1/29
XC9242/XC9243 Series
2A Synchronous Step-Down DC/DC Converters
XC9242B08C
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000 10000
Output Current: I
OUT
(mA)
Efficiency: EFFI (%)
L=4.7μH(SLF7055),CIN1 =20μF(LMK212ABJ106KGx2
)
CIN2 =1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2
)
R
FB1
=47kΩ, R
FB2
=15kΩ, C
FB
=330p
F
V
IN
=5.0V
■TYPICAL APPLICATION CIRCUIT
■APPLICATIONS
●Mobile phones
●Bluetooth headsets
●Personal digital assistance
●Portable game consoles
●Digital still cameras, Camcorders
Driver Transistor : 0.11Ω P-ch Driver Transistor
0.12Ω N-ch Switching Transistor
Input Voltage Range : 2.7V～6.0V
Output Voltage Setting : 0.9V～VIN
FB Voltage : 0.8V±2.0%
High Efficiency : 95%(TYP.)*
Output Current : 2.0A
Oscillation Frequency : 1.2MHz±15%, 2.4MHz±15%
Maximum Duty Cycle : 100%
Functions : Soft-Start Circuit Built-In
C
L Discharge
Current Limit Circuit
（
automatic return
）
Thermal Shutdown
UVLO
Output Capacitor : Low ESR Ceramic Capacitor
Control Methods : PWM control (XC9242)
PWM/PFM Auto (XC9243)
Operating Ambient Temperature
:-40℃ ~ +85℃
Packages : USP-10B, SOP-8FD
Environmentally Friendly
: EU RoHS Compliant, Pb Free
* Performance depends on external components and wiring on the PCB.
☆GreenO
p
erationCom
p
atible
■GENERAL DESCRIPTION
The XC9242/XC9243 series is a group of synchronous-rectification step-down DC/DC converters with a built-in 0.11Ω
(TYP.) P-channel MOS driver transistor and 0.12Ω(TYP.) N-channel MOS switching transistor, designed to allow the use of
ceramic capacitors. The small on-resistances of these two internal driver transistors enable a high efficiency, stable power
supply with an output current up to 2A. The XC9242/XC9243 series has operating voltage range of 2.7V~6.0V and a 0.8V
(±2.0%) reference voltage, and using externally connected resistors, the output voltage can be set freely from 0.9V. With
an internal switching frequency of 1.2MHz or 2.4MHz, small external components can be used.
The XC9242 series is PWM control, and the XC9243 series is PWM/PFM, which automatically switches from PWM to PFM
during light loads and provides high efficiency, high load response, low voltage ripple, can be achieved over a wide range of
load conditions. The series have a high speed soft-start as fast as 1ms in typical for quick turn-on. It’s suitable for
large-current application due to limit current is configured 4.0A in typical. During stand-by, all circuits are shutdown to
reduce current consumption to as low as 1.0μA or less. The integrated CL discharge function which enables the electric
charge at the output capacitor CL to be discharged via the internal discharge switch located between the LX and VSS pins.
Due to CL discharge function, malfunction on LX is prevented when Stand-by mode. With the built-in UVLO (Under Voltage
Lock Out) function, the internal P-channel driver transistor is forced OFF when input voltage becomes 2.5V or lower. The
series are available in USP-10B, SOP-8FD packages.
ETR0521-007
■
FEATURES
●XC9242/XC9243 Series (FB Type)
●Efficiency vs. Output Current (fosc=1.2MHz, VOUT=3.3V)
■TYPICAL PERFORMANCE
CHARACTERISTICS
2/29
XC9242/XC9243 Series
■BLOCK DIAGRAM
●XC9242/XC9243 Series
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
■PRODUCT CLASSIFICATION
●Ordering Information
XC9242①②③④⑤⑥-⑦(*1) Fixed PWM control
XC9243①②③④⑤⑥-⑦(*1) PWM / PFM automatic switching control
DESIGNATOR ITEM SYMBOL DESCRIPTION
① Functional Selection B CL Discharge
②③ Output Voltage 08 Reference Voltage is fixed at 0.8V
C 1.2MHz
④ Oscillation Frequency D 2.4MHz
DR-G USP-10B (3,000/Reel)(*2)
⑤⑥-⑦(*1) Package (Order Unit) QR-G SOP-8FD (1,000/Reel)
Selection Guide
TYPE SOFT-START
TIME
CHIP
ENABLE
CURRENT
LIMITER
THERMAL
SHUTDOWN UVLO CL AUTO-
DISCHARGE
B Fixed Yes Yes Yes Yes Yes
(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant.
(*2) The USP-10B reels are shipped in a moisture-proof packing.
3/29
XC9242/XC9243
Series
■PIN CONFIGURATION
■PIN ASSIGNMENT
PIN NUMBER
USP-10B SOP-8FD PIN NAME FUNCTIONS
1,10 1,8 Lx Switching Output
2,3 2 PGND Power Ground
4 3 FB Output Voltage Monitor
5 4 AGND Analog Ground
6 5 CE Chip Enable
7 6 AVIN Analog Input
8,9 7 PVIN Power Input
■CE PIN FUNCTION
PIN NAME SIGNAL STATUS
H Active
CE
L Stand-by
* Please do not leave the CE pin open.
