4.5V < POSITIVE SUPPLY VOLTAGE < 5.5V, 0°C < Tamb < 55°C for 100-lead LQFP and 25°C < Tj < 135°C. Currents
flowing into the chip are positive.
Current maximums are currents with the highest absolute value.
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Operation beyond the maximum ratings may damage the device
Symbol Parameter Rating
Vp Positive 5.0V Supply Voltage -0.5 to 7V
Storage Temperature -65 to 150°C
Solder Vapor Bath 215°C, 90s, 2 times
Junction Operating Temperature +135°C
Output Pins ±10 mA
Analog Pins ±10 mA
Voltage Applied to other Pins -0.3V to Vp+0.3V
Recommended Operating Conditions
Power Supply Current and Power Dissipation
Symbol Parameter Test Conditions Min. Nom. Max. Unit
ICC Supply current (VPn) Outputs and test
point pins open
Tamb = 27°C
190 mA
PD Power Dissipation
Normal Mode Outputs and test
point pins open,
Tamb = 27°C
1000 1530 mW
PWR Data Separator Off Power Down Register = 2d 500 mW
PWR Data Separator Off
and TBG Off Power Down Register = 6d 500 mW
PWR Idle through serial port Power Down Register = 7d 125 mW
Sleep Mode PDWN = Low 1 9 mW
1996 Jul 25 47
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Analog Inputs
TEST POINT INPUTS
Digital Inputs
TTL COMPATIBLE CMOS INPUTS
FREF AND VRDT INPUTS
CMOS INPUTS
PSEUDO ECL COMPATIBLE INPUTS
Digital Outputs
CMOS Outputs
Symbol Parameter Test Conditions Min. Nom. Max. Unit
TPC±, TPD±
Input Bias Voltage TPC±,TPD± selected as
inputs VPA -1.5 V
Symbol Parameter Test Conditions Min. Nom. Max. Unit
VIL Input Low voltage -0.3 0.8 V
VIH Input High voltage 2.0 VPD+0.3 V
IIL Input Low current VIL = 0.4V -250 µA
IIH Input High current VIH = 2.4V 100 µA
Symbol Parameter Test Conditions Min. Nom. Max. Unit
VIL Input Low voltage -0.3 0.8 V
VIH Input High voltage 2.0 VPD+0.3 V
IILF Input Low Current VIL = 0.4V -400 µA
IIHF Input High Current VIH = 2.4V 500 µA
Symbol Parameter Test Conditions Min. Nom. Max. Unit
VILC Input Low Voltage VPC = 5.0V 1.5 V
VIHC Input High Voltage VPC = 5.0V 3.5 V
Symbol Parameter Test Conditions Min. Nom. Max. Unit
VIL Input Low Voltage VPD-2.0 VIH-0.25 V
VIH Input High Voltage VPD-1.1 VPD-0.4 V
Input Current -100 +100 µA
Symbol Parameter Test Conditions Min. Nom. Max. Unit
VOLC Output Low voltage IOL = +2 mA 0.45 V
VOHC Output High voltage IOH = -100 µA 0.7 * VPD V
1996 Jul 25 48
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
DIGITAL DIFFERENTIAL OUTPUTS (WD, WD)
TEST POINT OUTPUT LEVELS
Serial Port Timing
Refer to Figure 16.
