AS1332
650mA, Step-Down DC-DC Converter for RF Power Amplifiers
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Datasheet
1 General Description
The AS1332 is a step-down DC-DC converter designed
to power radiofrequency (RF) power amplifiers (PAs)
from a single Li-Ion battery. The device also achieves
high-performance in mobile phones and similar RF PA
applications.
The AS1332 steps down an input voltage of 2.7V to 5.5V
to output voltages ranging from 1.3V to 3.16V. Using a
VCON analog input, the output voltage is set for
controlling power levels and efficiency of the RF PA.
The RF interferences are minimized due to the fixed-
frequency PWM operation. The batter y consumption is
reduced to 0.01µA (typ.) during shutdown.
Because of the high switching frequencies (2 MHz) tiny
surface-mount components can be used. Additional to
the small size the amount is also small. On ly three
external components are required, an inductor and two
ceramic capacitors.
The AS1332 is available in a 8-pin WL-CSP.
2 Key Features
! PWM Switching Frequency: 2MHz
! Single Lithium-Ion Cell Operation (2.7V to 5.5V)
! Dynamic Programmable Outpu t Voltage (1.3V to
3.16V)
! Maximum load capability of 650mA
! High Efficiency (96% Typ at 3.6VIN, 3.16VOUT at
400mA) from internal synchronous rectification
! Current Overload Protection
! Thermal Overload Protection
! Soft Start
! 8-pin WL-CSP
3 Applications
The AS1332 is an ideal solution for cellular phones,
hand-held radios, RF PC cards, and battery powered RF
devices.
Figure 1. AS1332 - Typical Application Circuit
AS1332
PGND AGND
VCON
EN
PVIN VDD
SW
FB
1.3V to 3.16V
VOUT = 2.5 x VCON
4.7 µF
3.3 µH VOUT
2.7V to 5.5V
VIN
10 µF
0.52V to 1.27V
VCON
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AS1332
Datasheet - Pin A s s i g n m e n t s
4 Pin Assignments
Figure 2. Pin Configuration
Pin Descriptions
Table 1. Pin Description s
Pin Name Pin Number Description
PVIN A1 +2.7V to + 5.5V Power Supply Voltage. Input to the i nternal PFET switch.
VDD B1 +2.7V to + 5.5V Analog Supply Input. Bypass this pin to GND with a 10µF
capacitor.
EN C1 Active-High Enable Input. Set this digital input high for normal operation. For
shutdown, set low.
VCON C2 Vo ltage Control Analog Input. VCON controls VOUT.
FB C3 Feedback Pin. Connect to the output at the output filter capacitor.
AGND B3 Analog and Control Ground. Connect this pin with low resistance to PGND.
PGND A3 Power Ground. Connect this pin with low resistance to AGND.
SW A2 Switch Pin. Switch node connection to the internal PFET switch and NFET
synchron ou s rectifier. Limit specification of the AS1332 .
A3
B3
C3
A1
B1
C1
PGND
AGND
FB
PVIN
VDD
EN C2
VCON
A2
SW
A1
B1
C1
A3
B3
C3
PVIN
VDD
EN
PGND
AGND
FB C2
VCON
A2
SW
Bottom ViewTop View
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AS1332
Datasheet - Ab so lu te Ma xi mu m R at in gs
5 Absolute Maximum Ratings
Stresses beyond those list ed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any othe r conditions beyond those indicated in Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter Min Max Units Comments
VDD, PVIN to AGND -0.3 +7 V
PGND to AGND -0.3 +0.3 V
EN, FB, VCON AGND - 0.3 VDD + 0.3 V 7V max
SW PGND - 0.3 PVIN + 0.3 V
PVIN to VDD -0.3 +0.3 V
Operating Temperature Range -40 +85 ºC
Junction Temperature (TJ-MAX)+150 ºC
Storage Temperature Range -65 +150 ºC
Maximum Lead Temperature
(soldering, 10sec) +260 ºC
ESD Rating
Human Body Model 2kVHBM MIL-Std. 883E 3015.7 methods
Operating Ratings
Input Voltage Range 2.7 5.5 V
Recommended Load Current 650 mA
Junction Temperature (TJ) Range -40 +125 ºC
Ambient Temperature (TA) Range -40 +85 ºC
In applications where high power
dissipation and/or poor package thermal
resistance is present, the maximum
ambient temperature may have to be
derated.
