SILVER BULLET
TM
PRODUCT
CHARACTERISTICS
The Silver BulletTM is a fundamental building block for constructing high-power diode
laser arrays. Each Silver BulletTM consists of one to three mounted, CW laser diode
bars on a BeO substrate. These modules can be either mounted on customer supplied
heat exchangers or on a variety of heat exchangers offered by IMC. For customers
who wish to build their own arrays using these modules, a soldering kit is available
which contains a complete set of instructions. The Silver BulletTM was designed to be
a viable option for those developing new systems and to offer the flexibility to be
retrofitted into existing systems.
Every Silver BulletTM comes with a complete data packet which includes, P-I, V-I,
power conversion efficiency and wavelength spectrum. This data packet offers
customers the unique opportunity to have their own bars packaged, characterized,
and prescreened according to customer supplied specification before being mounted
on heat exchangers. Laser diode bar cavity lengths of up to 1 mm can be packaged
in the current configuration, and the package is easily adapted to custom applications.
The 980nm Silver BulletTM family consists of 20W CW, 1-bar arrays; 40W CW 2-bar
arrays; and 55W CW 3-bar arrays.
940nm CW Laser Diode Array Submodules
· Packaged 1, 2, 3 Bar Laser
Diode Array
· Easily Soldered to a
Heat Exchanger
· Available Wavelengths
785-1064nm
Industrial Microphotonics Company ·20 Point West Blvd. ·St. Charles, MO 63301
636.916.5656 · 636.916.5665 fax · www.imclaser.com
Industrial Microphotonics Company
DIODE BAR
1, 2, 3 PLACES
ENDBLOCK
2 PLACES
SPACER(S)
METALIZED BeO
SOLDER PADS FOR
ELECTRICAL LEADS
“A”
“B”
“C”
.394 [10,01]
.250 [6,35]
“D”
.15
[3,81] .12
[3]
REV B-10/01
REV B-10/01
Industrial Microphotonics Company ·20 Point West Blvd. ·St. Charles, MO 63301
636.916.5656 · 636.916.5665 fax · www.imclaser.com
NOTES
(1) Lower beam divergence is also available.
(2) Typical degradation rates are 5% in the first 100 hours and 3% per 1,000 hours thereafter.
PARAMETER
CW Power Outputs (W)
Operating Current (A)
Threshold Current (A)
Slope Efficiency (W/A
Efficiency (%)
Number of Emitters
Emitter Size (µm)
Emitter Pitch (µm)
Center Wavelength (nm)
Wavelength Tolerance (nm)
Spectral Width (nm)
Wavelength Shift (nm/
˚
C)
Beam Divergence
(1)
FWHM (
˚
x
˚
)
Polarization
Degradation Rate
(2) (%/kHr)
Built-In Voltage (V)
Series Resistance (ohms)
Operating Voltage (V)
Max Reverse Current (µA)
Max Reverse Voltage (V)
“A” Package Height (in) ±.003
“B” Bar Pitch (in/mm) ±.003
“C” Outside to Bar (in) ±.004
“D” Soldering Pad Width (in) ±.01
OPTICAL
CHARACTERISTICS
ELECTRICAL
CHARACTERISTICS
MECHANICAL
CHARACTERISTICS
ASM02C040
Thorlabs Part Number: ASM940-40
MIN TYP MAX
40 --- ---
35A at 25˚C Heat Sink
--- 28 30
40W at 25˚C Heat Sink
--- 7.5 9.0
25˚C Heat Sink
1.4 1.8 ---
25˚C Heat Sink
30 40 ---
40W at 25˚C Heat Sink
--- 46 x 2 ---
--- 80x1 ---
--- 200 ---
--- 940 ---
40W at 25˚C Heat Sink
--- ± 5 ---
40W at 25˚C Heat Sink
--- 3.0 4.0
40W at 25˚C Heat Sink
0.23 0.25 0.27
--- 40x10 42x12
--- TE ---
--- 3 ---
25˚C Heat Sink
--- 3.2 3.4
25˚C Heat Sink
--- 0.010 0.024
25˚C Heat Sink
--- 3.6 4.2
25˚C Heat Sink, 40W
25
3
0.066
0.047/1.19
0.099
0.06
ASM01C020
Thorlabs Part Number: ASM940-20
MIN TYP MAX
20 --- ---
32A at 25˚C Heat Sink
--- 28 30
20W at 25˚C Heat Sink
--- 7.5 9.0
25˚C Heat Sink
0.7 0.9 ---
25˚C Heat Sink
35 42 ---
20W at 25˚C Heat Sink
--- 46 ---
--- 80x1 ---
--- 200 ---
--- 940 ---
20W at 25˚C Heat Sink
--- ± 5 ---
20W at 25˚C Heat Sink
--- 2.5 3.5
20W at 25˚C Heat Sink
0.23 0.25 0.27
--- 40x10 42x12
--- TE ---
--- 3 ---
25˚C Heat Sink
--- 1.6 1.7
25˚C Heat Sink
--- 0.005 0.012
25˚C Heat Sink
--- 1.8 2.1
25˚C Heat Sink, 40W
25
3
0.068
---
0.123
0.08
ASM05C055
MIN TYP MAX
55 --- ---
35A at 25˚C Heat Sink
--- 28 30
55W at 25˚C Heat Sink
--- 7.5 9.0
25˚C Heat Sink
1.9 2.6 ---
25˚C Heat Sink
