
RF01103, Rev. A (4/5/13) ©2013 Microsemi Corporation Page 1 of 5
UPT5e3 – UPT48e3, UP T5 Re 3 – UPT48Re3
and UPTB5e3 – UPTB48e3
Available
5V – 48V Small Footprint, Surface Mount
Transient Voltage Suppressors
Microsemi’s unique Powermite UPT series of transient voltage suppressors feature oxide-
passivated chips with high-temperature solder bonds for high surge capability and negligible
electrical degradation under repeated surge conditions. Both unidirectional and bidirectional
configurations are available. In addition to its size advantages, the Powermite package includes a
fully metallic bottom (cathode) side that eliminates the possibility of solder flux entrapment at
assembly and a unique locking tab serves as an integral heat sink. Its innovative design makes this
device fully compatible for use with automatic insertion equipment.
Powermite 1
(DO-216AA)
Package
Important: For the latest information, visit our website http://www.microsemi.com.
• Powermite package with standoff voltages 5 to 48 V.
• Both unidirectional and bidirectional polarities:
-Anode to case bottom (UPT5e3 thru UPT48e3)
-Cathode to case bottom (UPT5Re3 thru UPT48Re3)
-Bidirectional (UPTB5e3 thru UPTB48e3)
• Clamping time less than 100 pico-seconds for unidirectional and 5 nano-secon ds for bidir ectional.
• 100% surge current testing of all parts.
• Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B.
• RoHS compliant versions available.
• Protects sensitive components such as IC’s, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc.
• Protect ion from switch ing and i nduc ed RF transients.
• New improved lower leakage current for the UPT5Re3:
-Integral heat sink / locking tabs
-Fully metallic bottom side eliminates flux entrapment
• Compliant to IEC6 1000-4-2 and IEC610 00-4-4 for ESD and EFT protection respectively.
• Secondary lightning protection per IEC61000-4-5 with 42 Ohms source impedance:
Class 1: UPT5//UPT5R/UPTB8 to17
Class 2: UPT5//UPT5R/UPTB5 to12
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Junction and Storage Temperature TJ /
-65 to +150
C
Thermal Resi stan ce Jun cti on-to-Ambient (1)
Thermal Resi stan ce Jun cti on-to-Case (base tab)
Peak Pulse Power (see Figure 1 and Figure 2)
UPT5Re3:
UPT5e3 thr u UPT 48e3 :
UPT8Re3 thru UPT48Re3:
PPP 600
1000
1000
100
150
150
W
Rated Average Power Dissipation
o
PM(AV) 2.5 W
Impulse Repetition Rate (duty factor)
Solder Temperature @ 10 s
Notes: 1. When mounted on FR4 PC board with 1 oz copper.