1
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specifi cations are subject to change
FEATURES
• CLASS II DIELECTRIC, TEMPERATURE STABLE
• EXCELLENT FREQUENCY CHARACTERISTICS, NON-LINEAR
CAPACITANCE CHANGE
• HIGHER CAPACITANCE THAN NPO
• NICKEL BARRIER TERMINATIONS AND EXCELLENT
MECHANICAL STRENGTH
NMC Series X7R
Multilayer Ceramic Chip Capacitors
NMC 0805 X7R 102 K 50 TRP or TRPLP 3K F
RoHS Compliant
Optional Reel Qty (3K=3,000pcs)
Tape & Reel (Embossed Plastic Carrier)
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, fi rst 2 digits are
signifi cant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
Series
PART NUMBER SYSTEM
Capacitance Range 47pF ~ 0.82μF (see high CV datasheet for higher capacitance values)
Capacitance Tolerance ±5% (J), ±10% (K), ±20% (M)
Operating Temperature Range -55°C ~ +125°C
Temperature Characteristics ±15%Δ max. over temperature range (with 0 Vdc applied)
Rated Voltages 10Vdc, 16Vdc, 25Vdc, 35Vdc, 50Vdc (see NMC-H Series for higher voltages)
Dissipation Factor 2.5% max. (50Vdc, 100Vdc); 3.5% max. (16Vdc, 25Vdc) 5% max. (10Vdc)
@ 1.0Vrms and 1KHz, +25°C
insulation Resistance 10,000Megohms min. or 500Megohm/μF min. whichever is less @ +25°C
Dielectric Withstanding Voltage 250% of Rated Voltage for 5 ±1 seconds, 50mA maximum current
Test Conditions (EIA-198-2E) 1KHz, 1.0V ±0.2Vrms
Temperature °C
10000
1000
100
10
10 25 100 125
Minimum Insulation Resistance
vs. Temperature
Insulation Resistance
(Ω Farads)
Impedance vs. Frequency - X7R
Frequency (MHz)
Impedance Ω
% Dissipation Factor vs. Temperature
Temperature °C
% Dissipation Factor
Typical X7R Temperature Coeffi cient
Temperature °C
% Capacitance Change
Voltage Coeffi cient of Capacitance - X7R
DC Volts Applied
% Capacitance Change
*See Part Number System for Details
EAR
S
S
f
RoHS
Compliant
Includes all homogeneous materials
2
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specifi cations are subject to change
NMC Series X7R
Multilayer Ceramic Chip Capacitors
X7R CAPACITOR SIZE CHART (mm)
EIA Case Size 0201 0402 0603 0805
Length (L) 0.6±0.03 1.0±0.05 1.6±0.15 2.0±0.2
Width (W) 0.3±0.03 0.5±0.05 0.8±0.15 1.25±0.2
Thickness max. (T) 0.3±0.03 0.6 1.0 1.35
Termination Width (P) 0.15±0.05 0.2±0.1 0.12 ~ 0.51 0.25 ~ 0.71
Capacitance Working Voltage (Vdc)
16 25 50 10 16 25 50 10 16 25 50 100 10 16 25 50 100
47pF ~ 91pF
100pF ~ 470pF
510pF
560pF
620pF
680pF
750pF
820pF
910pF
0.001μF
0.0012μF
0.0015μF
0.0018μF
0.0022μF
0.0027μF
0.0030μF
0.0033μF
0.0039μF
0.0047μF
0.0056μF
0.0068μF
0.0075μF
0.0082μF
0.01μF
0.012μF
0.015μF
0.018μF
0.022μF
0.033μF
0.039μF
0.047μF
0.056μF
0.068μF
0.082μF
0.1μF*
0.15μF***
0.18μF***
0.22μF***
0.33μF***
0.39μF****
0.47μF****
