DS90LV032A
DS90LV032A 3V LVDS Quad CMOS Differential Line Receiver
Literature Number: SNLS011B
DS90LV032A
October 27, 2010
3V LVDS Quad CMOS Differential Line Receiver
General Description
The DS90LV032A is a quad CMOS differential line receiver
designed for applications requiring ultra low power dissipation
and high data rates. The device is designed to support data
rates in excess of 400 Mbps (200 MHz) utilizing Low Voltage
Differential Signaling (LVDS) technology.
The DS90LV032A accepts low voltage (350 mV typical) dif-
ferential input signals and translates them to 3V CMOS output
levels. The receiver supports a TRI-STATE® function that
may be used to multiplex outputs. The receiver also supports
open, shorted and terminated (100Ω) input Fail-safe. The re-
ceiver output will be HIGH for all fail-safe conditions.
The DS90LV032A and companion LVDS line driver (eg.
DS90LV031A) provide a new alternative to high power PECL/
ECL devices for high speed point-to-point interface applica-
tions.
Features
>400 Mbps (200 MHz) switching rates
0.1 ns channel-to-channel skew (typical)
0.1 ns differential skew (typical)
3.3 ns maximum propagation delay
3.3V power supply design
Power down high impedance on LVDS inputs
Low Power design (40mW @ 3.3V static)
Interoperable with existing 5V LVDS networks
Accepts small swing (350 mV typical) VID
Supports open, short and terminated input fail-safe
Compatible with ANSI/TIA/EIA-644
Industrial temp. operating range (-40°C to +85°C)
Available in SOIC and TSSOP Packaging
Connection Diagram
Dual-in-Line
10006701
Order Number DS90LV032ATM
or DS90LV032ATMTC
See NS Package Number M16A or MTC16
Functional Diagram
10006702
Truth Table
ENABLES INPUTS OUTPUT
EN EN* RIN+ − RIN− ROUT
L H X Z
All other combinations VID 0.1V H
of ENABLE inputs VID −0.1V L
Full Fail-safe
OPEN/SHORT H
or Terminated
TRI-STATE® is a registered trademark of National Semiconductor Corporation.
© 2010 National Semiconductor Corporation 100067 www.national.com
DS90LV032A 3V LVDS Quad CMOS Differential Line Receiver
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC)−0.3V to +4V
Input Voltage (RIN+, RIN−)−0.3V to +3.9V
Enable Input Voltage (EN, EN*) −0.3V to (VCC + 0.3V)
Output Voltage (ROUT) −0.3V to (VCC + 0.3V)
Maximum Package Power Dissipation @ +25°C
M Package 1025 mW
MTC Package 866 mW
Derate M Package 8.2 mW/°C above +25°C
Derate MTC Package 6.9 mW/°C above +25°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range
(Soldering 4 sec.) +260°C
Maximum Junction Temperature +150°C
ESD Rating (Note 10)
(HBM 1.5 kΩ, 100 pF) 4.5 kV
(EIAJ 0 Ω, 200 pF) 250 V
Recommended Operating
Conditions
Min Typ Max Units
Supply Voltage (VCC) +3.0 +3.3 +3.6 V
Receiver Input Voltage GND +3.0 V
Operating Free Air
Temperature (TA) −40 25 +85 °C
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Note 2)
Symbol Parameter Conditions Pin Min Typ Max Units
VTH Differential Input High Threshold VCM = +1.2V
(Note 13)
RIN+,
RIN−
+20 +100 mV
VTL Differential Input Low Threshold −100 −20 mV
VCMR Common-Mode Voltage Range VID = 200 mV peak to peak (Note 5) 0.1 2.3 V
IIN Input Current VIN = +2.8V VCC = 3.6V or 0V −10 ±1 +10 μA
VIN = 0V −10 ±1 +10 μA
VIN = +3.6V VCC = 0V -20 +20 μA
VOH Output High Voltage IOH = −0.4 mA, VID = +200 mV ROUT 2.7 3.0 V
IOH = −0.4 mA, Input terminated 2.7 3.0 V
IOH = −0.4 mA, Input shorted 2.7 3.0 V
VOL Output Low Voltage IOL = 2 mA, VID = −200 mV 0.1 0.25 V
IOS Output Short Circuit Current Enabled, VOUT = 0V (Note 11) −15 −48 −120 mA
IOZ Output TRI-STATE Current Disabled, VOUT = 0V or VCC −10 ±1 +10 μA
VIH Input High Voltage EN,
EN*
2.0 VCC V
VIL Input Low Voltage GND 0.8 V
IIInput Current VIN = 0V or VCC, Other Input = VCC or GND −10 ±1 +10 μA
VCL Input Clamp Voltage ICL = −18 mA −1.5 −0.8 V
ICC No Load Supply Current EN, EN* = VCC or GND, Inputs Open VCC 10 15 mA
Receivers Enabled EN, EN* = 2.4V or 0.5V, Inputs Open 10 15 mA
