ELX540AT2SLKTL940872 - INTEL

◯Product structure: Silicon Monolithic Integrated Circuit ◯This product is not designed protection against radioactive rays.

.

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Datashee

t

500-mA 3.3-V or 5.0-V Output

LDO Regulators

BD4xxM5-C Series

●General Description

The BD4xxM5 series are low quiescent regulators

featuring 45 V absolute maximum voltage, and output

voltage accuracy of ±2 % (3.3 V or 5 V: Typ.), 500 mA

output current and 38 μA (Typ.) current consumption.

These regulators are therefore ideal for applications

requiring a direct connection to the battery and a low

current consumption.

A logical “HIGH” at the CTL enables the device and

“LOW” at the CTL disables the device.

(Only W: Includes Enable Input).

Ceramic capacitors can be used for compensation of the

output capacitor phase. Furthermore, these ICs also

feature overcurrent protection to protect the device from

damage caused by short-circuiting and an integrated

thermal shutdown to protect the device from overheating

at overload conditions.

●Package W (Typ.) × D (Typ.) × H (Max.)

■ FPJ: TO252-J5(Note2) 6.60 mm × 10.10 mm × 2.38 mm

(Note2: TO252-J5 & TO252-J5F)

■ FP: TO252-3 6.50 mm × 9.50 mm × 2.50 mm

●Features

 Qualified for Automotive Applications

 Wide Temperature Range (Tj): -40 °C to +150 °C

 Wide Operating Input Range: 3.0 V to 42 V

 Low Quiescent Current: 38 μA (Typ.)

 Output Current: 500 mA

 High Output Voltage Accuracy: ±2 %

 Output Voltage: 3.3 V or 5.0 V (Typ.)

 Enable Input (Only W)

 Overload Current Protection (OCP)

 Thermal Shutdown Protection (TSD)

 AEC-Q100 Qualified

(Note1)

(Note1:Grade1)

■ FP2: TO263-5(Note3) 10.16 mm × 15.10 mm × 4.70 mm

(Note3: TO263-5 & TO263-5F)

■ FP2: TO263-3(Note4) 10.16 mm × 15.10 mm × 4.70 mm

(Note4: TO263-3 & TO263-3F)

Figure 1. Package Outlook

●Applications

■ Automotive (body, audio system, navigation system, etc.)

●Typical Application Circuits

■ Components Externally Connected: 0.1 µF ≤ CIN, 10 µF ≤ COUT (Typ.)

* Electrolytic, tantalum and ceramic capacitors can be used.

Figure 2. Typical Application Circuits

BD433 / 450M5WFPJ-C BD433 / 450M5WFP2-C BD433 / 450M5FP-C BD433 / 450M5FP2-C

Datasheet

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BD4xxM5-C Series

●Ordering Information

B D 4 x x M 5 W F P J －C Z E 2

Part

Number

Output Voltage

33: 3.3 V

50: 5.0 V

Output Current

5: 500 mA

Enable Input

W: Includes

Enable

Input

Package

FPJ: TO252-J5(F)

FP : TO252-3

FP2: TO263-5(F)

TO263-3(F)

Packaging and Forming

Specification

Z: Manufacturing Code

E2: Embossed Tape and Reel

●Lineup

Output Current

Ability

Output Voltage

(Typ.)

Enable

Input (1) Package Type Orderable Part Number

500 mA

3.3 V

○

TO252-J5(F) BD433M5WFPJ-CZE2

TO263-5(F) BD433M5WFP2-CZE2

－

TO252-3 BD433M5FP-CE2

TO263-3(F) BD433M5FP2-CZE2

5.0 V

○

TO252-J5(F) BD450M5WFPJ-CZE2

TO263-5(F) BD450M5WFP2-CZE2

－

TO252-3 BD450M5FP-CE2

TO263-3(F) BD450M5FP2-CZE2

(1) ○: Includes Enable Input

– : Not includes Enable Input

Datasheet

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BD4xxM5-C Series

●Pin Configurations

Figure 3. Pin Configuration

●Pin Descriptions

■ BD433 / 450M5WFPJ-C ■BD433 / 450M5WFP2-C

Pin No. Pin Name Function Pin No. Pin Name Function

1 VCC Supply Voltage Input Pin 1 VCC Supply Voltage Input Pin

2 CTL Output Control Pin 2 CTL Output Control Pin

3 GND Ground Pin 3 GND Ground Pin

4 N.C. Not Connected 4 N.C. Not Connected

5 VOUT Output Pin 5 VOUT Output Pin

6 (FIN) GND Ground Pin 6 (FIN) GND Ground Pin

■ BD433 / 450M5FP-C ■BD433 / 450M5FP2-C

Pin No. Pin Name Function Pin No. Pin Name Function

1 VCC Supply Voltage Input Pin 1 VCC Supply Voltage Input Pin

2 N.C. Not Connected 2 GND Ground Pin

3 VOUT Output Pin 3 VOUT Output Pin

4 (FIN) GND Ground Pin 4 (FIN) GND Ground Pin

* N.C. Pin is recommended to short with GND.

* N.C. Pin can be open because it isn’t connected it inside of IC.

TO252-J5(F)

(Top View)

TO263-5(F)

(Top View)

FIN

1 2 3

TO252-3

(Top View)

1 2 3

TO263-3(F)

(Top View)

3

1 2 4 5

FIN

3

1 2 4 5

Datasheet

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BD4xxM5-C Series

●Block Diagrams

■ BD433 / 450M5WFPJ-C

■ BD433 / 450M5WFP2-C

Datasheet

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BD4xxM5-C Series

■ BD433 / 450M5FP-C

■ BD433 / 450M5FP2-C

Figure 4. Block Diagrams

PREREG

N.C. (2PIN)

GND (FIN)

VCC (1PIN)

TSD

VREF

DRIVER

OCP

VOUT (3PIN)

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BD4xxM5-C Series

●Description of Blocks

Block Name Function Description of Blocks

CTL (1) Control Output Voltage ON/OFF A logical “HIGH” ( ≥ 2.8 V ) at the CTL enables the device

and “LOW” ( ≤ 0.8 V ) at the CTL disable the device.