USP-10B
* Please connect the power input pins (No.8 and No.9) and analog input pin (No.7) when operating.
* Please connect the two Lx pins (No.1 and 10).
* Please connect the power ground pins (No.2 and 3) and analog ground pin (No.5) when operating.
* It is recommended that the heat dissipation pad of the USP-10B package is soldered by using the reference
mount pattern and metal mask pattern for mounting strength. The mount pattern should be electrically opened or
connected to AGND pin (No.5) and PGND pin (No.2, and 3).
LX
CE
SOP-8FD
(TOP VIEW)
1
2
3
4
8
7
6
5
PVIN
AVIN
LX
AGND
PGND
FB
SOP-8FD
(TOP VIEW)
SOP-8FD
* Please connect the power input pin (No.7) and analog input pin (No.6) when operating.
* Please connect the two Lx pins (No.1 and 8).
* Please connect the two power ground pins (No.2 and 4).
* It is recommended that the heat dissipation pad of the SOP-8FD package is soldered by using the reference
mount pattern and metal mask pattern for mounting strength. The mount pattern should be electrically opened or
connected to AGND pin (No.6) and PGND pin (No.7).
USP-10B
(BOTTOM VIEW)
4/29
XC9242/XC9243 Series
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
All voltages are described based on the ground voltage of AGND and PGND.
(*1) Please connect PVIN pin and AVIN pin for use.
(*2) The maximum value should be either +7.0 or VPVIN+0.3 in the lowest.
(*3) It is measured when the two Lx pins (USP-10B No.1 and 10, SOP-8FD No.1 and 8) are tied up to each other.
PARAMETER SYMBOL RATINGS UNIT
PVIN Pin Voltage VPVIN
AVIN Pin Voltage VAVIN
-0.3 ~ +7.0(*1) V
CE Pin Voltage VCE -0.3 ~ +7.0 V
FB Pin Voltage VFB -0.3 ~ +7.0 V
Lx Pin Voltage VLx -0.3 ~ +7.0 or VPVIN +0.3 (*2) V
Lx Pin Current ILx ±6.0 (*3) A
USP-10B Pd 150 mW
Power Dissipation SOP-8FD Pd 300 mW
Operating Ambient Temperature Topr -40 ~ +85 ℃
Storage Temperature Tstg -55 ~ +125 ℃
5/29
XC9242/XC9243
Series
■ELECTRICAL CHARACTERISTICS
●XC9242/XC9243, fOSC=1.2MHz, Ta=25℃
PARAMETER SYMBOL CONDITIONS MIN TYP. MAX. UNIT CIRCUIT
FB Voltage VFB
VIN= 5.0V, VCE =5.0V
Voltage to start oscillation while
VFB=0.72V → 0.88V
0.784 0.800 0.816 V ③
Operating Voltage Range
VIN When connected to external components 2.7 - 6.0 V ①
Maximum Output Current
IOUTMAX VIN=VCE=5.0V (*1,*2)
When connected to external components 2.0 - - A ①
UVLO Voltage VUVLO VCE=5.0V, VFB=0.72V
Voltage which Lx pin holding ”L” level (*3) 2.00 - 2.68 V ③
Quiescent Current Iq V
IN=VCE=5.0V, VFB=0.88V - 41 78 μA ②
Stand-by Current ISTB V
IN=5.0V, VCE=0V, VFB=0.88V - 0.01 1.00 μA ②
Oscillation Frequency
fOSC VIN=VCE=5.0V, IOUT=300mA
When connected to external components 1020 1200 1380 kHz ①
PFM Switch Current
(*4) I
PFM VIN=VCE=4.0V, IOUT=1mA
When connected to external components - 280 - mA ①
PFM Duty Limit (*4) DTYLIMIT_PFM
VIN=VCE=2.7V, IOUT=1mA
When connected to external components - 180 250 % ①
Maximum Duty Limit DMAX V
IN=VCE=5.0V, VFB=0.72V 100 - - % ③
Minimum Duty Limit DMIN V
IN=VCE=5.0V, VFB=0.88V - - 0 % ③
Efficiency EFFI
VIN=VCE=5.0V, IOUT=500mA (*5)
RFB1=47kΩ, RFB2=15kΩ, CFB=330pF - 95 - % ①
LXSW”H”ON Resistance
RLxH V
IN=VCE=4.0V, VFB=0.72V (*6) - 0.11 0.21 Ω ④
LXSW”L”ON Resistance
RLxL - 0.12 0.30(*7) Ω -
LXSW”H” Leakage Current
ILeakH V
IN=5.0V, VCE=0V, VFB=0.88V, VLx=0V - 0.01 1.00(*8) μA ⑤
Current Limit ILIM V
IN=VCE=5.0V, VFB=0.72V (*9) - 4.0 - A ④
Output Voltage
Temperature
Characteristics
ΔVOUT/
(VOUT・Δtopr)
IOUT=100mA
-40℃≦To p r ≦85℃
When connected to external components
- ±100 - ppm/℃ ①
CE”H” Voltage VCEH VIN=5.0V, VFB=0.72V Applied voltage to VCE
Voltage changes Lx to “H” level 1.2 - VIN V ③
CE”L” Voltage VCEL VIN=5.0V, VFB=0.72V Applied to VCE Voltage