ICCZ No Load Supply Current
Receivers Disabled
EN = GND, EN* = VCC, Inputs Open 3 5 mA
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DS90LV032A
Switching Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (Note 3, Note 4, Note 7, Note 8)
Symbol Parameter Conditions Min Typ Max Units
tPHLD Differential Propagation Delay High to Low CL = 10 pF 1.8 3.3 ns
tPLHD Differential Propagation Delay Low to High VID = 200 mV 1.8 3.3 ns
tSKD1 Differential Pulse Skew |tPHLD − tPLHD| (Note 6)(Figure 1 and Figure 2)0 0.1 0.35 ns
tSKD2 Differential Channel-to-Channel Skew-same device (Note 7) 0 0.1 0.5 ns
tSKD3 Differential Part to Part Skew (Note 8) 1.0 ns
tSKD4 Differential Part to Part Skew (Note 9) 1.5 ns
tTLH Rise Time 0.35 1.2 ns
tTHL Fall Time 0.35 1.2 ns
tPHZ Disable Time High to Z RL = 2 k 8 12 ns
tPLZ Disable Time Low to Z CL = 10 pF 6 12 ns
tPZH Enable Time Z to High (Figure 3 and Figure 4) 11 17 ns
tPZL Enable Time Z to Low 11 17 ns
fMAX Maximum Operating Frequency (Note 14) All Channels Switching 200 250 MHz
Note 1: Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise
specified.
Note 3: All typicals are given for: VCC = +3.3V, TA = +25°C.
Note 4: Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr and tf (0% to 100%) 3 ns for RIN.
Note 5: The VCMR range is reduced for larger VID. Example: if VID = 400mV, the VCMR is 0.2V to 2.2V. The fail-safe condition with inputs shorted is valid over
a common-mode range of 0V to 2.3V. A VID up to VCC − 0V may be applied to the RIN+/ RIN− inputs with the Common-Mode voltage set to VCC/2. Propagation
delay and Differential Pulse skew decrease when VID is increased from 200mV to 400mV. Skew specifications apply for 200mV VID 800mV over the common-
mode range .
Note 6: tSKD1 is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel
Note 7: tSKD2, Channel-to-Channel Skew, is defined as the difference between the propagation delay of one channel and that of the others on the same chip with
any event on the inputs.
Note 8: tSKD3, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same
VCC, and within 5°C of each other within the operating temperature range.
Note 9: tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over recommended
operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay.
Note 10: ESD Rating:
HBM (1.5 kΩ, 100 pF) 4.5kV
EIAJ (0Ω, 200 pF) 250V
Note 11: Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not
exceed maximum junction temperature specification.
Note 12: CL includes probe and jig capacitance.
Note 13: VCC is always higher than RIN+ and RIN− voltage. RIN− and RIN+ are allowed to have a voltage range −0.2V to VCC − VID/2. However, to be compliant
with AC specifications, the common voltage range is 0.1V to 2.3V
Note 14: fMAX generator input conditions: tr = tf < 1ns (0% to 100%), 50% duty cycle, differential (1.05V to 1.35V peak to peak). Output Criteria: 60%/40% duty
cycle, VOL (max 0.4V), VOH (min 2.7V), Load = 10 pF (stray plus probes)
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DS90LV032A
Parameter Measurement Information
10006703
FIGURE 1. Receiver Propagation Delay and Transition Time Test Circuit
10006704
FIGURE 2. Receiver Propagation Delay and Transition Time Waveforms
10006705
CL includes load and test jig capacitance.
S1 = VCC for tPZL, and tPLZ measurements.
S1 = GND for tPZH and tPHZ measurements.
FIGURE 3. Receiver TRI-STATE Delay Test Circuit
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DS90LV032A
10006706
FIGURE 4. Receiver TRI-STATE Delay Waveforms
Typical Application
Balanced System
10006707
FIGURE 5. Point-to-Point Application
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DS90LV032A
Applications Information
General application guidelines and hints for LVDS drivers and
receivers may be found in the following application notes:
www.national.com/lvds.
