TEA1733LT/N2,118 - NXP Semiconductors

1. General description

The TEA1733LT/N1 and TEA1733LT/N2 are low cost Switched Mode Power Supply

(SMPS) controller ICs intended for flyback topologies. They operate in fixed frequency

mode. To reduce ElectroMagnetic Interference (EMI), frequency jitter has been

implemented. Slope compensation is integrated for Continuous Conduction Mode (C CM)

operation.

The TEA1733LT includes OverPower Protection (OPP). This enables the controller to

operate under over power situations for a limited amount of time.

Two pins, VINSENSE and PROTECT, are reserved for pr ot ection purposes . Inp ut

UnderVoltage Protection (UVP) and OverVoltage Protection (OVP), output OVP and

OverTemperature Protection (OT P) can be implemented using a minimal number of

external components.

At low power levels the primary peak current is set to 25 % of the maximum peak current

and the switching frequency is r educe d to limit switching losses. The co mbination of fixe d

frequency operation at high output power and frequency reduction at low output power

provides high-efficiency over the total load range.

The TEA1733LT enables low cost, highly efficient and reliable supplies for power

requirements up to 75 W to be designed easily and with a minimum number of external

components.

2. Features and benefits

2.1 Features

SMPS controller IC enabling low-cost applications

Large input volt age range (12 V to 30 V)

Very low supply current during sta rt-up and restart (typically 10 μA)

Low supply current during normal operation (typically 0.5 mA without load)

Overpower or high/low line compensation

Adjustable overpowe r tim e-ou t

Adjustable overpowe r re start timer

Fixed switching frequency with frequency jitter to reduce EMI

Frequency reduction with fixed minimum peak current to maintain high-efficiency at

low output power levels

Slope compensation for CCM operation

TEA1733LT

GreenChip SMPS control IC

Rev. 6 — 25 January 2011 Product data sheet

Product data sheet Rev. 6 — 25 January 2011 2 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

Low and adjustable OverCurrent Protection (OCP) trip level

Adjustable soft start operation

Two protection inputs (e.g. for input UVP and OVP, OTP and output OVP)

IC overtemperature protection

3. Applications

All applications requiring efficient and cost-effective power supply solutions up to

75 W.

4. Ordering information

Table 1. Ordering information

Type number Package

Name Description Version

TEA1733LT/N1 SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TEA1733LT/N2 SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

Product data sheet Rev. 6 — 25 January 2011 3 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

5. Block diagram

Fig 1. Block diagram TEA1733LT/N1

001aan641

OVERPOWER

CORRECTION

BLANK

OCP

LEB

VINSENSE

latch

stop

soft start

restart

OSCILLATOR

frequency reduction

set

δmax MODULATION

SLOPE

COMPENSATION

ANALOG

CONTROL

restart VCCstop

highvin

lowvin

latch

latch reset

DIGITAL CONTROL

soft start

μA

11 μA

2.5 V

1.2 V / 4.5 V

restart

VCCstart DQ

VCCstop

latch reset

RESTART

CONTROL

OPP switch

OTP

OPTIMER

5.4 V

7 kΩ

δmax

stop

set

power down

clamp

DRV

DRIVER

GND

VCC

ISENSE 4

driver

overpower OPTIMER

CTRL

PROTECT

VINSENSE

OPP switch

clamp latch

21 V

6 V22 V 12 V

5 V

400 mV

0.50 V/0.80 V

107

μA

107 μA

prothigh

protlow

highvin

lowvin

3.52 V

0.72 V/0.94 V

VCCstart

power down

lowvin

protlow

OTP

prothigh

protlow

overpower

Vctrl(Ipeak)

TEMPERATURE

PROTECTION

Product data sheet Rev. 6 — 25 January 2011 4 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

