1-DH1 F-219 QTE-014-01-F-D-DP-A (R) QTE-040-01-L-D-A QTE-060-01-L-D-A (0.80 mm) .0315" QTE SERIES HIGH-SPEED GROUND PLANE HEADER Integral metal plane for power or ground Board Mates: QSE SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QTE Standard stack heights from 5 mm to 25 mm Cable Mates: EQCD, EQDP (See Also Available Note) Insulator Material: Liquid Crystal Polymer Terminal Material: Phosphor Bronze Plating: Au or Sn over 50 " (1.27 m) Ni Current Rating: Contact: 2 A per pin (2 pins powered) Ground Plane: 23 A per ground plane (1 ground plane powered) Operating Temp Range: -55 C to +125 C Voltage Rating: 225 VAC mated with QSE & 5 mm Stack Height Max Cycles: 100 RoHS Compliant: Yes Standoffs: SO POWER/SIGNAL APPLICATION Compatible with UMPT/UMPS for flexible two-piece power/signal solutions PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (020-060) Board Stacking: For applications requiring more than two connectors per board contact ipg@samtec.com QTE-D/QSE-D or QTE-DP/QSE-DP @ 5 mm Mated Stack Height Rating based on Samtec reference channel.For full SI performance data visit Samtec.comor contact SIG@samtec.com PINS PER ROW NO. OF PAIRS QTE -020, -040, -060 (40 total pins per bank = -D) RECOGNITIONS -014, -028, -042 ALSO AVAILABLE Note: Some lengths, styles and options are non-standard, non-returnable. QTE-DP/QSE-DP G b p s Specify LEAD STYLE from chart -F = Gold Flash on Signal Pins and Ground Plane, Matte Tin on tails -L FILE NO. E111594 01 02 (0.80) .0315 (0.20) .008 A *Note: -C Plating passes 10 year MFG testing -L G b p s OTHER OPTION A TYPE -K -D = (7.00 mm) .275" DIA Polyimide Film Pick & Place Pad = Single-Ended -D-DP = Differential Pair (-01 only) -TR = Tape & Reel Packaging (N/A -05 & -07 lead style) -L -C* = Electro-Polished Selective (7.11) .280 50 " (1.27 m) min Au over 150" (3.81 m) Ni on Signal Pins in contact area, 10 " (0.25 m) min Au over 50 " (1.27 m) Ni on Ground Plane in contact area, Matte Tin over 50" (1.27 m) min Ni on all solder tails (0.76) .030 (0.89) .035 DIA HIGH MATING CYCLES = 10 " (0.25 m) Gold on Signal Pins and Ground Plane, Matte Tin on tails -D = (No. of Positions per Row/20) x (20.00) .7875 (20.00) .7875 (5.97) .235 EXTENDED LIFE PRODUCT 14 28 PLATING OPTION -D-DP = (No. of Positions per Row/14) x (20.00) .7875 * 15 mm, 22 mm and 30 mm stack height * 30 " (0.76 m) Gold (Specify -H plating for Data Rate cable mating applications.) * Edge Mount, Guide Posts, Screw Down & Friction Lock * 56 (-DP), 80, 100 positions per row * Retention Option QTE-D/QSE-D LEAD STYLE (14 pairs per bank = -D-DP) For complete scope of recognitions see www.samtec.com/quality (MOQ Required) 10 YEAR MFG WITH 50 " GOLD HIGH-SPEED CHANNEL PERFORMANCE (0.64) .025 = Latching Option (N/A on -042 & -060 positions) QTE LEAD STYLE -01 -02 -03 -04 -05 -07 -09 HEIGHT WITH QSE* (4.27) .168 (5.00) .197 (7.26) .286 (8.00) .315 (10.27) .404 (11.00) .433 (15.25) .600 (16.00) .630 (18.26) .718 (19.00) .748 (24.24) .954 (25.00) .984 (13.26) .522 (14.00) .551 *Processing conditions will affect mated height. See SO Series for board space tolerances Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM A All parts within this catalog are built to Samtec's specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.