MLX90393 Triaxis(R) Magnetic Node Datasheet 1. Features and Benefits Absolute Position Sensor IC featuring Triaxis(R) Hall Technology Simple & Robust Magnetic Design Miniature size for tiny assemblies Selectable SPI and I2C bus protocols Wide dynamic range (5-50mT) with on-thefly programmable gain 2.2V-3.6V supply for battery powered applications, down to 1.8V IO voltage On board filter settings On the fly programmable operating modes and sleep times for micro-power use External and internal acquisition triggering modes External interrupt pin enables waking a microcontroller when the field changes On board temperature sensor 3. Description The MLX90393 brings the highest flexibility in the Triaxis portfolio's smallest packaged assembly. Additionally, the MLX90393 is designed for micropower applications, with programmable duty cycles in the range of 0.1% to 100% allowing for configurable power consumption based on system requirements. The MLX90393 magnetic field sensor can be reprogrammed to different modes and with different settings at run-time to fine-tune the performance and power consumed. The sensor offers a 16-bit output proportional to the magnetic flux density sensed along the X, Y, and Z axes using the Melexis proprietary Triaxis technology and offers a 16-bit temperature output signal. These digital values are available via I2C and SPI, where the MLX90393 is a slave on the bus. Multiple sensors can be connected to the same bus, by A0 and A1 hardwired connection (4x) but also through ordering codes with different SW address (4x). By selecting which axes are to be measured, the raw data can be used as input for further postprocessing, such as for joystick applications, rotary knobs, and more complex 3D position sensing applications. Unparalleled performance is achieved with this sensor, which is primarily targeting industrial and consumer applications. 2. Application Examples Non-contacting HMI applications with push-pull functionality Rotary knobs & dials (Long stroke) Linear motion in one or two axes for levers & sliding switches A1 State Machine Bias Triaxis(R) RAM VX VY VZ VT Control SPI/I2C Interface ADC G EEPROM Temp Compensation Temp Sensor Home Security 3D closure detection Accurate liquid level sensing Factory automation position sensing Magnetic fingerprint detection REVISION 003 - SEPTEMBER 14, 2017 SDA/MOSI SCL/SCLK MISO MS/CS Interrupt Trigger Oscillator Low Power Oscillator Wake-Up Joystick (gimball or ball & socket) 3901090393 A0 VDD_IO MUX VDD Figure 1: General Block Diagram VSS MLX90393 Triaxis(R) Magnetic Node Datasheet Contents 1. Features and Benefits ............................................................................................................................... 1 2. Application Examples................................................................................................................................ 1 3. Description ............................................................................................................................................... 1 4. Ordering Information ............................................................................................................................... 4 5. Functional Diagram .................................................................................................................................. 5 6. Glossary of Terms ..................................................................................................................................... 5 7. Pinout ....................................................................................................................................................... 6 8. Absolute Maximum Ratings ...................................................................................................................... 7 9. General Electrical Specifications............................................................................................................... 8 10. Thermal Specification ............................................................................................................................. 9 11. Timing Specification ............................................................................................................................. 10 12. Magnetic Specification ......................................................................................................................... 11 13. Mode Selection..................................................................................................................................... 13 13.1. Burst mode ................................................................................................................................... 15 13.2. Single Measurement mode ......................................................................................................... 16 13.3. Wake-Up on Change mode.......................................................................................................... 16 14. Digital Specification .............................................................................................................................. 16 14.1. Command List .............................................................................................................................. 17 14.2. Status Byte ................................................................................................................................... 19 14.3. SPI Communication ...................................................................................................................... 19 14.4. I2C Communication ...................................................................................................................... 21 14.4.1. I2C Address ............................................................................................................................. 21 14.4.2. I2C Principle ............................................................................................................................ 21 15. Memory Map ........................................................................................................................................ 24 15.1. Parameter Description ................................................................................................................. 25 15.1.1. ANA_RESERVED_LOW............................................................................................................ 26 15.1.2. BIST ......................................................................................................................................... 26 15.1.3. Z_Series .................................................................................................................................. 