Maximum ambient temperature (TA-MAX)
is dependent on the maximum operating
junction temperature (TJ-MAX-OP =
125ºC), the maximum power dissipation
of the device in the application (PD-MAX),
and the junction-to ambient th ermal
resistance of the part/package in the
application (θJA), as given by the
following
equation: TA-MAX = TJ-MAX-OP – (θJA ×
PD-MAX).
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AS1332
Datasheet - Ele c t r i c a l C h a r a c t e r i s t i c s
6 Electrical Characteristics
TA = TJ = -40ºC to +85ºC; PVIN = VDD = EN = 3.6V, unless otherwise noted
.
Typ values are at TA = 25ºC
.
Table 3. Electrical Characteristics
Symbol Parameter Conditions Min Typ Max Units
VFB,MIN Feedback Vol tage at Minimum
Setting VCON = 0.4V 1.21 1.30 1.39 V
VFB Feedback Voltage VCON = 1.1V 2.693 2.75 2.807 V
VFB,MAX Feedback Voltage at Maximum
Setting VCON = 1.4V 3.03 3.17 3.29 V
ISHDN1
1. Shutdown current includes leakage current of PFET.
Shutdown Supply Current EN = SW = VCON = 0V 0.01 2 µA
IQ2
2. IQ specified here is when the part is operating at 100% duty cycle.
DC Bias Current into VDD VCON = 1V, FB = 0V,
No Switching 11.4mA
DC-DC Switches
ILIM,PFET Switch Peak Current Limit Current limit is built-in, fixed,
and not adjustable. 935 1100 1200 mA
RDSON(P) Pin-Pin Resistance for PFET ISW = 200mA; TA = +25°C 140 200 mΩ
ISW = 200mA 230
RDSON(N) Pin-Pin Resistance for NFET ISW = -200mA; TA = +25°C 300 415 mΩ
ISW = -200mA 485
Control Inputs
VIH,EN Logic High Input Th re sh ol d 1.2 V
VIL,EN Logic Low Input Threshold 0.5 V
IPIN,ENABLE Pin Pull Down Current 57µA
VCON,min VCON Threshold
Commanding VFB,MIN VCON swept down 0.484 0.52 0.556 V
VCON,max VCON Threshold
Commanding VFB,MAX VCON swept up 1.208 1.27 1.312 V
ZCON VCON Input Resistance3
3. Derived by input leakage test.
TA = +25°C 100 kΩ
ICON Control Pin Leakage Current -10 10 µA
Gain VCON to VOUT Gain 0.556V VCON 1.208V 2.5 V/V
Oscillator
FOSC Internal Oscillator Frequency 1.8 2 2.2 MHz
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AS1332
Datasheet - Ele c t r i c a l C h a r a c t e r i s t i c s
System Characteristics
TA = 25ºC; PVIN = VDD = EN = 3.6V, unless otherwise noted
.
The following parameters are verfied by characterisation
and are not production tested
.
Note: All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
Table 4. System Characteristics
Symbol Parameter Conditions Min Typ Max Unit
s
Control Inputs
TRESP
Time for VOUT to rise from
1.3V to 3.16V VIN = 4.2V, COUT = 4.7µF,
L = 3.3µH, RLOAD = 5Ω20 30 µs
Time for VOUT to fall from
3.16V to 1.3V VIN = 4.2V, COUT = 4.7µF,
L = 3.3µH, RLOAD = 10Ω20 30
CCON VCON Input Capacitance VCON = 1V, Test frequency = 100 kHz 20 pF
Linearity Linearity in Control
Range 0.556V to 1.208V VIN = 3.6V,
Monotonic in nature -3 +3 %
T_ON T urn-On Time
(time for output to reach 3.16V from
enable low to high transition)
EN = Low to High, VIN = 4.2V,
VOUT = 3.16V, COUT = 4.7µF, IOUT 1mA 210 750 µs
Performance Parameters
ηEfficiency
(L = 3.3µH, DCR 100mΩ)VIN = 3.6V, VOUT = 1.3V, IOUT = 90mA 87 %
VIN = 3.6V, VOUT = 3.16V, IOUT = 400mA 96
VOUT-
ripple Ripple voltage, PWM mode1
1. Ripple voltage should measured at COUT electrode on good layout PC board and under condition using sug-
gested inductors and capacitors.
