MLX90393 Triaxis® Magnetic Node
Datasheet
REVISION 003 - SEPTEMBER 14, 2017
3901090393
1. Features and Benefits
Absolute Position Sensor IC featuring
Triaxis® Hall Technology
Simple & Robust Magnetic Design
Miniature size for tiny assemblies
Selectable SPI and I2C bus protocols
Wide dynamic range (5-50mT) with on-the-
fly programmable gain
2.2V-3.6V supply for battery powered
applications, down to 1.8V IO voltage
On board filter settings
On the fly programmable operating modes
and sleep times for micro-power use
External and internal acquisition triggering
modes
External interrupt pin enables waking a
microcontroller when the field changes
On board temperature sensor
2. Application Examples
Non-contacting HMI applications with
push-pull functionality
Rotary knobs & dials
(Long stroke) Linear motion in one or
two axes for levers & sliding switches
Joystick (gimball or ball & socket)
Home Security 3D closure detection
Accurate liquid level sensing
Factory automation position sensing
Magnetic fingerprint detection
3. Description
The MLX90393 brings the highest flexibility in the
Triaxis portfolio's smallest packaged assembly.
Additionally, the MLX90393 is designed for
micropower applications, with programmable
duty cycles in the range of 0.1% to 100% allowing
for configurable power consumption based on
system requirements.
The MLX90393 magnetic field sensor can be
reprogrammed to different modes and with
different settings at run-time to fine-tune the
performance and power consumed. The sensor
offers a 16-bit output proportional to the
magnetic flux density sensed along the X, Y, and Z
axes using the Melexis proprietary Triaxis
technology and offers a 16-bit temperature
output signal. These digital values are available via
I2C and SPI, where the MLX90393 is a slave on the
bus. Multiple sensors can be connected to the
same bus, by A0 and A1 hardwired connection (4x)
but also through ordering codes with different SW
address (4x).
By selecting which axes are to be measured, the
raw data can be used as input for further post-
processing, such as for joystick applications,
rotary knobs, and more complex 3D position
sensing applications. Unparalleled performance is
achieved with this sensor, which is primarily
targeting industrial and consumer applications.
Figure 1: General Block Diagram
V
X
V
Y
V
Z
ADC
G
MUX
Temp Sensor
Bias
EEPROM
State Machine
RAM
Control
SPI/I2C
Interface
Low Power
Oscillator Wake-Up
Oscillator
V
T
Temp Compensation
VDD VDD_IO
SDA/MOSI
SCL/SCLK
MS/CS
Interrupt
Trigger
VSS
MISO
A0 A1
Triaxis®
MLX90393 Triaxis® Magnetic Node
Datasheet
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3901090393
Contents
1. Features and Benefits ............................................................................................................................... 1
2. Application Examples ................................................................................................................................ 1
3. Description ............................................................................................................................................... 1
4. Ordering Information ............................................................................................................................... 4
5. Functional Diagram .................................................................................................................................. 5
6. Glossary of Terms ..................................................................................................................................... 5
7. Pinout ....................................................................................................................................................... 6
8. Absolute Maximum Ratings ...................................................................................................................... 7
9. General Electrical Specifications ............................................................................................................... 8
10. Thermal Specification ............................................................................................................................. 9
11. Timing Specification ............................................................................................................................. 10
12. Magnetic Specification ......................................................................................................................... 11
13. Mode Selection ..................................................................................................................................... 13
13.1. Burst mode ................................................................................................................................... 15
13.2. Single Measurement mode ......................................................................................................... 16
13.3. Wake-Up on Change mode .......................................................................................................... 16
14. Digital Specification .............................................................................................................................. 16
14.1. Command List .............................................................................................................................. 17
14.2. Status Byte ................................................................................................................................... 19
14.3. SPI Communication ...................................................................................................................... 19
14.4. I2C Communication ...................................................................................................................... 21
14.4.1. I2C Address ............................................................................................................................. 21
14.4.2. I2C Principle ............................................................................................................................ 21
15. Memory Map ........................................................................................................................................ 24
15.1. Parameter Description ................................................................................................................. 25
15.1.1. ANA_RESERVED_LOW ............................................................................................................ 26
15.1.2. BIST ......................................................................................................................................... 26
15.1.3. Z_Series .................................................................................................................................. 26
15.1.4. GAIN_SEL[2:0] ........................................................................................................................ 27
15.1.5. HALLCONF[3:0] ....................................................................................................................... 28
15.1.6. TRIG_INT_SEL ......................................................................................................................... 28
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15.1.7. COMM_MODE[1:0] ................................................................................................................ 28
15.1.8. WOC_DIFF .............................................................................................................................. 28
15.1.9. EXT_TRIG ................................................................................................................................ 29
15.1.10. TCMP_EN ............................................................................................................................. 29
15.1.11. BURST_SEL[3:0] .................................................................................................................... 29
15.1.12. OSR2[1:0] ............................................................................................................................. 29
15.1.13. RES_XYZ[5:0] ........................................................................................................................ 29
15.1.14. DIG_FILT[1:0] ....................................................................................................................... 29
15.1.15. OSR[1:0] ............................................................................................................................... 29
15.1.16. SENS_TC_HT[7:0] ................................................................................................................. 29
15.1.17. SENS_TC_LT[7:0] .................................................................................................................. 30
15.1.18. OFFSET_i[15:0] ..................................................................................................................... 30
15.1.19. WOi_THRESHOLS[15:0] ........................................................................................................ 30
16. Recommended Application Diagram .................................................................................................... 31
1.1 I2C .................................................................................................................................................... 31
1.2 SPI .................................................................................................................................................... 31
17. Packaging Specification ........................................................................................................................ 32
17.1. QFN package ................................................................................................................................ 32
18. Standard Information ........................................................................................................................... 32
19. ESD Precautions .................................................................................................................................... 33
20. Revision History .................................................................................................................................... 33
21. Contact ................................................................................................................................................. 33
22. Disclaimer ............................................................................................................................................. 34
MLX90393 Triaxis® Magnetic Node
Datasheet
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4. Ordering Information
Product Temperature Package Option Code Packing Form Definition
MLX90393 S (-20°C to 85°C) LW ABA-011 RE I2C address = 00011xx
MLX90393 S (-20°C to 85°C) LW ABA-012 RE I2C address = 00100xx
MLX90393 S (-20°C to 85°C) LW ABA-013 RE I2C address = 00101xx
MLX90393 S (-20°C to 85°C) LW ABA-014 RE I2C address = 00110xx
MLX90393 E (-40°C to 85°C) LW ABA-011 RE I2C address = 00011xx
MLX90393 E (-40°C to 85°C) LW ABA-012 RE I2C address = 00100xx
MLX90393 E (-40°C to 85°C) LW ABA-013 RE I2C address = 00101xx
MLX90393 E (-40°C to 85°C) LW ABA-014 RE I2C address = 00110xx
Table 1: Product Ordering Codes
Legend:
Temperature Code:
S: from -20°C to 85°C
E: from -40°C to 85°C
Package Code: “LW” for QFN-16 3x3x1mm package with wettable flanks
Option Code: ABA-011:
ABA-012:
ABA-013:
ABA-014:
Different I2C addresses – 5 most significant bits. The 2 least significant bits of the
address are defined by the external address pins A0 and A1.