26 15.1.4. GAIN_SEL[2:0] ........................................................................................................................ 27 15.1.5. HALLCONF[3:0]....................................................................................................................... 28 15.1.6. TRIG_INT_SEL ......................................................................................................................... 28 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 2 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 15.1.7. COMM_MODE[1:0] ................................................................................................................ 28 15.1.8. WOC_DIFF .............................................................................................................................. 28 15.1.9. EXT_TRIG ................................................................................................................................ 29 15.1.10. TCMP_EN ............................................................................................................................. 29 15.1.11. BURST_SEL[3:0] .................................................................................................................... 29 15.1.12. OSR2[1:0] ............................................................................................................................. 29 15.1.13. RES_XYZ[5:0] ........................................................................................................................ 29 15.1.14. DIG_FILT[1:0] ....................................................................................................................... 29 15.1.15. OSR[1:0] ............................................................................................................................... 29 15.1.16. SENS_TC_HT[7:0] ................................................................................................................. 29 15.1.17. SENS_TC_LT[7:0] .................................................................................................................. 30 15.1.18. OFFSET_i[15:0] ..................................................................................................................... 30 15.1.19. WOi_THRESHOLS[15:0]........................................................................................................ 30 16. Recommended Application Diagram .................................................................................................... 31 1.1 I2C .................................................................................................................................................... 31 1.2 SPI .................................................................................................................................................... 31 17. Packaging Specification ........................................................................................................................ 32 17.1. QFN package ................................................................................................................................ 32 18. Standard Information ........................................................................................................................... 32 19. ESD Precautions.................................................................................................................................... 33 20. Revision History .................................................................................................................................... 33 21. Contact ................................................................................................................................................. 33 22. Disclaimer ............................................................................................................................................. 34 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 3 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 4. Ordering Information Product Temperature Package Option Code Packing Form Definition MLX90393 S (-20C to 85C) LW ABA-011 RE I2C address = 00011xx MLX90393 S (-20C to 85C) LW ABA-012 RE I2C address = 00100xx MLX90393 S (-20C to 85C) LW ABA-013 RE I2C address = 00101xx MLX90393 S (-20C to 85C) LW ABA-014 RE I2C address = 00110xx MLX90393 E (-40C to 85C) LW ABA-011 RE I2C address = 00011xx MLX90393 E (-40C to 85C) LW ABA-012 RE I2C address = 00100xx MLX90393 E (-40C to 85C) LW ABA-013 RE I2C address = 00101xx MLX90393 E (-40C to 85C) LW ABA-014 RE I2C address = 00110xx Table 1: Product Ordering Codes Legend: Temperature Code: S: from -20C to 85C E: from -40C to 85C Package Code: "LW" for QFN-16 3x3x1mm package with wettable flanks Option Code: ABA-011: ABA-012: ABA-013: ABA-014: Different I2C addresses - 5 most significant bits. The 2 least significant bits of the address are defined by the external address pins A0 and A1. Packing Form: "RE for Reel" Ordering Example: "MLX90393-ELW-ABA-011-RE" MLX90393 Micropower magnetometer with I2C address 00011xx where the last two bits are defined by external address pins A0 and A1. In QFN package, temperature range -40C to 85C. Table 2: Product Ordering Code Example REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 4 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 5. Functional Diagram VDD VDD_IO A0 A1 State Machine SDA/MOSI RAM SCL/SCLK Triaxis(R) VX VY VZ VT MUX Bias Control SPI/I2C Interface ADC G EEPROM Temp Compensation Temp Sensor MISO MS/CS Interrupt Trigger Oscillator Low Power Oscillator Wake-Up VSS 6. Glossary of Terms Term Definition TC Temperature Coefficient (in ppm/Deg.C.) Gauss (G), Tesla (T) Units for the magnetic flux density - 1 mT = 10 G NC Not Connected PWM Pulse Width Modulation %DC Duty Cycle of the output signal i.e. TON /(TON + TOFF) ADC Analog-to-Digital Converter DAC Digital-to-Analog Converter LSb Least Significant Bit MSb Most Significant Bit DNL Differential Non-Linearity INL Integral Non-Linearity EMC Electro-Magnetic Compatibility REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 5 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 7. Pinout Pin # Name Type Supply System Wiring Recommendation Reference To I2C 4-wire SPI 3-wire SPI 1 INT I/O out N/A VDD_IO Optional Optional Optional 2 SENB/CS I/O in MLX Test VDD_IO To VDD_IO Required Required 3 SCL/SCLK I/O in MLX Test VDD_IO Required Required Required 4 N/C -- -- -- -- -- -- 5 SDA/MOSI I/O bi MLX Test VDD_IO Required Required 6 MISO I/O out MLX Test VDD_IO Floating Required Short together 7 INT/TRIG I/O bi N/A VDD_IO Optional Optional Optional 8 VDD_IO Supply N/A Required Required Required 9 N/C -- -- -- -- -- -- 