Symbol Parameter Test Conditions Min. Nom. Max. Unit
VOLD Output Low Voltage IOL = 2 mA VPD-2.1 VOHD-0.3 V
VOHD Output High Voltage IOH = 2 mA VPD-1.4 VPD-0.5 V
Output Sink Current -3.5 mA
Differential Voltage | V(WD) - V(WD) | 0.6 Vppd
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Test Point Output Swing
TPA+, TPA-
TPB+, TPB-
0.7 Vppd
TPC+, TPC-
TPD+,TPD-
TPE
CLOAD = 5 pF 1.0 VPA-1.5 V
Source Impedance
TPC+/TPC-
TPD+/TPD-
TPE
30
Output Current
TPC+/TPC-
TPD+/TPD-
TPE
-0.8 +3 mA
Common Voltage
TPC+/TPC-
TPD+/TPD-
TPE
2.5 V
Symbol Parameter Test Conditions Min. Nom. Max. Unit
tCSCLK Data Clock Period, 80 ns
tCKL SCLK Low time SCLK < 0.8V 30 ns
tCKH SCLK High time SCLK > 2.0V 30 ns
tSENS Enable to SCLK 40 ns
tSENH SCLK to disable 40 ns
tDS Data set-up time 15 ns
tDH Data hold time 15 ns
tSL SDEN min. Low time 160 ns
1996 Jul 25 49
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
AGC Characteristics
Unless otherwise specified, recommended operating conditions apply.
AGC AMPLIFIER
The input signals are AC coupled to VIA+ and VIA-. Integrating capacitor CBYP = 1000 pF, is connected between BYP
and VPA. Integrating capacitor CBYPS = 1000 pF, is connected between BYPS and VPA. Unless otherwise specified,
the output is measured differentially at TPC+ and TPC-, Fin = 5 MHz, the filter frequency ƒc = max
and the filter boost = 0 dB. All specifications apply equally to servo and read mode prior to SFC.
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Input range Filter Boost =0 dB @ ƒc
4 MHz ƒc 34 MHz, Fin = ƒc20 250 mVppd
Input range Filter Boost =11 dB @ ƒc
9 MHz ƒc 34 MHz, Fin = ƒc20 200 mVppd
ON ON± voltage
measured @ TPC±VIA = 20 to 250 mVppd
1,1,-1,-1,--- pattern
DP/DN output selected
5 MHz <ƒc < 34 MHz, Fin = ƒc
Boost = 0 to 13 dB
1.19 1.40 1.61 Vppd
DP/DN Voltage variation 20mVppd < VIA < 250mVppd 5.0 %
Gain range 3 64 V/V
Gain sensitivity BYP or BYPS voltage
change 38 dB/V
Rin Differential input
resistance LOWZ = Low, LZTC = Low
LOWZ = Low, LZTC = High
LOWZ = High, LZTC = x
5.9
1.7
450
7.6
2.7
634
8.9
4.0
850
k
k
Single-ended input
resistance LOWZ = Low, LZTC = Low
LOWZ = Low, LZTC = High
LOWZ = High, LZTC = x
3.8
1.4
317
k
k
VOO Output offset change From gain = 3 V/V to 64 V/V
With DC cancellation off 200 mV
ein Input noise voltage Fixed Gain = 24 dB, Rs = 0 15 30 nV/Hz
CMRR Common mode rejection Fixed Gain = 24 dB, Rs = 0 40 dB
PSRR Power supply rejection Fixed Gain = 24 dB, Rs = 0 45 dB
1996 Jul 25 50
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
AGC Control Section
The input signals are DC coupled into TPC± with TPC± selected as inputs.
Pulse Qualifier Characteristics
Unless otherwise specified, a 100 mVpp sine wave at 15 MHz is AC coupled into VIA±. FC = 127, and FB = 0.
DUAL LEVEL QUALIFIER
See above for input conditions unless otherwise specified.
