MTE1122/SOG - Microchip Technology

 1995 Microchip Technology Inc. Preliminary DS21112B-page 1

FEATURES

• Energy Management Controller

• Based on 8-bit RISC Technology

• Proprietary Power Management Algorithm

• Reduces the power consumption of induction

motor systems

• 5V Operation

• 18-pin PDIP and SOIC Packages

• 8-bit Analog-to-Digital (A/D) Converter

• Automati c Power-on Reset

• Power-up Timer

• Commercial and Industrial Temperature Range

Operation

• Multip le parts can be s laved fo r three-pha se oper-

ation

INTRODUCTION

The MTE1122 is an Energy Manage me nt Controller IC

for single-phase induction motors. This CMOS device

is based on Microchip Technology Inc’s RISC proces-

sor core and proprietary algorithms. When combined

with some external analog components, it will provide

an electronic system that economically reduces the

operating costs of small induction motors by as much

as 58%. It wi ll al so allow motors t o ru n c ooler an d with

less vibration. The system operates on single phase

110 or 220 VAC.

PACKAGE TYPE

FIGURE 1: SYSTEM BLOCK DIAGRAM

VSS1

P-Sense

VSS

RESET

VSS

ZC-Sense

TTRIG

• 1

VSS

Gate Input

OSC1

OSC2

VDD

IND

MTE1122

18-Lead PDIP/ SOI C

MTE1122

LINE IN LINE OUT

TO MOTOR

TRIAC

VOLTAGE

ZERO-CROSS VOLTAGE AMP

CURRENT

ZERO-CROSS

POWER

NEUTRAL IN NEUTRAL OUT

FIGURE 2: ENERGY SAVINGS

0.0

10.0

20.0

30.0

40.0

50.0

60.0

0 102030405060708090100

Percent Saving s

Percent Load

MTE1122

Energy Management Controller IC

MTE1122

DS21112B-page 2 Preliminary  1995 Microchip Technology Inc.

FUNCTIONAL DESCRIPTION

Single-phase induction motors run most efficiently at

full load . As the appl ied load l essens, a gre ater p ortion

of the energ y consumed by the moto r is wasted , mostly

as heat.

It is estimated by the EPA that 50% of the energy pro-

duced in the US is consumed by small electric motors,

and th at 20% of this ene rgy does no usef ul work. There

are perhaps three major reasons for this:

1. Over-specification -- sometimes its easier or

costs no more to specify a larger motor than

determine actual loads.

2. Worst case design -- pumps, conveyers, fans,

and the like must be able to operate properly

with clogged filters, maximum heads, or speci-

fied lo ads. I f fi lters a re cl ean, or lo ads ar e l ower,

the motor will be running only partly loaded.

3. Idle time -- many times, systems can’t be shut

down con ve nie ntly when not in use .

Number 1 above can be corrected by proper design.

For example, in modern refrigerators, the compressor

systems have been optimized quite effectively. Num-

bers 2 and 3 can not be improved using traditional

approaches. This is where the MTE1122 provides a

new, cost-effective solution.

The MTE1122 calcula tes the amount of load on a motor

connec ted to it, and ad jus ts the motor’s sup ply vo ltage

to match that load. For example, if the load is lower

than the motor’s rated load, the voltage to the motor

can be reduced, thus decreasing the energy used by

the motor.

A 1/3 HP motor will typically see 85 VAC at no load

when powered through the MTE1122, for an energy

savings of as much as 58%.

A system block diagram i s shown in Figure 1. A graph

of energy savings vs. motor load is shown in Figure 2.

A graph of motor efficiency with and without an

MTE1122-based ener gy management controll er (EMC)

is shown in Figure 3. The data for the graphs are

sho wn in Table 1. These figures ar e based on a 1/3 HP

induction motor coupled to a dynamometer. Actual

saving s may vary ba sed on moto r size, motor lo ad and

motor construction.