Packing Form: “RE for Reel”
Ordering Example: “MLX90393-ELW-ABA-011-RE”
MLX90393 Micropower magnetometer with I2C address 00011xx where the last
two bits are defined by external address pins A0 and A1. In QFN package,
temperature range -40°C to 85°C.
Table 2: Product Ordering Code Example
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5. Functional Diagram
6. Glossary of Terms
Term Definition
TC Temperature Coefficient (in ppm/Deg.C.)
Gauss (G), Tesla (T) Units for the magnetic flux density − 1 mT = 10 G
NC Not Connected
PWM Pulse Width Modulation
%DC Duty Cycle of the output signal i.e. TON /(TON + TOFF)
ADC Analog-to-Digital Converter
DAC Digital-to-Analog Converter
LSb Least Significant Bit
MSb Most Significant Bit
DNL Differential Non-Linearity
INL Integral Non-Linearity
EMC Electro-Magnetic Compatibility
V
X
V
Y
V
Z
ADC
G
MUX
Temp Sensor
Bias
EEPROM
State Machine
RAM
Control
SPI/I2C
Interface
Low Power
Oscillator Wake-Up
Oscillator
V
T
Temp Compensation
V
DD
V
DD_IO
SDA/MOSI
SCL/SCLK
MS/CS
Interrupt
Trigger
V
SS
MISO
A0 A1
Triaxis
®
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Datasheet
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7. Pinout
Pin
#
Name Type Supply System Wiring Recommendation
Primary Secondary Reference To I2C 4-wire
SPI
3-wire
SPI
1 INT I/O out N/A VDD_IO Optional Optional Optional
2 SENB/CS I/O in MLX Test VDD_IO To VDD_IO Required Required
3 SCL/SCLK I/O in MLX Test VDD_IO Required Required Required
4 N/C -- -- -- -- -- --
5 SDA/MOSI I/O bi MLX Test VDD_IO Required Required Short
together
6 MISO I/O out MLX Test VDD_IO Floating Required
7 INT/TRIG I/O bi N/A VDD_IO Optional Optional Optional
8 VDD_IO Supply N/A Required Required Required
9 N/C -- -- -- -- -- --
10 N/C -- -- -- -- -- --
11 A1 I2C Address LSB MLX Test VDD To VDD/GND To GND To GND
12 A0 I2C Address LSB MLX Test VDD To VDD/GND To GND To GND
13 VSS Ground N/A Required Required Required
14 N/C -- -- -- -- -- --
15 VDD Supply N/A Required Required Required
16 N/C -- -- -- -- -- --
Table 3: Pinout Description
It is recommended to connect the N/C pins (Not Connected) to Ground.
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8. Absolute Maximum Ratings
Parameter Symbol Min. Typ. Max. Unit
VDD_MAX Analog Supply Voltage Limits -0.3 4 V
VDD_IO_MAX Digital IO Supply Limits -0.3 min(4, VDD+0.3) V
TSTORAGE Storage (idle) temperature range -50 125 °C
ESDHBM According to AEC-Q100-002 2.5 kV
ESDCDM According to AEC-Q100-011-B (QFN) 750 V
Table 4: Absolute Maximum Ratings
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum-rated
conditions for extended periods may affect device reliability.
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9. General Electrical Specifications
Parameter Remark Min Nom Max Unit
VDD Analog Supply Voltage 2.2 3 3.6 V
VDD_IO Digital IO Supply 1.65 1.8 VDD V
VPOR_LH Power-on Reset threshold
(rising edge)
1.42 1.55 V
VPOR_HL Power-on Reset threshold
(falling edge)
1 1.31 V
IDD,CONVXY Conversion Current XY-axis 2.29 3 mA
IDD,CONVZ Conversion Current Z-axis 2.96 4 mA
IDD,CONVT Conversion Current Temperature 1.60 2 mA
IDD,STBY Standby Current( 1) 43 60 µA
IDD,IDLE Idle Current(2) 1 2.4 5 µA
IDD,NOM Nominal Current (TXYZ, Datarate = 10Hz,
OSR=OSR2=0, DIG_FILT=4)
100 µA
Table 5: General Electrical Specifications
1 Standby current corresponds to the current consumed in the digital where only the low power oscillator is running.
This standby current is present in burst mode, or whenever the IC is counting down to start a new conversion.
2 Idle current corresponds to the current drawn by the IC in idle mode where all operating functions are disabled except
communications.
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Datasheet
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10. Thermal Specification
The MLX90393 has an on-board temperature sensor which measures the temperature of the MLX90393
sensor. The temperature can be read out via the communication protocol in a digital format
Parameter Symbol Min. Typ. Max. Unit
TRES Temperature sensor resolution 45.2 LSB/°C
T25 Temperature sensor output at 25°C 46244 LSB16u
TLIN Temperature Linearity (3) +/-3 °C
TOPERATING Operating temperature range [S code] -20 25 85 °C
Operating temperature range [E code] -40
Table 6: Thermal Specifications
3 The linearity is defined as the best fit curve through the digital temperature outputs over the entire temperature
range. It includes ADC non-linearity effects
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11. Timing Specification
The specifications are applicable at 25 Deg. C unless specified otherwise and for the complete supply range.
