34 .80 7IRELESS IMPORTANT NOTICE Dear customer, As from August 2nd 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless. As a result, the following changes are applicable to the attached document. Company name - Philips Semiconductors is replaced with ST-NXP Wireless. Copyright - the copyright notice at the bottom of each page "(c) Koninklijke Philips Electronics N.V. 200x. All rights reserved", shall now read: "(c) ST-NXP Wireless 200x All rights reserved". Web site - http://www.semiconductors.philips.com is replaced with http://www.stnwireless.com Contact information - the list of sales offices previously obtained by sending an email to sales.addresses@www.semiconductors.philips.com, is now found at http://www.stnwireless.com under Contacts. If you have any questions related to the document, please contact our nearest sales office. Thank you for your cooperation and understanding. ST-NXP Wireless 34 .80 7IRELESS www.stnwireless.com INTEGRATED CIRCUITS DATA SHEET TDA7040T Low voltage PLL stereo decoder Product specification File under Integrated Circuits, IC01 September 1986 Philips Semiconductors Product specification Low voltage PLL stereo decoder TDA7040T GENERAL DESCRIPTION The TDA7040T is a monolithic integrated circuit for low cost FM stereo radios with an absolute minimum of peripheral components and a simple lay-out. Features * Built-in four pole low pass filter with a 70 kHz corner frequency suppressing unwanted out-of-band input signals * Fully integrated 228 kHz oscillator * Pilot presence detector and soft mono/stereo blend * Built-in interference suppression * External stereo lamp driver applicable * Adjustable gain. QUICK REFERENCE DATA PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage (pin 4) VP 1,8 - 6 V Supply current VP = 3 V IP - 3 - mA Total harmonic distortion THD - 0,3 - % Signal to noise ratio S/(S + N) - 70 - dB Channel separation - 40 - dB PACKAGE OUTLINE 8-lead mini-pack; plastic (S08; SOT96A); SOT96-1; 1996 July 24. September 1986 2 Philips Semiconductors Product specification Low voltage PLL stereo decoder TDA7040T Fig.1 Block diagram. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage range VP - - 7 V Operating ambient temperature Tamb -10 - + 70 C Storage temperature range Tstg -55 - + 150 C September 1986 3 Philips Semiconductors Product specification Low voltage PLL stereo decoder TDA7040T CHARACTERISTICS VP = 3 V; Tamb = 25 C; test circuit Fig.2; unless otherwise specified PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage (pin 4) VP 1,8 3,0 6,0 V Supply current IP - 3 4 mA V5, 6-1 - 240 - mV f = 1 kHz Gv - 0 1 dB Output resistance RO - 5 - k THD - 0,1 - % THD - 0,3 - % S/(S + N) - 70 - dB S/(S + N) - 70 - dB - 40 - dB f - 3 - % f = 19 kHz - 30 - dB f = 38 kHz - 50 - dB - 70 - dB Output voltage (r.m.s. value) Vi(rms) L and R 120 mV; f = 1 kHz Channel balance Vi(rms) L and R 40mV; Total harmonic distortion Vi(rms) L and R 40 mV; f = 1 kHz Total harmonic distortion Vi(rms) L and R 40 mV; f = 1 kHz; Vp(rms) = 12 mV Signal-to-noise ratio Vi(rms) = 120 mV; f = 1 kHz Signal-to-noise ratio Vi(rms) = 120 mV; f = 1 kHz Vp(rms) = 12 mV Channel separation Vi(rms) L and R 40 mV; f = 1 kHz; Vp(rms) = 12 mV Capture range Vp(rms) = 12 mV; deviation from centre frequency Carrier leak Vi(rms) L and R 120 mV; Vp(rms) = 12 mV; f = 1 kHz; SCA (Subsidiary Communications Authorization) rejection Vi(rms) L and R 120 mV; Vp(rms) = 12 mV; f = 1 kHz; VSCA(RMS) = 12 mV; f = 67 kHz September 1986 67 4 Philips Semiconductors Product specification Low voltage PLL stereo decoder PARAMETER TDA7040T SYMBOL MIN. TYP. MAX. UNIT ACI (Adjacent channel interference) Vi(rms) L and R 120 mV; Vp(rms) = 12 mV; f = 1 kHz; VACI(RMS) = 1,3 mV; f = 114 kHz VACI(RMS) = 1,3 mV; f = 190 kHz Traffic radio (V.W.F.) suppression 114 - 90 - dB 119 - 85 - dB 57(VWF) - 75 - dB V o ( signal ) ( at 1 kHz ) 57 ( VWF ) = ------------------------------------------------------------------------------------V o ( spurious ) ( at 1 kHz 23 Hz ) measured with: 91% stereo signal; fm = 1 kHz; 9% pilot signal; 5% traffic subcarrier (f = 57 kHz, fm = 23 Hz AM, m = 60%) Fig.2 Test circuit. September 1986 5 Philips Semiconductors Product specification Low voltage PLL stereo decoder TDA7040T Fig.3 Application diagram in combination with TDA7021T and TDA7050T. September 1986 6 Philips Semiconductors Product specification Low voltage PLL stereo decoder TDA7040T CHARACTERISTICS Of the combination TDA7021T, TDA7040T and TDA7050T (Fig.3). Conditions unless otherwise specified: Vvhf(rms) = 1 mV; fhf = 97 MHz; fdev = 22,5 kHz; fdev pilot = 6,75 kHz; noise measured unweighted in a range from 400 Hz to 15 kHz. PARAMETER SYMBOL MIN. TYP. MAX. UNIT Total harmonic distortion (pilot on) Vi = (L + R) signal; fmod = 1 kHz THD - 0,5 - % Vi = L signal; fmod = 1 kHz THD - 1,0 - % pilot off S/(S + N) - 56 - dB pilot on S/(S + N) - 50 - dB - 26 - dB - 14 - dB Vo(rms) - 80 - mV Signal to noise ratio Vi = (L + R) signal; fmod = 1 kHz Channel separation Vi = L-signal, fmod = 1 kHz; pilot on; fRF = 97 MHz Vi = L-signal, fmod = 1 kHz; pilot on; fRF = 87,5 MHz and 108 MHz Output voltage (pilot off) Vi = (L + R) signal, fmod = 1 kHz a = measured in test circuit (Fig.2) b = measured in application diagram (Fig.3) Fig.4 Channel separation as a function of audio frequency. September 1986 7 Philips Semiconductors Product specification Low voltage PLL stereo decoder Fig.5 Signal/noise and channel separation behaviour in Fig.3. at R1 = 270 k and R2 = 13 k; without diode BAW62. Fig.6 September 1986 TDA7040T Signal/noise and channel separation behaviour in Fig.3. at R1 = 200 k, R2 = 30 k; with diode BAW62. 8 Philips Semiconductors Product specification Low voltage PLL stereo decoder TDA7040T PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA September 1986 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 9 o 8 0o Philips Semiconductors Product specification Low voltage PLL stereo decoder TDA7040T During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. September 1986 10 Philips Semiconductors Product specification Low voltage PLL stereo decoder TDA7040T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1986 11