Data Sheet
October 11, 2011
ESTW025A0F Series (Eighth-Brick) DC-DC Converter Powe r Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output Current
*
UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a re
g
istered trademark of the International Or
g
anization of Standards
Document No: DS09-013 ver.1.01
PDF name: ESTW025A0F.pd
f
STINGRAY™ SERIES
Features
Wide input voltage range: 36-75 V
dc
Delivers up to 25A Output current
Monotonic startup into prebiased load
Output Voltage adjust: 80% to 110% of V
o,nom
Remote sense
Constant switching frequency
Positive remote On/Off logic
Input under voltage protection
Output overcurrent and overvoltage protection
Over-temperature protection
Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 8.5mm
(2.28 in x 0.9 in x 0.335 in)
Low profile height and reduced component skyline
Suitable for cold wall cooling using suitable Gap
Pad applied directly to top side of module
High efficiency 92% at full load (Vin=48V
dc
)
No thermal derating up to 68°C, 1.0m/s (200 LFM)
Wide operating temperature range (-40°C to 85°C)
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
UL* 60950-1, 2
nd
Ed. Recognized, CSA
†
C22.2 No.
60950-1-07 Certified, and VDE
‡
(EN60950-1, 2
nd
Ed.) Licensed
CE mark meets 2006/95/EC directive
§
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed for
Basic insulation rating per EN60950-1
2250 V
dc
Isolation tested in compliance with IEEE
802.3
¤
PoE standards
ISO
**
9001 and ISO 14001 certified manufacturing
facilities
Applications
Distributed power architectures
Wireless networks
Access and optical network Equipment
Enterprise Networks including Power over Ethernet
(PoE)
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Options
Negative Remote On/Off logic (-1 option,
preferred/standard)
Surface Mount version (-S option)
Auto-restart (-4 option, preferred/standard)
Trimmed leads (-6 or -8 options)
Description
The ESTW025A0F series, Eighth-brick power modules are isolated dc-dc converters that can deliver up to 25A of output
current and provide a precisely regulated output voltage over a wide range of input voltages (Vin = 36 -75V
dc
). The
module achieves typical full load efficiency of 92% at 3.3V
dc
output voltage. The open frame modules construction, available
in both surface-mount and through-hole packaging, enable designers to develop cost- and space-efficient solutions.
RoHS Compliant
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All VIN -0.3 80 Vdc
Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
Maximum Base-plate Operating Temperature -18H, H TC -40 110 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current All IIN,max 2.7 Adc
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current All IIN,No load 50 mA
(VIN = VIN, nom, IO = 0, module enabled)
Input Stand-by Current All IIN,stand-by 6 8 mA
(VIN = VIN, nom, module disabled)
Inrush Transient All I2t 1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See Test configuration section)
All 30 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Nominal Output Voltage Set-point
VIN=VIN, nom, IO=IO, max, TA=25°C) All VO, set 3.250 3.300 3.350 Vdc
Output Voltage
All VO 3.200 3.400 Vdc
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max) All
±0.1 % VO, set
Load (IO=IO
,
min to IO
,
max) All 10 mV
Temperature (Tref=TA, min to TA, max) All
±0.2 % VO, set
Output Ripple and Noise on nominal output
(Co=1uF,ceramic+10uF,tantalum, VIN=VIN, nom ,IO= IO,
max , T
A
=T
A,
min to T
A,
max)
RMS (5Hz to 20MHz bandwidth) All 8 20 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 40 75 mVpk-pk
External Capacitance 1 All CO, max 0 20,000 μF
Output Current All Io 0 25.0 Adc
Output Current Limit Inception (Hiccup Mode ) All IO, lim 26.3 29 32.5 Adc
(VO= 90% of VO, set)
Output Short-Circuit Current (VO≤250mV) All IO, s/c 1.6 Arms
( Hiccup Mode)
Efficiency
VIN= VIN, nom, TA=25°C, IO=IO, max , VO= VO,set All η 91.0 92.0 %
VIN= VIN, nom, TA=25°C, IO=10A , VO= VO,set All η 91.0 92.0 %
VIN= VIN, nom, TA=25°C, IO=5A , VO= VO,set All η 85.5 87.0 %
Switching Frequency All fsw 355 kHz
Dynamic Load Response
(Co=1uF,ceramic+220uF,tantalum, dIo/dt=0.1A/s;
VIN = 48V; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation All Vpk 127 mV
