© Semiconductor Components Industries, LLC, 2016
September, 2016 − Rev. 11 1Publication Order Number:
NCP103/D
NCP103
150 mA CMOS Low Dropout
Regulator
The NCP103 is 150 mA LDO that provides the engineer with a very
stable, accurate voltage with low noise suitable for space constrained,
noise sensitive applications. In order to optimize performance for
battery operated portable applications, the NCP103 employs the
dynamic quiescent current adjustment for very low IQ consumption at
no−load.
Features
•Operating Input Voltage Range: 1.7 V to 5.5 V
•Available in Fixed Voltage Options: 0.9 V to 3.5 V
Contact Factory for Other Voltage Options
•Very Low Quiescent Current of Typ. 50 mA
•Standby Current Consumption: Typ. 0.1 mA
•Low Dropout: 75 mV Typical at 150 mA
•±1% Accuracy at Room Temperature
•High Power Supply Ripple Rejection: 75 dB at 1 kHz
•Thermal Shutdown and Current Limit Protections
•Stable with a 1 mF Ceramic Output Capacitor
•Available in uDFN 1.0 x 1.0 mm Package
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applicaitons
•PDAs, Mobile phones, GPS, Smartphones
•Wireless Handsets, Wireless LAN, Bluetooth®, Zigbee®
•Portable Medical Equipment
•Other Battery Powered Applications
Figure 1. Typical Application Schematic
NCP103
IN
EN
OUT
GND
OFF ON
VOUT
COUT
1 mF
Ceramic
CIN
VIN
UDFN4
MX SUFFIX
CASE 517CU
MARKING
DIAGRAM
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See detailed ordering, marking and shipping information on
page 14 of this data sheet.
ORDERING INFORMATION
PIN CONNECTION
XX = Specific Device Code
M = Date Code
34
12
GND OUT
EN IN
(Bottom View)
1
XX M
1
NCP103
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2
IN
OUT
BANDGAP
REFERENCE
ACTIVE
DISCHARGE*
MOSFET
DRIVER WITH
CURRENT LIMIT
THERMAL
SHUTDOWN
ENABLE
LOGIC
GND
AUTO LOW
POWER MODE
EN
EN
Figure 2. Simplified Schematic Block Diagram
*Active output discharge function is present only in NCP103AMXyyyTCG devices.
yyy denotes the particular VOUT option.
PIN FUNCTION DESCRIPTION
Pin No. Pin Name Description
1 OUT Regulated output voltage pin. A small ceramic capacitor with minimum value of 1 mF is needed from this
pin to ground to assure stability.
2 GND Power supply ground.
3 EN Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown
mode.
4 IN Input pin. A small capacitor is needed from this pin to ground to assure stability.
− EPAD Exposed pad should be connected directly to the GND pin. Soldered to a large ground copper plane allows
for effective heat removal.
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) VIN −0.3 V to 6 V V
Output Voltage VOUT −0.3 V to VIN + 0.3 V or 6 V V
Enable Input VEN −0.3 V to VIN + 0.3 V or 6 V V
Output Short Circuit Duration tSC ∞s
Maximum Junction Temperature TJ(MAX) 150 °C
Storage Temperature TSTG −55 to 150 °C
ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114,
ESD Machine Model tested per EIA/JESD22−A115,
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS (Note 3)
Rating Symbol Value Unit
Thermal Characteristics, uDFN4 1x1 mm
Thermal Resistance, Junction−to−Air RqJA 170 °C/W
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area.
NCP103
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ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 85°C; VIN = VOUT(NOM) + 1 V for VOUT options greater than 1.5 V. Otherwise VIN =
2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 1 mF, unless otherwise noted. VEN = 0.9 V. Typical values are at TJ = +25°C.
Min./Max. are for TJ = −40°C and TJ = +85°C respectively.