PINOUT DESCRIP TIONS

P-Sense - analog input that is used by the device to

measure the load voltage.

Gate Enable - analog input that monitors the voltage

across the triac. It is used as a current feedback mech-

anism.

IND - TTL-compatible output that indicates that the sys-

tem is operating normally. It is intended to control an

LED or another indicator device.

ZC-Sense - TTL-comp ati ble inpu t t hat is used to dete r-

mine the zero crossing point of the AC voltage wave-

form.

TTRIG - TTL -compati ble output that is used to drive th e

triac.

RESET - TTL-compatible inpu t used to reset the device

by holding this pin low.

OSC1, OSC2 - Oscillator crystal or resonator connec-

tions.

FIGURE 3: MOTOR EFFICIENCY

0.0

10.0

20.0

30.0

40.0

50.0

60.0

70.0

0 102030405060708090100

Efficiency

Percent Load

With E.M.C.

With o ut E. M. C.

 1995 Microchip Technology Inc. Preliminary DS21112B-page 3

MTE1122

TABLE 1: OPERATING PARAMTER COMPARISONS

1/3 HP Motor without E.M.C.

Load

(%) Load

(Nm) Vrms Irms

(A) Power

Factor Power

In (W) RPM Power

Out (W)

Power

Out

(HP)

Efficiency

(%)

0 0.00 115 5.7 0.18 120 1791 0 0.00 0.2

10 0.14 115 5.7 0.20 130 1788 26 0.04 20.1

20 0.29 115 5.7 0.24 160 1781 54 0.07 33.7

30 0.43 115 5.7 0.29 193 1777 80 0.11 41.4

40 0.57 115 5.7 0.35 229 1768 105 0.14 46.0

50 0.72 115 5.8 0.37 249 1764 133 0.18 53.3

60 0.86 115 5.8 0.42 280 1758 158 0.21 56.4

70 1.00 115 6.0 0.46 315 1750 183 0.25 58.0

80 1.14 116 6.1 0.49 348 1744 208 0.28 59.7

90 1.29 115 6.3 0.53 386 1736 234 0.31 60.6

100 1.43 116 6.5 0.57 428 1727 258 0.35 60.3

1/3 HP Motor with E.M.C.

Load

(%) Load

(Nm) Vrms Irms

(A) Power

Factor Power

In (W) RPM Power

Out (W)

Power

Out

(HP)

Efficiency

(%)

0 0.00 113 3.1 0.14 50 1794 0 0.00 0.4

10 0.14 113 3.2 0.19 68 1786 26 0.04 38.4

20 0.29 113 3.5 0.26 104 1775 54 0.07 51.7

30 0.43 113 3.8 0.32 138 1764 79 0.11 57.4

40 0.57 113 4.1 0.38 178 1755 104 0.14 58.7

50 0.72 113 4.3 0.42 206 1749 132 0.18 63.8

60 0.86 112 4.6 0.47 243 1740 156 0.21 64.3

70 1.00 112 4.9 0.51 281 1730 181 0.24 64.3

80 1.14 112 5.3 0.55 329 1722 205 0.27 62.3

90 1.29 112 5.6 0.59 371 1713 231 0.31 62.2

100 1.43 111 6.0 0.61 406 1705 255 0.34 62.7

MTE1122

DS21112B-page 4 Preliminary  1995 Microchip Technology Inc.