Settling Time (Vo<10% peak deviation) All ts 200 s
1. See Note 2 under Feature Specifications.
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All Ciso 1000 pF
Isolation Resistance All Riso 30 MΩ
I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 Vdc
General Specifications
Parameter Device Symbol Min Typ Max Unit
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,
airflow = 200 lfm, 90% confidence)
All FIT 229.4 109/Hours
All MTBF 4,359,904 Hours
Weight (Open Frame) All 22 (0.78) g(oz)
Weight (with Heatplate) All 35 (1.23) g(oz)
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 4
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current All Ion/off 0.15 mA
Logic Low - On/Off Voltage All Von/off -0.7 0.6 Vdc
Logic High Voltage – (Typ = Open Collector) All Von/off 2.4 15.0 Vdc
Logic High maximum allowable leakage current All Ion/off 25 μA
Turn-On Delay1 and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25oC)
Case 1: Input power is applied for >1 second and then
the On/Off input is set to ON (Tdelay = time from instant
On/Off signal is ON until VO = 10% of VO, set)
All Tdelay ― 12 ― msec
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay = time
at which VIN = VIN, min until Vo=10% of VO,set)
All Tdelay ― 20 ― msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise ― 4 ― msec
Output voltage overshoot – Startup All
― 5 % VO, set
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
Prebias Output Load Performance:
Output Start up characteristic All Monotonic
Back Bias current drawn from output (Module Enabled) All -15 mAdc
Remote Sense Range All VSENSE 10 % VO, set
Output Voltage Adjustment Range All -20 +10 % VO, set
Output Overvoltage Protection (CO=470μF)2 All VO, limit 3.9 5.1 Vdc
Overtemperature Protection – Hiccup Auto Restart All Tref 125 OC
Input Undervoltage Lockout All VUVLO
Turn-on Threshold 34.0 35.5 Vdc
Turn-off Threshold 30.5 32.0 Vdc
Hysteresis 1.0 2.0
Vdc
1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 25mS. The extended Tdelay will occur when the module restarts
following the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and
then back to normal.
2. The module requires a minimum of 470 μF external output capacitor to prevent shutdown during full load to no load transients and to avoid
exceeding the OVP maximum limits during startup into open loop fault conditions.
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 5
Characteristic Curves
The following figures provide typical characteristics for the ESTW025A0F (3.3V, 25A) at 25oC. The figures are
identical for either positive or negative remote On/Off logic.
EFFICIENCY, (%)
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (5A/div) VO (V) (200mV/div)
OUTPUT CURRENT, IO (A) TIME, t (200µs/div)
Figure 1. Converter Efficiency versus Output Current. Figur e 4. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE
VO (V) (20mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
VOn/off (V) (5V/div) VO (V) (1V/div)
TIME, t (2s/div) TIME, t (10ms/div)
Figure 2. Typical output ripple and noise (VIN = VIN,NOM,
Io = Io,max). Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io = Io,max).
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (5A/div) VO (V) (200mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (20V/div Vo (V) (1V/div)
TIME, t (200µs/div) TIME, t (5ms/div)
Figure 3. Transient Response to 0.1A/µS Dynamic
Load Change from 25% to 50% to 25% of full load. Figure 6. Typical Start-up Using Input Voltage (VIN =
VIN,NOM, Io = Io,max).
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 6
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kH
z
100μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possibl e battery impedance. Measure current as shown
above.
Figure 7. Input Re fl ected Ripple Cu rrent Test
Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O (+)
V O (
–
) 0.01uF
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
0.1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test
Setup.
=
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Filtering
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 100μF
electrolytic capacitor (ESR<0.7 at 100kHz), mounted
close to the power module helps ensure the stability of
the unit. Consult the factory for further application
guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e. UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.
One VIN pin and one VOUT pin are to be grounded,
or both the input and output pins are to be kept
floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety
agencies, to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding 60 Vdc but less than or
equal to 75 Vdc, these converters have been
evaluated to the applicable requirements of BASIC
INSULATION between secondary DC MAINS
DISTRIBUTION input (classified as TNV-2 in Europe)
and unearthed SELV outputs.
The input to these units is to be provided with a
maximum 5 A fast-acting fuse in the ungrounded lead.
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 7
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the ON/OFF
terminal and the VIN(-) terminal (see Figure 10). Logic
low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a
logic low is 1mA, the switch should maintain a logic
low level while sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 15V, and the maximum
allowable leakage current at Von/off = 5V is 1μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).
Figure 11. Circuit Configuration for remote
sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, VUV/ON.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shutdown if the thermal reference point
Tref (Figure 13), exceeds 125oC (typical), but the
thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating.