Parameter Test Conditions Symbol Min Typ Max Unit
Operating Input Voltage VIN 1.7 5.5 V
Output Voltage Accuracy −40°C ≤ TJ ≤ 85°CVOUT ≤ 2.0 V VOUT −40 +40 mV
VOUT > 2.0 V −2 +2 %
Line Regulation VOUT + 0.5 V ≤ VIN ≤ 5.5 V (VIN ≥ 1.7 V) RegLINE 0.01 0.1 %/V
Load Regulation IOUT = 1 mA to 150 mA RegLOAD 10 30 mV
Load Transient IOUT = 1 mA to 150 mA or 150 mA to 1 mA
in 1 ms, COUT = 1 mFTranLOAD −30/
+20 mV
Dropout Voltage (Note 4) IOUT = 150 mA
VOUT = 1.5 V
VDO
180 235
mV
VOUT = 1.85 V 120 165
VOUT = 2.8 V 75 125
VOUT = 3.0 V 72 120
VOUT = 3.1 V 70 120
VOUT = 3.3 V 65 110
Output Current Limit VOUT = 90% VOUT(nom) ICL 150 550 mA
Ground Current IOUT = 0 mA IQ50 95 mA
Shutdown Current VEN ≤ 0.4 V, VIN = 5.5 V IDIS 0.01 1 mA
EN Pin Threshold Voltage
High Threshold
Low Threshold VEN Voltage increasing
VEN Voltage decreasing VEN_HI
VEN_LO 0.9 0.4
V
EN Pin Input Current VEN = 5.5 V IEN 0.3 1.0 mA
Power Supply Rejection Ratio VIN = 3.6 V, VOUT = 3.1 V
IOUT = 150 mA f = 1 kHz PSRR 75 dB
Output Noise Voltage VIN = 2.5 V, VOUT = 1.8 V, IOUT = 150 mA
f = 10 Hz to 100 kHz VN60 mVrms
Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C
Thermal Shutdown Hysteresis Temperature falling from TSD TSDH 20 °C
Active Output Discharge Resistance VEN < 0.4 V, Version A only RDIS 100 W
4. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 1 V.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
NCP103
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TYPICAL CHARACTERISTICS
1.206
1.204
1.202
1.200
1.198
1.196
1.194
1.192
1.190
1.188
VOUT, OUTPUT VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (°C)
−40 9080−30−20 −10 0 10 20 30 40 50 60 70
IOUT = 1 mA
IOUT = 150 mA
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF
COUT = 1 mF
Figure 3. Output Voltage vs. Temperature
VOUT = 1.2 V
2.815
VOUT, OUTPUT VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (°C)
−40 9080−30−20 −10 0 10 20 30 40 50 60 70
Figure 4. Output Voltage vs. Temperature
VOUT = 2.8 V
2.810
2.805
2.800
2.795
2.790
2.785
2.780
2.775
2.770
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
IOUT = 1 mA
IOUT = 150 mA
80
IQ, QUIESCENT CURRENT (mA)
VIN, INPUT VOLTAGE (V)
0.0 0.5
Figure 5. Quiescent Current vs. Input Voltage
70
60
50
40
30
20
10
01.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
25°C
−40°C
85°C
85°C
25°C
−40°C
600
IGND, GROUND CURRENT (mA)
IOUT, OUTPUT CURRENT (mA)
0.001
Figure 6. Ground Current vs. Output Current
550
500
450
400
350
300
250
200
150
100
50
010000.01 0.1 1 10 100
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
600
IGND, GROUND CURRENT (mA)
TJ, JUNCTION TEMPERATURE (°C)
−40
Figure 7. Ground Current vs. Temperature
540
480
420
360
300
240
180
120
60
0−30 −20 −10 0 10 9080706050403020