LVDS drivers and receivers are intended to be primarily used
in an uncomplicated point-to-point configuration as is shown
in Figure 5. This configuration provides a clean signaling en-
vironment for the fast edge rates of the drivers . The receiver
is connected to the driver through a balanced media which
may be a standard twisted pair cable, a parallel pair cable, or
simply PCB traces. Typically the characteristic impedance of
the media is in the range of 100Ω. A termination resistor of
100Ω should be selected to match the media, and is located
as close to the receiver input pins as possible. The termination
resistor converts the driver output (current mode) into a volt-
age that is detected by the receiver. Other configurations are
possible such as a multi-receiver configuration, but the effects
of a mid-stream connector(s), cable stub(s), and other
impedance discontinuities as well as ground shifting, noise
margin limits, and total termination loading must be taken into
account.
The DS90LV032A differential line receiver is capable of de-
tecting signals as low as 100 mV, over a ±1V common-mode
range centered around +1.2V. This is related to the driver off-
set voltage which is typically +1.2V. The driven signal is
centered around this voltage and may shift ±1V around this
center point. The ±1V shifting may be the result of a ground
potential difference between the driver's ground reference
and the receiver's ground reference, the common-mode ef-
fects of coupled noise, or a combination of the two. Both
receiver input pins have a recommended operating input volt-
age range of 0V to +2.4V (measured from each pin to ground),
exceeding these limits may turn on the ESD protection cir-
cuitry which will clamp the bus voltages.
Power Decoupling Recommendations:
Bypass capacitors must be used on power pins. High fre-
quency ceramic (surface mount is recommended) 0.1µF in
parallel with 0.01µF, in parallel with 0.001µF at the power
supply pin as well as scattered capacitors over the printed
circuit board. Multiple vias should be used to connect the de-
coupling capacitors to the power planes A 10µF (35V) or
greater solid tantalum capacitor should be connected at the
power entry point on the printed circuit board.
PC Board considerations:
Use at least 4 PCB layers (top to bottom); LVDS signals,
ground, power, TTL signals.
Isolate TTL signals from LVDS signals, otherwise the TTL
may couple onto the LVDS lines. It is best to put TTL and
LVDS signals on different layers which are isolated by a pow-
er/ground plane(s).
Keep drivers and receivers as close to the (LVDS port side)
connectors as possible.
Differential Traces:
Use controlled impedance traces which match the differential
impedance of your transmission medium (ie. cable) and ter-
mination resistor. Run the differential pair trace lines as close
together as possible as soon as they leave the IC (stubs
should be < 10mm long). This will help eliminate reflections
and ensure noise is coupled as common-mode. Lab experi-
ments show that differential signals which are 1mm apart
radiate far less noise than traces 3mm apart since magnetic
field cancellation is much better with the closer traces. Plus,
noise induced on the differential lines is much more likely to
appear as common-mode which is rejected by the receiver.
Match electrical lengths between traces to reduce skew.
Skew between the signals of a pair means a phase difference
between signals which destroys the magnetic field cancella-
tion benefits of differential signals and EMI will result. (Note
the velocity of propagation, v = c/Er where c (the speed of
light) = 0.2997mm/ps or 0.0118 in/ps). Do not rely solely on
the autoroute function for differential traces. Carefully review
dimensions to match differential impedance and provide iso-
lation for the differential lines. Minimize the number of vias
and other discontinuities on the line.
Avoid 90° turns (these cause impedance discontinuities). Use
arcs or 45° bevels.
Within a pair of traces, the distance between the two traces
should be minimized to maintain common-mode rejection of
the receivers. On the printed circuit board, this distance
should remain constant to avoid discontinuities in differential
impedance. Minor violations at connection points are allow-
able.
Termination:
Use a resistor which best matches the differential impedance
of your transmission line. The resistor should be between
90 and 130. Remember that the current mode outputs
need the termination resistor to generate the differential volt-
age. LVDS will not work without resistor termination. Typical-
ly, connect a single resistor across the pair at the receiver end.
Surface mount 1% to 2% resistors are best. PCB stubs, com-
ponent lead, and the distance from the termination to the
receiver inputs should be minimized. The distance between
the termination resistor and the receiver should be <10mm
(12mm MAX)
Probing LVDS Transmission Lines:
Always use high impedance (> 100k), low capacitance
(< 2 pF) scope probes with a wide bandwidth (1 GHz) scope.
Improper probing will give deceiving results.