changes Lx to “L” level AGND - 0.4 V ③
CE”H” Current ICEH V
IN=5.0V, VCE=5.0V, VFB=0V -0.1 - 0.1 μA ⑤
CE”L” Current ICEL V
IN=5.0V, VCE=0V, VFB=0V -0.1 - 0.1 μA ⑤
FB”H” Current IFBH V
IN=5.0V, VCE=0V, VFB=5.0V -0.1 - 0.1 μA ⑤
FB”L” Current IFBL VIN=5.0V, VCE=0V, VFB=0V -0.1 - 0.1 μA ⑤
Soft-Start Time tSS VIN=5.0V, VCE=0V→5.0V, IOUT=1mA
When connected to external components 0.3 1.0 2.0 ms ①
Thermal Shutdown
Temperature TTSD - 150 - ℃ -
Hysteresis Width THYS - 20 - ℃ -
CL Discharge RDCHG V
IN=5.0V, VCE=0V, VFB=0.72V, VLx=1.0V 80 130 160 Ω ⑥
NOTE:
External Components: CIN1=20μF(ceramic), CIN2=1μF(ceramic), L=4.7μH(SLF7055T-4R7 TDK), CL=20μF(ceramic)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
Condition: Unless otherwise stated, ”H”=VIN ~ VIN - 1.2V, “L”=+ 0.1V ~ -0.1V
(*1) Mount conditions affect heat dissipation. Maximum output current is not guaranteed when TTSD starts to operate earlier.
(*2) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*3) These values include UVLO detect voltage, UVLO release voltage and hysteresis operating voltage range.
UVLO release voltage is defined as the VIN voltage which makes Lx pin “H”.
(*4) XC9242 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
(*5) EFFI = { ( output voltage×output current ) /( input voltage×input current) }×100
(*6) On resistance = (VIN – Lx pin measurement voltage) / 100mA
(*7) Design value
(*8) When temperature is high, a current of approximately 20μA (maximum) may leak.
(*9) Current limit denotes the level of detection at peak of coil current.
6/29
XC9242/XC9243 Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9242/XC9243, fOSC=2.4MHz, Ta=25℃
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT CIRCUIT
FB Voltage VFB
VIN= VCE =5.0V
Voltage to start oscillation while
VFB=0.72V → 0.88V
0.784 0.800 0.816 V ③
Operating Voltage Range
VIN When connected to external components 2.7 - 6.0 V ①
Maximum Output Current
IOUTMAX VIN=VCE=5.0V (*1,*2)
When connected to external components 2.0 - - A ①
UVLO Voltage VUVLO VCE=5.0V, VFB=0.72V
Voltage which Lx pin holding ”L” level(*3) 2.00 - 2.68 V ③
Quiescent Current Iq V
IN=VCE=5.0V, VFB=0.72V - 53 92 μA ②
Stand-by Current ISTB V
IN=5.0V, VCE=0V, VFB=0.88V - 0.01 1.00 μA ②
Oscillation Frequency
fOSC VIN=VCE=5.0V, IOUT=1000mA
When connected to external components 2040 2400 2760 kHz ①
PFM Switch Current
(*4)
IPFM VIN=VCE=6.0V, IOUT=1mA
When connected to external components - 680 - mA ①
PFM Duty Limit (*4) DTYLIMIT_PFM
VIN=VCE=2.7V, IOUT=1mA
When connected to external components - 180 250 % ①
Maximum Duty Limit DMAX V
IN=VCE=5.0V, VFB=0.72V 100 - - % ③
Minimum Duty Limit DMIN V
IN=VCE=5.0V, VFB=0.88V - - 0 % ③
Efficiency EFFI
VIN=VCE=5.0V, IOUT=500mA (*5)
RFB1=47kΩ, RFB2=15kΩ, CFB=330pF - 95 - % ①
LXSW”H”ON Resistance
RLXH V
IN=VCE=4.0V, VFB=0.72V (*6) - 0.11 0.21 Ω ④
LXSW”L”ON Resistance
RLXL - 0.120.30(*7) Ω -
LXSW”H” Leakage Current
ILeakH V
IN=5.0V, VCE=0V, VFB=0.88V, VLx=0V - 0.01 1.00(*8) μA ⑤
Current Limit ILIM V
IN=VCE=5.0V, VFB=0.72V (*9) - 4.0 - A ④
Output Voltage
Temperature
Characteristics
Δ
V
OUT
/
(V
OUT
・Δ
topr)
IOUT=100mA
-40℃≦To p r ≦85℃
When connected to external components
- ±100 - ppm/℃ ①
CE”H” Voltage VCEH VIN=5.0V, VFB=0.72V
Applied voltage to V
CE
Voltage changes Lx to “H” level
1.2 - VIN V ③
CE”L” Voltage VCEL VIN=5.0V, VFB=0.72V
Applied voltage to V
CE
Voltage changes Lx to “L” level
AGND - 0.4 V ③
CE”H” Current ICEH V
IN=5.0V, VCE=5.0V, VFB=0V -0.1 - 0.1 μA ⑤
CE”L” Current ICEL V
IN=5.0V, VCE=0V, VFB=0V -0.1 - 0.1 μA ⑤
FB”H” Current IFBH V
IN=5.0V,VCE=0V, VFB=5.0V -0.1 - 0.1 μA ⑤
FB”L” Current IFBL VIN=5.0V,VCE=0V, VFB=0V -0.1 - 0.1 μA ⑤
Soft-Start Time tSS VIN=5.0V, VCE=0V→5.0V, IOUT=1mA