Fig 2. Block diagram TEA1733LT/N2

001aan23

OVERPOWER

CORRECTION

BLANK

OCP

LEB

VINSENSE

OSCILLATOR

frequency reduction

set

δmax MODULATION

SLOPE

COMPENSATION

ANALOG

CONTROL

soft start

μA

11 μA

2.5 V

1.2 V / 4.5 V

restart

VCCstart DQ

VCCstop

latch reset

RESTART

CONTROL

OPP switch

OTP

OPTIMER

5.4 V

7 kΩ

δmax

stop

set

power down

clamp

DRV

DRIVER

GND

VCC

ISENSE 4

driver

overpower OPTIMER

CTRL

PROTECT

VINSENSE

OPP switch

clamp latch

21 V

6 V22 V 12 V

5 V

400 mV

0.50 V/0.80 V

107

μA

107 μA

prothigh

protlow

highvin

lowvin

3.52 V

0.72 V/0.94 V

Vctrl(Ipeak)

TEMPERATURE

PROTECTION

latch

stop

soft start

restart

VCCstop

overpower

lowvin

latch

latch reset

DIGITAL CONTROL

VCCstart

power down

lowvin

protlow

OTP

prothigh

protlow

overload

δ max

COUNT

TO 8

highvin

overload QS

driver

stop

δ max prot

Product data sheet Rev. 6 — 25 January 2011 5 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 3. Pinning diagram SOT96-1 (SO8)

TEA1733LT

VCC OPTIMER

GND CTRL

DRIVER PROTECT

ISENSE VINSENSE

001aan239

Table 2. Pin description

Symbol Pin Description

VCC 1 supply voltage

GND 2 ground

DRIVER 3 gate driver output

ISENSE 4 current sense input

VINSENSE 5 input voltage protection input

PROTECT 6 general purpose protection input

CTRL 7 control input

OPTIMER 8 overpower and restart timer

Product data sheet Rev. 6 — 25 January 2011 6 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

7. Functional description

7.1 General control

The TEA1733LT contains a flyback circuit controller, a typical configuration of which is

shown in Figure 4.

7.2 Start-up and UnderVoltage LockOut (UVLO)

Initially, the capacitor on the VCC pin is charged from the high voltage mains via resistor

R3.

If VCC is lower than Vstartup, the IC current consumption is low (typically 10 μA). When VCC

reaches Vstartup, the IC first waits for the VINSENSE pin to reach the Vstart(VINSENSE)

voltage an d PROTECT pin to reach the Vdet(L)(PROTECT) voltage. When both levels are

reached, the IC charges the ISENSE pin to the Vstart(soft) level and starts switching. In a

typical application, the supply voltage is taken over by the auxiliary winding of the

transformer.

If a protection is triggered the controller stops switching. Depending on the protection

triggered, the protection causes a restart or latches the converter to an off-state.

A restart caused by a protection rapidly charges the OPTIMER pin to 4.5 V (typical). The

TEA1733LT enters Power-down mode until the OPTIMER pin discharges down to 1.2 V

(typical). In Power-down mode, th e IC consumes a very low supply cu rrent (10 μAtypical)

and the VCC pin is clamped at 22 V (typical) by an internal clamp circuit. When the

voltage o n pin OPTIMER drop s below 1.2 V (typical) and the VCC pin volt age is above the

VCC start-up voltage (See Figure 5), the IC restarts.

When a latched protection is triggered, the TEA1733LT immediately enters Power-down

mode. The VCC pin is clampe d to a voltage just above the latch protection reset voltage

(Vrst(latch) +1V).

Fig 4. Typical configura tion

001aan24

TEA1733LT

R3 R4

C4 R8 C5

R10

DRIVER

GND

VCC

ISENSE

VINSENSE

PROTECT

CTRL

OPTIMER

Product data sheet Rev. 6 — 25 January 2011 7 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

When the voltage on pin VCC drops belo w the Vth(UVLO) level during n ormal operation, the

controller stop s switching. The TEA1733LT/N1 enters Restart mode. In Rest art mode, the

driver output is disabled and the VCC pin is recharged via resistor R3 to the rectified

mains. In the TEA1733LT/N2, a VCC undervoltage latches the IC in the off-state.

