DATA SHEET
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
© 1998, 2001
Document No. P13981EJ3V0DS00 (3rd edition)
Date Published May 2001 NS CP(K)
Printed in Japan
PHOTOCOUPLER
PS9613,PS9613L
1 Mbps, OPEN COLLECTOR OUTPUT, FOR GATE DRIVE INTERFACE
INTELLIGENT POWER MODULE
8-PIN DIP PHOTOCOUPLER −NEPOCTM Series−
The mark •
••
• shows major revised poi nts.
DESCRIPTION
The PS9613 and PS9613L are optically coupled isolators containing a GaAlAs LED on the input side and a photo
diode and a signal processing circuit on the output side on one chip.
The PS9613 is in a plastic DIP (Dual In-line Package) and the PS9613L is lead bending type (Gull-wing) for
surface mounting.
FEATURES
• High common mode transient immunity (CMH, CML = ±15 kV/
µ
s MIN.)
• High-speed response (tPHL = 500 ns MAX., tPLH = 750 ns MAX.)
• Maximum propagation delays (tPLH − tPHL = 270 ns TYP.)
• Pulse width distortion ( | tPHL − tPLH | = 270 ns TYP.)
• Ordering number of tape product: PS9613L-E3, E4: 1 000 pcs/reel
• Safety standards
• UL approved: File No. E72422 (S)
• VDE0884 approved (Option) : No.91877
APPLICATIONS
•IPM Driver
• General purpose inverter
Data Sheet P13981EJ3V0DS
2
PS9613,PS9613L
PACKAGE DIMENSIONS (UNIT: mm)
PS9613
10.16 MAX.
6.5
0 to 15˚
7.62
PS9613L
10.16 MAX.
6.5
0.9±0.25
9.60±0.4
0.05 to 0.2
1. NC
2. Anode
3. Cathode
4. NC
5. GND
6. V
O
7. NC
8. V
CC
12 43
65
87
TOP VIEW
1. NC
2. Anode
3. Cathode
4. NC
5. GND
6. V
O
7. NC
8. V
CC
12 43
65
87
TOP VIEW
2.54 1.27 MAX.
3.8 MAX.
0.65
4.55 MAX.
2.8 MIN.
1.25±0.15
0.25 M
0.5±0.1 0.88±0.1
2.54 1.27 MAX.
0.25 M
1.25±0.15
3.8 MAX.
0.88±0.1
Data Sheet P13981EJ3V0DS 3
PS9613,PS9613L
FUNCTIONAL DIAGRAM
8
6
5
2
3
LED Output
ON L
OFF H
Shield
MARKING EXAMPLE
PS9613
M003
No. 1 pin
Mark
M
Week Assembled
Year Assembled
(Last 1 Digit)
CTR Rank Code
003
Country Assembled
Type Number
Assembly Lot
Data Sheet P13981EJ3V0DS
4
PS9613,PS9613L
ORDERING INFORMATION
Part Number Package Packi ng Styl e Safety Standards
Approval Appl i cation P art
Number*1
PS9613 8-pin DIP Magazine c ase 50 pcs Approved products PS9613
PS9613L other than VDE PS9613L
PS9613L-E3 Embossed Tape 1 000 pcs/reel
PS9613L-E4
PS9613-V Magazine c ase 50 pcs VDE0884 approved PS9613
PS9613L-V (Option) PS9613L
PS9613L-V-E 3 Embossed Tape 1 000 pcs/reel
PS9613L-V-E4
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °
°°
°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current IF25 mA
Reverse Vol tage VR3.0 V
Detector Supply Voltage VCC −0.5 to +35 V
Output Vol tage VO−0.5 t o +35 V
Output Current IO15 mA
Power Dissipati on PC100 mW
Isolat i on Voltage *1 BV 5 000 Vr.m.s .