When connected to external components 0.3 1.0 2.0 ms ①
Thermal Shutdown
Temperature TTSD - 150 - ℃ -
Hysteresis Width THYS - 20 - ℃ -
CL Discharge RDCHG V
IN=5.0V, VCE=0V, VFB=0.72V, VLx=1.0V 80 130 160 Ω ⑥
NOTE:
External Components: CIN1=20μF(ceramic), CIN2=1μF(ceramic), L=2.2μH(SLF7055T-2R2 TDK), CL=20μF(ceramic)
R
FB1=15kΩ, RFB2=30kΩ, CFB=1000pF
Condition: Unless otherwise stated, ”H”= VIN ~ VIN - 1.2V, “L”= + 0.1V ~ -0.1V
(*1) Mount conditions affect heat dissipation. Maximum output current is not guaranteed when TTSD starts to operate earlier.
(*2) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*3) These values include UVLO detect voltage, UVLO release voltage and hysteresis operating voltage range.
UVLO release voltage is defined as the VIN voltage which makes Lx pin “H”.
(*4) XC9242 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
(*5) EFFI = { ( output voltage×output current ) /( input voltage×input current) }×100
(*6) On resistance = (VIN – Lx pin measurement voltage) / 100mA
(*7) Design value
(*8) When temperature is high, a current of approximately 20μA (maximum) may leak.
(*9) Current limit denotes the level of detection at peak of coil current.
7/29
XC9242/XC9243
Series
■TYPICAL APPLICATION CIRCUIT
●XC9242/XC9243 Series
External Components
<Output Voltage Setting>
Output voltage can be set by adding external split resistors. Output voltage is determined by the following equation, based on the values of
RFB1 and RFB2. The sum of RFB1 and RFB2 should normally be 100kΩ or less. Output voltage range is 0.9V~5.5V by a 0.8V (±2.0%)
reference voltage. When input voltage (VIN) ≦setting output voltage, output voltage (VOUT) can not output the power more than input voltage
(VIN).
VOUT = 0.8 x (RFB1 + RFB2) / RFB2
The value of CFB, speed-up capacitor for phase compensation, should be fZFB= 1 / (2 x
π
x
CFB x RFB1) which is equal to 10kHz. Adjustments
are required from 1kHz to 10kHz depending on the application, value of inductance (L), and value of load capacitance (CL).
[Example of calculation]
When RFB1=47kΩ, RFB2=15kΩ, VOUT=0.8×(47kΩ+15kΩ) / 15kΩ =3.3V
When CFB=330pF, fzfb= 1/(2
×π×
330pF
×
47 kΩ) =10.26kHz
1.2MHz 2.4MHz
L: 4.7μH(SLF7055T-4R7) L: 2.2μH(SLF7055T-2R2)
4.7μH(SPM6530T-4R7) 2.2μH(SPM6530T-2R2)
CIN1: 20μF (LMK212ABJ106KG 10V/10μF x2) CIN1:20μF (LMK212ABJ106KG 10V/10μF x2)
CIN2 1μF (LMK107BJ105KA 10V/1μF x1) CIN2 1μF (LMK107BJ105KA 10V/1μF x1)
CL: 20μF (LMK212ABJ106KG 10V/10μF x2) CL: 20μF (LMK212ABJ106KG 10V/10μF x2)
VOUT RFB1 RFB2 CFB VOUT RFB1 RFB2 CFB
(V) (kΩ) (kΩ) (pF) (V) (kΩ) (kΩ) (pF)
1.0 7.5 30 2000 2.5 51 24 300
1.2 15 30 1000 3.0 33 12 470
1.5 26 30 560 3.3 47 15 330
1.8 30 24 510 5.0 43 8.2 390
8/29
XC9242/XC9243 Series
■OPERATIONAL DESCRIPTION
The XC9242/XC9243 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase
compensation circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel MOS switching transistor for the
synchronous switch, current limiter circuit, UVLO circuit and others. (See the block diagram above.) The series ICs compare, using the error
amplifier, the voltage of the internal voltage reference source with the feedback voltage from the FB pin. Phase compensation is performed on
the resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM
comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers
the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to
ensure stable output voltage. The current feedback circuit monitors the P-channel MOS driver transistor current for each switching operation,
and modulates the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low
ESR capacitor such as a ceramic capacitor is used ensuring stable output voltage.