ELECTRICAL CHARACTERISTICS

Absolute Maximum Rating †

Ambient temperature under bias.................................................................................................................-55 to +125°C

Storage Temperature.............................................................................................................................. -65°C to +150°C

Voltage on any pin with respect to VSS (except VDD and RESET).................................................... -0.6V to VDD +0.6V

Voltage on VDD with respect to VSS ..................................................................................................................0 to +7.5V

Voltage on RESET with respect to VSS (Note 1)................................................................................................0 to +14V

Total power Dissipation (Note 2) ...........................................................................................................................800mW

Max. Current out of VSS pin ...................................................................................................................................150mA

Max. Current into VDD pin ......................................................................................................................................100mA

Input Clamping Current, IIK (VI<0 or VI>VDD) ..................................................................................................................±20mA

Output Clampi ng Curren t, IOK (V0<0 or V0>VDD) ..........................................................................................................±20mA

Max. Output Current sunk by any I/O pin................................................................................................................. 2 5mA

Max. Output Current sourced by any I/O pin............................................................................................................20mA

Note 1: Voltage spikes below VSS at the RESET pin, inducing currents greater than 80mA, may cause latch-up.

Thus , a series resis tor of 50 -100 Ω shou ld be use d when applyi ng a "low' level to the RESET pin rath er tha n

pulling this pin directly to VSS.

Note 2: Total power dissi pation should not exce ed 800 mW for the package. Power dissipa tion is calc ulated as fol-

lows:

PDIS = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOL x IOL)

TABLE 2: DC CHARACTERISTICS POWER SUPPLY PINS

†NOTICE: Stres s es abov e thos e liste d under “Maximum Rati ngs” may c ause permanent d amage to th e de vice. This

is a stres s rati ng only and func tio nal opera tio n of the dev ice or comp lia nce to AC and DC para metric spe cific ations at

thos e or an y other conditio ns abov e those indicated in the operation listings of this spe ci fication is not imp lied. Expo-

sure to maximum rating conditions for extended periods may affect device reliability.

Power Supply Pins

Standard Operating Conditions (unless otherwise stated)

Operati ng temper ature -40°C ≤ TA ≤ + 85°C for industrial,

0°C ≤ TA ≤ +70°C for commercial

Operati ng voltage VDD = 4.0V to 6.0V

Characteristic Sym Min Typ

(Note 1) Max Units Conditions

Suppl y Voltage VDD 4.0 6.0 V

VDD start voltage to guarantee

power on rese t VPOR Vss V

VDD rise rate to guarante e

Power-On Reset (Note 2) SVDD 0.05 V/ms

Suppl y Curren t (Note 3) IDD 1.8 3.3 mA FOSC = 4 MHz, VDD = 5.5V

Note1: Data in the column labeled “Typical” is based on characterization results at 25°C. This data is for design guidance only and

is not tested for, or guaranteed by Microchip Technology.

2: This parameter is characterized but not tested.

3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and

switching rate, osci llator type, internal code execut ion patter n, and temper ature also have an impact on the current con-

sumption.

 1995 Microchip Technology Inc. Preliminary DS21112B-page 5

MTE1122

TABLE 3: DC CHARACTERISTICS: ALL PINS EXCEPT POWER SUPPLY

TABLE 4: AC CHARACTERISTICS

All Pins Except Power

Standard Operating Conditions (unless otherwise stated)

Operati ng temper ature -40°C ≤ TA ≤ + 85°C for industrial,

0°C ≤ TA ≤ +70°C for commercial

Operati ng voltage VDD = 4.0V to 6.0V

Characteristic Sym Min Typ Max Units Conditions

Input Low Voltage:

All Input Pins (Except OSC1)

RESET OSC1 VIL

VIH VSS

VSS 0.2 VDD

0.3 VDD V

Input High Voltage:

All Input Pins (Except RESET,

OSC1)

RESET

OSC1

VIH

0.36 VDD

0.85 VDD

0.7 VDD

VDD

4.5V ≤ VDD ≤ 5.5 V

Input Leakage Current:

(Notes 1,2)

IND, TTRIG, AC-Sense

P-Sense, Gate Input

RESET

OSC1

IIL ±1

±1

µA

VSS ≤ VPIN ≤ VDD,

Pin at hi-impedance

VSS ≤ VPIN ≤ VDD,

Pin at hi-impedance

VSS ≤ VPIN ≤ VDD

Output Low Voltage:

All Output Pins VOL 0.6 VIOL = 8.5mA, VDD = 4.5V,

-40°C to +85°C

Output High Voltage:

All Output Pins (Note 2) VOH 0.7 VDD VIOH 83.mA, VDD = 4.5V,

-40°C to +85°C

Note1: The leakage curr ent on th e RES ET pin is strongly dependent on the applied voltage level. The specified levels represent

normal operating conditions. Higher leakage current may be measured at different input voltages.