PREREG Internal Power Supply Power Supply for Internal Circuit

TSD Thermal Shutdown Protection

To protect the device from overheating.

If the chip temperature ( Tj ) reaches ca. 175 °C ( Typ. ),

the output is turned off.

VREF Reference Voltage Generate the Reference Voltage

DRIVER Output MOS FET Driver Drive the Output MOS FET

OCP Over Current Protection

To protect the device from damage caused by over current.

If the output current reaches ca. 900 mA (Typ.),

the output is turned off.

(1) Applicable for product with Enable Input.

Datasheet

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BD4xxM5-C Series

●Absolute Maximum Ratings

Parameter Symbol Ratings Unit

Supply Voltage (1) VCC -0.3 to +45.0 V

Output Control Voltage (2) CTL -0.3 to +45.0 V

Output Voltage

VOUT -0.3 to +8.0 V

Junction Temperature Range Tj -40 to +150 °C

Storage Temperature Range Tstg -55 to +150 °C

Maximum Junction Temperature Tjmax 150 °C

ESD withstand Voltage (HBM) (3) V

ESD, HBM ±2000 V

(1) Do not exceed Pd.

(2) Applicable for product with Enable Input.

The start-up orders of power supply (VCC) and the CTL do not influence if the voltage is within the operation power supply voltage range.

(3) ESD susceptibility Human Body Model “HBM”.

●Operating Conditions (-40 °C ≤ Tj ≤ +150 °C)

Parameter Symbol Min. Max. Unit

Supply Voltage ( IOUT ≤ 500 mA ) (1) VCC 5.9 42.0 V

Supply Voltage ( IOUT ≤ 250 mA ) (1)

VCC 5.5 42.0 V

Supply Voltage ( IOUT ≤ 500 mA ) (2)

VCC 4.6 42.0 V

Supply Voltage ( IOUT ≤ 250 mA ) (2)

VCC 4.0 42.0 V

Output Control Voltage (3) CTL 0 42.0 V

Start-Up Voltage (4) VCC 3.0 – V

Output Current IOUT 0 500 mA

Junction Temperature Range Tj -40 +150 °C

(1) BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5FP-C / BD450M5FP2-C

(2) BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C

(3) Applicable for Product with Enable Input.

(4) When IOUT = 0 mA

Notice: Please consider that the output voltage would be dropped (Dropout voltage) according to the output current.

Datasheet

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BD4xxM5-C Series

●Thermal Impedance (1)

Parameter Symbol Typ. Unit Conditions

TO252-J5(F) / TO252-3

Junction to Ambient θJA

136 °C / W 1s (2)

23 °C / W 2s2p (3)

Junction to Top Center of Case (4) ΨJT

17 °C / W 1s (2)

3 °C / W 2s2p (3)

TO263-5(F) / TO263-3(F)

Junction to Ambient θJA

81 °C / W 1s (2)

21 °C / W 2s2p (3)

Junction to Top Center of Case (4) ΨJT

8 °C / W 1s (2)

2 °C / W 2s2p (3)

(1) The thermal impedance is based on JESD51 - 2A (Still-Air) standard.

(2) JESD51 - 3 standard FR4 114.3 mm × 76.2 mm × 1.57 mm 1-layer (1s)

(Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.)

(3) JESD51 -5 / -7 standard FR4 114.3 mm × 76.2 mm × 1.60 mm 4-layer（2s2p）

(Top copper foil: ROHM recommended footprint + wiring to measure / 2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm,

copper (top & reverse side / inner layers) 2oz. / 1oz.)

(4) TT : Top center of case’s (mold) temperature

Datasheet

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BD4xxM5-C Series

●Electrical Characteristics

Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (1), IOUT = 0 mA

The typical value is defined at Tj = 25 °C.

Parameter Symbol Limit Unit Conditions

Min. Typ. Max.

Shut Down Current Ishut (1) – 2.0 5.0 μA CTL = 0 V

Tj ≤ 125 °C

Circuit Current Icc

– 38 95 μA IOUT = 0 mA

Tj ≤ 125 °C

– 38 175 μA IOUT ≤ 500 mA

Tj ≤ 150 °C

Output Voltage

VOUT (2)

4.90 5.00 5.10 V

6 V ≤ VCC ≤ 42 V,

0 mA ≤ IOUT ≤ 400 mA

4.80 5.00 5.10 V

6 V ≤ VCC ≤ 42V

0 mA ≤ IOUT ≤ 500 mA

VOUT (3)

3.23 3.30 3.37 V

6 V ≤ VCC ≤ 42 V

0 mA ≤ IOUT ≤ 400 mA

3.20 3.30 3.37 V

6 V ≤ VCC ≤ 42 V

0 mA ≤ IOUT ≤ 500 mA

Dropout Voltage

∆Vd (2) – 0.20 0.50 V

VCC = VOUT × 0.95 (Typ. 4.75 V)

IOUT = 300 mA

∆Vd (3) – 0.25 0.75 V

VCC = VOUT × 0.95 (Typ. 3.135 V)

IOUT = 300 mA

Ripple Rejection R.R. 55 60 – dB

f = 120 Hz, ein = 1 Vrms

IOUT = 100 mA

Line Regulation Reg.I – 10 30 mV 8 V ≤ VCC ≤ 16 V

Load Regulation Reg.L – 10 30 mV 10 mA ≤ IOUT ≤ 400 mA

Thermal Shut Down TSD – 175 – °C Tj at TSD ON

(1) Applicable for Product with Enable Input.