<Reference Voltage Source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 1.2MHz or 2.4MHz.
Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal
circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by
the external split resistors, R1 and R2. When a voltage lower than the reference voltage is fed back, the output voltage of the error amplifier
increases. The gain and frequency characteristics of the error amplifier output are fixed internally to deliver an optimized signal to the mixer.
<Current Limit>
The XC9242/XC0243 series includes a fold-back circuit, which aids the operation of the current limiter and circuit protection. The
XC9242/XC9243 series monitors the current flowing through the P-channel MOS driver transistor
①When current flowing through P-channel MOS driver transistor reaches current limit ILIM, the current limiter circuit operates to limit the
inductor current ILX. If this state continues, the fold-back circuit operates and limit the output current in order to protect the IC from
damage.
②The output voltage is automatically resumed if the load goes light. When it is resumed, the soft-start function operates.
9/29
XC9242/XC9243
Series
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 2 4 6 8 101214161820
Discharge Time: t(ms)
Output Voltage: V
OUT
(V)
VOUT = 1.2V
VOUT = 1.8V
VOUT = 3.3V
Output Voltage Dischage characteristics
Rdischg = 130Ω(TYP.)
V
OUT
=1.2V
V
OUT
=1.8V
V
OUT
=3.3V
C
L
=20μF
■OPERATIONAL DESCRIPTION (Continued)
<Thermal Shutdown>
For protection against heat damage, the thermal shutdown function monitors chip temperature. When the chip’s temperature reaches
150OC (TYP.), the thermal shutdown circuit starts operating and the P-channel driver transistor will be turned off. At the same time, the output
voltage decreases. When the temperature drops to 130OC (TYP.) after shutting off the current flow, the IC performs the soft start function to
initiate output startup operation.
< Function of CE pin >
The XC9242/9243 series will enter into stand-by mode by inputting a low level signal to the CE pin. During a stand-by mode, the current
consumption of the IC becomes 0μA (TYP.). The IC starts its operation by inputting a high level signal to the CE pin. The input of the CE pin
is a CMOS input and the sink current is 0μA (TYP.).
<UVLO>
When the VIN pin voltage becomes 2.4V (TYP.) or lower, the P-channel MOS driver transistor output driver transistor is forced OFF to
prevent false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 2.68V (MAX.) or higher,
switching operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate output startup operation.
The soft start function operates even when the VIN pin voltage falls momentarily below the UVLO operating voltage. The UVLO circuit does
not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in operation.
<Soft Start>
The XC9242/XC9243 series provide 1.0ms (TYP). Soft start time is defined as the time interval to reach 90% of the output voltage from the
time when the VCE is turned on.
<CL High Speed Discharge>
The XC9242/XC9243 series can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which
enables a whole IC circuit put into OFF state, is inputted via the N-channel MOS switch transistor located between the LX pin and the VGND pin.
When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction.
Discharge time of the output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant
of a CL auto-discharge resistance value [R] and an output capacitor value (CL) as τ(τ=C x R), discharge time of the output voltage after
discharge via the N-channel transistor is calculated by the following formulas.
V = VOUT(E)
×
e -t /
τ
or t =
τ
ln (VOUT(E) /V)
V : Output voltage after discharge
V
OUT(E) : Output voltage
t: Discharge time
τ: CL×RDCHG
C
L : Capacitance of Output capacitor
R
DCHG : CL auto-discharge resistance
RDCHG
10/29
XC9242/XC9243 Series
■OPERATIONAL DESCRIPTION (Continued)
<PFM Switch Current> (*1)
In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the P-channel MOS driver transistor on. In this
case, time that the P-channel MOS driver transistor is kept on (tON) can be given by the following formula. Please refer to IPFM①
tON = L × IPFM / (VIN - VOUT)
< PFM Duty Limit > (*1)
In PFM control operation, the PFM duty limit (DTYLIMIT_PFM) is set to 200% (TYP.). Therefore, under the condition that the duty increases (e.g.
the condition that the step-down ratio is small), it’s possible for P-channel MOS driver transistor to be turned off even when coil current doesn’t
reach to IPFM. Please refer to IPFM②
(*1) XC9242 Series is excluded.
Fig. Fig.
11/29
XC9242/XC9243
Series
■NOTE ON USE
1. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising phenomenon,
the IC is liable to malfunction should the ratings be exceeded.
2. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current.
Please wire the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible.
3. When the difference between VIN and VOUT is large in PWM control, very narrow pulses will be outputted, and there is the possibility that
some cycles may be skipped completely.
4. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and there is the
possibility that some cycles may be skipped completely.
5. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when dropout voltage or
load current is high, current limit starts operation, and this can lead to instability. When peak current becomes high, please adjust the coil
inductance value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula:
Ipk = (V
IN-VOUT)×OnDuty / (2×L×fOSC) + IOUT
L : Coil Inductance Value
f
OSC: Oscillation Frequency
6. Use of the IC at voltages below the recommended voltage range may lead to instability.
7. This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device.
8. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak current of the
P-channel driver transistor.