IOUT = 150 mA 0.1
REGLINE, LINE REGULATION (%/V)
TJ, JUNCTION TEMPERATURE (°C)
Figure 8. Line Regulation vs. Output Current
VOUT = 1.2 V
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−1
−40 −30 −20 −10 0 10 9080706050403020
VIN = 1.7 V to 5.5 V
VOUT = 1.2 V
IOUT = 1 mA
CIN = 1 mF
COUT = 1 mF
IOUT = 1 mA VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
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TYPICAL CHARACTERISTICS
0.1
REGLINE, LINE REGULATION (%/V)
TJ, JUNCTION TEMPERATURE (°C)
−40 9080−30−20 −10 0 10 20 30 40 50 60 70
VIN = 3.8 V to 5.5 V
VOUT = 2.8 V
IOUT = 1 mA
CIN = 1 mF
COUT = 1 mF
Figure 9. Line Regulation vs. Temperature
VOUT = 2.8 V
10
REGLOAD, LOAD REGULATION (mV)
TJ, JUNCTION TEMPERATURE (°C)
−40 9080−30−20 −10 0 10 20 30 40 50 60 70
Figure 10. Load Regulation vs. Temperature
VOUT = 1.2 V
10
REGLOAD, LOAD REGULATION (mV)
TJ, JUNCTION TEMPERATURE (°C)
Figure 11. Load Regulation vs. Temperature
VOUT = 2.8 V
100
VDROP, DROPOUT VOLTAGE (mV)
IOUT, OUTPUT CURRENT (mA)
0
Figure 12. Dropout Voltage vs. Output Current
VOUT = 2.8 V
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
100
VDROP, DROPOUT VOLTAGE (mV)
TJ, JUNCTION TEMPERATURE (°C)
−40
Figure 13. Dropout Voltage vs. Temperature
−30 −20 −10 0 10 9080706050403020
IOUT = 0 mA
IOUT = 150 mA
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
800
ICL, CURRENT LIMIT (mA)
TJ, JUNCTION TEMPERATURE (°C)
Figure 14. Current Limit vs. Temperature
−40 −30 −20 −10 0 10 9080706050403020
VIN = VOUT(nom) + 1 V or 2.5 V
VOUT = 90% VOUT(nom)
CIN = 1 mF
COUT = 1 mF
9
8
7
6
5
4
3
2
1
0
VIN = 2.5 V
VOUT = 1.2 V
IOUT = 1 mA to 150 mA
CIN = 1 mF
COUT = 1 mF
0.08
0.06
0.04
0.02
0
−0.02
−0.04
−0.06
−0.08
−0.1
VIN = 3.8 V
VOUT = 2.8 V
IOUT = 1 mA to 150 mA
CIN = 1 mF
COUT = 1 mF
−40 9080−30−20 −10 0 10 20 30 40 50 60 70
9
8
7
6
5
4
3
2
1
0
90
80
70
60
50
40
30
20
10
0
TJ = 85°C
TJ = −40°C
TJ = 25°C
90
80
70
60
50
40
30
20
10
0
IOUT = 100 mA
750
700
650
600
550
500
450
400
350
300
VOUT = 2.8 V
VOUT = 1.2 V
15015 30 45 60 75 90 135120105
NCP103
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TYPICAL CHARACTERISTICS
800
ISC, SHORT−CIRCUIT CURRENT (mA)
TJ, JUNCTION TEMPERATURE (°C)
−40 9080−30−20 −10 0 10 20 30 40 50 60 70
VIN = VOUT(nom) + 1 V or 2.5 V
VOUT = 0 V
CIN = 1 mF
COUT = 1 mF
Figure 15. Short−Circuit Current vs.
Temperature
800
ISC, SHORT−CIRCUIT CURRENT (mA)
VIN, INPUT VOLTAGE (V)
3.0 5.65.43.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2
Figure 16. Short−Circuit Current vs. Input
Voltage
1
VEN, VOLTAGE ON ENABLE PIN (V)
TJ, JUNCTION TEMPERATURE (°C)
Figure 17. Enable Voltage Threshold vs.
Temperature
350
IEN, ENABLE CURRENT (nA)
TJ, JUNCTION TEMPERATURE (°C)
Figure 18. Current to Enable Pin vs.