VIN = 3V to 4.5V, VOUT = 1.3V,
IOUT = 10mA to 400mA 10 mVp
-p
Line_tr Line transient response VIN = 600mV perturbance, over Vin range
3V to 5.5V; TRISE = TFALL = 10µs,
VOUT = 1.3V, IOUT = 100mA 50 mVp
k
Load_tr Load transient response VIN = 3.1/3.6/4.5V, VOUT = 1.3V, transients
up to 100mA, TRISE = TFALL = 10µs 50 mVp
k
PSRR VIN = 3.6V, VOUT = 1.3V,
IOUT = 100mA sine wave perturbation frequency = 10kHz,
amplitude = 100mVp-p 40 dB
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AS1332
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
7 Typical Operating Characteristics
Circuit in Figure 31 on page 12, PVIN = VDD = EN = 3.6V, L = 3.3µH (LPS4018-332ML_), CIN = 10µF
(GRM21BR61C106KA01), COUT = 4.7µF (GRM32ER71H475KA88) unless otherwise noted;
Figure 3. IQ vs. VIN; VCON = 2V, FB = 0V, no switching Figure 4. ISHDN vs. Temperature; VCON = 0V, EN = 0V
0.2
0.4
0.6
0.8
1
1.2
1.4
2.5 3 3.5 4 4.5 5 5.5
Supply Volt age ( V)
Quiescent Current (mA)
- 45 °C
+ 25° C
+ 95° C
0
0.05
0.1
0.15
0.2
0.25
-40 -15 10 35 60 85
T e mperatur e ( °C)
Shutdown Cur rent (µA ) .
Vin=2.7V
Vin=3.6V
Vin=4.2V
Vin=5.5V
Figure 5. Switching Frequency Variation vs. Temp. Figure 6. VOUT vs. VIN; VOUT = 1.3V
-4
-3
-2
-1
0
1
2
3
4
-40 -15 10 35 60 85
Temper ature ( ° C)
Switching Frequency V ar iation (%)
Vin=2.7V
Vin=3.6V
Vin=4.2V
Vin=5.5V
1.21
1.24
1.27
1.3
1.33
1.36
1.39
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
S upply Voltage ( V)
Out put Voltage (V)
Iout=50mA
Iout=300mA
Iout=650mA
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AS1332
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 7. VOUT vs. Temp; VIN = 3.6V, VOUT = 1.3V Figure 8. VOUT vs. Temp; VIN = 3.6V, V OUT = 3.16V
1.25
1.26
1.27
1.28
1.29
1.3
1.31
1.32
1.33
1.34
1.35
-40 -15 10 35 60 85
T emperat ur e ( °C)
Out put Voltage (V)
Iout=50mA
Iout=300mA
Iout=650mA
3.1
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.2
-40 -15 10 35 60 85
T e mperatur e ( °C)
Out put Voltage (V)
Iout=50mA
Iout=300mA
Iout=650mA
Figure 9. Switch Pe ak C urre n t Li mi t vs. Temp. Figure 10. VCON vs. VOUT; VIN = 4.2V, RLOAD = 8Ω
1
1.05
1.1
1.15
1.2
-40 -15 10 35 60 85
T emperat ur e ( °C)
Peak Current Limit (A)
Vin=2.7V
Vin=3.6V
Vin=5.5V 1
1.5
2
2.5
3
3.5
00.511.52
VCON Volt age ( V)
Out put Voltage (V)
- 45 °C
+ 25° C
+ 90° C
Figure 11. Efficiency vs. VOUT; VIN = 3.6V Figure 12. Efficiency vs. IOUT; VOUT = 1.3V
70
75
80
85
90
95
100
11.522.533.5
O utput Volt age ( V)
Ef f iciency (%)
Rload=5Ohm
Rload=10Ohm
Rload=15Ohm 70
75
80
85
90
95
100
0 100 200 300 400 500 600 700 800
Output Current (mA)
Ef f iciency (%)
Vin=2.7V
Vin=3.25V
Vin=3.6V
Vin=4.2V
Vin=5.5V
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AS1332
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 13. Efficiency vs. IOUT; VOUT = 3.09V
70
75
80
85
90
95
100
0 100 200 300 400 500 600 700 800
Output Current (mA)
Efficiency (%)
Vin=2.7V
Vin=3.25V
Vin=3.6V
Vin=4.2V
Vin=5.5V
Figure 14. Load Transient Response; VIN = 3.6V,
VOUT = 1.3V Figure 15. Startup; VIN = 3.6V, VOUT = 1.3V,