9. The XC9242/XC9243 uses fold-back circuit limiter. However, fold-back may become “droop” affected by the wiring conditions. Care
must be taken especially for CIN distance and position.
10. If CL capacitance reduction happens such as in the case of low temperature, the IC may enter unstable operation. Care must be taken for
CL capacitor selection and its capacitance value.
1ch V
Lx
：2.0V/diｖ
2ch V
OUT
：50mV/diｖ
Ta = - 50℃
V
IN
= 3.6V, V
OUT
= 0.9V, f
OSC
= 2.4MHz
C
IN
= 20μF(Ceramic)
C
L
= 14.7μF(Ceramic)
I
OUT
= 300mA
11. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
12/29
XC9242/XC9243 Series
■
NOTE ON USE (Continued)
●Instructions of pattern layouts
1. In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the PVIN & PGND
pins and the AVIN & AGND pins.
2. Make sure to avoid noise from the PVIN pin to the AVIN pin. Please connect the AGND pin and PGND pin in the shortest length for wiring.
3. Please mount each external component as close to the IC as possible.
4. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
5. This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and N-channel MOS drive
r
transistors.
6. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time o
f
switching may result in instability of the IC.
●PCB (USP-10B)●Typical Application Circuit (USP-10B)
1) XC9242/XC9243 Series1) XC9242/XC9243 Series
1st Layer(USP-10B) 2
nd Layer(USP-10B)
3rd Layer(USP-10B)4th Layer(USP-10B)
US P-1 0B
13/29
XC9242/XC9243
Series
■
NOTE ON USE (Continued)
1st Layer(SOP-8FD) 2
nd Layer(SOP-8FD)
3rd Layer(SOP-8FD) 4
th Layer(SOP-8FD)
●PCB（SOP8-FD)Typical Application Circuit（SOP8-FD)
1) XC9242/XC9243 Series1) XC9242/XC9243 Series
14/29
XC9242/XC9243 Series
■TEST CIRCUITS
15/29
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
(2) Output Voltage vs. Output Current
XC9242B08C (V
OUT
=1.2V)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000 10000
Output Current: IOUT (mA)
Efficiency: EFFI (%)
V
IN
=3.7V
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
V
IN
=5.0V
XC9243B08C (V
OUT
=1.2V)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000 10000
Output Current: IOUT (mA)
Efficiency: EFFI (%)
V
IN
=3.7V
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
V
IN
=5.0V
XC9242B08C (V
OUT
=1.2V)
1
1.1
1.2
1.3
1.4
0.1 1 10 100 1000 10000
Output Current: IOUT (mA)
Output Voltage: VOUT (V)
V
IN
=3.7V, 5.0V
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
XC9242B08D (V
OUT
=1.2V)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000 10000
Output Current: IOUT (mA)
Efficiency: EFFI (%)
V
IN
=3.7V
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
R
FB1
=
15kΩ, R
FB2
=
30kΩ, C
FB
=
1000pF
V
IN
=5.0V
XC9243B08D (V
OUT
=1.2V)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000 10000
Output Current: IOUT (mA)
Efficiency: EFFI (%)
V
IN
=3.7V
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
R
FB1
=
15kΩ, R
FB2
=
30kΩ, C
FB
=
1000pF
V
IN
=5.0V
XC9243B08C (V
OUT
=1.2V)
1
1.1
1.2
1.3
1.4
0.1 1 10 100 1000 10000
Output Current: IOUT (mA)
Output Voltage: VOUT (V)
V
IN
=3.7V, 5.0V
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
R
FB1
=
15kΩ, R
FB2
=
30kΩ, C
FB
=
1000pF
16/29
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Output Current
(3) Ripple Voltage vs. Output Current
XC9242B08C (V
OUT
=1.2V)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000 10000
Output Current: I
OUT
(mA)
Ripple Voltage: Vr(mV)
V
IN
= 3.7V
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
V
IN
= 5.0V
XC9243B08C (V
OUT
=1.2V)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000 10000
Output Current: I
OUT
(mA)
Ripple Voltage: Vr(mV)
V
IN
= 3.7V
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
R
FB1
=15kΩ, R
FB2
=30kΩ, C
FB
=1000pF
V
IN
= 5.0V
XC9242B08D (V
OUT
=1.2V)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000 10000
Output Current: I
OUT
(mA)
Ripple Voltage: Vr(mV)
V
IN
= 5.0V, 3.7V
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
XC9243B08D (V
OUT
=1.2V)
1
1.1
1.2
1.3
1.4
0.1 1 10 100 1000 10000
Output Current: I
OUT
(mA)
Output Voltage: V
OUT
(V)
V
IN
=3.7V, 5.0V
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
XC9242B08D (V
OUT
=1.2V)
1
1.1
1.2
1.3
1.4
0.1 1 10 100 1000 10000
Output Current: IOUT (mA)
Output Voltage: VOUT (V)
V
IN
=3.7V, 5.0V
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
XC9243B08D (V
OUT
=1.2V)
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10 100 1000 10000