Parameter Remark Min Nom Max Unit
Main Oscillator & Derived Timings
TSTBY Time from IDLE to STBY 400 500 600 µs
TACTIVE Time from STBY to ACTIVE 8 µs
TCONVM Single Magnetic axis conversion time(4)
typical programming range
0.192 66.56 ms
[(2+2^DIG_FILT)*2^OSR*0.064]
TCONVT Temperature conversion time
typical programming range
0.192 1.54 ms
[2^OSR2*0.192]
TCONV_SMM Total conversion time in Single
Measurement Mode(4) TSTBY + TACTIVE + m*TCONVM + TCONVT ms
TCONV_BURSTWOC Total conversion time in BURST or WOC
Mode(4) TACTIVE + m*TCONVM + TCONVT ms
TOSC_TRIM Trimming accuracy -5 +5 %
TOSC_THD Thermal drift (full temperature range) -5 +5 %
Low-power Oscillator & Derived Timings
TINTERVAL Time in between 2 conversions (Burst
mode or Wake-Up on Change)(5)
0 1260
ms
BURST_DATA_RATE * 20
TLPOSC_TRIM Trimming accuracy -4 +4 %
TLPOSC_THD Thermal drift (full temperature range) -5 +5 %
Startup
TPOR Power-on-reset completion time 0.6 1.5 ms
External Trigger
TTRIG Trigger pulse width (active high) 0.01 250 us
Table 7: Timing Specifications
4 This conversion time is defined as the time to acquire a single axis of the magnetic flux density. When measuring
multiple axes they are obtained through time multiplexing. The conversion time is programmable through parameters
OSR and DIG_FILT for magnetic values and OSR2 for the temperature value. The conversion sequence is TXYZ, opposite
of the ZYXT argument of the command set.
5 The time TINTERVAL is defined as the time between the end of one set of measurements (any combination of TXYZ) and
the start of the following same set of measurements in BURST and WOC mode. As a result of this, the maximum output
data rate is not only a function of TINTERVAL but equals 1/(TCONV_BURSTWOC + TINTERVAL).
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12. Magnetic Specification
The specifications are applicable at 25 Deg. C unless otherwise specified and for the complete supply voltage
range.
Parameter Remark Min Nom Max Unit
NADC ADC span 17.4 bits
NOUT Output span (taken from 19 by RESXYZ) 16 bits
BRANGE Output range (function of RESXYZ) RANGE from Table 1Table 4 /
SENSii
mT
BSAT Magnetic saturation onset 50 mT
OFFS Deviation from expected 0mT output 0 LSB
OFFSTHD Offset thermal drift, Delta from 25°C (6) < ±1000 LSB
SENSXX,
SENSYY
Programming range of magnetic resolution
(µT/LSB) or sensitivity (LSB/mT) (7)
[modifying GAIN_SEL and RESXYZ], cfr. Table 3
3.220 0.161 µT/LSB
311 6211 LSB/mT
SENSZZ 5.872 0.294 µT/LSB
170 3406 LSB/mT
6 The offset thermal drift is defined as the deviation at 0Gauss from the output with respect to the output at 25°C when
sweeping the temperature. The highest gradient (µT/°C) typically occurs at 85°C. The spec value is based on
characterization on limited sample size at GAIN_SEL=0x7 and RES_XYZ=0x00.
7 The total axis sensitivity is programmable to support different applications, but has no Automatic Gain control on-chip
as do the other angular position sensors from Melexis. The highest gain corresponds to at least the minimum +/-4.8mT
magnetic measurement range and the magnetic resolution defined by SENSii.
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Parameter Remark Min Nom Max Unit
SENSXY,
SENSYX
Cross-axis sensitivity (X/Y-axis sensitivity to
Y/X magnetic fields)
< ±1 %
SENSXZ,
SENSYZ
Cross-axis sensitivity (X/Y-axis sensitivity to Z
magnetic field)
< ±1 %
SENSZX,
SENSZY
Cross-axis sensitivity (Z-axis sensitivity to X
and Y magnetic fields)
< ±1 %
SENSTHD Sensitivity thermal drift
Delta from 25°C(8)
-3 +3 %
Table 8: Magnetic Specifications
8 The sensitivity thermal drift is expressed as a band around the sensitivity at 25°C. It is applicable on wafer level
trimming, but can be influenced by packaging (overmolding).
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12.1. Noise vs Conversion Time
The MLX90393 provides configurable filters to adjust the tradeoff between current consumption, noise, and
conversion time. See section 15.1.5 for details on selecting the conversion time by adjusting OSR and
DIG_FILT.
Figure 2: XY axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7
Figure 3: Z axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7
0
10
20
30
40
50
60
110 100
Noise Stdev [mGauss]
Conversion Time [ms]
XY-axis Noise over Conversion Time (bundled per OSR setting)
OSR = 0
OSR = 1
OSR = 2
OSR = 3
0
10
20
30
40
50
60
70
80
90
110 100
Noise Stdev [mGauss]
Conversion Time [ms]
Z-axis Noise over Conversion Time (bundled per OSR setting)
OSR = 0
OSR = 1
OSR = 2
OSR = 3
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13. Mode Selection
The MLX90393 can operate in three modes. They are: Burst mode, Single Measurement mode, and Wake-
On-Change mode.
Burst mode
The ASIC will have a programmable data rate at which it will operate. This data rate implies auto-
wakeup and sequencing of the ASIC, flagging that data is ready on a dedicated pin (INT/DRDY). The
maximum data rate corresponds to continuous burst mode, and is a function of the chosen
measurement axes. For non-continuous burst modes, the time during which the ASIC has a counter
running but is not doing an actual conversion is called the Standby mode (STBY).
Single Measure mode
The master will ask for data via the corresponding protocol (I2C or SPI), waking up the ASIC to make a
single conversion, immediately followed by an automatic return to sleep mode (IDLE) until the next
polling of the master. This polling can also be done by strobing the TRG pin instead, which has the
same effect as sending a protocol command for a single measurement.