Operating Am bi ent Tem perature TA−40 to +100 °C
Storage Temperat ure Tstg −55 to +125 °C
*1 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit
Forward Current IF10 20 mA
Output Vol tage VO030V
Supply V ol tage VCC 4.5 15 30 V
Input Vol tage VF00.8V
Data Sheet P13981EJ3V0DS 5
PS9613,PS9613L
ELECTRICAL CHARACTERISTICS (TA = −
−−
−40 to +100 °
°°
°C, VCC = 15 V, unless otherwise specified)
Parameter Symbol Conditions MIN. TYP.*1 MAX. Unit
Diode Forward Voltage VFIF = 10 mA 1.3 1. 65 2.1 V
Reverse Current IRVR = 3 V 200
µ
A
Terminal Capaci tance CtV = 0 V, f = 1 MHz, TA = 25 °C30pF
Detector Low Level Output Voltage VOL IF = 10 mA, V CC = 5 V, IO = 2. 4 m A 0.13 0.6 V
High Level Output Current IOH VCC = 30 V, VF = 0.8 V 1.0 50
µ
A
High Level Supply Current ICCH VCC = 30 V, VF = 0.8 V, VO = open 0.6 1.3 mA
Low Level Suppl y Current I CCL VCC = 30 V, IF = 10 mA , VO = open 0.6 1.3 mA
Coupled Threshold Input Current
(H → L) IFHL VO = 0.8 V, IO = 0. 75 m A 1.5 5.0 mA
Current Transfer Ratio (IC/IF)CTRI
F = 10 mA, VO = 0.6 V 44 110 %
Isolat i on Resistance RI-O VI-O = 1 kVDC, RH = 40 to 60 % ,
TA = 25 °C1011 Ω
Isolat i on Capacitance CI-O V = 0 V, f = 1 MHz, TA = 25 °C0.6pF
Propagation Delay Ti m e
(H → L)*2 tPHL IF = 10mA, RL = 20 kΩ, CL = 100 pF,
VTHHL = 1.5 V, V THLH = 2.0 V 250 500 ns
Propagation Delay Ti m e
(L → H)*2 tPLH 520 750
Maximum Propagation
Delays tPLH−tPHL −200 270 650
Pulse Wi dt h Di storti on
(PWD)*2 |tPHL−tPLH| 270 650
Common Mode
Transient I mmunity at High
Level Output*3
CMHTA = 25 °C, IF = 0 mA, VO > 3.0 V,
VCM = 1.5 kV , RL = 20 kΩ,
CL = 100 pF
15 kV/
µ
s
Common Mode
Transient I mmunity at Low
Level Output*3
CMLTA = 25 °C, IF = 10 m A, VO < 1.0 V,
VCM = 1.5 kV , RL = 20 kΩ,
CL = 100 pF
15 kV/
µ
s
Data Sheet P13981EJ3V0DS
6
PS9613,PS9613L
*1 Typical values at TA = 25 °C.
*2 Test circuit for propagation delay time
C
L
includes probe and stray wiring capacitance.
Input
Output
V
THHL
= 1.5 V V
THLH
= 2.0 V
15 V
V
OL
t
PHL
t
PLH
I
F
(ON)
50 % I
F
(ON)
47 Ω
Pulse input (I
F
= 10 mA)
Input
(monitor)
GND
(PW = 10 s,
Duty cycle = 1/10)
µ
R
L
= 20 kΩ
V
O
(monitor)
V
CC
= 15 V
0.1 F
µ
C
L
= 100 pF
*3 Test circuit for common mode transient immunity
C
L
includes probe and stray wiring capacitance.
10 %
1.5 kV
0 V
V
OH
3.0 V
1.0 V
V
OL
V
CM
90 %
t
r
t
f
V
O
(Switch A: I
F
= 0 mA)
V
O
(Switch B: I
F
= 10 mA)
V
O
(monitor)
V
CC
= 15 V
R
L
= 20 kΩ
0.1 F
µ
C
L
= 100 pF
GL SW I
F
GND
BA
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of more than 0.1
µ
F is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
Data Sheet P13981EJ3V0DS 7
PS9613,PS9613L
TYPICAL CHARACTERISTICS (TA = 25 °
°°
°C, unless otherwise specified)
20 40 60 80 1000
10
20
30
40
20 40 60 80 1000
50
100
150
–50 –25
0
0.1
0.2
0.3
0.4
0.5
250 50 75 100
0
1
2
3
4
5V
CC
= 15 V,
V
O
= 0.8 V,
I
O
= 0.75 mA
–50 –25 0 25 50 75 100
0
400
200
600
1 000
800
1 200 V
CC
= 30 V,
V
O
= Open,
I
CCH
: V
F
= 0.8 V,
I
CCL
: I
F
= 10 mA
I
CCL
I
CCH
0.6
–50 –25 0 25 50 75 100
µ
µ
V
CC
= 15 V,
I
F
= 10 mA,
I
O
= 2.4 mA
Ambient Temperature T
A
(˚C)
Maximum Forward Current I
F
(mA)
MAXIMUM FORWARD CURRENT
vs. AMBIENT TEMPERATURE
Ambient Temperature T
A
(˚C)
Detector Power Dissipation P
C
(mW)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
Ambient Temperature T
A
(˚C)
High Level Supply Current I
CCH
( A),
Low Level Supply Current I
CCL
( A)
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
Ambient Temperature T
A
(˚C)
Threshold Input Current I
FHL
(mA)
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
Ambient Temperature T
A
(˚C)
Low Level Output Voltage V
OL
(V)
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
Forw ard V oltage V
F
(V)
Forward Current I
F
(mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
1.0
0.01
0.1
1
10
100
1.2 1.4 1.6 1.8 2.0 2.2 2.4
T
A
= +85 ˚C
+50 ˚C
+25 ˚C
0 ˚C
–25 ˚C
Data Sheet P13981EJ3V0DS
8
PS9613,PS9613L
Output Current I
O
(mA)