2: Negative current is defined as current coming out of the pin.

AC Characteristics

Standard Operating Conditions (unless otherwise stated)

Operati ng tempera ture -40°C ≤ TA ≤ + 85°C for industrial,

0°C ≤ TA ≤ +70°C for commercial

Operati ng voltage VDD = 4.0V to 6.0V

Characteristic Sym Min Typ Max Units Conditions

Oscillator Frequency FOSC 44MHz

Clock in (OSC1) High or Low Time TCKHLXT 50 ns Note 1

Clock in (OSC1) Rise or Fall Time TCKRFXT 25 ns Note 1

RESET Pulse Width (low) TMCL 200 ns Note 1

MTE1122

DS21112B-page 6 Preliminary  1995 Microchip Technology Inc.

PACKAGING INFORMATION

Package Type: 18-Lead Plastic Dual In-Line (300 mil)

Package Group: Plastic Dual In-Line (PLA)

Symbol

Millimeters Inches

Min Max Notes Min Max Notes

α0°10°0°10°

A — 4.064 — 0.160

A10.381 - 0.015 —

A23.048 3.810 0.120 0.150

B 0.3556 0.5588 0.014 0.022

B11.524 1.524 Reference 0.060 0.060 Reference

C 0.203 0.381 Typical 0.008 0.015 Typical

D 22.479 23.495 0.885 0.925

D120.320 20.320 Reference 0.800 0.800 Reference

E 7.620 8.255 0.300 0.325

E16.096 7.112 0.240 0.280

e12.4892 2.5908 Typical 0.098 0.102 Typical

eA 7.620 7.620 Reference 0.300 0.300 Reference

eB 7.874 9.906 0.310 0.390

L 3.048 3.556 0.120 0.140

N1818 1818

S 0.889 — 0.035 —

S10.508 — 0.005 —

Pin No. 1

Indicator

Area

Seating

Plane

Base

Plane

EE1

A1A2

αC

AAAA

 1995 Microchip Technology Inc. Preliminary DS21112B-page 7

MTE1122

Package Type: 18-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body)

Package Group: Plastic S OIC (SO)

Symbol

Millimeters Inches

Min Max Notes Min Max Notes

α0°8°0°8°

A 2.3622 2.6416 0.093 0.104

A10.1016 0.29972 0.004 0.0118

B 0.3556 0.4826 0.014 0.019

C 0.2413 0.3175 0.0095 0.0125

D 11.3538 11.7348 0.447 0.462

E 7.4168 7.5946 0.292 0.299

e 1.270 1.270 Reference 0.050 0.050 Reference

H 10.0076 10.6426 0.394 0.419

h 0.381 0.762 0.015 0.030

L 0.4064 1.143 0.016 0.045

N1818 1818

CP — 0.1016 — 0.004

αC

Chamfer

h x 45°

Index

Area

123

Seating

Plane Base

Plane

A1A

h x 45°

MTE1122

DS21112B-page 8 Preliminary  1995 Microchip Technology Inc.

MTE1122 Product Identification System

To order or to obt ain informat ion, e.g., on pricing or delivery, please use the list ed part numbers, and refer t o the factory or the listed

sales offices.

PART NO. X /XX Package: P = Plastic Dual In-line

SO = Plastic SOIC

Temperature - = 0°C to +70°C

Range: I= –40°C to +85°C

Device: MTE1122

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Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. No repre-

sentation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement

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rized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and

All rights res erve d .

 1995, Microchip Technology Inc.,USA.