0.56μF***
0.68μF***
0.82μF***
*1.45mm maximum thickness
See NMC High CV series for values above 0.82μF
(CONSULT FACTORY
FOR CAPACITANCE
VALUES NOT LISTED)
PP
L
W
T
100% Sn over Ni barrier
3
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specifi cations are subject to change
NMC Series X7R
Multilayer Ceramic Chip Capacitors
X7R CAPACITOR SIZE CHART (mm)
EIA Case Size 1206 1210 1812 2225
Length (L) 3.2±0.2 3.2±0.2 4.5±0.3 5.7±0.4
Width (W) 1.6±0.2 2.5±0.2 3.2±0.25 6.35±0.25
Thickness max. (T) 1.80 1.80 1.8 1.80
Termination Width (P) 0.25 ~ 0.71 0.25~0.75 0.25 ~ 0.75 0.25 ~ 1.02
Capacitance Working Voltage (Vdc)
10 16 25 50 100 10 16 25 35 50 100 10 16 25 50 100 25 50 100
150pF ~ 910pF
0.001
0.0012μF
0.0015μF
0.0018μF
0.0022μF
0.0027μF
0.0033μF
0.0036μF
0.0039μF
0.0043μF
0.0047μF
0.0056μF
0.0068μF
0.0075μF
0.0082μF
0.01μF
0.012μF
0.015μF
0.018μF
0.022μF
0.027μF
0.033μF
0.036μF
0.039μF
0.043μF
0.047μF
0.056μF
0.068μF
0.082μF
0.1μF
0.12μF
0.15μF
0.18μF
0.22μF
0.27μF
0.33μF
0.39μF
0.47μF
0.56μF
0.68μF
0.82μF**
* 2.20mm maximum thickness
See NMC High CV series for values above 0.82μF
PP
L
W
H
100% Sn over Ni barrier
4
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Specifi cations are subject to change
Taping Specifi cations
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
REEL DIMENSIONS (mm)
7 INCH REEL QUANTITIES*
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
Notes:
1. Specifi cations are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type AoBoWF E P1 P0D0
T1
max.
T2
max.
Mounting
Hole
01005 0.25 ± 0.04 0.45 ± 0.04
8.0 ± 0.3 3.5 ± 0.05 1.75 ± 0.1
2.0 ± 0.05
4.0 ± 0.1 1.5
+0.1/-0.0
0.27 0.36
Angular
Punch
Hole
0201 0.37 ± 0.03 0.67 ± 0.05 0.45 0.80
0402 0.65 ± 0.05 1.15 ± 0.05
1.1 1.4
0603 1.1 ± 0.2 1.9 ± 0.2
4.0 ± 0.100805 1.65 ± 0.2 2.4 ± 0.2
1206 2.0 ± 0.2 3.6 ± 0.2
Size 01005 0201 0402 0603 0805 1206 1210 1812
Tape Size 8mm 8mm 8mm 8mm 8mm 8mm 8mm 12mm
Min. Qty
Per Reel 20,000 20,000 10,000 4,000 4,000 4,000 2,000 1,000
Max. Qty
Per Reel 20,000 20,000 10,000 4,000 5,000 5,000 5,000 2,000
Multilayer Ceramic Chip Capacitors
Reel Diameter (A) B C D T max.
7” (178 ± 2.0)
13 ± 0.5
50 min.
21 ± 1.0
8.4 +1.0/-0
(1812 case size
12.4 +2.0/-0)
10” (250 ± 2.0) 100 ± 1.0
13” (330 ± 2.0) 100 ± 1.0
C
B
T
A
REEL
D
Tape Size W F E P0P2D K max. T max. P
8mm 8.0 ± 0.2 3.5 ± 0.05 1.75 ± 0.10 4.0 ± 0.1 2.0 ± 0.5 1.5 +0.1
-0.0 3.0 2.0 4.0 ± 0.1
12mm 12 ± 0.2 5.5 ± 0.05 4.5 8.0 ± 0.1
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
CARRIER TAPE MATERIAL
EMBOSSED PLASTIC CARRIER TAPE
K
T
DP
o
W
F
A
o
P
B
o
E
P
2
See notes 2 & 3 regarding dimensions
Ao and Bo
t2
t1
DP
o
W
F
A
o
P1
Component
Pitch
B
o
E
PUNCHED CARRIER TAPE