7.3 Supply management

All internal refere nce voltage s are derived fr om a temperature comp ensated on -chip band

gap circuit. Internal reference currents are derived from a trimmed and temperature

compensated current reference circuit.

7.4 Input voltage detection (VINSENSE pin)

In a typical application the mains input voltage can be detected by the VINSENSE pin.

Switching will not take place until the voltage on VINSENSE has reached the

Vstart(VINSENSE) voltage (typically 0.94 V).

When the VINSENSE voltage drops below Vdet(L)(VINSENSE) (typically 0.72 V) or exceeds

Vdet(H)(VINSENSE) (typically 3.52 V), the converter stops switching and performs a restart.

If pin VINSENSE is left open or disconnected, the pin is pulled up by the internal 20 nA

(typical) current source to reach the Vdet(H)(VINSENSE) level. This triggers restart protection.

An internal clamp of 5.2 V (typical) protect s this pin from overvoltages.

7.5 Protection input (PROTECT PIN)

Pin PROTECT is a general purpose input pin, which can be used to switch off the

converter (latched protection). The converter is stopped when the voltage on this pin is

pulled above Vdet(H)(PROTECT) (typically 0.8 V) or below Vdet(L)(PROTECT) (typically 0.5 V). A

current of 32 μA (typical) flows out of the chip when the pin voltage is at the

Vdet(L)(PROTECT) level. A current of 107 μA (typical) flows into the chip when the pin voltage

is at the Vdet(H)(PROTECT) level.

Fig 5. Start-up sequence, normal operation and restart sequence

014aaa929

starting

converter

charging VCC

capacitor

normal

operation protection

(power down)

soft start

VCC

ISENSE

VINSENSE

PROTECT

OPTIMER

restart

soft start

Vstartup

Vth(UVLO)

Vdet(H)(VINSENSE)

Vdet(H)(PROTECT)

Vdet(L)(PROTECT)

4.5 V

1.2 V

Product data sheet Rev. 6 — 25 January 2011 8 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

The PROTECT input can be used to create overvoltage detection and OTP functions.

A small capacitor can be connected to the pin if the protections on this pin are not used.

An internal clamp of 4.1 V (typical) protects this pin from overvoltages.

7.6 Duty cycle control (CTRL pin)

The output power of th e co nve r ter is reg ulate d by the CTRL pin. This pin is connec ted to

an internal 5.4 V supply using an internal 7 kΩ resistor.

The CTRL pin voltage sets the peak current which is measured using the ISENSE pin

(see Section 7.10). At a low output power the switching frequency is also red uced (see

Section 7.12). The maximum duty cycle is limited to 72 % (typical).

TEA1733LT/N1 does not trigger any protection when maximum duty cycle is reached. In

TEA1733LT/N2, after eight consecutive con ve rter strokes at the maximum duty cycle,

restart protection is activated. Typically, this will happen when the mains input supply

voltage is removed.

7.7 Slope compensation (CTRL pin)

A slope compensation circuit is integrated in the IC for CCM. Slope compensation

guarantees stable operation for duty cycles greater than 50 %.

7.8 Overpower timer (OPTIMER pin)

If the OPTIMER pin is connected to capacitor C4 (see Figure 4), a tempora ry ov er loa d

situation is allowed. Vctrl(Ipeak) (see Figure 2) is set by the CTRL. When Vctrl(Ipeak) is above

400 mV, the IIO(OPTIMER) current (11 μA typical) is sourced from the OPTIMER pin. If the

voltage on the OPTIMER pin reaches the Vprot(OPTIMER) voltage (2.5 V typical) the

OverPower Protection (OPP) is triggered (see Figure 6).