IOUT<1mA, RLOAD = 4.7kΩ
10µs/Div
250mA 50mV/Div 200mA/Div
VOUT
IL
IOUT
50mA
50µs/Div
500mA/DIV 5V/Div
VSW
ILVOUTEN
1V/Div
2V/Div
Figure 16. Startup; VIN = 4.2V, VOUT = 3.16V,
IOUT<1mA, RLOAD = 4.7kΩ Figure 17. Shutdown Response; VIN = 4.2V, VOUT =
3.16V, COUT = 4.7µF, RLOAD = 10Ω
500mA/DIV 5V/Div
VSW
IL
50µs/Div
VOUTEN
1V/Div
2V/Div
50µs/Div
500mA/Div 5V/Div
1V/Div
2V/Div
VSW
ILVOUTEN
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AS1332
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 18. VCON Voltage Response; VIN = 4.2V,
VCON = 0V to 1.4V, RLOAD = 10Ω Figure 19. VCON and Load Transient; VIN = 4.2V,
VCON = 0V to 1.4V, 15Ω/8Ω, same time
50µs/Div
5V/Div
VSW
VOUT
VCON
1.3V
0V 1.4V 3.16V
50µs/Div
1.3V 5V/Div
0V
VSW
VOUT
VCON
1.4V 3.16V
Figure 20. Timed Current Limit Response; VIN = 3.6V,
VOUT = 1.3V, RLOAD = 10ΩFigure 21. Output Voltage Ripple; VIN = 3.6V,
VOUT = 1.3V, IOUT = 200mA
5µs/Div
1A/Div 5V/Div
1V/Div
VSW
ILVOUT
200ns/Div
100mA/Div 5V/Div
VSW
ILVOUT
10mV/Div
Figure 22. VOUT Ripple in Skip Mode; VIN = 3.547 V,
VOUT = 3.16V, RLOAD = 5
Ω
Figure 23. RDSON (P-Chanel) vs. Temperature;
ISW = 200mA
500ns/Div
20mV/Div 2V/Div
500mA/Div
VSW
IL
VOUT
0
50
100
150
200
250
300
350
-40 -15 10 35 60 85
Temper ature ( ° C)
RDSON (m )
Vin=2.7V
Vin=3.6V
Vin=5.5V
Ω
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AS1332
Datasheet - Ty p i c a l O p e r a t i n g C h a r a c t e r i s t i c s
Figure 24. RDSON (N-Chanel) vs. T emp.; ISW=-200mA Figure 25. EN High Threshold vs. VIN
0
50
100
150
200
250
300
350
-40 -15 10 35 60 85
Temper ature ( ° C)
RDSON (m )
Vin=2.7V
Vin=3.6V
Vin=5.5V
Ω
0.7
0.8
0.9
1
1.1
1.2
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Supply Volt age ( V)
E N High Thr esh old ( V )
- 45 °C
+ 25°C
+ 90°C
Figure 26. VCON Threshold min vs. VIN Figure 27. VCON Threshold max vs. VIN
0.5
0.502
0.504
0.506
0.508
0.51
0.512
0.514
0.516
0.518
0.52
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Supply Volt age ( V)
Vcon Threshold min (V)
- 45 °C
+ 25°C
+ 90°C 1.25
1.252
1.254
1.256
1.258
1.26
1.262
1.264
1.266
1.268
1.27
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Supply Volt age ( V)
Vcon Threshold max (V)
-4C
+25°C
+90°C
Figure 28. VFB min vs. VIN; VCON = 0.4V, RLOAD = 10
Ω
Figure 29. VFB max vs. VIN; VCON = 0.4V, RLOAD=10
Ω
1.21
1.24
1.27
1.3
1.33
1.36
1.39
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
S upply Volt age ( V)
VFB min (V)
- 4 C
+ 25°C
+ 90°C 3.1
3.12
3.14
3.16
3.18
3.2
33.544.555.5
S upply Volt age ( V)
VFB max (V)
- 4 C
+ 25°C
+ 90°C
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AS1332
Datasheet - D et a i l e d De s c r i p t i o n
8 Detailed Description
For driving RF power amplifiers in portable devices and battery powered RF devices the AS1332 is a very suitable DC-
DC converter. The AS1332 features current overload protection, thermal overload shutdown and soft start. Besides
these features the device also di splays the following characteristics:
! Current-mode buck architecture with synchronous rectification for high efficiency.