Wake-Up on Change
This mode is similar to the burst mode in the sense that the device will be auto-sequencing, with the
difference that the measured component(s) is/are compared with a reference and in case the
difference is bigger than a user-defined threshold, the DRDY signal is set on the designated pin. The
user can select which axes and/or temperature fall under this cyclic check, and which thresholds are
allowed.
The user can change the operating mode at all time through a specific command on the bus. The device
waits in IDLE mode after power-up, but with a proper user command any mode can be set after power-up.
Changing to Burst or WOC mode, coming from Single Measure mode, is always accompanied by a
measurement first. The top-level state diagram indicating the different modes and some relevant timing is
shown below in Figure 4. In the Measure state, the MDATA flag will define which components will be
measured (ZYXT). The order of conversion is defined as TXYZ and can not be modified by the user, only the
combination of axes is a degree of freedom.
Arrows indicated in grey are the direct result of an Exit command. The main difference between STANDBY
and WOC_IDLE is that in STANDBY mode, all analog circuitry is ready to make a conversion, but this is
accompanied by a larger current consumption than IDLE mode. For burst mode this extra current
consumption is justified because the emphasis is more on accurate timing intervals, avoiding the delay of
TSTBY before conversion and supporting an efficient continuous burst mode without standby overhead.
It is the user’s responsibility to read back the measured data as the MLX90393 is a slave device on the bus.
Even in burst mode and WOC mode when the MLX90393 is auto-sequencing, the master will be responsible
for collecting the acquired sensor data.
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STARTUP
LOAD CALIB DATA
IDLE
LP_OSC disabled
STANDBY
LP_OSC enabled
POR
VDD > V
POR_LH
Burst
mode
WOC_IDLE
LP_OSC enabled
WOC
mode
SM mode
EX
TIME
m*T
CONVM
+
T
CONVT
T
ACTIVE
T
STBY
T
POR
EX
~T
INTERVAL
~T
INTERVAL
&& Burst mode
T?
X?
Y?
Z?
MDATA ?
MEASURE
LP_OSC & MAIN_OSC
enabled
Figure 4: Top-level state diagram with indication of timings
13.1. Burst mode
When the sensor is operating in burst mode, it will make conversions at specific time intervals. The
programmability of the user is the following:
Burst speed (TINTERVAL) through parameter BURST_DATA_RATE
Conversion time (TCONV) through parameters OSR, OSR2 and DIG_FILT
Axes/Temperature (MDATA) through parameter BURST_SEL or via the command argument (ZYXT)
Whenever the MLX90393 has made the selected conversions (based on MDATA), the DRDY signal will be set
(active H) on the INT and/or INT/TRG pin to indicate that the data is ready for readback. It will remain high
until the master has sent the command to read out at least one of the converted quantities (ZYXT). Should
the master have failed to read out any of them by the time the sensor has made a new conversion, the
INT/DRDY pin will be strobed low for 10us, and the next rising edge will indicate a new set of data is ready.
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13.2. Single Measurement mode
Whenever the sensor is set to this mode (or after startup) the MLX90393 goes to the IDLE state where it
awaits a command from the master to perform a certain acquisition. The duration of the acquisition will be
the concatenation of the TSTBY, TACTIVE, m*TCONVM (with m # of axes) and TCONVT. The conversion time will
effectively be programmable by the user (see burst mode), but is equally a function of the required
axes/temperature to be measured.
Upon reception of such a polling command from the master, the sensor will make the necessary
acquisitions, and set the DRDY signal high to flag that the measurement has been performed and the master
can read out the data on the bus at his convenience. The INT/DRDY will be cleared either when:
The master has issued a command to read out at least one of the measured components
The master issues an Exit (EX) command to cancel the measurement
The chip is reset, after POR (Power-on reset) or Reset command (RT)
13.3. Wake-Up on Change mode
The Wake-Up on Change (WOC) functionality can be set by the master with as main purpose to only receive
an interrupt when a certain threshold is crossed. The WOC mode will always compare a new burst value with
a reference value to assess if the difference between both exceeds a user-defined threshold. The reference
value is defined as one of the following:
The first measurement of WOC mode is stored as reference value once, because of a measurement.
This measurement at “t=0” is then the basis for comparison or,
The reference for acquisition(t) is always acquisition(t-1), in such a way that the INT signal will only
be set if the derivative of any component exceeds a threshold.
The in-application programmability is the same as for burst mode, but now the thresholds for setting the
interrupt are also programmable by the user, as well as the reference, if the latter is data(t=0) or data(t-1).
14. Digital Specification
The supported protocols are I2C and SPI. The SENB/CS pin is used to define the protocol to be used:
/CS = 0 for SPI, addressing the MLX90393 slave in SPI mode (3- and 4-wire), but releasing this line in
between commands (no permanent addressing allowed)
/CS = 1 for I2C, addressing the MLX90393 slave when the correct address is transmitted over the bus
(permanently kept high)
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To ensure the activity on the SPI bus cannot be accidentally interpreted as I2C protocol, programming bits
are available in the memory of the MLX90393 to force the communication mode. It concerns the
COMM_MODE[1:0] bits with the following effect:
COMM_MODE[1] COMM_MODE[0] Description
0 X The mode in which the first valid command is transmitted to the
MLX90393 defines the operating mode (SPI or I2C) for all its future
commands, until a reset (hard or soft) is done.
1 0 SPI mode only
1 1 I2C mode only
Table 9: Communication mode definition
14.1. Command List
The MLX90393 only listens to a specific set of commands. Apart from the Reset command, all commands
generate a status byte that can be read out. The table below indicates the 10 different commands that are
(conditionally) accepted by the MLX90393. The MLX90393 will always acknowledge a command in I2C, even
if the command is not a valid command. Interpreting the associated status byte is the method for
verification of command acceptance.
Command Set
Command Name Symbol # CMD1 byte CMD2 byte CMD3 byte CMD4 byte
Start Burst Mode SB 1 0001 zyxt N/A N/A N/A
Start Wake-up on Change Mode SW 2 0010 zyxt N/A N/A N/A
Start Single Measurement Mode SM 3 0011 zyxt N/A N/A N/A
Read Measurement RM 4 0100 zyxt N/A N/A N/A
Read Register RR 5 0101 0abc {A5…A0,0,0} N/A N/A
Write Register WR 6 0110 0abc D15…D8 D7…D0 {A5…A0,0,0}
Exit Mode EX 8 1000 0000 N/A N/A N/A
Memory Recall HR D 1101 0000 N/A N/A N/A
Memory Store HS E 1110 0000 N/A N/A N/A
Reset RT F 1111 0000 N/A N/A N/A
Table 10: Command List
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The argument for the volatile memory access commands (RR/WR) «abc» should be set to 0x0h, in order to
get normal read-out and write of the memory.