(2) For BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5FP-C / BD450M5FP2-C

(3) For BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C

●Electrical Characteristics ( Enable function * Applicable for product with Enable Input. )

Unless otherwise specified, -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA. The typical value is defined at Tj = 25 °C.

Parameter Symbol Limit Unit Conditions

Min. Typ. Max.

CTL ON Mode Voltage VthH 2.8 – – V Active Mode

CTL OFF Mode Voltage VthL – – 0.8 V Off Mode

CTL Bias Current ICTL – 15 30 µA CTL = 5 V

Datasheet

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BD4xxM5-C Series

●Typical Performance Curves

■BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (1), IOUT = 0 mA.

(1) Applicable for Product with Enable Input.

0

10

20

30

40

50

60

70

80

90

100

0 5 10 15 20 25 30 35 40 45

Circuit Current: Icc [µA]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

10

20

30

40

50

60

70

80

90

100

012345678910

Circuit Curent: Icc [µA]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

1

2

3

4

5

6

0123456

Output Voltage: VOUT [V]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

1

2

3

4

5

6

0 5 10 15 20 25 30 35 40 45

Output Voltage: VOUT [V]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

Figure 5. Circuit Current vs. Power Supply Voltage Figure 6. Output Voltage vs. Power Supply Voltage

(IOUT = 0 mA)

Figure 7. Circuit Current vs. Power Supply Voltage

*Magnified Figure 5. at low supply voltage

Figure 8. Output voltage vs. Power Supply Voltage

(IOUT = 0 mA)

* Magnified Figure 6. at Low Supply Voltage

Datasheet

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BD4xxM5-C Series

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0 50 100 150 200 250 300 350 400 450 500

Dropout Voltage: ∆Vd [V]

Output Current: IOUT [mA]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

10

20

30

40

50

60

70

80

90

0.01 0.1 1 10 100

Ripple Rejection: R.R. [dB]

Frequency: f [kHz]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

1

2

3

4

5

6

0 100 200 300 400 500 600 700 800 900 1000

Output Voltage: VOUT [V]

Output Current: IOUT [mA]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

●Typical Performance Curves

■BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (1), IOUT = 0 mA.

(1) Applicable for Product with Enable Input.

0

1

2

3

4

5

6

0 5 10 15 20 25 30 35 40 45

Output Voltage: VOUT [V]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

Figure 10. Output Voltage vs. Load

(Over Current Protection)

Figure 9. Output Voltage vs. Power Supply Voltage

(IOUT = 10 mA)

Figure 11. Dropout Voltage

(VCC = 3.135 V)

Figure 12. Ripple Rejection

(ein = 1 Vrms, IOUT = 100 mA)

Datasheet

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BD4xxM5-C Series

0

1

2

3

4

5

6

100 120 140 160 180 200

Output Voltage: VOUT [V]

Junction Temperature: Tj [°C]

3.230

3.250

3.270

3.290

3.310

3.330

3.350

3.370

-40-200 20406080100120140160

Output Voltage: VOUT [V]

Junction Temperature: Tj [°C]

0

10

20

30

40

50

60

70

80

90

0 100 200 300 400 500

Circuit Current: Icc [μA]

Output Current: IOUT [mA]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

10

20

30

40

50

60

70

80

90

100

-40 0 40 80 120 160

Circuit Current: Icc [μA]

Junction Temperature: Tj [°C]

●Typical Performance Curves

■BD433M5WFPJ-C / BD433M5WFP2-C / BD433M5FP-C / BD433M5FP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5 V (1), IOUT = 0 mA.

(1) Applicable for Product with Enable Input.

Figure 13. Circuit Current vs. Output Current Figure 14. Output Voltage vs. Temperature

(Thermal Shut Down)

Figure 15. Output Voltage vs. Temperature Figure 16. Circuit Current vs. Temperature

Datasheet

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BD4xxM5-C Series

0

1

2

3

4

5

6

012345

Output Voltage: VOUT [V]

CTL Supply Voltage: CTL [V]

Tj = -40 °C

0

1

2

3

4

5

6

012345

Output Voltage: VOUT [V]

CTL Supply Voltage: CTL [V]

Tj = 25 °C

0

1

2

3

4

5

6

012345

Output Voltage: VOUT [V]

CTL Supply Voltage: CTL [V]

Tj = 125 °C

●Typical Performance Curves

■BD433M5WFPJ-C / BD433M5WFP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA

0

1

2

3

4

5

6

7

8

9

10

0 5 10 15 20 25 30 35 40 45

Shut Down Current: Ishut [μA]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

Figure 17. Shut Down Current vs. Power Supply Voltage

(CTL = 0 V)

Figure 18. CTL ON / OFF Mode Voltage

(Tj = -40 °C)

Figure 19. CTL ON / OFF Mode Voltage

(Tj = 25 °C)

Figure 20. CTL ON / OFF Mode Voltage

(Tj = 125 °C)

Datasheet

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BD4xxM5-C Series

0

1

2

3

4

5

-40 0 40 80 120 160

Shutdown Current: Ishut [µA]

Junction Temperature: Tj [°C]

●Typical Performance Curves

■BD433M5WFPJ-C / BD433M5WFP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA

0

5

10

15

20

012345

CTL Bias Current: ICTL [µA]

CTL Supply Voltage: CTL [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

Figure 21. Shut Down Current

(CTL = 0 V)

Figure 22. CTL Bias Current vs. CTL Supply Voltage

Datasheet

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BD4xxM5-C Series

0

1

2

3

4

5

6

0 5 10 15 20 25 30 35 40 45

Output Voltage: VOUT [V]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

10

20

30

40

50

60

70

80

90

100

0 5 10 15 20 25 30 35 40 45

Circuit Current: Icc [µA]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

●Typical Performance Curves

■BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5FP-C/BD450M5FP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5V (1), IOUT = 0 mA

(1) Applicable for Product with Enable Input.