Temperature
100
IDIS, DISABLE CURRENT (nA)
TJ, JUNCTION TEMPERATURE (°C)
−40
Figure 19. Disable Current vs. Temperature
−30 −20 −10 0 10 9080706050403020
VIN = 5.5 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
VOUT = 0 V
CIN = 1 mF
COUT = 1 mF
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
−40 9080−30−20 −10 0 10 20 30 40 50 60 70
VOUT = 2.8 V
VOUT = 1.2 V
750
700
650
600
550
500
450
400
350
300
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
OFF −> ON
ON −> OFF
315
280
245
210
175
140
105
70
35
0−40 9080−30−20 −10 0 10 20 30 40 50 60 70
VEN = 5.5 V
VEN = 0.4 V
VIN = 5.5 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
80
60
40
20
0
−20
−40
−60
−80
−100
750
700
650
600
550
500
450
400
350
300
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TYPICAL CHARACTERISTICS
Figure 20. Output Voltage Noise Spectral Density for VOUT = 1.2 V, COUT = 1 mF
FREQUENCY (kHz)
10001010.10.01
10000
Figure 21. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 1 mF
Figure 22. Output Voltage Noise Spectral Density for VOUT = 2.8 V, COUT = 4.7 mF
OUTPUT VOLTAGE NOISE (mV/rtHz)
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF
COUT = 1 mF
IOUT = 10 mA
1 mA 60.93 59.11
10 mA 52.73 50.63
150 mA 51.20 48.96
10 Hz − 100 kHz 100 Hz − 100 kHz
RMS Output Noise (mV)
IOUT
FREQUENCY (kHz)
10000
OUTPUT VOLTAGE NOISE (mV/rtHz)
FREQUENCY (kHz)
OUTPUT VOLTAGE NOISE (mV/rtHz)
100
10001010.10.01 100
10001010.10.01 100
IOUT = 1 mA
IOUT = 150 mA
1000
100
10
1
1 mA 79.23 74.66
10 mA 75.03 70.37
150 mA 77.28 72.66
10 Hz − 100 kHz 100 Hz − 100 kHz
RMS Output Noise (mV)
IOUT
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 1 mF
1000
100
10
1
IOUT = 10 mA
IOUT = 1 mA
IOUT = 150 mA
1 mA 80.17 75.29
10 mA 81.28 76.46
150 mA 81.31 76.77
10 Hz − 100 kHz 100 Hz − 100 kHz
RMS Output Noise (mV)
IOUT
IOUT = 10 mA
IOUT = 1 mA
IOUT = 150 mA
10000
1000
100
10
1
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF
COUT = 4.7 mF
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TYPICAL CHARACTERISTICS
100
RR, RIPPLE REJECTION (dB)
FREQUENCY (kHz)
Figure 23. Power Supply Rejection Ratio,
VOUT = 1.2 V, COUT = 1 mF
RR, RIPPLE REJECTION (dB)
FREQUENCY (kHz)
Figure 24. Power Supply Rejection Ratio,
VOUT = 2.8 V, COUT = 4.7 mF
100
ESR (W)
IOUT, OUTPUT CURRENT (mA)
0
Figure 25. Output Capacitor ESR vs. Output
Current
0.1
IOUT = 1 mA
IOUT = 10 mA
IOUT = 150 mA
VIN = 3.8 V
VOUT = 2.8 V
CIN = none
MLCC, X7R,
1206 size1 10000100010 100
VIN = 3.8 V
VOUT = 2.8 V
CIN = none
MLCC, X7R,
1206 size
100
10
1
0.1
0.01 15 30 45 90 135 150
VIN = 5.5 V
CIN = 1 mF
COUT = 1 mF
MLCC, X7R,
1206 size
UNSTABLE OPERATION
STABLE OPERATION
IOUT = 1 mA
IOUT = 10 mA
IOUT = 150 mA
0.1 1 10000100010 100
60 75 120105
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
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TYPICAL CHARACTERISTICS
Figure 26. Enable Turn−on Response,
COUT = 1 mF, IOUT = 1 mA Figure 27. Enable Turn−on Response,
COUT = 1 mF, IOUT = 150 mA
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
500 mV/div1 V/div
200 mA/div
IINRUSH
40 ms/div
VEN
VOUT
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 150 mA
200 mA/div
500 mV/div1 V/div
VEN
IINRUSH
VOUT
40 ms/div
Figure 28. Enable Turn−on Response,
COUT = 4.7 mF, IOUT = 1 mA
500 mV/div1 V/div
200 mA/div
IINRUSH
40 ms/div
VEN
VOUT
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
200 mA/div
500 mV/div1 V/div
VIN = 3.8 V
VOUT = 2.8 V
VEN = 1 V
COUT = 1 mF
CIN = 1 mF
IOUT = 150 mA
Figure 29. Enable Turn−on Response,
COUT = 4.7 mF, IOUT = 150 mA
40 ms/div
IINRUSH
VEN
VOUT
500 mV/div10 mV/div
Figure 30. Line Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA
20 ms/div
tRISE = 1 ms
VIN
VOUT
Figure 31. Line Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA
10 ms/div
500 mV/div10 mV/div
tFALL = 1 ms