28 36 ---
55W at 25˚C Heat Sink
--- 46 x 3 ---
--- 80x1 ---
--- 200 ---
--- 940 ---
55W at 25˚C Heat Sink
--- ± 5 ---
55W at 25˚C Heat Sink
--- 3.5 4.5
55W at 25˚C Heat Sink
0.23 0.25 0.27
--- 40x10 42x12
--- TE ---
--- 3 ---
25˚C Heat Sink
--- 4.8 5.1
25˚C Heat Sink
--- 0.015 0.036
25˚C Heat Sink
--- 5.4 6.3
25˚C Heat Sink, 55W
25
3
0.066
0.047/1.19
0.076
0.05
MECHANICAL
CHARACTERISTICS
PARAMETER DIMENSIONS
Package Length 0.250 ± 0.004 inches
Package Width 0.394 ± 0.004 inches
Package Height see chart
Package Weight 0.6 grams
Package Thermal Resistance 0.4˚C/W
Bar Length 9.6 ± 0.01 mm
Bar Thickness 135 ± 10 µm
Operating Temperature Range
(3)
-20˚C to 50˚C
Storage Temperature Range
(3)
-40˚C to 85˚C
ASM01 C020 W0940 05
ORDERING
SPECIFICATIONS
± Wavelength
Package Type Tolerance (nm)
CW Power (Watts) Wavelength (nm)
NOTES
REV B-10/01
Industrial Microphotonics Company ·20 Point West Blvd. ·St. Charles, MO 63301
636.916.5656 · 636.916.5665 fax · www.imclaser.com
Copyright © 2000 Industrial Microphotonics Company.
All Rights Reserved.
Industrial Microphotonics Company reserves the right to change product
design and specification at any time without notice.
No license is granted by implication or otherwise under any patents or
patent rights of Industrial Microphotonics Company, or others.
No responsibility is assumed for the use of these products, nor for any in-
fringement on the rights of others resulting from the use of these products.
Laser diode product components are intended for use in a user-
devised end system.However, these products are capable of emitting
Class IV radiation. Extreme care must be exercised during their oper-
ation. Only persons familiar with the appropriate safety precautions
should operate a laser product. Directly viewing the laser beam or
exposure to specular reflections must be avoided. Ser ious injur y may
result if any part of the body is exposed to the beam. The eye is
extremely sensitive to the infrared radiation and theref ore , proper eye-
wear must be worn at all times. Use of optical instr uments with these
products may increase e ye hazard.Always wear proper e ye protection
when operating.
Diode laser
CLASS IV
5W 635-1000nm
AVOID EYE OR SKIN EXPOSURE TO DIRECT
OR SCATTERED RADIATION.
INVISIBLE LASER
RADIATION
DISTRIBUTORS
Australia
Photon Engineering
Adam Weigold, Managing Director
Telephone: 61.8.8410.4599
Fax: 61.8.8410.4544
Email: photeng@ozemail.com.au
Web:www.photon.on.net
France
Optilas
Jean-Claude Sanudo
Telephone: 33.01.60.79.59.85
Fax: 33.01.60.86.96.33
Email: Jean-Claude_Sanudo@fr.optilas.com
Web: www.optilas.com
Germany, Austria, Switzerland
Polytec GmbH
Mustafa Dinc
Telephone: 49.7243.604.0
Fax: 49.7243.69944
Email: m.dinc@polytec.de
Web: www.polytecpi.com
Israel
R.M. Photonics
PO Box 1507
Ramat Modiim
D.N. Modiim 73127
Israel
Meir Chazon
Telephone: 011.972.8.926.5733
Fax: 011.972.8.926.2021
E-mail: rmphoton@inter.net.il
United Kingdom
Laser 2000 (UK) LTD
Guy Holmes
Telephone: 44.1933.461666
Fax: 44.1933.461699
Email: sales@laser2000.co.uk
Web: www.laser2000.co.uk
Japan
Opto Science, Inc.
Shinjiro Kato
Telephone: 03.3356.1064
Fax: 03.3356.3466
Email: info@optoscience.com
Matsuo Sangyo Co.; Ltd.
K. Nakaki
Telephone: 06.252.6381
Fax: 06.245.3923
telex: 5225235 Matsuo J
Tsukasa-Tec Inc.
Tadao Shoji
Telephone: 81.298.53.7611
Fax: 81.298.53.7622
PACKAGING
CHARACTERISTICS
PARAMETER DIMENSIONS
Metalization 100 µ inch Au over TiW barrier
Soldering (4) Detailed instructions provided
Heat Exchanger Capacity (5) 2.5 times the output power
Heat Exchanger Thermal Resistance < 0.25˚C -cm2/W
(3) A dry nitrogen environment should be provided by the user when storing and operating at temperatures
below ambient dew point.
(4) Maximum solder temperature is 100˚C. Indalloy 8 or Ostalloy 200 (44In42Sn14Cd)
are recommended solders.
(5) Several heat exchangers and heatsinking application notes are offered by IMC.