•TEA1733LT: when the Vprot(OPTIMER) voltage is reached, it is latched in the off state

Fig 6. Overpower delay

014aaa930

VOPTIMER

VISENSE

400 mV

protectionhigh loadhigh load normal

load

Vprot(OPTIMER)

Product data sheet Rev. 6 — 25 January 2011 9 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

7.9 Current mode control (ISENSE pin)

Current mode control is used for its good line regulation.

The primary current is sensed by the ISENSE pin across an external resistor R9 (see

Figure 4) and comp ared with an internal refer ence volt age. The in ternal reference volt age

is proportional to the CTRL pin voltage (see Figure 8).

Leading edge blanking prevents false triggering due to capacitive discharge wh en

switching on the external power switch (see Figure 9).

Fig 7. Overpower delay: latched

014aaa968

VOPTIMER

VISENSE

400 mV

protectionhigh loadhigh load normal

load

Vprot(OPTIMER)

Fig 8. Peak current control using pin ISENSE

frequency

reduction

0.2

0.4

0.6

04312

014aaa931

VCTRL (V)

Vsense(max)

(V)

Product data sheet Rev. 6 — 25 January 2011 10 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

7.10 Overpower or high/low line compensation (VINSENSE and

ISENSE pins)

The overpower comp ensation function can be used to realize a ma ximum output power

which is nearly constant over the full inpu t mains.

The overpower comp ensation circuit measures the input voltage on the VINSENSE pin

and outputs a proportionally dependent current on the ISENSE pin. The DC voltage

across the soft start resistor limits the maximum peak current on the current sense

resistor.

At low output power levels the overpower compensation circuit is switched off

(See Figure 10).

7.11 Soft start-up (ISENSE pin)

To prevent audible noise during sta rt-up or a restart condition, a sof t st art is made. Before

the converte r starts, the soft start capacitor C6 (see Figure 4) on the ISENSE pin is

charged. When the converter starts switching, the primary peak current slowly increases

as the soft start capacitor discharges through the soft start resistor (R6, see Figure 4).

The soft start time constant is set by the soft start capacitor value chosen. The soft start

resistor value must also be taken into account, but this value is typically defined by the

overpower co mp e nsation (see Section 7.10).

Fig 9. Leading ed ge blanking using pin ISENSE

tleb

Vsense(max)

VISENSE t

014aaa93

Fig 10. Overpower compensation using pins VINSENSE and ISENSE

1.7

0.68 1234

014aaa93

IISENSE

(μA)

VVINSENSE (V)

Product data sheet Rev. 6 — 25 January 2011 11 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

7.12 Low power operation

In low power operatio n switching losse s are r educe d by lower ing the switching fr equency.

The converter switching frequency is red uced and the peak current is set to 25 % of the

maximum peak current (see Figure 8 and Figure 11).

7.13 Driver (DRIVER pin)

The driver circuit to the gate of the power MOSFET has a current sourcing capability of

typically 300 mA and a current sink capability of typically 750 mA. This allows for a fast

turn-on and turn-off of the power MOSFET for efficient operation.

7.14 OverTemperature Protection (OTP)

Integrated overtemperature protection ensures the IC stops switching if the junction

temperature exceeds the thermal temperature shutdown limit.

OTP is a latched protection and it can be reset by re moving the voltage on pin VCC.

Fig 11. Frequency control

switching

frequency

014aaa93

VCTRL (V)

fsw

(kHz)

Product data sheet Rev. 6 — 25 January 2011 12 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

8. Limiting values

[1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.

[2] Equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor.

