Document Number: 28722 For technical questions, contact: filmresistorsleaded@vishay.com www.vishay.com
Revision: 06-Aug-10 41
SFR16S/25/25H
Standard Metal Film Leaded Resistors Vishay BCcomponents
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with
IEC 60115-1 specification, category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category temperature; damp heat, steady state, test
duration: 56 days).
The tests are carried out in accordance with IEC 60068-2-xx
test method under standard atmospheric conditions
according to IEC 60068-1, 5.3.
In the Test Procedures and Requirements table, tests and
requirements are listed with reference to the relevant clauses
of IEC 60115-1 and IEC 60068-2-xx test methods. A short
description of the test procedure is also given. In some in-
stances deviations from the IEC recommendations were
necessary for our method of specifying. All soldering tests
are performed with mildly activated flux.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2-
TEST
METHOD
TEST PROCEDURE
RESISTANCE
RANGE
REQUIREMENTS
SFR16S SFR25 SFR25H
4.16 Robustness of
terminations:
4.16.2 21 (Ua1) Tensile all
samples
Ø 0.45 mm, load 5 N; 10 s
Ø 0.58 mm, load 10 N; 10 s Number of failures < 10 x 10-6
4.16.3 21 (Ub)
Bending half
number of
samples
Ø 0.45 mm, load 2.5 N; 4 x 90°
Number of failures < 10 x 10-6
Ø 0.58 mm, load 5 N; 4 x 90°
4.16.4 21 (Uc) Torsion other half
of samples
3 x 360°
in opposite directions
No damage
ΔR max.: ± (0.25 % R + 0.05 Ω)
4.17 20 (Ta) Solderability
2 s; 235 °C:
Solder bath method; SnPb40
3 s; 245 °C:
Solder bath method;
SnAg3Cu0.5
Good tinning (≥ 95 % covered);
no damage
Solderability
(after aging)
8 h steam or 16 h 155 °C;
leads immersed 6 mm;
for 2 s at 235 °C: Solder bath
(SnPb40)
for 3 s at 245 °C: Solder bath
(SnAgCu0.5) method
Good tinning (≥ 95 % covered);
no damage
4.18 20 (Tb) Resistance to
soldering heat
Thermal shock:
10 s; 260 °C; 3 mm from body ΔR max.: ± (0.25 % R + 0.05 Ω)
4.19 14 (Na) Rapid change of
temperature
30 min at - 55 °C and
30 min at + 155 °C; 5 cycles ΔR max.: ± (0.25 % R + 0.05 Ω)
4.20 29 (Eb) Bump 3 x 1500 bumps in 3 directions;
40 g
No damage
ΔR max.: ± (0.25 % R + 0.05 Ω)
4.22 6 (Fc) Vibration
Frequency 10 Hz to 500 Hz;
displacement 1.5 mm or
acceleration 10 g; 3 directions;
total 6 h (3 x 2 h)
No damage
ΔR max.: ± (0.25 % R + 0.05 Ω)
4.23
Climatic sequence
:Rins min.: 1000 MΩ
4.23.2 2 (Ba) Dry heat 16 h; 155 °C
4.23.3 30 (Db)
Damp heat
(accelerated)
1st cycle
24 h; 55 °C;
90 % to 100 % RH
4.23.4 1 (Aa) Cold 2 h; - 55 °C
4.23.5 13 (M) Low air pressure 2 h; 8.5 kPa; 15 °C to 35 °C
4.23.6 30 (Db)
Damp heat
(accelerated)
remaining cycles
5 days; 55 °C;
95 % to 100 % RH
R≤1MΩΔR max.: ± (1 % R + 0.05 Ω)
R>1MΩΔR max.: ± (1 % R + 0.05 Ω)
ΔR max.
± (2 % R
+0.1 Ω)
4.24 78 (Cab) Damp heat
(steady state)
56 days; 40 °C;
90 % to 95 % RH;
loaded with 0.01 P70
(Steps: 0 V to 100 V)
Rins min.: 1000 MΩ
ΔR max.: ± (2 % R + 0.05 Ω)