TDA1552QU - NXP Semiconductors / Philips Semiconductors

DATA SH EET

Product speciﬁcation

File under Integrated Circuits, IC01 July 1994

INTEGRATED CIRCUITS

TDA1552Q

2 x 22 W BTL stereo car radio

power amplifier

July 1994 2

Philips Semiconductors Product speciﬁcation

2 x 22 W BTL stereo car radio power

ampliﬁer TDA1552Q

GENERAL DESCRIPTION

The TDA1552Q is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package.

The circuit contains 2 x 22 W amplifiers in Bridge Tied Load (BTL) configuration. The device is primarily developed for

car radio applications.

Features

•Requires very few external components

•High output power

•Low offset voltage at outputs

•Fixed gain

•Good ripple rejection

•Mute/stand-by switch

•Load dump protection

•AC and DC short-circuit-safe to ground and VP

•Thermally protected

•Reverse polarity safe

•Capability to handle high energy on outputs (VP = 0 V)

•Protected against electrostatic discharge

•No switch-on/switch-off plop

•Low thermal resistance

•Flexible leads.

QUICK REFERENCE DATA

PACKAGE OUTLINE

13-lead SIL-bent-to-DIL; plastic power (SOT141R); SOT 141-6; 1996 July 23.

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage range

operating VP6.0 14.4 18.0 V

non-operating VP−−30 V

load dump protected VP−−45 V

Repetitive peak output

current IORM −−4A

Total quiescent current Itot −80 160 mA

Stand-by current Isb −0.1 100 µA

Switch-on current Isw −−60 µA

Input impedance |ZI| 506075kΩ

Junction temperature Tj−−150 °C

Stereo application

Output power RL = 4 Ω; THD = 10% Po20 22 −W

Supply voltage ripple

rejection RS = 0 Ω

f = 100 Hz to 10 kHz RR 48 −−dB

DC output offset voltage |∆VO|−−150 mV

Channel separation α40 −−dB

Channel unbalance |∆Gv|−−1dB

July 1994 3

Philips Semiconductors Product speciﬁcation

2 x 22 W BTL stereo car radio power

ampliﬁer TDA1552Q

Fig.1 Block diagram.

handbook, full pagewidth

mute/stand-by

MLB952

output 1A

Vref

stand-by

switch

mute

switch

stand-by

reference

voltage

310

VP1 VP2

18 kΩ

kΩ

18 kΩ

15 kΩ

kΩ

18 kΩ

kΩ

18 kΩ

kΩ

mute switch

power stage

mute switch

power stage

mute switch

power stage

mute switch

power stage

Vref

258

ground (signal)

GND1 GND2

power ground (substrate)

output 2B

output 2A

not connected

output 1B

input 1

input 2 13

TDA1552Q

July 1994 4

Philips Semiconductors Product speciﬁcation

2 x 22 W BTL stereo car radio power

ampliﬁer TDA1552Q

PINNING

FUNCTIONAL DESCRIPTION

The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications.

The gain of each amplifier is fixed at 26 dB. A special feature of this device is:

Mute/stand-by switch

•low stand-by current (< 100 µA)

•low mute/stand-by switching current (low cost supply switch)

•mute facility.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

1 IP1 input 1 8 GND2 power ground 2 (substrate)

2 GND ground (signal) 9 OUT2B output 2B

P1 positive supply voltage 1 10 VP2 positive supply voltage 2

4 OUT1A output 1A 11 M/SS mute/stand-by switch

5 GND1 power ground 1 (substrate) 12 n.c. not connected

6 OUT1B output 1B 13 IP2 input 2

7 OUT2A output 2A

PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT

Supply voltage

operating VP−18 V

non-operating VP−30 V

load dump protected during 50 ms;

tr ≥ 2.5 ms VP−45 V

Non-repetitive peak output current IOSM −6A

Repetitive peak output current IORM −4A

Storage temperature range Tstg −55 +150 °C

Junction temperature Tj−150 °C

AC and DC short-circuit-safe voltage VPSC −18 V

Energy handling capability at outputs VP = 0 V −200 mJ

Reverse polarity VPR −6V

Total power dissipation see Fig.2 Ptot −60 W

July 1994 5

Philips Semiconductors Product speciﬁcation

2 x 22 W BTL stereo car radio power

ampliﬁer TDA1552Q

Fig.2 Power derating curve.