9. Thermal characteristics

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Voltages

VCC supply voltage continuous −0.4 +30 V

t < 100 ms - 35 V

VVINSENSE voltage on pin VINSENSE current limited −0.4 +5.5 V

VPROTECT voltage on pin PROTECT current limited −0.4 +5 V

VCTRL voltage on pin CTRL −0.4 +5.5 V

VIO(OPTIMER) input/output voltage on pin

OPTIMER −0.4 +5 V

VISENSE voltage on pin ISENSE current limited −0.4 +5 V

Currents

ICC current on pin VCC δ<10% - +0.4 A

II(VINSENSE) input current on pin

VINSENSE −1+1mA

II(PROTECT) input current on pin

PROTECT −1+1mA

ICTRL current on pin CTRL −30 mA

IISENSE current on pin ISENSE −10 +1 mA

IDRIVER current on pin DRIVER δ<10% −0.4 +1 A

General

Ptot total power dissipation Tamb <75°C-0.5W

Tstg storage temperature −55 +150 °C

Tjjunction temperature −40 +150 °C

ESD

VESD electrostatic discharge

voltage class 1

human body

model [1] -4000V

machine model [2] -300V

charged device

model -750V

Table 4. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resist ance from junction to ambient in free air; JEDEC test

board 150 K/W

Rth(j-c) thermal resistance from junction to case in free air; JEDEC test

board 79 K/W

Product data sheet Rev. 6 — 25 January 2011 13 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

10. Characteristics

Table 5. Characteristics

Tamb =25

C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into

the IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Supply voltage management (pin VCC)

Vstartup start-up voltage 18.6 20.6 22.6 V

Vth(UVLO) undervoltage lockout

threshold voltage 11.2 12.2 13.2 V

Vclamp(VCC) cl amp voltage on pin VCC activated during restart - Vstartup +1 - V

activated during latched

protection -V

rst(latch) +1 - V

Vhys hysteres is voltage Vstartup −Vth(UVLO) 89 10V

ICC(startup) start-up supply current VCC <V

startup 510 15μA

ICC(oper) operatin g supply current no load on pin DRIVER 0.4 0.5 0.6 mA

Vrst(latch) latched reset voltage 4 5 6 V

Input voltage sensing (pin VINSENSE)

Vstart(VINSENSE) start voltage on pin

VINSENSE detection level 0.89 0.94 0.99 V

Vdet(L)(VINSENSE) LOW-level detection voltage

on pin VINSENSE 0.68 0.72 0.76 V

Vdet(H)(VINSENSE) HIGH-level detection

voltage on pin VINSENSE 3.39 3.52 3.65 V

IO(VINSENSE) output curren t on pin

VINSENSE -−20 - nA

Vclamp(VINSENSE) clamp voltage on pin

VINSENSE II(VINSENSE) =50μA-5.2-V

Protection input (pin PROTECT)

Vdet(L)(PROTECT) LOW-level detection voltage

on pin PROTECT 0.47 0.50 0.53 V

Vdet(H)(PROTECT) HIGH-level detection

voltage on pin PROTECT 0.75 0.8 0.85 V

IO(PROTECT) output current on pi n

PROTECT VPROTECT =V

low(PROTECT) −34 −32 −30 μA

VPROTECT =V

high(PROTECT) 87 107 127 μA

Vclamp(PROTECT) clamp voltage on pin

PROTECT II(PROTECT) =200μA[1] 3.54.1 4.7V

Peak current control (pin CTRL)

VCTRL voltage on pin CTRL for minimum flyback peak

current 1.51.8 2.1V

for maximum flyback peak

current 3.43.9 4.3V

Rint(CTRL) internal resistance on pin

CTRL 57 9kΩ

IO(CTRL) output curren t on pi n CTRL VCTRL =1.4V −0.7 −0.5 −0.3 mA

VCTRL =3.7V −0.28 −0.2 −0.12 mA

Product data sheet Rev. 6 — 25 January 2011 14 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

Pulse width modulator

fosc oscillator frequency 62 66.5 71 kHz

fmod modulation frequency 210 280 350 Hz

Δfmod modulation frequency

variation ±3±4±5kHz

δmax maximum duty cycle 68.5 72 79 %

Ncy(sw)δmax[2] number of switching cycles

with maximum duty cycle -- 8

Vstart(red)f frequency reduction start

voltage pin CTRL 1.5 1.8 2.1 V

Vδ(zero) zero duty cycle voltage pin CTRL 1.25 1.55 1.85 V

Overpower protection (pin OPTIMER)