10 N/C -- -- -- -- -- -- 11 A1 I2C Address LSB MLX Test VDD To VDD/GND To GND To GND 12 A0 I2C Address LSB MLX Test VDD To VDD/GND To GND To GND 13 VSS Ground N/A Required Required Required 14 N/C -- -- -- -- -- 15 VDD Supply N/A Required Required Required 16 N/C -- -- -- -- -- Primary Secondary -- -Table 3: Pinout Description It is recommended to connect the N/C pins (Not Connected) to Ground. REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 6 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 8. Absolute Maximum Ratings Parameter Symbol Min. VDD_MAX Analog Supply Voltage Limits VDD_IO_MAX Typ. Max. Unit -0.3 4 V Digital IO Supply Limits -0.3 min(4, VDD+0.3) V TSTORAGE Storage (idle) temperature range -50 125 C ESDHBM According to AEC-Q100-002 2.5 kV ESDCDM According to AEC-Q100-011-B (QFN) 750 V Table 4: Absolute Maximum Ratings Exceeding the absolute maximum ratings may cause permanent damage. conditions for extended periods may affect device reliability. REVISION 003 - SEPTEMBER 14, 2017 3901090393 Exposure to absolute maximum-rated Page 7 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 9. General Electrical Specifications Parameter Remark Min Nom Max Unit Analog Supply Voltage 2.2 3 3.6 V VDD_IO Digital IO Supply 1.65 1.8 VDD V VPOR_LH Power-on Reset threshold 1.42 1.55 V VDD (rising edge) VPOR_HL Power-on Reset threshold 1 1.31 V (falling edge) IDD,CONVXY Conversion Current XY-axis 2.29 3 mA IDD,CONVZ Conversion Current Z-axis 2.96 4 mA IDD,CONVT Conversion Current Temperature 1.60 2 mA IDD,STBY Standby Current(1) 43 60 A IDD,IDLE Idle Current(2) 2.4 5 A IDD,NOM Nominal Current (TXYZ, Datarate = 10Hz, OSR=OSR2=0, DIG_FILT=4) 1 100 A Table 5: General Electrical Specifications Standby current corresponds to the current consumed in the digital where only the low power oscillator is running. This standby current is present in burst mode, or whenever the IC is counting down to start a new conversion. 2 Idle current corresponds to the current drawn by the IC in idle mode where all operating functions are disabled except communications. 1 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 8 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 10. Thermal Specification The MLX90393 has an on-board temperature sensor which measures the temperature of the MLX90393 sensor. The temperature can be read out via the communication protocol in a digital format Parameter Symbol Min. Typ. TRES Temperature sensor resolution 45.2 LSB/C T25 Temperature sensor output at 25C 46244 LSB16u TLIN Temperature Linearity (3) +/-3 C TOPERATING Operating temperature range [S code] -20 Operating temperature range [E code] -40 25 Max. 85 Unit C Table 6: Thermal Specifications The linearity is defined as the best fit curve through the digital temperature outputs over the entire temperature range. It includes ADC non-linearity effects 3 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 9 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 11. Timing Specification The specifications are applicable at 25 Deg. C unless specified otherwise and for the complete supply range. Parameter Remark Min Nom Max Unit 500 600 s Main Oscillator & Derived Timings TSTBY Time from IDLE to STBY TACTIVE Time from STBY to ACTIVE TCONVM Single Magnetic axis conversion time(4) typical programming range 0.192 TCONVT Temperature conversion time typical programming range 0.192 TCONV_SMM Total conversion time in Single Measurement Mode(4) TCONV_BURSTWOC 400 8 s 66.56 [(2+2^ DIG_FILT )*2^ OSR *0.064] 1.54 [2^ *0.192] OSR2 Total conversion time in BURST or WOC Mode(4) ms ms TSTBY + TACTIVE + m*TCONVM + TCONVT ms TACTIVE + m*TCONVM + TCONVT ms TOSC_TRIM Trimming accuracy -5 +5 % TOSC_THD Thermal drift (full temperature range) -5 +5 % Low-power Oscillator & Derived Timings TINTERVAL Time in between 2 conversions (Burst mode or Wake-Up on Change)(5) 0 1260 BURST_DATA_RATE * 20 ms TLPOSC_TRIM Trimming accuracy -4 +4 % TLPOSC_THD Thermal drift (full temperature range) -5 +5 % 1.5 ms 250 us Startup TPOR Power-on-reset completion time 0.6 External Trigger TTRIG Trigger pulse width (active high) 0.01 Table 7: Timing Specifications This conversion time is defined as the time to acquire a single axis of the magnetic flux density. When measuring multiple axes they are obtained through time multiplexing. The conversion time is programmable through parameters OSR and DIG_FILT for magnetic values and OSR2 for the temperature value. The conversion sequence is TXYZ, opposite of the ZYXT argument of the command set. 5 The time TINTERVAL is defined as the time between the end of one set of measurements (any combination of TXYZ) and the start of the following same set of measurements in BURST and WOC mode. As a result of this, the maximum output data rate is not only a function of TINTERVAL but equals 1/(TCONV_BURSTWOC + TINTERVAL). 4 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 10 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 12. Magnetic Specification The specifications are applicable at 25 Deg. C unless otherwise specified and for the complete supply voltage range. Parameter Remark NADC ADC span NOUT Output span (taken from 19 by RESXYZ) Min Nom Max Unit 17.4 bits 16 bits Output range (function of RESXYZ) RANGE from Table 1Table 4 / SENSii mT BSAT Magnetic saturation onset 50 mT OFFS Deviation from expected 0mT output BRANGE OFFSTHD Offset thermal drift, Delta from 25C (6) SENSXX, SENSYY Programming range of magnetic resolution (T/LSB) or sensitivity (LSB/mT) (7) [modifying GAIN_SEL and RESXYZ], cfr. Table 3 SENSZZ 0 LSB < 1000 LSB 3.220 0.161 T/LSB 311 6211 LSB/mT 5.872 0.294 T/LSB 170 3406 LSB/mT The offset thermal drift is defined as the deviation at 0Gauss from the output with respect to the output at 25C when sweeping the temperature. The highest gradient (T/C) typically occurs at 85C. The spec value is based on characterization on limited sample size at GAIN_SEL=0x7 and RES_XYZ=0x00. 7 The total axis sensitivity is programmable to support different applications, but has no Automatic Gain control on-chip as do the other angular position sensors from Melexis. The highest gain corresponds to at least the minimum +/-4.8mT magnetic measurement range and the magnetic resolution defined by SENSii. 6 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 11 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet Parameter Remark Min Nom Max Unit SENSXY, SENSYX Cross-axis sensitivity (X/Y-axis sensitivity to Y/X magnetic fields) < 1 % SENSXZ, SENSYZ Cross-axis sensitivity (X/Y-axis sensitivity to Z magnetic field) < 1 % SENSZX, SENSZY Cross-axis sensitivity (Z-axis sensitivity to X and Y magnetic fields) < 1 % SENSTHD Sensitivity thermal drift -3 +3 % Delta from 25C(8) Table 8: Magnetic Specifications The sensitivity thermal drift is expressed as a band around the sensitivity at 25C. It is applicable on wafer level trimming, but can be influenced by packaging (overmolding). 