The module can be restarted by cycling the dc input
power for at least one second or by toggling the
remote on/off signal for at least one second. If the
auto-restart option (4) is ordered, the module will
automatically restart upon cool-down to a safe
temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current limiting circuitry and can endure current
limiting continuously. At the point of current limit
inception, the unit enters hiccup mode. If the unit is
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACT AND
DISTRIBUTION LOSSE
SUPPLY II
CONTACT
RESISTANCE
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 8
Feature Descriptions (continued)
not configured with auto–restart, then it will latch off
following the over current condition. The module can
be restarted by cycling the dc input power for at least
one second or by toggling the remote on/off signal for
at least one second. If the unit is configured with the
auto-restart option (4), it will remain in the hiccup
mode as long as the overcurrent condition exists; it
operates normally, once the output current is brought
back into its specified range. The average output
current during hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin.
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figur e 12. Circ uit Con fi gu rat i on t o Tr im Ou tpu t
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the VO(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
22.10
%
511
downtrim
R
Where 100% ,
,
seto
desiredseto V
VV
For example, to trim-down the output voltage of the
module by 8% to 3.036V, Rtrim-down is calculated as
follows:
8%
22.10
8
511
downtrim
R
655.53
downtrim
R
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equation
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:
22.10
%
511
%225.1
%)100(11.5 ,seto
uptrim V
R
Where 100% ,
,
seto
setodesired
V
VV
For example, to trim-up the output voltage of the
module by 5% to 3.465V, Rtrim-up is calculated is as
follows:
5%
22.10
5
511
5225.1 )5100(3.311.5
uptrim
R
7.176
uptrim
R
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output voltage
of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the
maximum output power of the module remains at or
below the maximum rated power (Maximum rated
power = VO,set x IO,max).
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 9
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference points, Tref1,Tref2 and Tref3 used
in the specifications for open frame modules are
shown in Figures 13a and 13b. For reliable operation
these temperatures should not exceed 125oC, 110oC
and 105oC respectively.
Figure 13 a. Tref 1 Tempe rature Measurement
Location for Open Frame Mod ul e .
Figure 13 b. Tref 2 and Tref 3 Temperature
Measurement Locations for Open Frame Module.
The thermal reference point, Tref, used in the
specifications for modules with heatplate is shown in
Figure 14. For reliable operation this temperature
should not exceed 110oC.
Figure 14. Tref Temperature Measurement
Location for Module with Heatplate.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves, showing the
maximum output current that can be delivered by
each module versus local ambient temperature (TA)
for natural convection and up to 2.0 m/s (400 ft./min)
forced airflow, are shown in Figure 15.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, TA (oC)
Figure 15. Output Current Derating for the Open
Frame Module; Airfl ow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
Heat Transfer vi a Conduction
The module can also be used in a sealed environment
with cooling via conduction from the module’s top
surface through a gap pad material to a cold wall, as
shown in Figure 16. The output current derating
versus cold wall temperature, when using a gap pad
such as Bergquist GP2500S20, is shown in Figure 17.
Figure 16. Cold Wall Mounting
OUTPUT CURRENT, IO (A)
COLDPLATE TEMEPERATURE, TC (oC)
Figure 17. Derate d Output Current versus Cold
Wall Temperature with local ambi ent tempe r atu re
around module a t 85C; Vin=48V.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 10
Surface Mount Information
Pick and Place
The ESTW025A0F modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 18. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The ESTW025A0F power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP (C)
REFLOW TIME (S)
Figure 19. Reflow Profile for Tin/Lead (Sn/Pb)
process.
MAX TEMP SOLDER (C)
Figure 20. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
Lead F r ee S o lderi ng
The –Z version of the ESTW025A0F modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Reflow Soldering Information
The surface mountable modules in the
ESTW025A0F-S family use our newest SMT
0
50
10 0
15 0
200
250
300
Preheat zo ne
max 4
o
Cs
-1
Soak zo ne
30-240s
Heat zo ne
max 4
o
Cs
-1
Peak Temp 235
o
C
Cooling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
200
205
210
215
220
225
230
235
240
0 10 203040 5060
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 11
Surface Mount Information (continued)
technology called “Column Pin” (CP) connectors.
Figure 19 shows the new CP connector before and
after reflow soldering onto the end-board assembly.
ESTW Board
Insulator
Solder Ball
End assembly PCB
Figure 21. Column Pin Connector Before and After
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn63/Pb37) solder for non-Z codes, or
Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 183oC (Sn/Pb solder) or 217-218 oC (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 22.
MSL Rating
The ESTW025A0F modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Pow er Module s : Sold ering a nd Clean in g
Application Note (AN04-001).
Figure 22. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have a RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is
270C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C )
He ating Zone
1°C/ S ec ond
Peak Temp 260°C
* Min. Time Above 2 35°C
15 Seconds
*Time Abov e 217°C
60 S ec onds
Cooling
Zone
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 12
EMC Considerations
The filter circuit schematic and plots in Figure 23 shows a suggested configuration as tested to meet the conducted
emission limits of EN55022 Class B.