Vprot(OPTIMER) protection voltage on pin

OPTIMER 2.42.5 2.6V

Iprot(OPTIMER) protection current on pin

OPTIMER no overpower situation 100 150 200 μA

overpower situation −12.2 −10.7 −9.2 μA

Restart timer (pin OPTIMER)

Vrestart(OPTIMER) restart voltage on pin

OPTIMER low level 0.8 1.2 1.6 V

high level 4.1 4.5 4.9 V

Irestart(OPTIMER) restart curr en t on pi n

OPTIMER charging OPTIMER

capacitor −127 −107 −87 μA

discharging OPTIMER

capacitor −0.1 0 0.1 μA

Current sense (pin ISENSE)

Vsense(max) maximum sense voltage ΔV/Δt=50mV/μs;

VVINSENSE =0.78V 0.48 0.51 0.54 V

ΔV/Δt = 200 mV/μs;

VVINSENSE =0.78V 0.50 0.53 0.56 V

Vth(sense)opp overpower protection sense

threshold voltage 370 400 430 mV

ΔVISENSE/Δt slope compensation voltage

on pin ISENSE ΔV/Δt=50mV/μs172533mV/μs

tleb leading edge bla nking time 250 300 350 ns

Overpower compensation (pin VINSENSE and pin ISENSE)

Iopc(ISENSE) overpower compensation

current on pin IS EN SE VVINSENSE =1V;

Vsense(max) > 400 mV -0.28-μA

VVINSENSE=3 V;

Vsense(max) > 400 mV -1.7-μA

Table 5. Characteristics …continued

Tamb =25

C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into

the IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 6 — 25 January 2011 15 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

[1] The clamp voltage on the PROTECT pin is lowered when the IC is in power-down (latched or restart protection).

[2] Ncy(sw)dmax is only valid for TEA1733LT/N2. TEA1733LT/N1 does not count the number of switching cycles with maximum duty cycle.

11. Application information

A power supply with the TEA1733LT is a flyback converter operating in Continuous

conduction mode (See Figure 12).

Capacitor C5 buffers the IC supply voltage, which is powered via resistor R3 at st art-up

and via the auxiliary winding during normal operation. Sense resistor R9 converts the

current throug h th e MO SF ET S1 into a voltage on pin ISENSE. The value of R9 defines

the maximum primary peak current on MOSFET S1. Resistor R7 reduces the peak

current to capacitor C5.

In the example shown in Figure 12, the PROTECT pin is used for OVP and OTP. The

OVP level is set by diode Z1 to VCC = 25.8 V. The OTP level is set by Negative

Temperature Coefficient (NTC) resistor R4. The VINSENSE pin is used for mains voltage

detection and resistors R1 an d R2 set the start voltag e to about 80 V (AC). The overpower

protection time is defined by cap acitor C4 is set at 60 ms.

The restart time is defined by capacitor C4 and resistor R8 at 0.5 s.

Resistor R6 and cap acitor C6 define th e sof t st art time. Resistor R5 prevents th e soft st art

capacitor C6 from being charged during normal operation caused by negative voltage

spikes across the current sense resistor R9.

Capacitor C3 reduces noise on the CTRL pin.