VOUT
VIN
VIN = 3.8 V to 4.8 V
VOUT = 2.8 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
VIN = 4.8 V to 3.8 V
VOUT = 2.8 V
COUT = 1 mF
CIN = 1 mF
IOUT = 1 mA
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TYPICAL CHARACTERISTICS
Figure 32. Line Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 150 mA
500 mV/div20 mV/div
4 ms/div
VIN
VOUT
VIN = 3.8 V to 4.8 V
VOUT = 2.8 V
COUT = 10 mF
CIN = 1 mF
IOUT = 150 mA
500 mV/div20 mV/div
Figure 33. Line Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 150 mA
4 ms/div
VIN
VOUT
50 mA/div20 mV/div
Figure 34. Load Transient Response − Rising
Edge, VOUT = 1.2 V, IOUT = 1 mA to 150 mA,
COUT = 1 mF, 4.7 mF
4 ms/div
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
tRISE = 1 ms
COUT = 4.7 mF
COUT = 1 mF
IOUT
VOUT
Figure 35. Load Transient Response − Falling
Edge, VOUT = 1.2 V, IOUT = 1 mA to 150 mA,
COUT = 1 mF, 4.7 mF
20 ms/div
20 mV/div
COUT = 1 mF
COUT = 1 mF
tFALL = 1 ms
VOUT
20 mV/div
Figure 36. Load Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA to 150 mA,
COUT = 1 mF, 4.7 mF
4 ms/div
COUT = 1 mF
COUT = 4.7 mF
tRISE = 1 ms
VOUT
Figure 37. Load Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA to 150 mA,
COUT = 1 mF, 4.7 mF
10 ms/div
20 mV/div
tFALL = 1 ms
COUT = 4.7 mF
COUT = 1 mF
VOUT
VIN = 4.8 V to 3.8 V
VOUT = 2.8 V
COUT = 1 mF
CIN = 1 mF
IOUT = 150 mA
tRISE = 1 ms
tFALL = 1 ms
VIN = 2.5 V
VOUT = 1.2 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
50 mA/div
IOUT
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
50 mA/div
IOUT
50 mA/div
IOUT VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
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TYPICAL CHARACTERISTICS
500 mA/div20 mV/div
Figure 38. Load Transient Response − Rising
Edge, VOUT = 2.8 V, IOUT = 1 mA to 150 mA,
VIN = 3.8 V, 5.5 V
2 ms/div
VIN = 5.5 V
tRISE = 1 ms
IOUT
VOUT
VIN = 3.8 V
Figure 39. Load Transient Response − Falling
Edge, VOUT = 2.8 V, IOUT = 1 mA to 150 mA,
VIN = 3.8 V, 5.5 V
10 ms/div
20 mV/div
tFALL = 1 ms
IOUT
VOUT
1 V/div
Figure 40. Turn−on/off − Slow Rising VIN
4 ms/div Figure 41. Short−Circuit and Thermal
Shutdown
10 ms/div
VOUT
100 mA/div50 mV/div
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
500 mA/div
VIN = 5.5 V
VIN = 3.8 V
VIN = 3.8 V
VOUT = 2.8 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
VOUT
VIN
VIN = 5.5 V
VOUT = 2.8 V
IOUT = 10 mA
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
Overheating
Full Load
IOUT
Thermal Shutdown
TSD Cycling
VIN = 5.5 V
VOUT = 1.2 V
CIN = 1 mF (MLCC)
COUT = 1 mF (MLCC)
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APPLICATIONS INFORMATION
General
The NCP103 is a high performance 150 mA Low Dropout
Linear Regulator. This device delivers very high PSRR
(over 75 dB at 1 kHz) and excellent dynamic performance
as load/line transients. In connection with very low
quiescent current this device is very suitable for various
battery powered applications such as tablets, cellular
phones, wireless and many others. The device is fully
protected in case of output overload, output short circuit
condition and overheating, assuring a very robust design.
Input Capacitor Selection (CIN)
It is recommended to connect at least a 1mF Ceramic X5R
or X7R capacitor as close as possible to the IN pin of the
device. This capacitor will provide a low impedance path for
unwanted AC signals or noise modulated onto constant
input voltage. There is no requirement for the min. /max.
ESR of the input capacitor but it is recommended to use
ceramic capacitors for their low ESR and ESL. A good input
capacitor will limit the influence of input trace inductance
and source resistance during sudden load current changes.
Larger input capacitor may be necessary if fast and large
load transients are encountered in the application.