Symbol Parameter Test Conditions Min. Nom. Max. Unit
TPC+/
TPC-,
TPD+/
TPD-
Common Mode Input
Voltage For test only VPA-1.5 V
IDDecay current
Normal FASTREC = Low, SG = Low
DR = Data Rate Register
37 < DR < 127
-24.5 µA
Servo Mode Decay current
Normal FASTREC = Low, SG = High
TPC+ = TPC- -24.5 µA
IDFR Fast Decay Current FASTREC = High
TPC+ = TPC- 8 * IDA
ICH Normal Attack Current |TPC+ - TPC-| = 0.7875V
FASTREC = Low -17 * IDA
ICHF Fast Attack Current |TPC+ - TPC-| 1.09V
FASTREC = Low -143 * IDA
ICHFR Fast Recovery Attack
Current |TPC+ - TPC-| = 0.7875V
FASTREC = High -64 * IDA
Sample Data AGC
Peak Charge and
Discharge Currents
0 AGC 3
AGC = AGC1-0
DR = data rate register
37 < DR <127, RR(k)
+/-2.66
* 10-6
* AGC
* DR/RR
A
BYP Pin Leakage Current HOLD = Low, VBYP = VRC -70 +50 nA
BYPS Pin Leakage Current HOLD = Low, VBYPS = VRC -70 +50 nA
VRC Reference Voltage -100 µA Io +500 µA VPA - 2.56 VPA - 2.1 V
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Lth Data Level Threshold Prior to SFC
Lth (mV) = 10.47 * LD
16 LD 63
Lth
-11% Lth Lth
+11% V
After SFC
ALE = 0
Lth (mV) = 7.44 * LD
ALE = 1
Lth (mV) = 1.574 * LD
16 LS 63
Lth
-11% Lth Lth
+11% V
LSth Servo Level Threshold LSth (mV) = 10.47 * LS
16 LS 63 LSth
-11% LSth LSth
+11% V
RDS/RDS pulse width High
voltage RDSPW = 0 7.7 15 20 ns
RDSPW = 1 16.8 27 35 ns
1996 Jul 25 51
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
VITERBI QUALIFIER
See General for input conditions unless otherwise specified.
EQUALIZATION QUALITY FACTOR
Unless otherwise specified, measured at ATO pin loaded with 5 pF. VIA± input signal has no asymmetry. Measured
after training sequences. Continuous Training pattern with zeros displaced by ±10% of one's magnitude of 500 mV
AMPLITUDE ASYMMETRY QUALITY FACTOR
Unless otherwise specified, measured at ATO pin loaded with 5 pF. VIA± input signal has 10% amplitude asymmetry.
Asymmetry (%) = ((V+1-V-1)/(V+1+V-1)) * 100, where V+1 = positive "1" sample value and V-1 = negative "1" sample value.
This is measured with continuous training bytes, 93H, with distance between canceled and non-canceled zeros at 10 %
of one's magnitude of 500 mV or 100 mV.
DUAL LEVEL QUALIFIER (Continued)
Symbol Parameter Test Conditions Min. Nom. Max. Unit
PPOL to RDS/RDS delay
time PPOL Edge to RDS/RDS
rise/fall, measured at 1.5V
crossing
2.5 12 ns
PPOL, RDS/RDS Rise time 15 pF load, 0.8 to 2.4V 8 ns
PPOL, RDS/RDS Fall time 15 pF load, 2.4 to 0.8V 6 ns
Pulse pairing Window and Hysteresis
LSth = 50%. Measured at
the rising/falling edge of
RDS/RDS
Fin = 5 MHz, FCS = 30
-2.5 +2.5 ns
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Vth Viterbi threshold voltage Vth (mV) = 7.874 * VD
45 VD 127 Vth - 11% Vth Vth+11% V
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Reference Voltage No pulse asymmetry
ATOSEL1-0 = 00 Typ.-130mV MAXREF/2 Typ.+130mV V
Gain Absolute deviation of zeros
is multiplied by gain 600 mV
Drift 0.2 mV/µs
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Reference Voltage ATOSEL1-0 = 00 Typ.-100mV MAXREF/2 Typ.+100mV V
Qasym at ATO 400 mV
1996 Jul 25 52
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
INTERNAL AC COUPLER CHARACTERISTICS
Unless otherwise specified, Measured at TPC+/TPC- and TPD+/TPD- pins loaded with 5 pF.
ATO Buffer Characteristics
Unless otherwise specified, measured at ATO pin loaded with 5 pF. VIA± input signal has no asymmetry.
Programmable Filter Characteristics
Unless otherwise specified, recommended operating conditions apply. The input signals are AC coupled to VIA+ and
VIA-. All specifications identical for identical data and servo register settings.
