Datasheet One Package Regulator Series 0.65A Output, Fully Integrated, Step-down Switching Power Supply Module BZ6Axx06GM Series General Description Tne BZ6Axx06GM is a fully integrated power supply module that is useful for shortening the product at the design period and shortening the product launch time for electronics product, communication of portable it, and various applications industrial etc. BZ6Axx06GM is based on a high efficiency 6MHz synchronous step-down switching regulator. It provides up to 0.65A load current and an input voltage range from 2.3V to 5.5V, optimized for battery powered portable applications. BZ6Axx06GM has a mode control pin that allows the user to select Forced PWM(Pulse Width Modulation) mode or PFM(Pulse Frequency Modulation) and PWM auto change mode utilized power save operation at light load current. Applications Smart Phones, Cell phones, Portable applications, POL applications, RF applications, and USB Line Application Package(s) BGA-MD Features No External components required SMPS Fast transient response Automatic PFM/PWM operation Forced PWM operation Internal Soft Start Under voltage lockout Over current protection Thermal shutdown Ultra small and low profile package BGA-MD Typical Application Circuit(s) VIN Vin=2.3~5.5V VIN EN From Controller Lineup Part No. Output voltage BZ6A1206GM 1.20V BZ6A7D06GM 1.25V GND A3 A1 VOUT Vout A2 B2 GND C3 GND C2 B1 MODE C1 GND From Controller GND Figure 1. Typical Application Circuit(s) Pin Description(s) Pin Configuration(s) (Top View) Pin No. 1 2 3 4 5 6 7 8 Coil Cin W(Typ.) x D(Typ.) x H(Max.) 2.90mm x 2.30mm x 1.00mm Co INDEX MARK Symbol A1 A2 A3 B1 B2 C1 C2 C3 Name VOUT VIN VIN MODE EN GND GND GND Function Output pin Power supply input pin Power supply input pin Forced PWM mode pin Enable pin GND pin GND pin GND pin Figure 2. Pin Configuration(s) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211114001 1/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Block Diagram(s) L PWM/PFM MODE H PWM MODE MODE VIN TSD UVLO PWM/PFM control Cin 2.3 5.5V FB VOUT + ERROR COMP Switching Control Logic and Gate Driver L VOUT Co VREF EN H ON L OFF SHUTDOWN Frequency control GND Figure 3. Block Diagram(s) Cin : C1005X5R0J225M Co : C1005X5R0J475M L : MLP2012V1R0M Description of Block(s) The BZ6Axx06GM are a synchronous step-down DC/DC converter that achieves fast transient response from light load to heavy load by hysteretic PWM control system and current constant PFM control system. PWM control BZ6Axx06GM operates by hysteretic PWM control. This scheme ensures fast switching, high efficiency, and fast transient response. When the output voltage is below the VREF voltage, the error comparator output is low to high and turning on P-channel MOSFET until above the VREF voltage and minimum on time. PFM control At light load the regulator and MODE=low, the regulator operates with reduced switching frequency and improves the efficiency. During PFM operation, the output voltage slightly higher than typical output voltage. Figure 4. Operation of PFM mode and PWM mode www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Description of operations 1) Shutdown If the EN input pin set to low (<0.4V), all circuit are shut down and the regulator is standby mode. Do not leave the EN pin floating. 2) Soft start function The regulator has a soft start circuit that reduces in-rush current at start-up. Typical start up times with a 4.7uF output capacitor is 120usec. 3) Current limit The BZ6Axx06GM has a current limit circuit that protects itself and external components during overload condition. 4) Under Voltage Lock Out (UVLO) The BZ6Axx06GM has a Under Voltage Lock Out circuit that turn off device when VIN>2.05V(typ.) 5) FORCED PWM MODE Setting MODE pin high (>1.4V) places the regulator in forced PWM.This control provides noise reduction and output stability. Do not leave the MODE pin floating. 6) TSD The BZ6Axx06GM has a thermal shutdown feature to protect the device if the junction temperature exceeds 150.In thermal shutdown, the DRIVER is disabled. This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind. Absolute Maximum Ratings (Ta=25) Parameter Maximum input power supply voltage Power dissipation Symbol Rating Unit VIN 7 V *1 Pd 0.75 Operating temperature range Topr -40 to +85 Storage temperature range Tstg -55 to +125 Tjmax +125 Junction temperature W *1 When mounted on the specified PCB (55mm x 63mm), Deducted by 3.9m W/c when used over Ta=25c Recommended Operating Rating(s) Rating Parameter Symbol Input voltage VIN 2.3 5.5 V Output current IOUT 0 0.65 A www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Min. 