8 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 12 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 12.1. Noise vs Conversion Time The MLX90393 provides configurable filters to adjust the tradeoff between current consumption, noise, and conversion time. See section 15.1.5 for details on selecting the conversion time by adjusting OSR and DIG_FILT. XY-axis Noise over Conversion Time (bundled per OSR setting) 60 Noise Stdev [mGauss] 50 40 OSR = 0 30 OSR = 1 OSR = 2 20 OSR = 3 10 0 1 10 100 Conversion Time [ms] Figure 2: XY axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7 Z-axis Noise over Conversion Time (bundled per OSR setting) 90 80 Noise Stdev [mGauss] 70 60 50 OSR = 0 OSR = 1 40 OSR = 2 30 OSR = 3 20 10 0 1 10 100 Conversion Time [ms] Figure 3: Z axis RMS noise versus conversion time, expressed in mGauss for GAIN_SEL = 0x7 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 13 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 13. Mode Selection The MLX90393 can operate in three modes. They are: Burst mode, Single Measurement mode, and WakeOn-Change mode. Burst mode The ASIC will have a programmable data rate at which it will operate. This data rate implies autowakeup and sequencing of the ASIC, flagging that data is ready on a dedicated pin (INT/DRDY). The maximum data rate corresponds to continuous burst mode, and is a function of the chosen measurement axes. For non-continuous burst modes, the time during which the ASIC has a counter running but is not doing an actual conversion is called the Standby mode (STBY). Single Measure mode The master will ask for data via the corresponding protocol (I2C or SPI), waking up the ASIC to make a single conversion, immediately followed by an automatic return to sleep mode (IDLE) until the next polling of the master. This polling can also be done by strobing the TRG pin instead, which has the same effect as sending a protocol command for a single measurement. Wake-Up on Change This mode is similar to the burst mode in the sense that the device will be auto-sequencing, with the difference that the measured component(s) is/are compared with a reference and in case the difference is bigger than a user-defined threshold, the DRDY signal is set on the designated pin. The user can select which axes and/or temperature fall under this cyclic check, and which thresholds are allowed. The user can change the operating mode at all time through a specific command on the bus. The device waits in IDLE mode after power-up, but with a proper user command any mode can be set after power-up. Changing to Burst or WOC mode, coming from Single Measure mode, is always accompanied by a measurement first. The top-level state diagram indicating the different modes and some relevant timing is shown below in Figure 4. In the Measure state, the MDATA flag will define which components will be measured (ZYXT). The order of conversion is defined as TXYZ and can not be modified by the user, only the combination of axes is a degree of freedom. Arrows indicated in grey are the direct result of an Exit command. The main difference between STANDBY and WOC_IDLE is that in STANDBY mode, all analog circuitry is ready to make a conversion, but this is accompanied by a larger current consumption than IDLE mode. For burst mode this extra current consumption is justified because the emphasis is more on accurate timing intervals, avoiding the delay of TSTBY before conversion and supporting an efficient continuous burst mode without standby overhead. It is the user's responsibility to read back the measured data as the MLX90393 is a slave device on the bus. Even in burst mode and WOC mode when the MLX90393 is auto-sequencing, the master will be responsible for collecting the acquired sensor data. REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 14 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet POR VDD > VPOR_LH STARTUP TPOR LOAD CALIB DATA ~TINTERVAL IDLE WOC_IDLE LP_OSC enabled EX LP_OSC disabled TSTBY EX STANDBY ~TINTERVAL && Burst mode LP_OSC enabled TACTIVE MEASURE MDATA ? LP_OSC & MAIN_OSC enabled WOC mode T? X? Y? Z? m*TCONVM + TCONVT Burst mode SM mode TIME Figure 4: Top-level state diagram with indication of timings 13.1. Burst mode When the sensor is operating in burst mode, it will make conversions at specific time intervals. The programmability of the user is the following: Burst speed (TINTERVAL) through parameter BURST_DATA_RATE Conversion time (TCONV) through parameters OSR, OSR2 and DIG_FILT Axes/Temperature (MDATA) through parameter BURST_SEL or via the command argument (ZYXT) Whenever the MLX90393 has made the selected conversions (based on MDATA), the DRDY signal will be set (active H) on the INT and/or INT/TRG pin to indicate that the data is ready for readback. It will remain high until the master has sent the command to read out at least one of the converted quantities (ZYXT). Should the master have failed to read out any of them by the time the sensor has made a new conversion, the INT/DRDY pin will be strobed low for 10us, and the next rising edge will indicate a new set of data is ready. REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 15 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 13.2. Single Measurement mode Whenever the sensor is set to this mode (or after startup) the MLX90393 goes to the IDLE state where it awaits a command from the master to perform a certain acquisition. The duration of the acquisition will be the concatenation of the TSTBY, TACTIVE, m*TCONVM (with m # of axes) and TCONVT. The conversion time will effectively be programmable by the user (see burst mode), but is equally a function of the required axes/temperature to be measured. Upon reception of such a polling command from the master, the sensor will make the necessary acquisitions, and set the DRDY signal high to flag that the measurement has been performed and the master can read out the data on the bus at his convenience. The INT/DRDY will be cleared either when: The master has issued a command to read out at least one of the measured components The master issues an Exit (EX) command to cancel the measurement The chip is reset, after POR (Power-on reset) or Reset command (RT) 13.3. Wake-Up on Change mode The Wake-Up on Change (WOC) functionality can be set by the master with as main purpose to only receive an interrupt when a certain threshold is crossed. The WOC mode will always compare a new burst value with a reference value to assess if the difference between both exceeds a user-defined threshold. The reference value is defined as one of the following: The first measurement of WOC mode is stored as reference value once, because of a measurement. This measurement at "t=0" is then the basis for comparison or, The reference for acquisition(t) is always acquisition(t-1), in such a way that the INT signal will only be set if the derivative of any component exceeds a threshold. The in-application programmability is the same as for burst mode, but now the thresholds for setting the interrupt are also programmable by the user, as well as the reference, if the latter is data(t=0) or data(t-1). 