0

10

20

30

40

50

60

70

80

90

100

012345678910

Circuit Current: Icc [µA]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

1

2

3

4

5

6

0123456

Output Voltage: VOUT [V]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

Figure 23. Circuit Current vs. Power Supply Voltage Figure 24. Output Voltage vs. Power Supply Voltage

(IOUT = 0 mA)

Figure 25. Circuit Current vs. Power Supply Voltage

*Magnified Figure 23. at low supply voltage

Figure 26. Output Voltage vs. Power Supply Voltage

(IOUT = 0 mA)

*Magnified Figure 24. at low supply voltage

Datasheet

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BD4xxM5-C Series

0

1

2

3

4

5

6

0 5 10 15 20 25 30 35 40 45

Output Voltage: VOUT [V]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0 50 100 150 200 250 300 350 400 450 500

Dropout Voltage: ∆Vd [V]

Output Current: IOUT [mA]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

10

20

30

40

50

60

70

80

90

0.01 0.1 1 10 100

Ripple Rejection: R.R. [dB]

Frequency: f [kHz]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

●Typical Performance Curves

■BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5FP-C / BD450M5FP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5V (1), IOUT = 0 mA

(1) Applicable for Product with Enable Switch.

Figure 28. Output Voltage vs. Output Current

(Over Current Protection)

Figure 27. Output Voltage vs. Power Supply Voltage

(IOUT = 10 mA)

Figure 29. Dropout Voltage

(VCC=4.75V)

Figure 30. Ripple Rejection

(ein = 1 Vrms, IOUT = 100 mA)

0

1

2

3

4

5

6

0 100 200 300 400 500 600 700 800 900 1000

Output Voltage: VOUT [V]

Output Current: IOUT [mA]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

Datasheet

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BD4xxM5-C Series

0

1

2

3

4

5

6

100 120 140 160 180 200

Output Voltage: VOUT [V]

Junction Temperature: Tj [°C]

4.900

4.920

4.940

4.960

4.980

5.000

5.020

5.040

5.060

5.080

5.100

-40-200 20406080100120140160

Output Voltage: VOUT [V]

Junction Temperature: Tj [°C]

0

10

20

30

40

50

60

70

80

90

0 100 200 300 400 500

Circuit Current: Icc [μA]

Output Current: IOUT [mA]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

0

10

20

30

40

50

60

70

80

90

100

-40 0 40 80 120 160

Circuit Current: Icc [μA]

Junction Temperature: Tj [°C]

●Typical Performance Curves

■BD450M5WFPJ-C / BD450M5WFP2-C / BD450M5WFP2-C / BD450M5FP-C / BD450M5FP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, CTL = 5V (1), IOUT = 0 mA

(1) Applicable for Product with Enable Input.

Figure 31. Circuit Current vs. Output Current Figure 32. Output Voltage vs. Temperature

(Thermal Shut Down)

Figure 33. Output Voltage vs. Temperature Figure 34. Circuit Current vs. Temperature

Datasheet

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22.Feb.2017 Rev.006

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TSZ22111･15･001

BD4xxM5-C Series

0

1

2

3

4

5

6

012345

Output Voltage: VOUT [V]

CTL Supply Voltage: CTL [V]

Tj = -40 °C

0

1

2

3

4

5

6

012345

Output Voltage: VOUT [V]

CTL Supply Voltage: CTL [V]

Tj = 25 °C

0

1

2

3

4

5

6

012345

Output Voltage: VOUT [V]

CTL Supply Voltage: CTL [V]

Tj = 125 °C

●Typical Performance Curves

■BD450M5WFPJ-C / BD450M5WFP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA

0

1

2

3

4

5

6

7

8

9

10

0 5 10 15 20 25 30 35 40 45

Shut Down Current: Ishut [μA]

Supply Voltage: VCC [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

Figure 35. Shut Down Current vs. Power Supply Voltage

(CTL = 0 V)

Figure 36. CTL ON / OFF Mode Voltage

(Tj = -40 °C)

Figure 37. CTL ON / OFF Mode Voltage

(Tj = 25 °C)

Figure 38. CTL ON / OFF Mode Voltage

(Tj = 125 °C)

Datasheet

19/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

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TSZ22111･15･001

BD4xxM5-C Series

0

1

2

3

4

5

-40 0 40 80 120 160

Shutdown Current: Ishut [µA]

Junction Temperature: Tj [°C]

●Typical Performance Curves

■BD450M5WFPJ-C / BD450M5WFP2-C Reference Data

Unless otherwise specified: -40 °C ≤ Tj ≤ +150 °C, VCC = 13.5 V, IOUT = 0 mA

0

5

10

15

20

012345

CTL Bias Current: ICTL [µA]

CTL Supply Voltage: CTL [V]

Tj = -40 °C

Tj = 25 °C

Tj = 125 °C

Figure 39. Shut Down Current vs. Temperature

(CTL = 0 V)

Figure 40. CTL Bias Current vs. CTL Supply Voltage

Datasheet

20/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

www.rohm.com

TSZ22111･15･001

BD4xxM5-C Series

4.7μF10μF

1: VCC 3: N.C. 5: VOUT

FIN

2: CTL 4: N.C.