Output Current: I
OUT
(mA)
Ripple Voltage: Vr(mV)
V
IN
= 3.7V
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
V
IN
= 5.0V
17/29
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) FB Voltage vs. Ambient Temperature (5) UVLO Voltage vs. Ambient Temperature
(6) Quiescent Current vs. Ambient Temperature
(7) Stand-by Current vs. Ambient Temperature
XC9242B08C
0.72
0.74
0.76
0.78
0.80
0.82
0.84
0.86
0.88
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Feedback Voltage: V
FB
(V)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08C
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Quiescent Current: Iq (μA)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08C
0.0
1.0
2.0
3.0
4.0
5.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Standby Current: I
STB
(μA)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08C
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
UVLO Voltage: UVLO (V)
UVLO
XC9242B08D
0
10
20
30
40
50
60
70
80
90
100
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Quiescent Current: Iq (μA)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08D
0.0
1.0
2.0
3.0
4.0
5.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Standby Current: I
STB
(μA)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
18/29
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Oscillation Frequency vs. Ambient Temperature
(9) PFM Switching Current vs. Ambient Temperature
(10) PFM Duty Limit vs. Ambient Temperature
XC9242B08C
600
800
1000
1200
1400
1600
1800
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Oscillation Freqency: f
OSC
(MHz)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9243B08C
0
100
200
300
400
500
600
700
800
900
1000
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
PFM SW Current: I
PFM
(mA)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08D
1800
2000
2200
2400
2600
2800
3000
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Oscillation Freqency: f
OSC
(MHz)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9243B08D
0
200
400
600
800
1000
1200
1400
1600
1800
2000
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
PFM SW Current: I
PFM
(mA)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9243B08Ｃ
0
50
100
150
200
250
300
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
PFM Duty Limit: DTY
LIMIT_PFM
(%)
XC9243B08D
0
50
100
150
200
250
300
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
PFM Duty Limit: DTYLIMIT_PFM (%)
19/29
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(11) Pch Driver ON Resistance vs. Ambient Temperature (12) Nch Driver ON Resistance vs. Ambient Temperature
(13) LxSW”H” Leakage Current vs. Ambient Temperature (14) Current Limit vs. Ambient Temperature
(15) CE”H” Voltage vs. Ambient Temperature (16) CE”L” Voltage vs. Ambient Temperature
XC9242B08C
0
50
100
150
200
250
300
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Lx SW Pch ON Resistance: R
LxH
(mΩ)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08C
0.0
1.0
2.0
3.0
4.0
5.0
-50 -25 0 25 50 75 100
Ambient Temperature : Ta (℃)
LxSW”H” Leakage Current: I
Lx
(μA)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08C
0
50
100
150
200
250
300
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Lx SW Nch ON Resistance: R
LxL
(mΩ)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
CE”H” Voltage V
CEH
(V)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
CE”L” Voltage V
CEL
(V)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08C
2000
3000
4000
5000
6000
7000
8000
-50 -25 0 25 50 75 100
Ambient Temperature : Ta (℃)
Current Limit: I
LIM
(mA)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
20/29
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(17) Soft-Start Time vs. Ambient Temperature (18) C
L
Discharge Resistance vs. Ambient Temperature
XC9242B08C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Soft-Start Time: t
SS
(ms)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
XC9242B08C
0
50
100
150
200
250
300
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
C
L
Discharge Resistance: R
DCHG
(Ω)
VIN = 6.0V
VIN = 5.0V
VIN = 4.0V
21/29
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(19) Load Transient Response
XC9242B08C
L=4.7μH(SLF7055),CIN1=20μF(LMK212ABJ106KGx2)
CIN2=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
V
IN
= 5.0V, V
OUT
= 1.2V, I
OUT
= 1mA ⇒ 1.5ＡV
IN
= 5.0V, V
OUT