14. Digital Specification The supported protocols are I2C and SPI. The SENB/CS pin is used to define the protocol to be used: /CS = 0 for SPI, addressing the MLX90393 slave in SPI mode (3- and 4-wire), but releasing this line in between commands (no permanent addressing allowed) /CS = 1 for I2C, addressing the MLX90393 slave when the correct address is transmitted over the bus (permanently kept high) REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 16 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet To ensure the activity on the SPI bus cannot be accidentally interpreted as I2C protocol, programming bits are available in the memory of the MLX90393 to force the communication mode. It concerns the COMM_MODE[1:0] bits with the following effect: COMM_MODE[1] COMM_MODE[0] Description The mode in which the first valid command is transmitted to the MLX90393 defines the operating mode (SPI or I2C) for all its future commands, until a reset (hard or soft) is done. 0 X 1 0 SPI mode only 1 1 I2C mode only Table 9: Communication mode definition 14.1. Command List The MLX90393 only listens to a specific set of commands. Apart from the Reset command, all commands generate a status byte that can be read out. The table below indicates the 10 different commands that are (conditionally) accepted by the MLX90393. The MLX90393 will always acknowledge a command in I2C, even if the command is not a valid command. Interpreting the associated status byte is the method for verification of command acceptance. Command Set Command Name Symbol # CMD1 byte CMD2 byte CMD3 byte CMD4 byte Start Burst Mode SB 1 0001 zyxt N/A N/A N/A Start Wake-up on Change Mode SW 2 0010 zyxt N/A N/A N/A Start Single Measurement Mode SM 3 0011 zyxt N/A N/A N/A Read Measurement RM 4 0100 zyxt N/A N/A N/A Read Register RR 5 0101 0abc {A5...A0,0,0} N/A N/A Write Register WR 6 0110 0abc D15...D8 D7...D0 {A5...A0,0,0} Exit Mode EX 8 1000 0000 N/A N/A N/A Memory Recall HR D 1101 0000 N/A N/A N/A Memory Store HS E 1110 0000 N/A N/A N/A Reset RT F 1111 0000 N/A N/A N/A Table 10: Command List REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 17 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet The argument for the volatile memory access commands (RR/WR) abc should be set to 0x0h, in order to get normal read-out and write of the memory. The argument in all mode-starting commands (SB/SW/SM) is a nibble specifying the conversions to be performed by the sensor in the following order zyxt. For example, if only Y axis and temperature are to be measured in Single Measurement mode the correct command to be transmitted is 0x35h. The sequence of measurement execution on-chip is inverted to TXYZ, so T will be measured before X, followed by Y and finally Z. By issuing an all-zero zyxt nibble, the BURST_SEL value from RAM will be used instead of the empty argument of the command. REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 18 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 14.2. Status Byte The status byte is the first byte transmitted by the MLX90393 in response to a command issued by the master. It is composed of a fixed combination of informative bits: bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 BURST_MODE WOC_MODE SM_MODE ERROR SED RS D1 D0 Table 11: Status Byte Definition MODE bits These bits define in which mode the MLX90393 is currently set. Whenever a mode transition command is rejected, the first status byte after this command will have the expected mode bit cleared, which serves as an indication that the command has been rejected, next to the ERROR bit. The SM_MODE flag can be the result of an SM command or from raising the TRG pin when TRG mode is enabled in the volatile memory of the MLX90393. ERROR bit This bit is set in case a command has been rejected or in case an uncorrectable error is detected in the memory, a so called ECC_ERROR. A single error in the memory can be corrected (see SED bit), two errors can be detected and will generate the ECC_ERROR. In such a case all commands but the RT (Reset) command will be rejected. The error bit is equally set when the master is reading back data while the DRDY flag is low. SED bit The single error detection bit simply flags that a bit error in the non-volatile memory has been corrected. It is purely informative and has no impact on the operation of the MLX90393. RS bit Whenever the MLX90393 gets out of a reset situation - both hard and soft reset - the RS flag is set to highlight this situation to the master in the first status byte that is read out. As soon as the first status byte is read, the flag is cleared until the next reset occurs. D[1:0] bits These bits only have a meaning after the RR and RM commands, when data is expected as a response from the MLX90393. The number of response bytes correspond to 2*D[1:0] + 2, so the expected byte counts are either 2, 4, 6 or 8. For commands where no response is expected, the content of D[1:0] should be ignored. 14.3. SPI Communication The MLX90393 can handle SPI communication at a bitrate of 10Mhz. The SPI communication is implemented in a half-duplex way, showing high similarities with I2C communication, but addressing through the \CS (Chip Select) pin instead of through bus arbitration. The half-duplex nature is at the basis of the supported 3-wire SPI operation. SPI mode 3 is implemented: CPHA=1 (data changed on leading edge and captured on trailing edge, and CPOL=1 (high level is inactive state). The Chip Select line is active-low. REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 19 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet Symbol Parameter Value Min tc(SPC) fc(SPC) tsu(CS) th(CS) tsu(SI) th(SI) tv(SO th(SO) tdis(SO) SPI clock cycle SPI clock frequency CS setup time CS hold time SDI input setup time SDI input hold time SDO valid output time SDO output hold time SDO output disable time Unit Max 100 ns MHz 10 5 10 5 15 ns 50 5 50 The communication is also bundled in bytes, equally MSB first and MSByte first. A command can of course consist of more than 1 byte (refer to Chapter 8.1) as can the response be from the MLX90393 in the form of multiple bytes after the status byte (not shown in Figure 5) /CS SCL 1 MOSI 2 3 4 5 6 COMMAND[7:0] MISO Z (3 & 4-wire