Cables and Connectors, General Comments:
When choosing cable and connectors for LVDS it is important
to remember:
Use controlled impedance media. The cables and connectors
you use should have a matched differential impedance of
about 100. They should not introduce major impedance dis-
continuities.
Balanced cables (e.g. twisted pair) are usually better than
unbalanced cables (ribbon cable, simple coax.) for noise re-
duction and signal quality. Balanced cables tend to generate
less EMI due to field canceling effects and also tend to pick
up electromagnetic radiation as common-mode (not differen-
tial mode) noise which is rejected by the receiver. For cable
distances < 0.5M, most cables can be made to work effec-
tively. For distances 0.5M d 10M, CAT 3 (category 3)
twisted pair cable works well, is readily available and relatively
inexpensive.
Fail-Safe Feature:
The LVDS receiver is a high gain, high speed device that am-
plifies a small differential signal (20mV) to CMOS logic levels.
Due to the high gain and tight threshold of the receiver, care
should be taken to prevent noise from appearing as a valid
signal.
The receiver's internal fail-safe circuitry is designed to source/
sink a small amount of current, providing fail-safe protection
(a stable known state of HIGH output voltage) for floating,
terminated or shorted receiver inputs.
1. Open Input Pins. The DS90LV032A is a quad receiver
device, and if an application requires only 1, 2 or 3
receivers, the unused channel(s) inputs should be left
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DS90LV032A
OPEN. Do not tie unused receiver inputs to ground or any
other voltages. The input is biased by internal high value
pull up and pull down resistors to set the output to a HIGH
state. This internal circuitry will guarantee a HIGH, stable
output state for open inputs.
2. Terminated Input. If the driver is disconnected (cable
unplugged), or if the driver is in a TRI-STATE or power-
off condition, the receiver output will again be in a HIGH
state, even with the end of cable 100Ω termination
resistor across the input pins. The unplugged cable can
become a floating antenna which can pick up noise. If the
cable picks up more than 10mV of differential noise, the
receiver may see the noise as a valid signal and switch.
To insure that any noise is seen as common-mode and
not differential, a balanced interconnect should be used.
Twisted pair cable will offer better balance than flat ribbon
cable.
3. Shorted Inputs. If a fault condition occurs that shorts
the receiver inputs together, thus resulting in a 0V
differential input voltage, the receiver output will remain
in a HIGH state. Shorted input fail-safe is not supported
across the common-mode range of the device (GND to
2.4V). It is only supported with inputs shorted and no
external common-mode voltage applied.
External lower value pull up and pull down resistors (for a
stronger bias) may be used to boost fail-safe in the presence
of higher noise levels. The pull up and pull down resistors
should be in the 5k to 15k range to minimize loading and
waveform distortion to the driver. The common-mode bias
point should be set to approximately 1.2V (less than 1.75V)
to be compatible with the internal circuitry.
The footprint of the DS90LV032A is the same as the industry
standard 26LS32 Quad Differential (RS-422) Receiver.
Pin Descriptions
Pin No. Name Description
2, 6, RIN+ Non-inverting receiver input pin
10, 14
1, 7, RIN− Inverting receiver input pin
9, 15
3, 5, ROUT Receiver output pin
11, 13
4 EN Active high enable pin, OR-ed with EN*
12 EN* Active low enable pin, OR-ed with EN
16 VCC Power supply pin, +3.3V ± 0.3V
8 GND Ground pin
Ordering Information
Operating Package Type/ Order Number
Temperature Number
−40°C to +85°C SOP/M16A DS90LV032ATM
−40°C to +85°C TSSOP/MTC16 DS90LV032ATMTC
10006708
FIGURE 6. ICC vs Frequency, four channels switching
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DS90LV032A
10006709
FIGURE 7. Typical Common-Mode Range variation with respect to amplitude of differential input
10006710
FIGURE 8. Typical Pulse Skew variation versus common-mode voltage
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DS90LV032A
10006711
FIGURE 9. Variation in High to Low Propagation Delay versus VCM
10006712
FIGURE 10. Variation in Low to High Propagation Delay versus VCM
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DS90LV032A
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead (0.150″ Wide) Molded Small Outline Package, JEDEC
Order Number DS90LV032ATM
NS Package Number M16A
16-Lead (0.100″ Wide) Molded Thin Shrink Small Outline Package, JEDEC
Order Number DS90LV032ATMTC
NS Package Number MTC16
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DS90LV032A
Notes
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DS90LV032A
Notes
DS90LV032A 3V LVDS Quad CMOS Differential Line Receiver
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