! Operation at maximum efficiency over a wide range of power levels from a single Li -Ion battery cell.
! The maximum load capability of 650mA is provided in PWM mode, wherein th e maximum load range may vary
depending on input voltage, output voltage and the selected inductor.
! Efficiency is of around 96% for a 400mA load with 3.16V output and 3.6V inpu t.
! For longer battery life, th e output voltage can be dynamically pr ogrammable from 1.3V (typ) to 3.16V (typ) by
adjusting the voltage on the control pin without the need for external feedback resistors.
Figure 30. AS1332 Block Diagram
AS1332 is fabricated using a 8-pi n WL-CSP, which requires special design considerations for implementation. Its fine
bumppitch requires careful board design and precision assembly equipment. This package offers the smallest possible
size, for space-critical applications such as cell phones, where board area is an important design consideration. The
size of the external components is reduced by using a high switching frequency (2MHz). For implementation only three
external power components are required (see Figure 1 on page 1). The 8-pin WL-CSP package is appropriate for
opaque case applications, where its edges are not subject to high intensity ambient red or infrared light. Also the
system controller should set EN low during power-up and other low supply voltage conditions. See Shutdown Mode on
page 13.
Mosfet
Control
Logic
Shutdown
Control
Main Control
Clamp
Logic and
Soft Start
Oscillator
Current
Sense
PVIN
PWM
COMP
VDD
Error
Amplifier
FB
VCON
EN
SW
AGND PGND
AS1332
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AS1332
Datasheet - D et a i l e d De s c r i p t i o n
Figure 31. Typical Operating Syste m Circuit
Operating the AS1332
AS1332’s control block turns on the internal PFET (P-channel MOSFET ) switch during the first part of each switching
cycle, thus allowing current to flow from the input through the inductor to the output filter capacitor and load. The
inductor limits the current to a ramp with a slope of around (VIN - VOUT) / L, by storing energy in a magnetic field.
During the second part of each cycle, the controller turns the PFET switch off, blocking current flow from the input, and
then turns the NFET (N-ch annel MOSFET) synchronous rectifier on. As a result, the indu ctor’s magnetic field
collapses, generating a voltage that forces current from ground through the synchronous rectifier to t he output filter
capacitor and load.
While the stored energy is transferred back into the circuit and depleted, the inductor current ramps down with a slope
around VOUT / L. The output filt er capacitor stores charge when the inductor current is hig h, and releases it when low,
smoothing the voltage across the load. The output voltage is regulated by modulating the PFET swit ch on time to
control the average current sent to the load. The effect is identical to sending a duty-cycle modulated rect angular wave
formed by the switch and synchronous rectifier at SW to a low-pass filter formed by the inductor and output filter
capacitor.
The output voltage is equal to the average voltage at the SW pin.
While in operation, the output voltage is regulated by switching at a constant frequency and then modulating the
energy per cycle to control power to the load. Energy per cycle is set by modulating the PFET switch on-time pulse
width to control the peak inductor current. This is done by comparing the signal from the current-sense amplifier with a
slope compensated error signal from the voltage-feedback error amplifier. At the beginning of each cycle, the clock
turns on the PFET switch, causing the inductor current to ramp up. When the current sense signal ramps past the error
amplifier signal, the PWM comparator turns off the PFET switch and turns on the NFET synchronous rectifier, ending
the first part of the cycle.
If an increase in load pulls the out put down, the error amplifier output increases, which allows th e inductor current to
ramp higher before the comparator turns off the PFET. This increases the average current sent to the output and
adjusts for the increase in the load. Before appearing at the PWM comparator, a slope compensation ramp from the
oscillator is subtracted from the error signal for stability of the current feedback loop. The minimum on time of PFET in
PWM mode is 50ns (typ.)
AS1332
AGND PGND
VCON
EN
PVIN VDD
SW
FB
1.3V to 3.16V
VOUT = 2.5 x VCON
4.7 µF
3.3 µH VOUT
2.7V to 5.5V
VIN
10 µF
DAC
ON/OFF
System
Controller
C1
C2
L1
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AS1332
Datasheet - D et a i l e d De s c r i p t i o n
Internal Synchronous Rectifier
To redu ce the rectifier forward voltage drop and the associated power loss, the AS1332 uses an intern al NFET as a
synchronous rectifier . The big advantage of a synchronous rectification is the higher efficiency in a condition where the
output voltage is low compared to the voltage drop across an ordinary rectifier diode. During the inductor current down
slope in the second part of each cycle the synchronous rectifier is turned on. Before the next cycle the synchronous
rectifier is turned off.