BD4xxM5WFPJ-C

1Vrms

IOUT

4.7μF10μF

1: VCC 3: N.C. 5: VOUT

FIN

2: CTL 4: N.C.

BD4xxM5WFPJ-C

IOUT4.7μF10μF

1: VCC 3: N.C. 5: VOUT

FIN

2: CTL 4: N.C.

BD4xxM5WFPJ-C

4.7μF10μF

1: VCC 3: N.C. 5: VOUT

FIN

2: CTL 4: N.C.

BD4xxM5WFPJ-C

4.7μF10μF

1: VCC 3: N.C. 5: VOUT

FIN

2: CTL 4: N.C.

BD4xxM5WFPJ-C

4.7μF10μF

1: VCC 3: N.C. 5: VOUT

FIN

2: CTL 4: N.C.

BD4xxM5WFPJ-C

●Measurement Circuit for Typical Performance Curves (BD433 / 450M5WFPJ-C)

Measurement Setup for

Figure 5, 7, 16, 17, 21,

Figure 23, 25, 34, 35, 39

Measurement Setup for

Figure 6, 8, 14, 15,

Figure 24, 26, 32, 33

Measurement Setup for

Figure 9, 27

Measurement Setup for

Figure 10, 28

Measurement Setup for

Figure 11, 29

Measurement Setup for

Figure 12, 30

Measurement Setup for

Figure 22, 40

Measurement Setup for

Figure 18, 19, 20,

Figure 36, 37, 38

Measurement Setup for

Figure 13, 31

Datasheet

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22.Feb.2017 Rev.006

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TSZ22111･15･001

BD4xxM5-C Series

●Measurement Circuit for Typical Performance Curves (BD433 / 450M5WFP2-C)

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

4.7μF10μF

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

4.7μF10μF

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

IOUT4.7μF10μF

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

IOUT4.7μF10μF

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

1Vrms

IOUT

4.7μF10μF

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

4.7μF10μF

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

4.7μF10μF

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

4.7μF10μF

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

4.7μF10μF

Measurement Setup for

Figure 5, 7, 16, 17, 21,

Figure 23, 25, 34, 35, 39

Measurement Setup for

Figure 6, 8, 14, 15,

Figure 24, 26, 32, 33

Measurement Setup for

Figure 9, 27

Measurement Setup for

Figure 10, 28

Measurement Setup for

Figure 11, 29

Measurement Setup for

Figure 12, 30

Measurement Setup for

Figure 22, 40

Measurement Setup for

Figure 18, 19, 20,

Figure 36, 37, 38

Measurement Setup for

Figure 13, 31

Datasheet

22/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

www.rohm.com

TSZ22111･15･001

BD4xxM5-C Series

4.7 μF10 μF

1: VCC 2: N.C. 3: VOUT

FIN

BD4xxM5FP-C

4.7 μF10 μF

1: VCC 2: N.C. 3: VOUT

FIN

BD4xxM5FP-C

4.7 μF10 μFIOUT

1: VCC 2: N.C. 3: VOUT

FIN

BD4xxM5FP-C

4.7 μF10 μF

1: VCC 2: N.C. 3: VOUT

FIN

BD4xxM5FP-C

1Vrms

IOUT4.7 μF 10 μF

1: VCC 2: N.C. 3: VOUT

FIN

BD4xxM5FP-C

4.7 μF 10 μFIOUT

1: VCC 2: N.C. 3: VOUT

FIN

BD4xxM5FP-C

●Measurement Circuit for Typical Performance Curves (BD433 / 450M5FP-C)

4.7 μF10 μF

1: VCC 2: N.C. 3: VOUT

FIN

BD4xxM5FP-C

Measurement Setup for

Figure 5, 7, 16,

Figure 23, 25, 34

Measurement Setup for

Figure 6, 8, 14, 15,

Figure 24, 26, 32, 33

Measurement Setup for

Figure 9, 27

Measurement Setup for

Figure 10, 28

Measurement Setup for

Figure 11, 29

Measurement Setup for

Figure 12, 30

Measurement Setup for

Figure 13, 31

Datasheet

23/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

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TSZ22111･15･001

BD4xxM5-C Series

●Measurement Circuit for Typical Performance Curves (BD433 / 450M5FP2-C)

4.7 μF10 μF

FIN

2: GND

BD4xxM5FP2-C

1: VCC 3: VOUT

4.7 μF10 μFIOUT

FIN

2: GND

BD4xxM5FP2-C

1: VCC 3: VOUT

4.7 μF10 μF

FIN

2: GND

BD4xxM5FP2-C

1: VCC 3: VOUT

1Vrms

IOUT4.7 μF10 μF

FIN

2: GND

BD4xxM5FP2-C

1: VCC 3: VOUT

Measurement Setup for

Figure 5, 7, 16,

Figure 23, 25, 34

Measurement Setup for

Figure 6, 8, 14, 15,

Figure 24, 26, 32, 33

Measurement Setup for

Figure 9, 27

Measurement Setup for

Figure 10, 28

Measurement Setup for

Figure 11, 29

Measurement Setup for

Figure 12, 30

Measurement Setup for

Figure 13, 31

Datasheet

24/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

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TSZ22111･15･001

BD4xxM5-C Series

●Selection of Components Externally Connected

・VCC

Insert capacitors with a capacitance of 0.1 μF or higher between the VCC and the GND. Choose the capacitance

according to the line between the power smoothing circuit and the VCC. Selection of the capacitance also depends

on the application. Verify the application and allow sufficient margins in the design. We recommend using a

capacitor with excellent voltage and temperature characteristics.