Forward Current I
F
(mA) Ambient Temperature T
A
(˚C)
Output Current (Relative Value)
0 5 10 15 20
–40 –20 0 20 40 60 80 100
Load Capacitance C
L
(pF)
Propagation Delay Time t
PHL
, t
PLH
(ns)
0
100
200
300
400
500
600
700
0.70
0.80
0.75
0.85
0.95
1.05
0.90
1.00
1.10
V
CC
= 15 V,
I
F
= 10 mA,
C
L
= 100 pF,
R
L
= 20 kΩ
I
F
= 10 mA,
V
O
= 0.6 V
I
F
= 10 mA,
C
L
= 100 pF,
R
L
= 20 kΩ
V
CC
= 15 V,
C
L
= 100 pF,
R
L
= 20 kΩ
V
CC
= 15 V,
I
F
= 10 mA,
R
L
= 20 kΩ
–40 –20 0 20 40 60 80 100
0
100
200
300
400
500
600
700
0
200
400
600
800
1 000
1 200
1 400
1 600
0 100 200 300 400 500
010203040
0
200
400
600
800
1 000
1 200
1 400
1 600
1 800
–200
t
PHL
t
PLH
t
PLH
– t
PHL
PWD
t
PHL
t
PLH
t
PLH
– t
PHL
t
PHL
t
PLH
t
PLH
t
PHL
0 5 10 15 20
0
2
4
6
8
10
12
14 V
O
= 0.6 V
–40 ˚C
+100 ˚C
T
A
= +25 ˚C
Forward Current I
F
(mA)
Propagation Delay Time t
PHL
, t
PLH
(ns),
Maximum Propagation Delays t
PLH
– t
PHL
(ns)
PROPAGATION DELAY TIME,
MAXIMUM PROPAGATION DELAYS
vs. FORWARD CURRENT
Ambient Temperature T
A
(˚C)
Propagation Delay Time t
PHL
, t
PLH
(ns),
Pulse Width Distortion t
PHL
– t
PLH
(ns)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
Supply V oltage V
CC
(V)
Propagation Delay Time t
PHL
, t
PLH
(ns),
Maximum Propagation Delays t
PLH
– t
PHL
(ns)
PROPAGATION DELAY TIME,
MAXIMUM PROPAGATION DELAYS
vs. SUPPLY VOLTAGE
PROPAGATION DELAY TIME vs.
LOAD CAPACITANCE
OUTPUT CURRENT vs. FORWARD CURRENT OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
Data Sheet P13981EJ3V0DS 9
PS9613,PS9613L
VCC = 15 V,
IF = 10 mA,
CL = 100 pF
VCC = 5 V,
IF = 10 mA,
CL = 15 pF
0 5 10 15 20 25
50
100
150
200
250
300
350
400
450
500
0
010203040
50
–200
200
0
400
800
600
1 000
tPHL
tPLH
tPHL
tPLH
tPLH – tPHL tPLH – tPHL
Load Resistance RL (kΩ)
Propagation Delay Time tPHL, tPLH (ns),
Maximum Propagation Delays tPLH – tPHL (ns)
PROPAGATION DELAY TIME,
MAXIMUM PROPAGATION DELAYS
vs. LOAD RESISTANCE
Load Resistance RL (kΩ)
Propagation Delay Time tPHL, tPLH (ns),
Maximum Propagation Delays tPLH – tPHL (ns)
PROPAGATION DELAY TIME,
MAXIMUM PROPAGATION DELAYS
vs. LOAD RESISTANCE
Remark The graphs indicate nominal characteristics.
Data Sheet P13981EJ3V0DS
10
PS9613,PS9613L
TAPING SPECIFICATIONS (UNIT: mm)
Tape Direction
Outline and Dimensions (Tape)
Outline and Dimensions (Reel)
Packing: 1 000 pcs/reel
16.4
+2.0
–0.0
80.0±5.0
φ
330
φ
2.0±0.5
R 1.0
13.0±0.5
φ
21.0±0.8
φ
PS9613L-E3 PS9613L-E4
1.5
1.55±0.1
2.0±0.1
4.0±0.1
1.75±0.1
4.5 MAX.
10.4±0.1
12.0±0.1
1.5
+0.1
–0
7.5±0.1
10.3±0.1
16.0±0.3
4.0±0.1
0.3
Data Sheet P13981EJ3V0DS 11
PS9613,PS9613L
NOTES ON HANDLING
Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 235 °C or below (package surface temperature)
• Time of temperature higher than 210 °C 30 seconds or less
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
60 to 120 s
(preheating)
210 ˚C
100 to 160 ˚C
Package Surface Temperature T (˚C)
Time (s)
(heating)
to 10 s
to 30 s
235 ˚C (peak temperature)
Recommended Temperature Profile of Infrared Reflow
(2) Wave soldering
• Temperature 260 °C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 100 °C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt % is recommended.)
(3) Cautions
•Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
PS9613,PS9613L
SAFETY INFORMATION ON THIS PRODUCT
Caution GaAs Products The product contains gallium ars enide, GaAs.
GaAs vapor and powder are hazardous t o hum an heal t h i f inhaled or ingested.
• Do not destroy or burn the product.
• Do not cut or cleave of f any part of the product.
• Do not crush or chemic al l y diss ol ve the product.
• Do not put the product in t he m outh.
Follow related l aws and ordinances for dispos al . The product should be excluded from general
industri al was te or household garbage.
NEPOC is a trademark of NEC Corporation.
M8E 00. 4
The information in this document is current as of May, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
•
•
•
•
•
•