There is no need for an external diode becau se the NFET is conducting through its intrinsic body diode during the
transient intervals before it turns on.
Dynamic Output Voltage Programming
Because of the dynamically ad justable output voltage of the AS1332 there is no need for external feedback resistors.
Through changing the voltage at the analog pin VCON, the output voltage is set from VFB,MIN to VFB,MAX. This is a very
helpful feature because the supply vol tage of a PA appl ication can be changed due to the operation mode. For
example, during the data transmission from a handset peak power is needed. In the other states the transmitting power
can be reduced to ensure a longer battery lifetime.
Shutdown Mode
If EN is set to high (>1.2V) the AS1332 is in normal operation mode. During power-up and when the po wer supply is
less than 2.7V minimum operating voltage, the chip should be turned off by setting EN low. In shutdown mode the
following blocks of the AS1332 are turned off, PFET switch, NFET synchronous rectifier, reference voltage source,
control and bias circuitry . The AS1332 is designed for compact port able applications, such as mobile phones where the
system controller controls operation mode for maximizing battery life and requirements for small package size
outweigh the additional size required for inclusion of UVLO (Under Voltage Lock-Out) circuitry.
Note: Setting the EN digital pin low (<0.5 V ) places the AS1332 in a 0.01µA (typ.) shutdown mode.
Thermal Overload Protection
To preve nt the AS1332 from short-term misuse and overload conditions th e chip includes a thermal overload
protection. To block the norma l operation mode the device is turning the PFET and the NFET off in PWM mode as
soon as the junction temperature exceeds 150°C. To resume the normal operation the temperature has to drop below
125°C.
Note: Continuing operation in t hermal overload conditions may damage the device and is cons idered bad practice.
Current Limiting
If in the PWM mode the cycle-by-cycle current limit of 1.2A (max.) is reached the current limit feature takes place and
protects the device and the external components. A timed current limiting mode is working when a load pulls the output
voltage down to approximately 0.375V. In this timed current limit mode the inductor current is forced to ramp down to a
safe value. This is achieved by turning off the internal PFET swit ch and delaying the start of the next cycle for 3.5us.
The synchronous rectifier is also turned off in the timed current limit mode.
The advantage of the timed current limi t mode is to prevent the device of the loss of the curren t cont rol.
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AS1332
Datasheet - App l i c a t i o n I n f o r m a t i o n
9 Application Information
Through setting the voltage on the VCON pin (see Table 5) the output voltage of the AS1332 can be programmed from
1.3V (typ) to 3.16V (typ). Thi s feat ure eliminates the need for external fe edback resistors.
If the voltage on the control pin varies from 0.556V to 1.208V, the output voltage will change according to the equation
stated in Table 5. The output voltage is regulated at VFB,MIN as long as the voltage on the control pin is less than
0.484V. If the voltage on the control pin is higher than 1.312V, the output voltage is regulated at VFB,MAX.
Before the control voltage is fed to the error amplifier inputs, the control voltage is clamped internal in the devic e.
Table 5. Output Voltage Selection
VCON (V) VOUT (V)
VCON 0.484 VFB,MIN
0.556 < VCON < 1.208 VOUT = 2.5 x VCON
VCON 1.312 VFB,MAX
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AS1332
Datasheet - App l i c a t i o n I n f o r m a t i o n
External Component Selection
Inductor Selection
For the external inductor, a 3.3µH inductor is recommend. Minimum inductor size is dependant on the desired effi-
ciency and output current. Inductors with low core losses and small DCR at 2MHz are recommended.
Capacitor Selection
A 10µF capacitor is recommend for CIN as well as a 4.7µF for COUT. Small-sized X5R or X7R ceramic capacitors are
recommend as they retain capacitance over wide ranges of voltages and temperatures.
Input and Output Capacitor Selection
Low ESR input capacitors reduce input switching noise and reduce the peak current drawn from the battery. Also low
ESR capacitors should be used to minimize VOUT ripple. Multi-layer ceramic capacitors are recommended since they
have extremely low ESR and are available in small f ootprints.
For input decoupling the ceramic capacitor should be located as close to the device as practical. A 4.7µF input capaci-
tor is sufficient for most applications. Larger values may be used without limitations.