・Output Pin Capacitor

In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND. We recommend

using a capacitor with a capacitance of 10 μF (Typ.) or higher. Electrolytic, tantalum and ceramic capacitors can be

used. When selecting the capacitor ensure that the capacitance of 6 μF or higher is maintained at the intended

applied voltage and temperature range. Due to changes in temperature the capacitor’s capacitance can fluctuate

possibly resulting in oscillation. For selection of the capacitor refer to the data of Figure 41.

The stable operation range given in the data of Figure 41 and Figure 42 is based on the standalone IC and resistive

load. For actual applications the stable operating range is influenced by the PCB impedance, input supply

impedance and load impedance. Therefore verification of the final operating environment is needed.

When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and

DC-biasing characteristics and high voltage tolerance.

Also, in case of rapidly fluctuation of input voltage and load current, select the capacitance in accordance with

verifying that the actual application meets with the required specification. Mount the capacitor as much as possible

near connected pin.

●Measurement setup

FIN

2: GND

BD4xxM5FP2-C

1: VCC 3: VOUT

CIN

COUT

ESR

1: VCC 3: GND 5: VOUT

2: CTL 4: N.C.

FIN

BD4xxM5WFP2-C

CIN COUT

ESR

1: VCC 3: N.C. 5: VOUT

FIN

2: CTL 4: N.C.

BD4xxM5WFPJ-C

CIN COUT

ESR

1

10

100

1000

0 100 200 300 400 500

COUT [µF]

IOUT [mA]

Unstable Operation Range

Stable Operation Range

0.001

0.01

0.1

1

10

100

0 100 200 300 400 500

ESR [Ω]

IOUT[mA]

Unstable Operation Range

Stable Operation Range

Figure 41. ESR vs. IOUT Figure 42. COUT vs. IOUT

○Condition:

VCC = 13.5 V

(CTL = 5 V)

CIN = 0.1 µF

-40 °C ≤ Tj ≤ +150 °C

○Condition:

VCC = 13.5 V

(CTL = 5 V)

CIN = 0.1 μF

10 µF ≤ COUT (Typ.)

-40 °C ≤ Tj ≤ +150°C

Figure 43. Measurement Setups for ESR Reference Data

(about Output Pin Capacitor)

Datasheet

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TSZ22111･15･001

BD4xxM5-C Series

●Power Dissipation

■TO252-J5(F) / TO252-3

IC mounted on ROHM standard board based on JEDEC.

①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm)

Board material: FR4

Board size: 114.3mm × 76.2mm × 1.57 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.

②: 4-layer PCB (Copper foil area on the reverse side of PCB: 74.2mm × 74.2mm)

Board material: FR4

Board size: 114.3mm × 76.2mm × 1.60 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.

2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm, 1 oz. copper.

Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm, 2 oz. copper.

Condition①: θJA = 136 °C/W、ΨJT (top center) = 17 °C/W

Condition②: θJA = 23 °C/W、ΨJT (top center) = 3 °C/W

Figure 44. Package Data

(TO252-J5 / TO252-3)

■TO263-5(F) / TO263-3(F)

IC mounted on ROHM standard board based on JEDEC.

①: 1-layer PCB (Copper foil area on the reverse side of PCB: 0 mm × 0 mm)

Board material: FR4

Board size: 114.3mm × 76.2mm × 1.57 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.

②: 4-layer PCB (Copper foil area on the reverse side of PCB: 74.2mm × 74.2mm)

Board material: FR4

Board size: 114.3mm × 76.2mm × 1.60 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.

2 inner layers copper foil area of PCB: 74.2 mm × 74.2 mm, 1 oz. copper.

Copper foil area on the reverse side of PCB: 74.2 mm × 74.2 mm, 2 oz. copper.

Condition①: θJA = 81 °C/W、ΨJT (top center) = 8 °C/W

Condition②: θJA = 21 °C/W、ΨJT (top center) = 2 °C/W

Figure 45. Package Data

(TO263-5 / TO263-3)

②5.9 W

①1.5 W

0

2

4

6

8

10

0 255075100125150

Power Dissipation: Pd [W]

Ambient Temperature: Ta [°C]

②5.4 W

①0.9 W

0

2

4

6

8

10

0 25 50 75 100 125 150

Power Dissipation: Pd [W]

Ambient Temperature: Ta [°C]

Datasheet

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TSZ22111･15･001

BD4xxM5-C Series

●Thermal Design

This product exposes a frame on the back side of the package for thermal efficiency improvement.

Within this IC, the power consumption is decided by the dropout voltage condition, the load current and the circuit current.

Refer to power dissipation curves illustrated in Figure 44, 45 when using the IC in an environment of Ta ≥ 25 °C. Even if the

ambient temperature Ta is at 25 °C, depending on the input voltage and the load current, chip junction temperature can be

very high. Consider the design to be Tj ≤ Tjmax = 150 ℃ in all possible operating temperature range.

Should by any condition the maximum junction temperature Tjmax = 150℃ rating be exceeded by the temperature

increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is

based on recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient

margins in the thermal design by the following method is used to calculate the junction temperature Tj.

Tj can be calculated by either of the two following methods.

1. The following method is used to calculate the junction temperature Tj.

Tj = Ta + PC × θJA

Tj : Junction Temperature

Ta : Ambient Temperature

PC : Power Consumption

θJA : Thermal Impedance

(Junction to Ambient)

2. The following method is also used to calculate the junction temperature Tj.

Tj = TT + PC × ΨJT

Tj : Junction Temperature

TT : Top Center of Case’s (mold) Temperature

PC : Power consumption

ΨJT : Thermal Impedance

(Junction to Top Center of Case)

The following method is used to calculate the power consumption Pc (W).