SPI) 7 8 1 2 3 4 5 6 7 8 X (4-wire SPI) or Z (3-wire SPI) STATUS_BYTE[7:0] ADD NADD Figure 5: SPI communication example REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 20 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 14.4. I2C Communication 14.4.1. I2C Address The I2C address is made up of some hard-coded bits and a memory written value as follows: I2C_ADDR[6:0] = {EE_I2C_ADDR[4:0],A1,A0} with Ai the user-selectable active-high value of the input pads of the MLX90393, referred to the VDD supply system and EE_I2C_ADDR[4:0] default programmed to 0x03h, but factory accessible for overwrite. Table 7 below indicated the available ordering codes for different EE_I2C_ADDR[4:0] factory calibrated values. This permits connection of up to 16 distinguishable sensors on the bus: 4 ordering codes x 4 possible hardwired A1A0 connections for each. Ordering Code EE_I2C_ADDR[4:0] 7-bit I2C addresses possible MLX90393xLW-ABA-011-RE 0x03h 0x0Ch, 0x0Dh, 0x0Eh, 0x0Fh MLX90393xLW-ABA-012-RE 0x04h 0x10h, 0x11h, 0x12h, 0x13h MLX90393xLW-ABA-013-RE 0x05h 0x14h, 0x15h, 0x16h, 0x17h MLX90393xLW-ABA-014-RE 0x06h 0x18h, 0x19h, 0x1Ah, 0x1Bh Table 12: I2C address ordering codes. 14.4.2. I2C Principle The MLX90393 supports I2C communication in both Standard Mode and Fast Mode. Bytes are transmitted MSB first, and in order to reconstruct words, the bytes need to be concatenated MSByte first. The general principle of communication is always the same: Initiating the communication is always done by the Master (Start condition S) Addressing the Slave (MLX90393) followed by a cleared bit to indicate the Master intends to write something to the specific addressed Slave Acknowledging by the Slave if the transmitted address corresponds to the Slave's I2C address. If the latter isn't the case, any further activity on the bus except a Sr (Start Repeat) and P (Stop) condition will be ignored by the MLX90393 Sending a Command Byte by the Master, as depicted in Figure 6. The Slave will always acknowledge this, even if it is an unrecognized command. A command such as WR and RR consist of more than 1 byte, which can then be transmitted sequentially over the I2C bus. Referring to Figure 6 the COMMAND byte should then be a sequence of COMMAND byte1, byte2, etc... Issuing a Start Repeat (Sr) condition by the Master in order to restart the addressing phase Addressing the Slave (MLX90393) followed by a set bit to indicate the Master intends to read something from the specific addressed Slave Acknowledging by the Slave if the transmitted address corresponds to the Slave's I2C address. If the latter isn't the case, any further activity on the bus except a Sr (Start Repeat) and P (Stop) condition will be ignored by the MLX90393 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 21 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet Transmitting the Status Byte by the Slave, who is in control of the bus. Following the RR and RM commands the sensor returns additional data bytes after the status byte. Acknowledging by the Master if the data is well received Generating a Stop condition (P) by the master The Master controlled bus activity is shown in blue, the Slave controlled bus activity is shown in orange. In case a command is longer than a single byte (see Table 6), the bytes are transmitted sequentially before generating the Start Repeat (Sr) condition. SCL 1 2 SDA 3 4 5 6 7 I2C_ADDR[6:0] 8 9 W ACK 8 9 R ACK 1 2 3 4 5 6 7 8 COMMAND[7:0] 9 ACK S SCL 1 SDA 2 3 4 5 I2C_ADDR[6:0] 6 7 1 2 3 4 5 6 STATUS_BYTE[7:0] 7 8 9 ACK P Sr Figure 6: Default I2C communication example with status byte readback The same applies to the Slave responses: following RR and RM commands, the Slave response is more than just the Status Byte. There as well, the data is partitioned in bytes that are transmitted sequentially by the slave. It is the Master's responsibility to issue enough clocking pulses to read back all the data. Finding out how many bytes is possible by decoding the Status Byte information, see Section Status Byte. Finally, the master is also free to not read back the status byte when issuing a command. In doing so, he loses the ability to see if the command was received properly by the MLX90393. Moreover, the first SM command issued by the master after power-up or reset should have the status byte read back to get valid measurement data back. REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 22 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet Symbol f(SCL) tw(SCLL) tw(SCLH) tsu(SDA) th(SDA) tr(SDA), tr(SCL) tf(SDA), tf(SCL) th(ST) tsu(SR) tsu(SP) tw(SP:SR) Parameter SCL clock frequency SCL clock low time SCL clock high time SDA setup time SDA data hold time SDA and SCL rise time SDA and SCL fall time START condition hold time Repeated START condition setup time STOP condition setup time Bus free time between STOP and START condition REVISION 003 - SEPTEMBER 14, 2017 3901090393 I2C standard mode I2C fast mode Min Max Min Max 0 4.7 4.0 250 0 100 0 1.3 0.6 100 0 20+0.1Cb 20+0.1Cb 0.6 400 4 3.45 1000 300 4.7 0.6 4 0.6 4.7 1.3 Unit kHz s 0.9 300 300 ns s ns s Page 23 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 15. Memory Map The MLX90393 has 1kbit of non-volatile memory, and the same amount of volatile memory. Each memory consists out of 64 addresses containing 16 bit words. The non-volatile memory has automatic 2-bit error detection and 1-bit error correction capabilities per address. The handling of such corrections & detections is explained in Section Status Byte. The memory is split in 2 areas: Customer area [address 0x00h to 0x1Fh] Melexis area [address 0x20h to 0x3Fh] The RR and WR commands impact the volatile memory only, there no direct access possible to the nonvolatile memory. The customer area of the volatile memory is bidirectionally accessible to the customer; the Melexis area is write-protected. Only modifications in the blue area are allowed with the WR command. The adjustments in the customer area can be stored in the permanent non-volatile memory with the STORE command HS, which copies the entire volatile memory including the Melexis area to the non-volatile one. With the HR command the non-volatile memory content can be recalled to the volatile memory, which can restore any modifications due to prior WR commands. The HR step is performed automatically at start-up of the ASIC, either through cold reset or warm reset with the RT command. The above is graphically shown in Figure 7. VOLATILE MEMORY NON-VOLATILE MEMORY CUSTOMER AREA CUSTOMER AREA STORE (HS) RECALL (HR) MELEXIS AREA RR MELEXIS AREA WR Figure 7: The memories of the MLX90393, their areas and the impacting commands. The customer area houses 3 types of data: Analog configuration bits Digital configuration bits REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 24 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet Informative (free) bits The latter can be filled with customer content freely, and covers the address span from (and including) 0x0Ah to 0x1Fh, a total of 352 bits. The memory mapping of volatile and non-volatile memory on address level is identical. The volatile memory map is given in Figure 8. BIT NUMBER ADDRESS 0x00h 0x01h 0x02h 0x03h 0x04h 0x05h 0x06h 0x07h 0x08h 0x09h 0x0Ah 0x0Bh 0x0Ch 0x0Dh 0x0Eh 0x0Fh 0x10h 0x11h 0x12h 0x13h 0x14h 0x15h 0x16h 0x17h 0x18h 0x19h 0x1Ah 0x1Bh 0x1Ch 0x1Dh 0x1Eh 0x1Fh 15 TRIG_INT_ 11 13 12 ANA_RESERVED_LOW COMM_MODE WOC_DIFF EXT_TRIG OSR2 SENS_TC_HT 14 10 TCMP_EN 9 8 7 BIST Z_SERIES BURST_SEL (zyxt) RES_XYZ 6 5 GAIN_SEL 4 3 2 1 HALLCONF BURST_DATA_RATE DIG_FILT SENS_TC_LT 0 OSR OFFSET_X OFFSET_Y OFFSET_Z WOXY_THRESHOLD WOZ_THRESHOLD WOT_THRESHOLD FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE FREE Figure 8: Customer area memory map. The non-volatile memory can only be written (HS store command) if pin VDD is supplied with 3.3V minimum, otherwise the write sequence cannot be performed in a reliable way. Additionally, this HS command was designed to be used as one-time calibration, but not as multi write-cycle memory within the application. In case memory is written within the application, the number of write cycles should be kept to a minimum. There is no limit to the write cycles in the volatile memory (WR write command). 15.1. Parameter Description The meaning of each customer accessible parameter is explained in this section. The customer area of both the volatile and the non-volatile memory can be written through standard SPI and I2C communication, within the application. No external high-voltages are needed to perform such operations, nor access to dedicated pins that need to be grounded in the application. Parameter Description ANA_RESERVED_LOW Reserved IO trimming bits BIST Enabled the on-chip coil, applying a Z-field [Built-In Self Test] Z_SERIES Enable all plates for Z-measurement GAIN_SEL[2:0] Analog chain gain setting, factor 5 between min and max code HALLCONF[3:0] Hall plate spinning rate adjustment REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 25 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet Parameter Description TRIG_INT_SEL Puts TRIG_INT pin in TRIG mode when cleared, INT mode otherwise COMM_MODE[1:0] Allow only SPI [10b], only I2C [11b] or both [0Xb] according to CS pin WOC_DIFF Sets the Wake-up On Change based on {sample(t),sample(t-1)} EXT_TRIG Allows external trigger inputs when set, if TRIG_INT_SEL = 0 TCMP_EN Enables on-chip sensitivity drift compensation BURST_SEL[3:0] Defines the MDATA in burst mode if SB command argument = 0 BURST_DATARATE[6:0] Defines TINTERVAL as BURST_DATA_RATE * 20ms OSR2[1:0] Temperature sensor ADC oversampling ratio RES_XYZ[5:0] Selects the desired 16-bit output value from the 19-bit ADC DIG_FILT[1:0] Digital filter applicable to ADC OSR[1:0] Magnetic sensor ADC oversampling ratio SENS_TC_HT[7:0] Sensitivity drift compensation factor for T < TREF SENS_TC_LT[7:0] Sensitivity drift compensation factor for T > TREF OFFSET_i[15:0] Constant offset correction, independent for i = X, Y, Z WOi_THRESHOLD[15:0] Wake-up On Change threshold, independent for i = X, Y, Z and T Table 13: NVRAM parameter description 15.1.1. ANA_RESERVED_LOW Reserved bits for analog trimming at Melexis factory. Do not modify. 15.1.2. BIST Enables (1) or disables (0) the built in self-test coil. In normal operation set to 0. 15.1.3. Z_Series Enables series connection of hall plates for Z axis measurement. In normal operation set to 0. REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 26 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 15.1.4. GAIN_SEL[2:0] Sets the analog gain to the desired value. The sensitivity is dependent on the axis (X and Y have higher sensitivity) as well as the setting of the RES_XYZ[5:0] parameter. The relationship is given in the below table. Table for HALLCONF = 0xC, sensitivity in uT/LSB: GAIN_SEL 0 1 2 3 4 5 6 7 RES = 0 SENSXY SENSZ 0.751 1.210 0.601 0.968 0.451 0.726 0.376 0.605 0.300 0.484 0.250 0.403 0.200 0.323 0.150 0.242 RES = 1 SENSXY SENSZ 1.502 2.420 1.202 1.936 0.901 1.452 0.751 1.210 0.601 0.968 0.501 0.807 0.401 0.645 0.300 0.484 RES = 2 SENSXY SENSZ 3.004 4.840 2.403 3.872 1.803 2.904 1.502 2.420 1.202 1.936 1.001 1.613 0.801 1.291 0.601 0.968 RES = 3 SENSXY SENSZ 6.009 9.680 4.840 7.744 3.605 5.808 3.004 4.840 2.403 3.872 2.003 3.227 1.602 2.581 1.202 1.936 Table 14: Sensitivity table for given gain and resolution selection for HALLCONF=0xC Table for HALLCONF = 0x0, sensitivity in uT/LSB: GAIN_SEL 0 1 2 3 4 5 6 7 RES = 0 SENSXY SENSZ 0.981 1.581 0.785 1.265 0.589 0.949 0.491 0.791 0.393 0.632 0.327 0.527 0.262 0.422 0.196 0.316 RES = 1 SENSXY SENSZ 1.963 3.162 1.570 2.530 1.178 1.897 0.981 1.581 0.785 1.265 0.654 1.054 0.523 0.843 0.393 0.632 RES = 2 SENSXY SENSZ 3.926 6.324 3.141 5.059 2.355 3.794 1.961 3.162 1.570 2.530 1.309 2.108 1.047 1.686 0.785 1.265 RES = 3 SENSXY SENSZ 7.851 12.648 6.281 10.119 4.711 7.589 3.926 6.324 3.141 5.059 2.617 4.216 2.094 3.373 1.570 2.530 Table 15: : Sensitivity table for given gain and resolution selection for HALLCONF=0x0 REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 27 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 15.1.5. HALLCONF[3:0] Modifies the hall plate spinning (2-phase vs 4-phase) which has an effect on the minimum sampling rate achievable. Some configurations of OSR and DIG_FILT are not permitted. The cells shown in red are not permitted with HALL_CONF=0xC (default) but are allowed when HALL_CONF=0x0. DIG_FILT OSR Typical TCONV(TXYZ) for OSR2=0x0 [ms] 0 1 2 3 0 1.27 1.84 3.00 5.30 1 1.46 2.23 3.76 6.84 2 1.84 3.00 5.30 9.91 3 2.61 4.53 8.37 16.05 4 4.15 7.60 14.52 28.34 5 7.22 13.75 26.80 52.92 6 13.36 26.04 51.38 102.07 7 25.65 50.61 100.53 200.37 Table 16: TCONV as a function of OSR & DIG_FILT DIG_FILT Maximum ODR for OSR2=0x0 [Hz] 0 1 2 3 4 5 6 7 0 716.9 622.7 493.0 348.0 219.2 125.9 68.0 35.4 1 493.0 408.0 303.4 200.6 119.6 66.1 34.9 18.0 OSR 2 303.4 241.5 171.5 108.6 62.6 33.9 17.7 9.0 3 171.5 133.0 91.8 56.6 32.1 17.2 8.9 4.5 Table 17: Maximum Output Data Rate (ODR) as a function of OSR & DIG_FILT 15.1.6. TRIG_INT_SEL When set to 0 the TRIG_INT pin is in trigger mode. When set to 1 the TRIG_INT pin acts as an interrupt pin. 15.1.7. COMM_MODE[1:0] When set to 0x2 only SPI communication is allowed. When set to 0x3 only I2C communication is allowed. When set to 0x0 or 0x1 both communication modes can be used but the selection is made by the CS pin. 15.1.8. WOC_DIFF When wake-on-change mode is enabled this parameter defines the difference needed between the current measurement and the previous