A 2.2µF to 10µF output ceramic capacitor is sufficient for most applications. Larger values up to 22µF may be used to
obtain extremely low output voltage ripple and improve transient response.
EN Pin Control
Drive the EN pin using the system controll er to turn the AS1332 ON and OFF. Use a comparator, Schmidt trigger or
logic gate to drive the EN pin. Set EN high (>1.2V) for normal operation and low (<0. 5V) for a 0. 01µA (typ.) shutdown
mode. Set EN low to turn off the AS1332 during power-up and under voltage conditions when the power supply is less
than the 2.7V minimum operating voltage. The part is out of regulation when the input voltage is less than 2.7V.
Table 6. Recommended Inductors
Part Number LDCR Current Rating Dimensions (L/W/T) Manufacturer
LPS4018-222ML_ 2.2µH 0.070Ω 2.9A 3.9x3.9x1.7mm Coilcraft
www.coilcraft.com
LPS4018-332ML_ 3.3µH 0.080Ω 2.4A 3.9x3.9x1.7mm
LPS4018-472ML_ 4.7µH 0.125Ω 1.9A 3.9x3.9x1.7mm
Table 7. Recommended Capacitors for the Step-Down Converter
Part Number CVoltage Type Size Manufacturer
GRM21BR60J226ME39 22µF 6.3V X5R 0805 Murata
www.murata.com
GRM21BR60J106KE01 10µF 6.3V X5R 0805
GRM21BR61C475KA88 4.7µF 16V X5R 0805
GRM188R61C225KE15 2.2µF 16V X5R 0603
GRM188R61A225KE34 2.2µF 10V X5R 0603
C0603C475K8PAC7867 4.7µF 10V X5R 0603 KEMET
www.kemet.com
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AS1332
Datasheet - App l i c a t i o n I n f o r m a t i o n
Layout Considerations
The AS1332 converts higher input voltage to lower output voltage with high efficiency . This is achieved with an inductor
based switching topology. During the first half of the switching cycle, the internal PMOS swit ch turns on, the input
voltage is applied to the induct or, and the current flows from PVDD line to the output capacitor (C2) through the
inductor. During the second half cycle, the PMOS turns off and the internal NMOS turns on. The inductor current
continues to flow via the inductor from the device PGND line to the output capacitor (C2). Referring to Figure 32, the
AS1332 has two major current loops where pulse and ripple current flow. The loop shown in the left hand side is most
important, because pulse current shown in Figure 32 flows in this path. The right hand side is next. The current
waveform in this path is triangular, as shown in Figure 32. Pulse current has many high-frequency components due to
fast di/dt. Triangular ripple current also has wide high-frequency components. Board layout and circuit pattern design
of these two loops are the key factors for reducing noise radiation and stable operation. Other lines, such as from
battery to C1(+) and C2(+) to lo ad, are almost DC current, so it is not necessary to take so much care. Only pattern
width (current capability) and DCR drop considerations are needed.
Figure 32. Current Loop
PGND AGND
VCON
EN
PVIN VDD
SW
FB
VOUT = 2.5 x VCON
4.7 µF
3.3 µH VOUT
2.7V to 5.5V
VIN
10 µF
C1
+
-
C2 +
-
L1
i
fOSC = 2MHz
i
0.52V to 1.27V
VCON
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AS1332
Datasheet - Pa ck ag e D ra wi ng s a nd Markings
10 Package Drawings and Markings
The device is available in a 8-pin WL-CSP
Figure 33. Package Drawings
1625 ±20µm
1515 ±20µm
Top through view Bottom view
(Ball side)
500 500
500
500
320 typ.
600 ±30µm
Notes:
ccc Coplanarity
All dimensions are in µm
40 typ. 240 typ.
40 µm
40 µm
CCC
330 ±20
A
A
11
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AS1332
Datasheet - O r d e r i n g I n f o r m a t i o n
11 Ordering Information
The device is available as the standard products listed in Table 8.
Note: All products are RoHS compliant and Pb-free.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect
For further info rmation and requests, please contact us mailto:sales@austriamicrosystems.com
or find your local distribu tor at http://www.austriamicrosystems.com/distributor
Table 8. Ordering Information
Ordering Code Marking Description Delivery Form Package
AS1332-BWLT ASQW 650mA, DC-DC Step-Down for RF Tape and Reel 8-pi n WL-CSP
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AS1332
Datasheet
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