Data uses CBYP from BYP to VPA and servo uses CBYPS from BYPS to VPA.
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Offset voltage ACCPL = 0 -35 +35 mV
LOWZ Time Constant LOWZ = 1, LZCTR = X 0.3 µs
Non LOWZ Time Constant LOWZ = 0, LZCTR = 0 5 µs
LOWZ = 0, LZCTR = 1 1.5 µs
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Reference voltage ATOSEL 1-0 = 00 Typ. - 100 MAXREF/2 Typ. +100 V
Swing From Reference Voltage -0.6 +0.6 V
Source Impedance 50
Drive Capability +/- refers to source/sink +2/-2 +5/-3 mA
Symbol Parameter Test Condition Min. Nom. Max. Unit
ƒcr Filter cutoff range ƒc (MHz) = 0.301 * FC - 1.142
44 FC 117
ƒc (MHz) = 0.277 * FCS - 0.08
14 FC 43
0 dB Boost
4-34 MHz
ƒca Filter ƒc Accuracy 44 FC 117
14 FC 43 -15
-20 +15
+20 %
OD gain to ON gain
mismatch ƒin = 0.67 * ƒc
0 dB Boost
Mismatch = %
-30 +30 %
Boost @ Fc Boost (dB) = 20 * log [0.021848 *
FB + 0.000046 * FB * FC +1] 0 13 dB
Boost accuracy Boost = 13 dB -2.0 +2.0 dB
Boost = 9 dB -1.7 +1.7 dB
Filter Output Dynamic
Range ON±THD = 2.5%,
ƒin = 0.67 * ƒc, CL = 15 pF 1.4 Vpp
ODgain ONgain
ONgain
--------------------------------------------------- 10
0×
1996 Jul 25 53
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Transversal Filter Characteristics
Programmable Filter Characteristics (Continued)
Symbol Parameter Test Condition Min. Nom. Max. Unit
TGD Variation ƒc = 34 MHz
Fin = 0.3ƒc to ƒc
0 FB 127
ƒc = 12 MHz to 34 MHz
Fin =0.3 ƒc to ƒc
0 FB 127
ƒc = 4 MHz to 12 MHz
Fin = 0.2ƒc to ƒc
0 FB 127
ƒc = 12 MHz to 34 MHz
Fin = ƒc to 1.75ƒc
0 FB 127
ƒc = 4 MHz to 12 MHz
Fin = ƒc to 1.75ƒc
0 FB 127
-700
-5
-5
-6
-6
+700
-5
-5
-6
+6
ps
ps
ps
ps
ps
Group delay equalization
accuracy Fc = 12-34 MHz, FB = 0 db
% GD = (0.9783 * FGB) - 0.665 +5 %
ON+ - ON- output
noise voltage,
no boost
BW=100 MHz, Rs=50
ƒc = 34 MHz, boost = 0 dB
AGC gain = 24 dB fixed
3.7 mV rms
ON+ - ON- output
noise voltage,
max. boost
BW=100 MHz, Rs=50
ƒc = 34 MHz; FB = 127
AGC gain = 24 dB fixed
6.8 mV rms
VRX Rx pin voltage Tamb = 27°C
Tamb = 125°C600
800 mV
mV
Rx resistance 1% fixed value 10.0 k
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Km1 Range ±0.15 ±0.2 V/V
Km1 Gain Drift EQHOLD = 1
Hold time < 1 ms 0.015 0.05 V/V/ms
Km2 Range -0.15 +0.13125
Km2 Resolution 0.01875
Km2 Accuracy ±5±20 %
Note: Km1 and the equalizer control voltage at TPA+ - TPA- is approximately related by Km1 = 0.009 * Data Rate
(Mbit/s) * (TPA+ - TPA-).