Note: Customer is ultimately responsible for the proper selection, component rating and verification of the suggested
parts based on the end application.
Figure 23. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 13
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View*
*Top side label includes Lineage Power name, product designation and date code.
Side
View
*For optional pin lengths, see Table 2, Device Options
Bottom
View
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 14
Mechanical Outline for Surface Mount Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View*
* Top side label includes Lineage Power name, product designation and date code.
Side
View
Bottom
View
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 15
Mechanical Outline for Through-Hole Module with 1/8th Heat Plate (-H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View*
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 16
Mechanical Outline for Through-Hole Module with 1/4th Heat Plate (-18H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 17
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
SMT Recommended Pad Layout (Component Side View)
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 18
TH Recommended Pad Layout (Component Side View)
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
LINEAGE POWER 19
Packaging Details
The surface mount versions of the ESTW025A0F
modules (suffix –S) are supplied as standard in
the plastic tray shown in Figure 24. The tray has
external dimensions of 135.1mm(W) x 321.8mm(L) x
12.42mm(H) or 5.319in(W) x 12.669in(L) x 0.489in(H).
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.
Figure 24. Surface Mount Packaging Tray.
Data Sheet
October 11, 2011
ESTW025A0F Series Eighth-Brick Power Modules
36–75Vdc Input; 3.3Vdc Output; 25A Output
Document No: DS09-013 ver.1.01
PDF name: ESTW025A0F.pd
f
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes Input Voltage Output
Voltage Output
Current On/Off
Logic Connector
Type Comcodes
ESTW025A0F41Z 48V (36-75Vdc) 3.3V 25A Negative Through hole CC109158498
ESTW025A0F41-HZ 48V (36-75Vdc) 3.3V 25A Negative Through hole CC109159505
ESTW025A0F41-SZ 48V (36-75Vdc) 3.3V 25A Negative Surface Mount
CC109159496
ESTW025A0F641 48V (36-75Vdc) 3.3V 25A Negative Through hole CC109159125
ESTW025A0F4Z 48V (36-75Vdc) 3.3V 25A Positive Through hole CC109168118
ESTW025A0F641Z 48V (36-75Vdc) 3.3V 25A Negative Through hole CC109169363
ESTW025A0F841Z 48V (36-75Vdc) 3.3V 25A Negative Through hole CC109167367
ESTW025A0F64-18HZ 48V (36-75Vdc) 3.3V 25A Positive Through hole CC109172846
Table 2. Device Options
Characteristic Definition
Form Factor E E = Eighth Brick
Family De signator ST ST = Stingra y Series
In put Vol ta ge W W = Wi de Ra ng e, 36V-75V
Ou tp u t Cu r ren t 025A0 025A0 = 025. 0 Am ps Ma xi m um Output Current
Output Vol ta ge F F = 3. 3V nom i nal
Omit = De fault Pin Le ngth shown in Me chanica l Outline Figure s
6 6 = Pin Le ngth: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
8 8 = Pin Le ngth: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
Omit = La tching Mode
4 4 = Auto-re start foll owi ng shutdown (Overcurre nt/Overvoltage)
Omit = P ositive Logic
1 1 = Ne gative Lo gi c
Custome r Spe cific XY XY = Custome r Spe cific Modified Code , Omit for Standa rd Code
Omit = Sta ndard ope n Fra me Module
HH = 1/ 8th Brick siz e h eat p late, fo r
use with heat sinks (not available with –S option)
18H 18H = 1/4th Brick si z e hea t pl ate with unthre ad ed i nserts for
use in coldwa ll a pplications (not available w ith –S option)
S = S urfa ce m oun t conne ctions
Omit = RoHS 5/6 , Lead Based So ld er Used
Z Z = RoHS 6/6 Compliant, Lead free
Charact er and Posit i on
Ratings
Pi n Le ngth
Acti o n fo l lowin g
Prote ctive
On/Off Logic
RoHS
Options
Mechanical Feature
s
World Wide Headquarters
Lineag e Power Corporation
601 Shiloh Road, Plano, TX 75074, USA
+1-800-526-7819
(Outside U.S.A.: +1-972-244-9428)
www.lineag e power.com
e-mail: techsupport1@lineagepower.com
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Tel: +65 6593 7211
Europe, Middle-East and Africa Headquart ers
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Tel: +91 80 28411633
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a
pplica tion. No rig hts und er a n y p atent acco mp an y th e sal e of any suc h pr o duc t(s) or infor mati on.
Line ag e P ower DC-DC products are pr ot ecte d u nd er various p ate nts. Inf or mation o n th ese pa te nts is avai labl e at www.lineagepower.com/patents.
©
201 1 Line a
g
e P ower C or
p
or atio n
,
(
Plano
,
Texas
)
All International Ri
g
hts Reser ved.