The argument in all mode-starting commands (SB/SW/SM) is a nibble specifying the conversions to be
performed by the sensor in the following order «zyxt». For example, if only Y axis and temperature are to be
measured in Single Measurement mode the correct command to be transmitted is 0x35h. The sequence of
measurement execution on-chip is inverted to «TXYZ», so T will be measured before X, followed by Y and
finally Z. By issuing an all-zero «zyxt» nibble, the BURST_SEL value from RAM will be used instead of the
empty argument of the command.
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14.2. Status Byte
The status byte is the first byte transmitted by the MLX90393 in response to a command issued by the
master. It is composed of a fixed combination of informative bits:
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
BURST_MODE WOC_MODE SM_MODE ERROR SED RS D1 D0
Table 11: Status Byte Definition
MODE bits
These bits define in which mode the MLX90393 is currently set. Whenever a mode transition
command is rejected, the first status byte after this command will have the expected mode bit
cleared, which serves as an indication that the command has been rejected, next to the ERROR bit.
The SM_MODE flag can be the result of an SM command or from raising the TRG pin when TRG mode
is enabled in the volatile memory of the MLX90393.
ERROR bit
This bit is set in case a command has been rejected or in case an uncorrectable error is detected in
the memory, a so called ECC_ERROR. A single error in the memory can be corrected (see SED bit),
two errors can be detected and will generate the ECC_ERROR. In such a case all commands but the
RT (Reset) command will be rejected. The error bit is equally set when the master is reading back
data while the DRDY flag is low.
SED bit
The single error detection bit simply flags that a bit error in the non-volatile memory has been
corrected. It is purely informative and has no impact on the operation of the MLX90393.
RS bit
Whenever the MLX90393 gets out of a reset situation – both hard and soft reset – the RS flag is set
to highlight this situation to the master in the first status byte that is read out. As soon as the first
status byte is read, the flag is cleared until the next reset occurs.
D[1:0] bits
These bits only have a meaning after the RR and RM commands, when data is expected as a response
from the MLX90393. The number of response bytes correspond to 2*D[1:0] + 2, so the expected byte
counts are either 2, 4, 6 or 8. For commands where no response is expected, the content of D[1:0]
should be ignored.
14.3. SPI Communication
The MLX90393 can handle SPI communication at a bitrate of 10Mhz. The SPI communication is implemented
in a half-duplex way, showing high similarities with I2C communication, but addressing through the \CS (Chip
Select) pin instead of through bus arbitration. The half-duplex nature is at the basis of the supported 3-wire
SPI operation. SPI mode 3 is implemented: CPHA=1 (data changed on leading edge and captured on trailing
edge, and CPOL=1 (high level is inactive state). The Chip Select line is active-low.
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Symbol
Parameter
Value
Unit
Min
Max
tc(SPC)
SPI clock cycle
100
ns
fc(SPC)
SPI clock frequency
10
MHz
tsu(CS)
CS setup time
5
ns
th(CS)
CS hold time
10
tsu(SI)
SDI input setup time
5
th(SI)
SDI input hold time
15
tv(SO
SDO valid output time
50
th(SO)
SDO output hold time
5
tdis(SO)
SDO output disable time
50
The communication is also bundled in bytes, equally MSB first and MSByte first. A command can of course
consist of more than 1 byte (refer to Chapter 8.1) as can the response be from the MLX90393 in the form of
multiple bytes after the status byte (not shown in Figure 5)
COMMAND[7:0]
SCL
MOSI
12345678 12345678
MISO
/CS
STATUS_BYTE[7:0]
X (4-wire SPI) or Z (3-wire SPI)
Z (3 & 4-wire SPI)
ADD NADD
Figure 5: SPI communication example
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14.4. I2C Communication
14.4.1. I2C Address
The I2C address is made up of some hard-coded bits and a memory written value as follows:
I2C_ADDR[6:0] = {EE_I2C_ADDR[4:0],A1,A0} with Ai the user-selectable active-high value of the input pads of
the MLX90393, referred to the VDD supply system and EE_I2C_ADDR[4:0] default programmed to 0x03h, but
factory accessible for overwrite. Table 7 below indicated the available ordering codes for different
EE_I2C_ADDR[4:0] factory calibrated values. This permits connection of up to 16 distinguishable sensors on
the bus: 4 ordering codes x 4 possible hardwired A1A0 connections for each.
Ordering Code EE_I2C_ADDR[4:0] 7-bit I2C addresses possible
MLX90393xLW-ABA-011-RE 0x03h 0x0Ch, 0x0Dh, 0x0Eh, 0x0Fh
MLX90393xLW-ABA-012-RE 0x04h 0x10h, 0x11h, 0x12h, 0x13h
MLX90393xLW-ABA-013-RE 0x05h 0x14h, 0x15h, 0x16h, 0x17h
MLX90393xLW-ABA-014-RE 0x06h 0x18h, 0x19h, 0x1Ah, 0x1Bh
Table 12: I2C address ordering codes.