Pc = (VCC - VOUT) × IOUT + VCC × Icc

PC : Power Consumption

VCC : Input Voltage

VOUT : Output Voltage

IOUT : Load Current

Icc : Circuit Current

Datasheet

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TSZ22111･15･001

BD4xxM5-C Series

・Calculation Example(TO252-J5(F) / TO252-3)

If VCC = 13.5 V, VOUT = 5.0 V, IOUT = 200 mA, Icc = 38 μA, the power consumption Pc can be calculated as follows:

PC = (VCC - VOUT) × IOUT + VCC × Icc

= (13.5 V – 5.0 V) × 200 mA + 13.5 V × 38 μA

= 1.7 W

At the ambient temperature Tamax = 85°C, the thermal Impedance ( Junction to Ambient )θJA = 23 °C / W( 4-layer PCB ),

Tj = Tamax + PC × θJA

= 85 °C + 1.7 W × 23 °C / W

= 124.1 °C

When operating the IC, the top center of case’s (mold) temperature TT = 100℃、ΨJT = 17 °C / W( 1-layer PCB ),

Tj = TT + PC × ΨJT

= 100 °C + 1.7 W × 17 °C / W

= 128.9 °C

For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and

thermal via between thermal land pad.

・Calculation Example (TO263-5(F) / TO263-3(F))

If VCC = 13.5 V, VOUT = 5.0 V, IOUT = 200 mA, Icc = 38 μA, the power consumption Pc can be calculated as follows:

PC = (VCC - VOUT) × IOUT + VCC × Icc

= (13.5 V – 5.0 V) × 200 mA + 13.5 V × 38 μA

= 1.7 W

At the ambient temperature Tamax = 85°C, the thermal impedance ( Junction to Ambient )θJA = 21 °C / W( 4-layer PCB ),

Tj = Tamax + PC × θJA

= 85 °C + 1.7 W × 21 °C / W

= 120.7 °C

When operating the IC, the top center of case’s (mold) temperature TT = 100℃、ΨJT = 8 °C / W( 1-layer PCB ),

Tj = TT + PC × ΨJT

= 100 °C + 1.7 W × 8 °C / W

= 113.6 °C

For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and

thermal via between thermal land pad.

Datasheet

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TSZ22111･15･001

BD4xxM5-C Series

●Application Examples

・Applying positive surge to the VCC

If the possibility exists that surges higher than 45 V will be applied to the VCC, a Zener Diode should be placed between

the VCC and the GND as shown in the figure below.

Figure 46. Sample Application Circuit 1

・Applying negative surge to the VCC

If the possibility exists that negative surges lower than the GND are applied to the VCC, a Schottky Diode should

be place between the VCC and the pin as shown in the figure below.

Figure 47. Sample Application Circuit 2

・Implementing a Protection Diode

If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of

startup and shutdown, a protection diode should be placed as shown in the figure below.

Figure 48. Sample Application Circuit 3

●I/O Equivalence Circuit

Figure 49. Input / Output Equivalence Circuit

COUTCIN IOUT

1: VCC 2: N.C. 3: VOUT

FIN

BD4xxM5FP-C

Battery

Zener

Diode

VOUT

FIN

2:GND

BD4xxM5FP2-C

1:VCC 3:VOUT

COUT

CIN

Battery

IOUT

VOUT

Zener

Diode

1:VCC 3:GND 5:VOUT

2:CTL 4:N.C.

FIN

BD4xxM5WFP2-C

CIN

Battery

COUT

Input

switch

VOUT

Shottky

Diode IOUT

COUTCIN IOUT

1: VCC 2: N.C. 3: VOUT

FIN

BD4xxM5FP-C

Battery

Shottky

Diode

VOUT

FIN

2:GND

BD4xxM5FP2-C

1:VCC 3:VOUT

COUT

CIN

Battery

IOUT

VOUT

Shottky

Diode

1:VCC 3:GND 5:VOUT

2:CTL 4:N.C.

FIN

BD4xxM5WFP2-C

CIN

Battery

COUT

Input

switch

VOUT

Zener

Diode IOUT

Datasheet

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BD4xxM5-C Series

●Operational Notes

1) Absolute Maximum Ratings

Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in

damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage

(e.g. short circuit, open circuit, etc.). Therefore, if any special mode is being considered with values expected to exceed

the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered.

2) The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply

voltage and external components. Transient characteristics should be sufficiently verified.

3) GND Electric Potential

Keep the GND potential at the lowest (minimum) level under any operating condition. Furthermore, ensure that,

including the transient, none of the pin’s voltage is less than the GND voltage.

4) GND Wiring Pattern

When both a small-signal GND and a high current GND are present, single-point grounding (at the set standard point) is

recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage changes

stemming from the wiring resistance and high current do not cause any voltage change in the small-signal GND.

Similarly, care must be taken to avoid wiring pattern fluctuations in any connected external component GND.

5) CTL

Do not make voltage level of chip enable keep floating level, or in between VthH and VthL. Otherwise, the output voltage

would be unstable or indefinite.

6) Inter-pin Shorting and Mounting Errors

Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in

damaging the IC. Also, shorts caused by dust entering between the output, input and the GND may result in damaging

the IC.

7) Inspection Using the Set Board

The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a

capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the

assembly setup is grounded and take sufficient caution with transportation and storage. Also, make sure to turn off the

power supply when connecting and disconnecting the inspection equipment.

8) Thermal Design

The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin

should be allowed for in the thermal design. On the reverse side of the package this product has an exposed heat pad

for improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation

pattern as far as possible. The amount of heat generated depends on the voltage difference across the input and output,

load current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed

the Pd rating.

