GE Data Sheet
MicroTLynxTM 12A: Non-Isolated DC-DC Power Modules
2.4Vdc –5.5Vdc input; 0.6Vdc to 3.63Vdc output; 12A Output Current
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or information.
December 4, 2019 ©2017 General Electric Company. All International rights reserved. Version 1.3
Surface Mount Information
Pick and Place
The Micro TLynxTM modules use an open frame construction and
are designed for a fully automated assembly process. The
modules are fitted with a label designed to provide a large
surface area for pick and place operations. The label meets all
the requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow temperatures
of up to 300oC. The label also carries product information such
as product code, serial number and the location of
manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be considered to
optimize this process. The minimum recommended inside
nozzle diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the bottom
side of a customer board. If such an assembly is attempted,
components may fall off the module during the second reflow
process. If assembly on the bottom side is planned, please
contact Lineage Power for special manufacturing process
instructions.
Only ruggedized (-D version) modules with additional epoxy will
work with a customer’s first side assembly. For other versions,
first side assembly should be avoided
Lead Free Soldering
The Micro TLynxTM modules are lead-free (Pb-free) and RoHS
compliant and fully compatible in a Pb-free soldering process.
Failure to observe the instructions below may result in the
failure of or cause damage to the modules and can adversely
affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. D
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a
recommended forced-air-convection reflow profile
based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is
Sn/Ag/Cu (SAC). A 6 mil thick stencil is recommended.
For questions regarding Land grid array(LGA) soldering,
solder volume; please contact Lineage Power for special
manufacturing process instructions.
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 47. Soldering outside of the
recommended profile requires testing to verify results and
performance.
MSL Rating
The Micro TLynxTM modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB) with
desiccant are required for MSL ratings of 2 or greater.
These sealed packages should not be broken until time of
use. Once the original package is broken, the floor life of
the product at conditions of 30°C and 60% relative
humidity varies according to the MSL rating (see J-STD-
033A). The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90% relative
humidity.