Soft start (pin ISENSE)

Istart(soft) soft st art current −63 −55 −47 μA

Vstart(soft) soft start voltage VCTRL = 4 V; enable

voltage -V

sense(max) -V

Rstart(soft) sof t start resistance 12 - - kΩ

Driver (pin DRIVER)

Isource(DRIVER) source current on pin

DRIVER VDRIVER =2V - −0.3 −0.25 A

Isink(DRIVER) sink current on pin DRIVER VDRIVER = 2 V 0.25 0.3 - A

VDRIVER =10V 0.6 0.75 - A

VO(DRIVER)max maximum output voltage on

pin DRIVER 9 10.5 12 V

Temperature protection

Tpl(IC) IC protection level

temperature 130 140 150 °C

Table 5. Characteristics …continued

Tamb =25

C; VCC = 20 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into

the IC; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 6 — 25 January 2011 16 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

Fig 12. Typical application

001aan24

TEA1733LT

10 MΩ

82 kΩ

1 MΩR4

200 kΩ

25 V C4

220 nF

2.2 MΩ

4.7 μF

0.25 Ω

1 nF

68 μF

100 nF

10 Ω

220 nF

22 kΩ

10 Ω

R10

DRIVER

GND

VCC

ISENSE

VINSENSE

PROTECT

CTRL

OPTIMER

470 Ω

Product data sheet Rev. 6 — 25 January 2011 17 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

12. Package outline

Fig 13. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10

1.45

1.25 0.25 0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6

0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004

0.057

0.049 0.01 0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15 0.05 0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96

-1

99-12-27

03-02-18

Product data sheet Rev. 6 — 25 January 2011 18 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

13. Revision history

Table 6. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TEA1733LT v.6 20110125 Product data sheet - TEA1733T_LT_P v.5

Modifications: •Minor updates.

•Data sheet split in three separate product types.

TEA1733T_LT_P v.5 20101119 Product data sheet - TEA1733T_LT_P v.4

TEA1733T_LT_P v.4 20100823 Product data sheet - TEA1733T_LT_P_LP v.3

TEA1733T_LT_P_LP v.3 20100520 Product data sheet - TEA1733T_TEA1733LT v.2

TEA1733T_TEA1733LT v.2 20100326 Product data sheet - TEA1733T_TEA1733LT v.1

TEA1733T_TEA1733LT v.1 20091026 Objective data sheet - -

Product data sheet Rev. 6 — 25 January 2011 19 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

14. Legal information

14.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

14.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information se e the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

14.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings onl y and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 6 — 25 January 2011 20 of 21

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automo tive use. It i s neit her qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applicat ions, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product cl aims resulting f rom customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

14.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

GreenChip — is a trademark of NXP B.V.

15. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors TEA1733LT

GreenChip SMPS control IC

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 January 2011

Document identifier: TEA1733LT

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

16. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Functional description . . . . . . . . . . . . . . . . . . . 6

7.1 General control. . . . . . . . . . . . . . . . . . . . . . . . . 6

7.2 Start-up and UnderVoltage LockOut (UVLO) . . 6

7.3 Supply management. . . . . . . . . . . . . . . . . . . . . 7

7.4 Input voltage detection (VINSENSE pin) . . . . . 7

7.5 Protection input (PROTECT PIN). . . . . . . . . . . 7

7.6 Duty cycle control (CTRL pin). . . . . . . . . . . . . . 8

7.7 Slope compensation (CTRL pin). . . . . . . . . . . . 8

7.8 Overpower timer (OPTIMER pin) . . . . . . . . . . . 8

7.9 Current mode control (ISENSE pin) . . . . . . . . . 9

7.10 Overpower or high/low line compensation

(VINSENSE and ISENSE pins) . . . . . . . . . . . 10

7.11 Soft start-up (ISENSE pin) . . . . . . . . . . . . . . . 10

7.12 Low power operation . . . . . . . . . . . . . . . . . . . 11

7.13 Driver (DRIVER pin). . . . . . . . . . . . . . . . . . . . 11

7.14 OverTemperature Protection (OTP) . . . . . . . . 11

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12

9 Thermal characteristics . . . . . . . . . . . . . . . . . 12

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13

11 Application information. . . . . . . . . . . . . . . . . . 15

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17

13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19

14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19

14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

14.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

15 Contact information. . . . . . . . . . . . . . . . . . . . . 20

16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21