1996 Jul 25 54
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Time Base Generator Characteristics
RR = 10.0 k to GND for 125 Mbit/s max. operation, and 12.1 k for 100 Mbit/s max. operation
Symbol Parameter Test Conditions Min. Nom. Max. Unit
FREF input range Control Operating Register
BT bit = 0 6 25 MHz
Control Operating Register
BT bit = 1 and
Control Test Register
EFR bit =1
141 MHz
FREF input pulse width Control Operating Register
BT bit = 0 10 ns
Control Operating Register
BT bit = 1 and
Control Test Register
EFR bit =1
3 ns
FTBG frequency range 47 141 MHz
FTBG jitter > 10K samples 30 200 psRMS
M counter range 2 255
N counter range 2 127
FTBG VCO center frequency FLTR1+ - FL TR1- = 0V
FTBG =[(1.143 * DR) + 4.986]
MHz
RR = 10.0 k
0.80 * FTBG 1.20 * FTBG MHz
VCO dynamic range -2.0V < FLTR1+ - FLTR1-
< +2.0V
FTBG = 80 MHz
+25 %
KVCO VCO control gain ωi =2π * FTBG
-2.0V < FLTR1+ - FLTR1-
< 2.0V
0.12 * ωi 0.18* ωi 0.24 * ωi rad/(V.s)
KD Phase detector gain KD = (2.088 * DR) + 3.442
RR = 10 k0.72 * KD 1.22 * KD µA/rad
KVCO * KD product
accuracy -28 +28 %
1996 Jul 25 55
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
DATA SEPARATOR CHARACTERISTICS
Unless otherwise specified, recommended operating conditions apply.
Read Mode - Byte-Wide (Refer to Fig. 19)
Symbol Parameter Test Conditions Min. Nom. Max. Unit
tRRC Read clock rise time 0.8V to 2.4V
CL< 15 pF 10 ns
tFRC Read clock fall time 2.4V to 0.8V
CL< 15 pF 10 ns
tRD RCLK pulse width Except during re-sync 4/9tORC-5 4/9tORC+5 ns
tDC1 RCLK re-sync period
at SFC and RG falling edge Measured from rising edge
to rising edge of RCLK tORC tORC+2TC ns
tDC2 RCLK re-sync period
at code boundary detect Measured from rising edge
to rising edge of RCLK tORC 2tORC ns
tNS, tNH NRZx out set-up and
hold time 20 ns
Figure 19: Byte-Wide Read Timing
9 t
C
4 t
C
t
RD
VCO CLK
RCLK
NRZ0–7
NRZP
SBD
t
ORC
t
FRC
t
RRC
2.4V
0.8V 2.4V
0.8V
1.5V1.5V
1.5V (SB2) 1.5V (DT0)
t
NS
t
NH
1.5V
t
SBS
SM00004
1996 Jul 25 56
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Write Mode - Byte-Wide (Refer to Fig. 20)
Write Data Output (Refer to Fig. 21)
Read Mode - Nibble
Symbol Parameter Test Conditions Min. Typ. Nom. Unit
tRWC Write clock rise time 0.8 to 2.0 V
CL< 15 pF 10 ns
tFWC Write clock fall time 2.0 to 0.8 V
CL< 15 pF 8 ns
tSNRZ NRZx set-up time 10 ns
tHNRZ NRZx hold time 3 ns
Symbol Parameter Test Conditions Min. Typ. Max. Unit
tWD Write data output position
accuracy Write precomp = 0,
CL < 15 pF, TTBG = 1/FTBG TTBG - 0.5 TTBG + 0.5 ns
tRWD Write data output rise time 20% to 80% points 3 ns
tFWD Write data output fall time 80% to 20% points 3 ns
Symbol Parameter Test Conditions Min. Nom. Max. Unit
tRCL RCLK Low time CL< 15 pF 5 ns