Output Decoupling (COUT)
The NCP103 requires an output capacitor connected as
close as possible to the output pin of the regulator. The
recommended capacitor value is 1 mF and X7R or X5R
dielectric due to its low capacitance variations over the
specified temperature range. The NCP103 is designed to
remain stable with minimum effective capacitance of
0.22 mF to account for changes with temperature, DC bias
and package size. Especially for small package size
capacitors such as 0402 the effective capacitance drops
rapidly with the applied DC bias.
There is no requirement for the minimum value of
Equivalent Series Resistance (ESR) for the COUT but the
maximum value of ESR should be less than 3 W. Larger
output capacitors and lower ESR could improve the load
transient response or high frequency PSRR. It is not
recommended to use tantalum capacitors on the output due
to their large ESR. The equivalent series resistance of
tantalum capacitors is also strongly dependent on the
temperature, increasing at low temperature.
Enable Operation
The NCP103 uses the EN pin to enable/disable its device
and to deactivate/activate the active discharge function.
If the EN pin voltage is <0.4 V the device is guaranteed to
be disabled. The pass transistor is turned−off so that there is
virtually no current flow between the IN and OUT. The
active dischar ge transistor is active so that the output voltage
VOUT is pulled to GND through a 100 W resistor. In the
disable state the device consumes as low as typ. 10 nA from
the VIN.
If the EN pin voltage >0.9 V the device is guaranteed to
be enabled. The NCP103 regulates the output voltage and
the active discharge transistor is turned−off.
The EN pin has internal pull−down current source with
typ. value of 300 nA which assures that the device is
turned−off when the EN pin is not connected. In the case
where the EN function isn’t required the EN should be tied
directly to IN.
Output Current Limit
Output Current is internally limited within the IC to a
typical 550 mA. The NCP103 will source this amount of
current measured with a voltage drops on the 90% of the
nominal VOUT. If the Output Voltage is directly shorted to
ground (VOUT = 0 V), the short circuit protection will limit
the output current to 580 mA (typ). The current limit and
short circuit protection will work properly over whole
temperature range and also input voltage range. There is no
limitation for the short circuit duration.
Thermal Shutdown
When the die temperature exceeds the Thermal Shutdown
threshold (TSD − 160°C typical), Thermal Shutdown event
is detected and the device is disabled. The IC will remain in
this state until the die temperature decreases below the
Thermal Shutdown Reset threshold (TSDU * 140°C
typical). Once the IC temperature falls below the 140°C the
LDO is enabled again. The thermal shutdown feature
provides the protection from a catastrophic device failure
due to accidental overheating. This protection is not
intended to be used as a substitute for proper heat sinking.
Power Dissipation
As power dissipated in the NCP103 increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part.
The maximum power dissipation the NCP103 can handle
is given by:
PD(MAX) +ƪ125°C*TAƫ
qJA
(eq. 1)
The power dissipated by the NCP103 for given
application conditions can be calculated from the following
equations:
PD[VINǒIGND@IOUTǓ)IOUTǒVIN *VOUTǓ(eq. 2)
NCP103
www.onsemi.com
13
Figure 42. qJA vs. Copper Area (uDFN4)
1
100
120
140
160
180
200
220
0 100 200 300 400 500 600 700
COPPER HEAT SPREADER AREA (mm2)
qJA, JUNCTION−TO−AMBIENT
THERMAL RESISTANCE (°C/W)
PD(MAX), TA = 25°C, 2 oz Cu
PD(MAX), MAXIMUM POWER
DISSIPATION (W)
PD(MAX), TA = 25°C, 1 oz Cu
qJA, 1 oz Cu
qJA, 2 oz Cu
240
260
0.9
0.8
0.7
0.6
0.5
0.4
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case that VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
Power Supply Rejection Ratio
The NCP103 features very good Power Supply Rejection
ratio. If desired the PSRR at higher frequencies in the range
100 kHz − 10 MHz can be tuned by the selection of COUT
capacitor and proper PCB layout.
Turn−On T ime
The turn−on time is defined as the time period from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT(NOM), COUT and TA.
For example typical value for VOUT = 1.2 V, COUT = 1 mF,
IOUT = 1 mA and TA = 25°C is 90 ms.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors close to the
device pins and make the PCB traces wide. In order to
minimize the solution size, use 0402 capacitors. Larger
copper area connected to the pins will also improve the
device thermal resistance. The actual power dissipation can
be calculated from the equation above (Equation 2). Expose
pad should be tied the shortest path to the GND pin.