measurement ({sample(t),sample(t-1)}) that will cause the interrupt pin to toggle. REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 28 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 15.1.9. EXT_TRIG Allows for external trigger events when set to 1 and TRIG_INT_SEL = 0. When enabled an acquisition will start with the external trigger pin detects a high value. Acquisitions will continue to be triggered until the EST_TRIG pin is brought low. 15.1.10. TCMP_EN Enables (1) or disables (0) the on-chip sensitivity drift compensation. Enabling the temperature compensation will influence the way the magnetic values are encoded and transmitted to the system microcontroller as shown in the table below. RESi ABA TCMP_EN = 0x0 RANGE 0 215 1 215 2 22000 3 11000 TYPE 2's complement 0T = 0LSB 2's complement 0T = 0LSB unsigned 0T = 215LSB unsigned 0T = 214LSB TCMP_EN = 0x1 RANGE 215 215 TYPE unsigned 0T = 215LSB unsigned 0T = 215LSB N/A Table 18: Output Range and Type as a function of TCMP_EN and RES_XYZ={RESX,RESY,RESZ} 15.1.11. BURST_SEL[3:0] Defines the axes that will be converted in burst mode if the SB command argument is 0. 15.1.12. OSR2[1:0] Selects the temperature sensor ADC oversampling ratio 15.1.13. RES_XYZ[5:0] See 15.4.1 GAIN_SEL for the relationship between the gain and resolution. Additionally, section 15.1.10 TCMP_EN for the relationship between RES_XYZ and the output data format. 15.1.14. DIG_FILT[1:0] See 15.1.5 for the selection of DIG_FILT and the impact on conversion time 15.1.15. OSR[1:0] Oversampling ratio for the magnetic measurements 15.1.16. SENS_TC_HT[7:0] Sensitivity drift compensation factor for T > TREF REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 29 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 15.1.17. SENS_TC_LT[7:0] Sensitivity drift compensation factor for T < TREF 15.1.18. OFFSET_i[15:0] Constant offset correction, independent of temperature, and programmable for each individual axis where i=X, Y, or Z. 15.1.19. WOi_THRESHOLS[15:0] Wake-on-change threshold. Independently programmable for each magnetic axis (i=X, Y, Z) and temperature (i=T) REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 30 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 16. Recommended Application Diagram A1 A0 1.1 I2C A1 A0 I2C Address ------------------------------------Vss Vss 0001100R/W Vss Vdd 0001101R/W Vdd Vss 0001110R/W Vdd Vdd 0001111R/W R1=R2=10K C1=C2=0.1uF VDDIO (1.71V - VDD) VDDIO R1 C2 SDA/MOSI I2C R2 SCL/SCLK MLX90393 SENB/CS MCU VDD (2.2V - 3.6V) VDD C1 VSS INT/TRG Trigger INT Interrupt/DRDY 1.2 SPI A1 A0 Short on PCB for 3-wire SPI VDDIO (1.71V - VDD) C1=C2=0.1uF VDDIO C2 MISO SDA/MOSI SPI SCL/SCLK SENB/CS MLX90393 VDD (2.2V - 3.6V) MCU VDD C1 VSS INT/TRG INT REVISION 003 - SEPTEMBER 14, 2017 3901090393 Trigger Interrupt/DRDY Page 31 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 17. Packaging Specification 17.1. QFN package The MLX90393 shall be delivered in a QFN package as shown below in Figure 9. X Z Y Figure 9: Package Outline Drawing The sensing elements - Hall plates with the patented IMC technology - are located in the center of the die, which on its turn is located in the center of the package. The pinout (in name and function) is given in section 7. 18. Standard Information Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to standards in place in Semiconductor industry. For further details about test method references and for compliance verification of selected soldering method for product integration, Melexis recommends reviewing on our web site the General Guidelines soldering recommendation. For all soldering technologies deviating from the one mentioned in above document (regarding peak REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 32 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet temperature, temperature gradient, temperature profile, etc.), additional classification and qualification tests have to be agreed upon with Melexis. For package technology embedding trim and form post-delivery capability, Melexis recommends to consult the dedicated trim & form recommendation application note: lead trimming and forming recommendations Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment 19. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 20. Revision History Date Revision 11-Nov-2014 001 First Document Release 16-Feb-2015 002 Changed Ordering Code to indicate QFN wettable flanks Update Document number Added description of yellow cells in Table 1 and Table 2. Added additional ordering codes for up to 16 sensors on the same bus and their description in Table 7 Added E temperature code for -40C capable products and the associated update of the operating range in Chapter 3 Updated template to new Melexis format 13-Jul-2017 003 Remark 21. Contact For the latest version of this document, go to our website at www.melexis.com. For additional information, please contact our Direct Sales team and get help for your specific needs: Europe, Africa Telephone: +32 13 67 04 95 Email : sales_europe@melexis.com Americas Telephone: +1 603 223 2362 Email : sales_usa@melexis.com Asia Email : sales_asia@melexis.com REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 33 of 34 MLX90393 Triaxis(R) Magnetic Node Datasheet 22. Disclaimer The information furnished by Melexis herein ("Information") is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the furnishing, performance or use of the technical data or use of the product(s) as described herein ("Product") (ii) any and all liability, including without limitation, special, consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, noninfringement and merchantability. No obligation or liability shall arise or flow out of Melexis' rendering of technical or other services. The Information is provided "as is" and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current. Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a particular purpose. The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights. This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities. The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support or lifesustaining equipment are specifically not recommended by Melexis. The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage, recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons: 2) civil firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any similar violent situation. The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-andconditions. This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document. Melexis NV (c) - No part of this document may be reproduced without the prior written consent of Melexis. (2016) ISO/TS 16949 and ISO14001 Certified REVISION 003 - SEPTEMBER 14, 2017 3901090393 Page 34 of 34