14.4.2. I2C Principle
The MLX90393 supports I2C communication in both Standard Mode and Fast Mode. Bytes are transmitted
MSB first, and in order to reconstruct words, the bytes need to be concatenated MSByte first. The general
principle of communication is always the same:
Initiating the communication is always done by the Master (Start condition S)
Addressing the Slave (MLX90393) followed by a cleared bit to indicate the Master intends to write
something to the specific addressed Slave
Acknowledging by the Slave if the transmitted address corresponds to the Slave’s I2C address. If the
latter isn’t the case, any further activity on the bus except a Sr (Start Repeat) and P (Stop) condition
will be ignored by the MLX90393
Sending a Command Byte by the Master, as depicted in Figure 6. The Slave will always acknowledge
this, even if it is an unrecognized command. A command such as WR and RR consist of more than 1
byte, which can then be transmitted sequentially over the I2C bus. Referring to Figure 6 the
COMMAND byte should then be a sequence of COMMAND byte1, byte2, etc…
Issuing a Start Repeat (Sr) condition by the Master in order to restart the addressing phase
Addressing the Slave (MLX90393) followed by a set bit to indicate the Master intends to read
something from the specific addressed Slave
Acknowledging by the Slave if the transmitted address corresponds to the Slave’s I2C address. If the
latter isn’t the case, any further activity on the bus except a Sr (Start Repeat) and P (Stop) condition
will be ignored by the MLX90393
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Transmitting the Status Byte by the Slave, who is in control of the bus. Following the RR and RM
commands the sensor returns additional data bytes after the status byte.
Acknowledging by the Master if the data is well received
Generating a Stop condition (P) by the master
The Master controlled bus activity is shown in blue, the Slave controlled bus activity is shown in orange. In
case a command is longer than a single byte (see Table 6), the bytes are transmitted sequentially before
generating the Start Repeat (Sr) condition.
I2C_ADDR[6:0] W ACK
S
COMMAND[7:0] ACK
I2C_ADDR[6:0] R ACK
Sr
STATUS_BYTE[7:0] ACK
SCL
SDA
SCL
SDA
123456789 123456789
123456789
P
123456789
Figure 6: Default I2C communication example with status byte readback
The same applies to the Slave responses: following RR and RM commands, the Slave response is more than
just the Status Byte. There as well, the data is partitioned in bytes that are transmitted sequentially by the
slave. It is the Master’s responsibility to issue enough clocking pulses to read back all the data. Finding out
how many bytes is possible by decoding the Status Byte information, see Section Status Byte.
Finally, the master is also free to not read back the status byte when issuing a command. In doing so, he
loses the ability to see if the command was received properly by the MLX90393. Moreover, the first SM
command issued by the master after power-up or reset should have the status byte read back to get valid
measurement data back.
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Symbol Parameter
I2C standard mode I2C fast mode
Unit
Min Max Min Max
f(SCL)
SCL clock frequency
0
100
0
400
kHz
tw(SCLL)
SCL clock low time
4.7
1.3
µs
tw(SCLH)
SCL clock high time
4.0
0.6
tsu(SDA)
SDA setup time
250
100
ns
th(SDA)
SDA data hold time
0
3.45
0
0.9
µs
tr(SDA), tr(SCL)
SDA and SCL rise time
1000
20+0.1Cb
300
ns
tf(SDA), tf(SCL)
SDA and SCL fall time
300
20+0.1Cb
300
th(ST)
START condition hold time
4
0.6
µs
t
su(SR)
Repeated START condition setup
time
4.7 0.6
tsu(SP)
STOP condition setup time
4
0.6
t
w(SP:SR)
Bus free time between STOP and
START condition
4.7 1.3
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15. Memory Map
The MLX90393 has 1kbit of non-volatile memory, and the same amount of volatile memory. Each memory
consists out of 64 addresses containing 16 bit words. The non-volatile memory has automatic 2-bit error
detection and 1-bit error correction capabilities per address. The handling of such corrections & detections
is explained in Section Status Byte.
The memory is split in 2 areas:
Customer area [address 0x00h to 0x1Fh]
Melexis area [address 0x20h to 0x3Fh]
The RR and WR commands impact the volatile memory only, there no direct access possible to the non-
volatile memory. The customer area of the volatile memory is bidirectionally accessible to the customer; the
Melexis area is write-protected. Only modifications in the blue area are allowed with the WR command. The
adjustments in the customer area can be stored in the permanent non-volatile memory with the STORE
command HS, which copies the entire volatile memory including the Melexis area to the non-volatile one.
With the HR command the non-volatile memory content can be recalled to the volatile memory, which can
restore any modifications due to prior WR commands. The HR step is performed automatically at start-up of
the ASIC, either through cold reset or warm reset with the RT command.
The above is graphically shown in Figure 7.
CUSTOMER AREA CUSTOMER AREA
MELEXIS AREA MELEXIS AREA
VOLATILE
MEMORY NON-VOLATILE
MEMORY
STORE (HS)
RECALL (HR)
RR WR
Figure 7: The memories of the MLX90393, their areas and the impacting commands.
The customer area houses 3 types of data:
Analog configuration bits
Digital configuration bits
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Informative (free) bits
The latter can be filled with customer content freely, and covers the address span from (and including)
0x0Ah to 0x1Fh, a total of 352 bits. The memory mapping of volatile and non-volatile memory on address
level is identical. The volatile memory map is given in Figure 8.
Figure 8: Customer area memory map.
The non-volatile memory can only be written (HS store command) if pin VDD is supplied with 3.3V minimum,
otherwise the write sequence cannot be performed in a reliable way. Additionally, this HS command was
designed to be used as one-time calibration, but not as multi write-cycle memory within the application. In
case memory is written within the application, the number of write cycles should be kept to a minimum.
There is no limit to the write cycles in the volatile memory (WR write command).
15.1. Parameter Description
The meaning of each customer accessible parameter is explained in this section. The customer area of both
the volatile and the non-volatile memory can be written through standard SPI and I2C communication, within
the application. No external high-voltages are needed to perform such operations, nor access to dedicated
pins that need to be grounded in the application.