NCP103
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14
ORDERING INFORMATION
Device Voltage
Option Marking Marking
Rotation Option Package Shipping†
NCP103AMX090TCG 0.9 V AQ 0°
With active output
discharge function uDFN4
(Pb-Free) 3000 / Tape & Reel
NCP103AMX100TCG 1.0 V 5 180°
NCP103AMX105TCG 1.05 V A 0°
NCP103AMX110TCG 1.1 V E 180°
NCP103AMX120TCG 1.2 V D 0°
NCP103AMX125TCG 1.25 V D 180°
NCP103AMX130TCG 1.3 V AD 0°
NCP103AMX150TCG 1.5 V E 0°
NCP103AMX160TCG 1.6 V Y 180°
NCP103AMX180TCG 1.8 V K 180°
NCP103AMX185TCG 1.85 V F 0°
NCP103AMX210TCG 2.1 V P 180°
NCP103AMX220TCG 2.2 V R 180°
NCP103AMX240TCG 2.4 V AL 0°
NCP103AMX250TCG 2.5 V AX 0°
NCP103AMX260TCG 2.6 V V 180°
NCP103AMX270TCG 2.7 V AK 0°
NCP103AMX280TCG 2.8 V J 0°
NCP103AMX285TCG 2.85 V K 0°
NCP103AMX300TCG 3.0 V L 0°
NCP103AMX310TCG 3.1 V P 0°
NCP103AMX320TCG 3.2 V AY 0°
NCP103AMX330TCG 3.3 V Q 0°
NCP103AMX345TCG 3.45 V AE 0°
NCP103AMX350TCG 3.5 V 3 180°
NCP103AMX360TCG 3.6 V AV 0°
NCP103BMX100TCG 1.0 V 5 270°
Without active output
discharge function uDFN4
(Pb-Free) 3000 / Tape & Reel
NCP103BMX105TCG 1.05 V A 90°
NCP103BMX110TCG 1.1 V E 270°
NCP103BMX120TCG 1.2 V D 90°
NCP103BMX125TCG 1.25 V D 270°
NCP103BMX130TCG 1.3 V CD 0°
NCP103BMX150TCG 1.5 V E 90°
NCP103BMX160TCG 1.6 V Y 270°
NCP103BMX180TCG 1.8 V K 270°
NCP103BMX185TCG 1.85 V F 90°
NCP103BMX210TCG 2.1 V P 270°
NCP103BMX220TCG 2.2 V R 270°
NCP103BMX250TCG 2.5 V CH 0°
NCP103BMX260TCG 2.6 V V 270°
NCP103BMX280TCG 2.8 V J 90°
NCP103BMX285TCG 2.85 V K 90°
NCP103BMX300TCG 3.0 V L 90°
NCP103BMX310TCG 3.1 V P 90°
NCP103BMX330TCG 3.3 V Q 90°
NCP103BMX345TCG 3.45 V CE 0°
NCP103BMX350TCG 3.5 V 3 270°
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCP103
www.onsemi.com
15
PACKAGE DIMENSIONS
ÉÉ
ÉÉ
UDFN4 1.0x1.0, 0.65P
CASE 517CU
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.03 AND 0.07
FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
D2
BOTTOM VIEW
b
e
4X
NOTE 3
2X 0.05 C
PIN ONE
REFERENCE
TOP VIEW
2X 0.05 C
A
A1
(A3)
0.05 C
0.10 C
CSEATING
PLANE
SIDE VIEW
L
3X
12
DIM MIN MAX
MILLIMETERS
A−−− 0.60
A1 0.00 0.05
A3 0.15 REF
b0.20 0.30
D1.00 BSC
D2 0.38 0.58
E1.00 BSC
e0.65 BSC
L0.20 0.30
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOUNTING FOOTPRINT*
1.30
0.30
0.53 4X
DIMENSIONS: MILLIMETERS
RECOMMENDED
PACKAGE
OUTLINE
NOTE 4
e/2
D2
45543
0.65
PITCH
DET AIL A
L2 0.27 0.37
0.58
2X
L2
DETAIL A
C0.27 x 0.25
1
DETAIL B 0.23
4X
DETAIL B0.10
3X
A
M
0.10 BC
M
0.05 C
3X C0.18
X 45 5
0.43
3X
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