tRCH RCLK High time CL< 15 pF 5 ns
tRRC Read clock rise time 0.8V to 2.4V
CL< 15 pF 8 ns
tFRC Read clock fall time 2.4V to 0.8V
CL< 15 pF 6 ns
tNS, tNH NRZx out set-up and hold
time 5.6 ns
WCLK
NRZ0–7
NRZP
t
WC
t
RWC
2.0V
0.8V
1.5V1.5V
1.5V 1.5V
t
SNRZ
t
HNRZ
t
FWC
2.0V
0.8V
t
WCH
t
WCL
“DT1”
1.5V
SM00028
0.8V
1996 Jul 25 57
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Write Mode - Nibble (Refer to Fig. 20)
Write Precompensation
Symbol Parameter Test Conditions Min. Nom. Max. Unit
tWC WCLK period CL< 15 pF 24 ns
tWCL WCLK Low time CL< 15 pF 5 ns
tWCH WCLK High time CL< 15 pF 5 ns
tRWC Write clock rise time 0.8 to 2.0 V
CL< 15 pF 10 ns
tFWC Write clock fall time 2.0 to 0.8 V
CL< 15 pF 8 ns
tSNRZ NRZx set-up time 8 ns
tHNRZ NRZx hold time 3 ns
Symbol Parameter Test Conditions Min. Nom. Max. Unit
TPC Write precomp time shift as
a percentage of TTBG TPC = 2.1 * WPC
0 < WPC < 15 0.7 * TPC
- 0.5 1.3 * TPC
+ 0.5 %
Figure 21: Nibble Read Timing
tRRC
2.4V
0.8V
tFRC
2.4V
0.8V
tRCH
tRCL
2.4V
1.5V
1.5V
2 tC
5 tC4 tC
tRD
1.5V 1.5V
tNS tNH
SB2(7:4) SB2(3:0)
VCO CLK
RCLK
NRZ0–3
SBD
SM00006
tSDL
1.5V
1996 Jul 25 58
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
Servo Characteristics
Unless otherwise specified input is 10 MHz sine wave into DP/DN inputs, TPC/D1-0 = 01.
Data Synchronizer PLL
Symbol Parameter Test Conditions Min. Nom. Max. Unit
FVCO VCO center frequency FLTR2+ - FLTR2- = 0V
FVCO = [(1.115 * DR) + 3.576] MHz
RR = 10.0 k
0.8 * FVCO 1.2 * FVCO ns
VCO dynamic range in
each direction -2.0V < FLTR2+ - FLTR2- <
+2.0V +25 %
VCO control gain and
M, M * KVCO ωi =2π/FVCO
M = 4.32 * (DR/127)
RR = 10.0 k
-0.25V < FL TR2+ - FL TR2- < +0.25V
0.11 * ωi * M 0.29 * ωi * M rad/(V-S)
Charge Pump
Transconductance Gm = 350 µA/V
during synchronization 0.6 * Gm 1.4 * Gm A/V
KDI Idle Mode Phase
Detector Gain KDI = 0.15 Gm * M
RR = 10.0 kKDI µA/rad
Gm * M * KVCO
product accuracy -28 +28 %
A * KVCO product
accuracy A= 0.8 * (DRC/127) -30 +30 %
Symbol Parameter Test Conditions Min. Nom. Max. Unit
MAXREF output voltage ISOURCE = 0 mA 3.06 3.28 3.48 V
SERVO GAIN,
(SEROUT - SREF) Fin = 10 MHz, SG = 1,
Input signal at TPC/TPC of
0.7 and 1.4 Vp-pd
0.5 0.6 0.7 V/Vp-pd
200 mV REFERENCE,
Change in SEROUT when
SELVRC is toggled
SG = 0 195 215 235 mV
SEROUT OFFSET,
(SEROUT - SREF) SG = 0, SELVRC = 1 0 15 55 mV
SREF OUTPUT VOLTAGE Load current = 1 mA,
T = junction temperature in
deg C
VPA - 3.2
+ 2 mV*T V
SEROUT PULL DOWN
CURRENT SDIEN = 0, SEROUT =
VPA - 2.3V 435 µA
SREF PULL DOWN
CURRENT SDIEN = 0, SEROUT =
VPA - 2.3V 445 µA
1996 Jul 25 59
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
DAC Differential Non-Linearity
Monitor the output of each DAC and measure the DNL.