Should by any condition the maximum junction temperature Tjmax = 150℃ rating be exceeded by the temperature

increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this

specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application

and allow sufficient margins in the thermal design.

9) Overcurrent Protection Circuit

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not

be used in applications characterized by continuous operation or transitioning of the protection circuit.

10) Thermal Shut Down (TSD)

This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation should

be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature

(Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below the TSD threshold

the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat

damage.

Datasheet

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BD4xxM5-C Series

11) In some applications, the VCC and the VOUT potential might be reversed, possibly resulting in circuit internal damage

or damage to the elements. For example, the accumulated charge in the output pin capacitor flowing backward from the

VOUT to the VCC when the VCC shorts to the GND. In order to minimize the damage in such case, use a capacitor with

a capacitance less than 1000 μF. Also by inserting a reverse polarity diode in series to the VCC, it can prevent reverse

current from reverse battery connection or the case. When the point A is short-circuited GND, if there may be any

possible case point B is short-circuited to GND, we also recommend using a bypass diode between the VCC and the

VOUT.

Figure 50. Recommend Example of Using Diodes

12) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a

variety of parasitic elements.

For example, in case a resistor and a transistor are connected to the pins as shown in the figure below then:

○ The P/N junction functions as a parasitic diode when the GND > pin A for the resistor, or the GND > pin B for the

transistor.

○ Also, when the GND > pin B for the transistor (NPN), the parasitic diode described above combines with the N layer

of the other adjacent elements to operate as a parasitic NPN transistor.

Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between

circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not

employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than

the (P substrate) GND.

Figure 51. Example of parasitic element device

VCC VO

GND

A

B

Bypass Diode

Reverse Polarity Diode

Datasheet

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22.Feb.2017 Rev.006

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BD4xxM5-C Series

●Physical Dimension, Tape and Reel Information

Package Name TO252-J5(F)

(

F

)

Datasheet

32/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

www.rohm.com

TSZ22111･15･001

BD4xxM5-C Series

Package Name TO263-5(F)

(

F

)

Datasheet

33/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

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TSZ22111･15･001

BD4xxM5-C Series

Package Name TO252-3

Datasheet

34/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

www.rohm.com

TSZ22111･15･001

BD4xxM5-C Series

Package Name TO263-3(F)

(

F

)

Datasheet

35/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

www.rohm.com

TSZ22111･15･001

BD4xxM5-C Series

●Marking Diagrams (Top View)

Part Number

Marking

Output

Voltage [V]

Enable

Input (1) Part Number

Marking

Output

Voltage [V]

Enable

Input (1)

433M5W 3.3

◯ 433M5W 3.3

◯

450M5W 5.0

◯ 450M5W 5.0

◯

Part Number

Marking

Output

Voltage [V]

Enable

Input (1) Part Number

Marking

Output

Voltage [V]

Enable

Input (1)

433M5 3.3

– 433M5 3.3

–

450M5 5.0 – 450M5 5.0 –

TO252-J5(F) (Top View)

Part Number Marking

LOT Number

1Pin

TO252-3

(Top View)

Part Number Marking

LOT Number

TO263-5(F) (Top View)

Part Number Marking

LOT Number

1Pin

(1) ○: Includes Enable Input

– : Not includes Enable Input

TO263-3(F) (Top View)

Part Number Marking

LOT Number

1Pin

(1) ○: Includes Enable Input

– : Not includes Enable Input

(1) ○: Includes Enable Input

– : Not includes Enable Input

(1) ○: Includes Enable Input

– : Not includes Enable Input

Datasheet

36/36 TSZ02201-0G1G0AN00066-1-2

22.Feb.2017 Rev.006

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TSZ22111･15･001

BD4xxM5-C Series

●Revision History

Date Revision Changes

5.Apr.2013 001

New Release

18.Oct.2013 002

General description and key specifications revised.

Figure 1. FP2: TO263-5F H (Max.) revised.

Pin No. Fin of BD433 / 450M5WFPJ-C and BD433 / 450M5WFP2-C revised.

Figure 4. Block Diagrams (BD433 / 450M5WFPJ-C, BD433 / 450M5WFP2-C,

BD433 / 450M5FP-C, BD433 / 450M5FP2-C) revised.

Physical Dimension(TO252-J5F),

Tape and Reel Information (TO263-5F, TO263-3F) revised.

01.Oct.2014 003

Key specifications is revised to Features.

Calculation Example Figure No. of output current max.

about TO252-3, TO263-5F, TO263-3F revised.

Tape and Reel Information (TO263-5F, TO263-3F) revised.

04.Feb.2015 004

Names of PKG revised.

Description of Thermal impedance (TO252-J5, TO252-3, TO263-5, TO263-3) revised.

23.May.2016 005

Names of Ordering Information revised.

Title of Figure 45 revised.

Copper foil area on the reverse side of PCB revised.

AEC-Q100 (Note1:Grade1) appended.

22.Feb.2017 006

Names of Ordering Information revised.

Improve the description, TO252-J5 to To252-J5(F), TO263-5 to TO263-5(F),

TO263-3 to TO263-3(F).

Measurement Figure revised.

TO252-J5(F), TO263-5(F), TO263-3(F)’s PKG information revised.

Notice-PAA-E Rev.003

Notice

Precaution on using ROHM Products

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅡb

CLASSⅢ

CLASSⅣ

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or

concerning such information.

Datasheet

Part Number bd433m5fp2-c

Package TO263-3F

Unit Quantity 500

Minimum Package Quantity 500

Packing Type Taping

Constitution Materials List inquiry

RoHS Yes

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