= 1.2V, I
OUT
= 1.5A ⇒ 1mＡ
V
OUT
: 100mV/div
I
Lx
: 1.0A/div
V
OUT
: 200mV/div
I
Lx
: 1.0A/div
XC9243B08C
L=4.7μH(SLF7055),CIN1=20μF(LMK212ABJ106KGx2)
CIN2=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
V
IN
= 5.0V, V
OUT
= 1.2V, I
OUT
= 1mA ⇒ 1.5ＡV
IN
= 5.0V, V
OUT
= 1.2V, I
OUT
= 1.5A ⇒ 1mＡ
V
OUT
: 100mV/div
I
Lx
: 1.0A/div
V
OUT
: 200mV/div
I
Lx
: 1.0A/div
22/29
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(19) Load Transient Response
XC9242B08D
L=2.2μH(SLF7055),CIN1=20μF(LMK212ABJ106KGx2)
CIN2=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
V
IN
= 5.0V, V
OUT
= 1.2V, I
OUT
= 1mA ⇒ 1.5Ａ V
IN
= 5.0V, V
OUT
= 1.2V, I
OUT
= 1.5A ⇒ 1mＡ
V
OUT
: 100mV/div
I
Lx
: 1.0A/div
V
OUT
: 200mV/div
I
Lx
: 1.0A/div
XC9243B08D
L=2.2μH(SLF7055),CIN1=20μF(LMK212ABJ106KGx2)
CIN2=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
V
IN
= 5.0V, V
OUT
= 1.2V, I
OUT
= 1mA ⇒ 1.5ＡV
IN
= 5.0V, V
OUT
= 1.2V, I
OUT
= 1.5A ⇒ 1mＡ
V
OUT
: 200mV/div
I
Lx
: 1.0A/div
I
Lx
: 1.0A/div
V
OUT
: 100mV/div
23/29
XC9242/XC9243
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(20) Frequency Response
Test Condition:
Measurement equipment:NF FRA5097 Version:3.00
OSC amplitude=20.0mVpeak OSC.Dcbias=0.00V
OSC waveform:SIN, Sweep minimum frequency=1Hz
Sweep maximum frequency=15MHz
Sweep resolution=300steps/sweep
Integration period=100cycle, Delay time=0cycle
Order of harmonic analysis=1, Measure mode:CH1&CH2
Auto integration:OFF, Amplitude compression:OFF
Slow sweep:OFF
XC9242B08CDR
L=4.7μH(SLF7055), CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN=5.0V, VCE=VIN, VOUT=1.2V, IOUT=1mA
L=4.7μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN=5.0V, VCE=VIN, VOUT=1.2V, IOUT=1000mA
24/29
XC9242/XC9243 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(20) Frequency Response (Continued)
Test Condition:
Measurement equipment:NF FRA5097 Version:3.00
OSC amplitude=20.0mVpeak OSC.Dcbias=0.00V
OSC waveform:SIN, Sweep minimum frequency=1Hz
Sweep maximum frequency=15MHz
Sweep resolution=300steps/sweep
Integration period=100cycle, Delay time=0cycle
Order of harmonic analysis=1, Measure mode:CH1&CH2
Auto integration:OFF, Amplitude compression:OFF
Slow sweep:OFF
XC9242B08DDR
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN=5.0V, VCE=VIN, VOUT=1.2V, IOUT=1mA
L=2.2μH(SLF7055),CIN=20μF(LMK212ABJ106KGx2)
CIN=1μF(LMK107BJ105KAx1),CL=20μF(LMK212ABJ106KGx2)
RFB1=15kΩ, RFB2=30kΩ, CFB=1000pF
VIN=5.0V, VCE=VIN, VOUT=1.2V, IOUT=1000mA
25/29
XC9242/XC9243
Series
■PACKAGING INFORMATION
●USP-10B (unit: mm)
●USP-10BReference Pattern Layout (unit: mm)●USP-10BReference Metal Mask Design (unit: mm)
12345
9 876
2.9±0.05
10
2.5±0.05
0.125 0.15
0.2±0.05
0.2±0.05
0.2±0.05
0.45±0.05
0.45±0.05
0.1±0.03
(0.65) (0.65) (0.5) (0.5)
0.1±0.03
1pin INDENT
(0.45) (0.2)
0.30
0.55 0.55
1.051.05
0.25
0.475
0.125
1.25
1.35
1.25
1.35
0.2375
0.675 0.4375
0.2
0.5
0.25
26/29
XC9242/XC9243 Series
■PACKAGING INFORMATION (Continued)
●SOP-8FD (unit: mm)
●SOP-8FDReference Pattern Layout (unit: mm)●SOP-8FDReference Metal Mask Design (unit: mm)
0.6
3.3
2.41.62
1.27
4.88
1.27
4.88
0.5
1.0 1.0
2.31.52
3.9±0.1
6.0±0.2
0.4 MIN
0～0.11
（1.45）
1.55±0.2
(2.4)
27/29
XC9242/XC9243
Series
8
7
6
1
2
3
4
5
⑤ ⑥④
② ③①
9
10
■MARKING RULE
① represents product series
② represents product function
③ represents reference voltage
④ represents oscillation frequency
⑤⑥ represents production lot number
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to AZ, B1 to ZZ repeated
(G, I, J, O, Q, W excluded)
*No character inversion used.
MARK PRODUCT SERIES
B XC9242******-G
C XC9243******-G
MARK FUNCTION PRODUCT SERIES
B CL High Speed Discharge XC924*B*****-G
MARK OUTPUT VOLTAGE (V) PRODUCT SERIES
8 0.8 XC924*B08***-G
MARK OSCILLATION FREQUENCY (MHz) PRODUCT SERIES
C 1.2 XC924*B**C**-G
D 2.4 XC924*B**D**-G
●USP-10B
28/29
XC9242/XC9243 Series
■MARKING RULE (Continued)
① represents product series
② represents product function
③ represents oscillation frequency
④⑤ represents production lot number
01 to 09, 0A to 0Z, A1 to A9, AA to AZ, B1 to ZZ repeated
(G, I, J, O, Q, W excluded)
*No character inversion used.
MARK PRODUCT SERIES
B XC9242******-G
C XC9243******-G
MARK FUNCTION PRODUCT SERIES
B CL High Speed Discharge XC924*B*****-G
MARK OSCILLATION FREQUENCY (MHz) PRODUCT SERIES
C 1.2 XC924*B**C**-G
D 2.4 XC924*B**D**-G
●SOP-8FD
29/29
XC9242/XC9243
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