July 1994 6

Philips Semiconductors Product speciﬁcation

2 x 22 W BTL stereo car radio power

ampliﬁer TDA1552Q

DC CHARACTERISTICS

VP = 14.4 V; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise speciﬁed

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply

Supply voltage range note 1 VP6.0 14.4 18.0 V

Total quiescent current Itot −80 160 mA

DC output voltage note 2 VO−6.9 −V

DC output offset voltage |∆VO|−−150 mV

Mute/stand-by switch

Switch-on voltage level VON 8.5 −−V

Mute condition Vmute 3.3 −6.4 V

Output signal in mute VI = 1 V (max);

position f = 1 kHz VO−−2mV

DC output offset voltage

(between pins 4 to 6 and 7 to 9) |∆VO|−−150 mV

Stand-by condition Vsb 0−2V

DC current in VII < 0.5 V Isb −−100 µA

stand-by condition 0.5 V ≤VII < 2 V Isb −−500 µA

Switch-on current Isw −25 60 µA

Supply current short-circuit

to GND

note 3 IP−5.5 −mA

July 1994 7

Philips Semiconductors Product speciﬁcation

2 x 22 W BTL stereo car radio power

ampliﬁer TDA1552Q

AC CHARACTERISTICS

VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise speciﬁed

Notes to the characteristics

1. The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8.5 V to 18 V.

2. At 18 V < VP < 30 V the DC output voltage ≤ VP/2.

3. Conditions:

a) V11 = 0 V

b) short-circuit to GND

c) switch V11 to MUTE or ON condition (rise time ≥10 µs).

4. Frequency response externally fixed.

5. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V).

6. Frequency f = 100 Hz.

7. Frequency between 1 kHz and 10 kHz.

8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.

9. Noise output voltage independent of RS (VI = 0 V).

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Output power THD = 0.5% Po15 17 −W

THD = 10% Po20 22 −W

Output power at VP = 13.2 V THD = 0.5% Po−12 −W

THD = 10% Po−17 - W

Total harmonic distortion Po = 1 W THD −0.1 −%

Power bandwidth THD = 0.5%

Po = −1 dB

w.r.t. 15 W Bw- 20 to −Hz

15000

Low frequency roll-off note 4

−1 dB fL−25 −Hz

High frequency roll-off −1 dB fH20 −−kHz

Closed loop voltage gain Gv25 26 27 dB

Supply voltage ripple rejection notes 5, 6 RR 42 −−dB

ON notes 5, 7 RR 48 −−dB

mute notes 5, 6, 7 RR 48 −−dB

stand-by notes 5, 6, 7 RR 80 −−dB

Input impedance |Zi| 506075kΩ

Noise output voltage

(RMS value)

ON RS = 0 Ω; note 8 Vno(rms) - 70 120 µV

ON RS = 10 kΩ; note 8 Vno(rms) −100 −µV

mute notes 8, 9 Vno(rms) −60 −µA

Channel separation α40 −−dB

Channel unbalance |∆Gv|- −1dB

July 1994 8

Philips Semiconductors Product speciﬁcation

2 x 22 W BTL stereo car radio power

ampliﬁer TDA1552Q

APPLICATION INFORMATION

Fig.3 Application circuit diagram.

handbook, full pagewidth

MLB951

100

mute/stand-by switch

12 11 3 10

220 nF 14

220 nF 13 9

TDA1552Q

2200

µF

14.4 V

not connected

R = 4 Ω

kΩ

reference

voltage

ground (signal)

input 2

input 1

power ground (substrate)

July 1994 9

Philips Semiconductors Product speciﬁcation

2 x 22 W BTL stereo car radio power

ampliﬁer TDA1552Q

PACKAGE OUTLINE

UNIT A e1

A2bpcD

(1) E(1) Z(1)

deD

hLL

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 17.0

15.5 4.6

4.2 0.75

0.60 0.48

0.38 24.0

23.6 20.0

19.6 10 3.4

0.8

12.2

11.8 1.7

5.08 2.4

1.6

62.00

1.45

2.1

1.8

3.4

3.1 4.3

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

12.4

11.0

SOT141-6

0 5 10 mm

scale

0.25

0.03

Ze2

113

non-concave

view B: mounting base side

92-11-17

95-03-11

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6

July 1994 10

Philips Semiconductors Product speciﬁcation

2 x 22 W BTL stereo car radio power

ampliﬁer TDA1552Q

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.