Parameter Description
ANA_RESERVED_LOW Reserved IO trimming bits
BIST Enabled the on-chip coil, applying a Z-field [Built-In Self Test]
Z_SERIES Enable all plates for Z-measurement
GAIN_SEL[2:0] Analog chain gain setting, factor 5 between min and max code
HALLCONF[3:0] Hall plate spinning rate adjustment
ADDRESS 15 14 13 12 11 10 9876543210
0x00h BIST Z_SERIES
0x01h
TRIG_INT_
WOC_DIFF EXT_TRIG TCMP_EN
0x02h
0x03h
0x04h
0x05h
0x06h
0x07h
0x08h
0x09h
0x0Ah
0x0Bh
0x0Ch
0x0Dh
0x0Eh
0x0Fh
0x10h
0x11h
0x12h
0x13h
0x14h
0x15h
0x16h
0x17h
0x18h
0x19h
0x1Ah
0x1Bh
0x1Ch
0x1Dh
0x1Eh
0x1Fh
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
FREE
OFFSET_X
OFFSET_Y
OFFSET_Z
WOXY_THRESHOLD
WOZ_THRESHOLD
WOT_THRESHOLD
OSR2
RES_XYZ
DIG_FILT
OSR
SENS_TC_HT
SENS_TC_LT
BIT NUMBER
ANA_RESERVED_LOW
GAIN_SEL
HALLCONF
COMM_MODE
BURST_SEL (zyxt)
BURST_DATA_RATE
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Parameter Description
TRIG_INT_SEL Puts TRIG_INT pin in TRIG mode when cleared, INT mode otherwise
COMM_MODE[1:0] Allow only SPI [10b], only I2C [11b] or both [0Xb] according to CS pin
WOC_DIFF Sets the Wake-up On Change based on Δ{sample(t),sample(t-1)}
EXT_TRIG Allows external trigger inputs when set, if TRIG_INT_SEL = 0
TCMP_EN Enables on-chip sensitivity drift compensation
BURST_SEL[3:0] Defines the MDATA in burst mode if SB command argument = 0
BURST_DATARATE[6:0] Defines TINTERVAL as BURST_DATA_RATE * 20ms
OSR2[1:0] Temperature sensor ADC oversampling ratio
RES_XYZ[5:0] Selects the desired 16-bit output value from the 19-bit ADC
DIG_FILT[1:0] Digital filter applicable to ADC
OSR[1:0] Magnetic sensor ADC oversampling ratio
SENS_TC_HT[7:0] Sensitivity drift compensation factor for T < TREF
SENS_TC_LT[7:0] Sensitivity drift compensation factor for T > TREF
OFFSET_i[15:0] Constant offset correction, independent for i = X, Y, Z
WOi_THRESHOLD[15:0] Wake-up On Change threshold, independent for i = X, Y, Z and T
Table 13: NVRAM parameter description
15.1.1. ANA_RESERVED_LOW
Reserved bits for analog trimming at Melexis factory. Do not modify.
15.1.2. BIST
Enables (1) or disables (0) the built in self-test coil. In normal operation set to 0.
15.1.3. Z_Series
Enables series connection of hall plates for Z axis measurement. In normal operation set to 0.
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15.1.4. GAIN_SEL[2:0]
Sets the analog gain to the desired value. The sensitivity is dependent on the axis (X and Y have higher
sensitivity) as well as the setting of the RES_XYZ[5:0] parameter. The relationship is given in the below table.
Table for HALLCONF = 0xC, sensitivity in uT/LSB:
GAIN_SEL
RES = 0
RES = 1
RES = 2
RES = 3
SENSXY
SENSZ
SENSXY
SENSZ
SENSXY
SENSZ
SENSXY
SENSZ
0
0.751
1.210
1.502
2.420
3.004
4.840
6.009
9.680
1
0.601
0.968
1.202
1.936
2.403
3.872
4.840
7.744
2
0.451
0.726
0.901
1.452
1.803
2.904
3.605
5.808
3
0.376
0.605
0.751
1.210
1.502
2.420
3.004
4.840
4
0.300
0.484
0.601
0.968
1.202
1.936
2.403
3.872
5
0.250
0.403
0.501
0.807
1.001
1.613
2.003
3.227
6
0.200
0.323
0.401
0.645
0.801
1.291
1.602
2.581
7
0.150
0.242
0.300
0.484
0.601
0.968
1.202
1.936
Table 14: Sensitivity table for given gain and resolution selection for HALLCONF=0xC
Table for HALLCONF = 0x0, sensitivity in uT/LSB:
GAIN_SEL
RES = 0
RES = 1
RES = 2
RES = 3
SENSXY
SENSZ
SENSXY
SENSZ
SENSXY
SENSZ
SENSXY
SENSZ
0
0.981
1.581
1.963
3.162
3.926
6.324
7.851
12.648
1
0.785
1.265
1.570
2.530
3.141
5.059
6.281
10.119
2
0.589
0.949
1.178
1.897
2.355
3.794
4.711
7.589
3
0.491
0.791
0.981
1.581
1.961
3.162
3.926
6.324
4
0.393
0.632
0.785
1.265
1.570
2.530
3.141
5.059
5
0.327
0.527
0.654
1.054
1.309
2.108
2.617
4.216
6
0.262
0.422
0.523
0.843
1.047
1.686
2.094
3.373
7
0.196
0.316
0.393
0.632
0.785
1.265
1.570
2.530
Table 15: : Sensitivity table for given gain and resolution selection for HALLCONF=0x0
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15.1.5. HALLCONF[3:0]
Modifies the hall plate spinning (2-phase vs 4-phase) which has an effect on the minimum sampling rate
achievable. Some configurations of OSR and DIG_FILT are not permitted. The cells shown in red are not
permitted with HALL_CONF=0xC (default) but are allowed when HALL_CONF=0x0.
Typical T
CONV
(TXYZ)
for OSR2=0x0 [ms]
OSR
0
1
2
3
DIG_FILT
0
1.27
1.84
3.00
5.30
1
1.46
2.23
3.76
6.84
2
1.84
3.00
5.30
9.91
3
2.61
4.53
8.37
16.05
4
4.15
7.60
14.52
28.34
5
7.22
13.75
26.80
52.92
6
13.36
26.04
51.38
102.07
7
25.65
50.61
100.53
200.37
Table 16: TCONV as a function of OSR & DIG_FILT
Maximum ODR
for OSR2=0x0 [Hz]
OSR
0
1
2
3
DIG_FILT
0
716.9
493.0
303.4
171.5
1
622.7
408.0
241.5
133.0
2
493.0
303.4
171.5
91.8
3
348.0
200.6
108.6
56.6
4
219.2
119.6
62.6
32.1
5
125.9
66.1
33.9
17.2
6
68.0
34.9
17.7
8.9
7
35.4
18.0
9.0
4.5
Table 17: Maximum Output Data Rate (ODR) as a function of OSR & DIG_FILT
15.1.6. TRIG_INT_SEL
When set to 0 the TRIG_INT pin is in trigger mode. When set to 1 the TRIG_INT pin acts as an interrupt pin.