Symbol Parameter Test Conditions Min. Nom. Max. Unit
Fc DAC DNL Filter cutoff DAC +1 lsb
FB DAC DNL Filter Boost DAC +1 lsb
VDT DAC DNL Viterbi Threshold DAC +1 lsb
LDP DAC DNL Level Positive Threshold
DAC +1 lsb
LDN DAC DNL Level Negative Threshold
DAC +1 lsb
DR DAC DNL Data Rate DAC +1 lsb
WP DAC DNL Write Precomp DAC +1 lsb
DRC DAC DNL Damping Ratio Control
DAC +1 lsb
1996 Jul 25 60
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
P32P4911A Pinout
100 LQFP
SEROUT
SREF
AGCREF
NC
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
12
11
44434241
21
22
25 403937 38363534
23
24
48474645 5049
52
51
56
55
54
53
60
59
58
57
919293949596979899100
26 27 28 29 30 31 32 33
61
62
64
63
65
66
75
74
73
72
71
70
69
68
67
81828384858687888990 80 79 7678 77
VIA+
FLTR1+
VIA-
BYPD
HOLD
LOWZ
FASTREC
VRDT
SCLK
SDATA
SDEN
VPF
FREF
VNF
VPT
DWI
VNT
DWI
VPA
VNA
SG
TPE
VRX
NC
TPD+
AGCRST
AGCDEL
WRDEL
NC
NC
EQHOLD
ATO
VPS
VRC
RR
MAXREF
SDIEN
SELVRC
TPB+
TPB-
VNS
PPOL
NC
WD
WD
NC
WG/WG
FLTR1-
VPS
VNS
TPA+
TPA-
VPP
FLTR2+
FLTR2-
VNP
VNC
VPC
NC
NC
NRZ2
DWR
NRZ1
NRZ0
PDWN
NCLK
NC
NRZP
RG
NRZ3
NC
VND
VPD
NRZ4
NRZ5
NRZ6
NRZ7
WCLK
RCLK
SBD
NC
NC
NC
NC
BYPS
NC
NC
NC
NC
RDS/RDS
VNRX
NC
TPD-
TPC+
TPC-
NC
1996 Jul 25 61
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1
Figure 22: Package Diagram
1996 Jul 25 63
Philips Semiconductors Product specification
PRML Read Channel with PR4,
8/9 ENDEC, FWR Servo P32P4911A
DEFINITIONS
Data Sheet
Identification Product Status Definition
Objective
Specification Formative or in Design This data sheet contains the design target or goal specifications for product
development. Specifications may change in any manner without notice.
Preliminary
Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at
a later date. Philips Semiconductors reserves the right to make changes at any time
without notice in order to improve design and supply the best possible product.
Product
Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the
right to make changes at any time without notice, in order to improve design and
supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without
notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to
improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of
these products, conveys no license or title under any patent, copyright, or mask work right to these products, and
makes no representations or warranties that these products are free from patent, copyright, or mask work right
infringement, unless otherwise specified. Applications that are described herein for any of these products are for
illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be
suitable for the specified use without further testing or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life
support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North
America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and
Philips Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and
Philips Electronics of North America Corporation customers using or selling Philips Semiconductors and Philips
Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics of North America Corporation for any damages resulting
from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088-3409
Telephone 800-234-7381
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
© Copyright Philips Electronics North America Corporation 1996
All rights reserved. Printed in U.S.A.
Internet: http://www.semiconductors.philips.com/ps/
(1) CGY2020G_1.mif June 26, 1996 11:51 am
Philips Semiconductors – a worldwide company
© Philips Electronics N.V. 1996 SCA50
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
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Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 648 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +1 800 234 7381, Fax. +1 708 296 8556
Middle East: see Italy
Printed in The Netherlands 647021/1200/01/pp12 Date of release: 1996 Jul 17 Document order number: 9397 750 00971