15.1.7. COMM_MODE[1:0]
When set to 0x2 only SPI communication is allowed. When set to 0x3 only I2C communication is allowed.
When set to 0x0 or 0x1 both communication modes can be used but the selection is made by the CS pin.
15.1.8. WOC_DIFF
When wake-on-change mode is enabled this parameter defines the difference needed between the current
measurement and the previous measurement (Δ{sample(t),sample(t-1)}) that will cause the interrupt pin to
toggle.
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15.1.9. EXT_TRIG
Allows for external trigger events when set to 1 and TRIG_INT_SEL = 0. When enabled an acquisition will
start with the external trigger pin detects a high value. Acquisitions will continue to be triggered until the
EST_TRIG pin is brought low.
15.1.10. TCMP_EN
Enables (1) or disables (0) the on-chip sensitivity drift compensation. Enabling the temperature
compensation will influence the way the magnetic values are encoded and transmitted to the system
microcontroller as shown in the table below.
ABA
TCMP_EN = 0x0
TCMP_EN = 0x1
RANGE
TYPE
RANGE
TYPE
RESi
0 ±215
2’s complement
0µT = 0LSB
±215
unsigned
0µT = 2
15
LSB
1 ±215
2’s complement
0µT = 0LSB
±215
unsigned
0µT = 2
15
LSB
2 ±22000
unsigned
0µT = 2
15
LSB
N/A
3 ±11000
unsigned
0µT = 2
14
LSB
Table 18: Output Range and Type as a function of TCMP_EN and RES_XYZ={RESX,RESY,RESZ}
15.1.11. BURST_SEL[3:0]
Defines the axes that will be converted in burst mode if the SB command argument is 0.
15.1.12. OSR2[1:0]
Selects the temperature sensor ADC oversampling ratio
15.1.13. RES_XYZ[5:0]
See 15.4.1 GAIN_SEL for the relationship between the gain and resolution. Additionally, section 15.1.10
TCMP_EN for the relationship between RES_XYZ and the output data format.
15.1.14. DIG_FILT[1:0]
See 15.1.5 for the selection of DIG_FILT and the impact on conversion time
15.1.15. OSR[1:0]
Oversampling ratio for the magnetic measurements
15.1.16. SENS_TC_HT[7:0]
Sensitivity drift compensation factor for T > TREF
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15.1.17. SENS_TC_LT[7:0]
Sensitivity drift compensation factor for T < TREF
15.1.18. OFFSET_i[15:0]
Constant offset correction, independent of temperature, and programmable for each individual axis where
i=X, Y, or Z.
15.1.19. WOi_THRESHOLS[15:0]
Wake-on-change threshold. Independently programmable for each magnetic axis (i=X, Y, Z) and temperature
(i=T)
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16. Recommended Application Diagram
1.1 I2C
MLX90393
VDDIO
SDA/MOSI
SCL/SCLK
A0
A1
SENB/CS
A1 A0 I2C Address
-------------------------------------
Vss Vss 0001100R/W
Vss Vdd 0001101R/W
Vdd Vss 0001110R/W
Vdd Vdd 0001111R/W
VDD
INT
VSS
VDDIO
(1.71V - VDD)
VDD
(2.2V - 3.6V)
R1
R2
C1
MCU
Interrupt/DRDY
I2C
R1=R2=10K
C1=C2=0.1uF
C2
INT/TRG Trigger
1.2 SPI
MLX90393
VDDIO
SDA/MOSI
SCL/SCLK
A0
A1
SENB/CS
VDD
INT
VSS
VDDIO
(1.71V - VDD)
VDD
(2.2V - 3.6V)
C1
MCU
Interrupt/DRDY
SPI
C1=C2=0.1uF
C2
INT/TRG Trigger
MISO
Short on PCB
for 3-wire SPI
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17. Packaging Specification
17.1. QFN package
The MLX90393 shall be delivered in a QFN package as shown below in Figure 9.
Figure 9: Package Outline Drawing
The sensing elements – Hall plates with the patented IMC technology – are located in the center of the die, which on its turn
is located in the center of the package. The pinout (in name and function) is given in section 7.
18. Standard Information
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level
according to standards in place in Semiconductor industry.
For further details about test method references and for compliance verification of selected soldering method for
product integration, Melexis recommends reviewing on our web site the General Guidelines soldering
recommendation. For all soldering technologies deviating from the one mentioned in above document (regarding peak
X
Z
Y
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temperature, temperature gradient, temperature profile, etc.), additional classification and qualification tests have to
be agreed upon with Melexis.
For package technology embedding trim and form post-delivery capability, Melexis recommends to consult the
dedicated trim & form recommendation application note: lead trimming and forming recommendations
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information
on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain
Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment
19. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
20. Revision History
Date Revision Remark
11-Nov-2014 001 First Document Release
16-Feb-2015 002 Changed Ordering Code to indicate QFN wettable flanks
Update Document number
Added description of yellow cells in Table 1 and Table 2.
13-Jul-2017 003 Added additional ordering codes for up to 16 sensors on the same
bus and their description in Table 7
Added E temperature code for -40°C capable products and the
associated update of the operating range in Chapter 3
Updated template to new Melexis format
21. Contact
For the latest version of this document, go to our website at www.melexis.com.
For additional information, please contact our Direct Sales team and get help for your specific needs:
Europe, Africa Telephone: +32 13 67 04 95
Email : sales_europe@melexis.com
Americas Telephone: +1 603 223 2362
Email : sales_usa@melexis.com
Asia Email : sales_asia@melexis.com
MLX90393 Triaxis® Magnetic Node
Datasheet
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REVISION 003 - SEPTEMBER 14, 2017
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22. Disclaimer
The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the
furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation, special,
consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, non-
infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services.
The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to
designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current.
Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a
particular purpose.
The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant, explicitly or implicitly, to
any party any patent rights, licenses, or any other intellectual property rights.
This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities.
The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be
suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support or life-
sustaining equipment are specifically not recommended by Melexis.
The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage,
recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons: 2) civil
firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone
or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any
similar violent situation.
The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-and-
conditions.
This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.
Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016)
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