3/16 Typ. Max. Unit TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Electrical Characteristic(s) (unless otherwise specified VIN=3.6V, Ta=25) Item Min. Rating Typ. Max. -2.5 - +2.5 -2.5 - +3.5 Tss 65 120 240 usec Symbol Unit Condition Switching regulator Output voltage accuracy VOUTA % MODE:H(PWM Operation) MODE:L(PFM Operation) Soft start Soft start time Control EN pin control voltage Operation VENH 1.4 - VIN V Non Operation VENL 0 - 0.4 V MODE pin control voltage Operation VMODEH 1.4 - VIN V Forced PWM Non Operation VMODEL 0 - 0.4 V Automatic PFM/PWM Protect threshold voltage Uvth 1.95 2.05 2.15 V Hysteresis Uvhy 50 100 150 mV Operating quiescent current IINS - 45 72 uA EN:H, MODE:L, VOUT=3.6V forced Not switching Shutdown current SHD - 0 1 uA EN=0V UVLO Circuit current www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Electrical characteristic curves (Reference data) BZ6A1206GM(1.20V OUTPUT) EN 2V/div EN 2V/div 20us VOUT 500mV/div 100us VOUT 500m/div Figure 5. Start up Figure 6. Shut down Vout 50mV/div 1.2V offset Vout 50mV/div 1.2V offset 4us 10us IOUT 200mA/div IOUT 200mA/div Figure 8. Load transient response 50mA to 350mA tr=tf=100ns, MODE : Low Figure 7. Load transient response 5mA to 200mA tr=tf=100ns, MODE : Low www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Vout 50mV/div ac coupled Vout 20mV/div ac coupled 2us 2us IOUT 100mA/div IOUT 100mA/div Figure 9. PWM/PFM Auto mode Operation Iout=50mA Figure 10. PWM mode Operation Iout=50mA Vout 20mV/div ac coupled Vout 50mV/div ac coupled 2us 2us IOUT 100mA/div IOUT 100mA/div Figure 11. PWM/PFM Auto mode Operation Iout=100mA www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 12. PWM mode Operation Iout=100mA 6/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Vout 50mV/div ac coupled Vout 20mV/div ac coupled 2us IOUT 100mA/div 2us IOUT 100mA/div Figure 13. PWM/PFM Auto mode Operation Iout=200mA Figure 14. PWM mode Operation Iout=200mA MODE 2V/div MODE 2V/div 10us 10us Vout 50mV/div ac coupled Vout 50mV/div ac coupled Figure 15. Mode Change Response MODE : Low to High www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 16. Mode Change Response MODE : High to Low 7/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet 100 100 90 90 80 80 70 70 Efficiency [%] Efficiency [%] BZ6Axx06GM Series 60 50 40 VIN=2.5V VIN=3.6V VIN=4.2V 30 60 50 40 20 20 10 10 0 0 0.1 1 10 100 VIN=2.5V VIN=3.6V VIN=4.2V 30 0.1 1000 1 100 1000 Load current [mA] Load current [mA] Figure 17. Efficiency vs Load current PWM/PFM Auto mode Figure 18. Efficiency vs Load current PWM mode 1.224 1.224 1.212 1.212 VIN=4.2 VIN=3.6 VIN=2.5 Output Voltage [V] Output Voltage [V] 10 1.200 VIN=4.2 VIN=3.6 VIN=2.5 1.200 1.188 1.188 1.176 1.176 0 100 200 300 400 500 600 700 100 200 300 400 500 600 700 Load current [mA] Load current [mA] Figure 19. Load regulation PWM/PFM Auto mode www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0 Figure 20. Load regulation PWM mode 8/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Electrical characteristic curves (Reference data) BZ6A7D06GM(1.25V OUTPUT) EN 2V/div EN 2V/div 20us VOUT 500mV/div 100us VOUT 500m/div Figure 21. Start up Figure 22. Shut down Vout 50mV/div 1.2V offset Vout 50mV/div 1.2V offset 4us 10us IOUT 200mA/div IOUT 200mA/div Figure 23. Load transient response 5mA to 200mA tr=tf=100ns, MODE : Low www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/16 Figure 24. Load transient response 50mA to 350mA tr=tf=100ns, MODE : Low TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Vout 50mV/div ac coupled Vout 20mV/div ac coupled 2us 2us IOUT 100mA/div IOUT 100mA/div Figure 25. PWM/PFM Auto mode Operation Iout=50mA Figure 26. PWM mode Operation Iout=50mA Vout 20mV/div ac coupled Vout 50mV/div ac coupled 2us 2us IOUT 100mA/div IOUT 100mA/div Figure 27. PWM/PFM Auto mode Operation Iout=100mA www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 28. PWM mode Operation Iout=100mA 10/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Vout 50mV/div ac coupled Vout 20mV/div ac coupled 2us IOUT 100mA/div 2us IOUT 100mA/div Figure 29. PWM/PFM Auto mode Operation Iout=200mA Figure 30. PWM mode Operation Iout=200mA MODE 2V/div MODE 2V/div 10us 10us Vout 50mV/div ac coupled Vout 50mV/div ac coupled Figure 31. Mode Change Response MODE : Low to High www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 32. Mode Change Response MODE : High to Low 11/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet 100 100 90 90 80 80 70 70 Efficiency[%] Efficiency[%] BZ6Axx06GM Series 60 50 40 VIN=2.5V VIN=3.6V VIN=4.2V 30 60 50 40 VIN=2.5V VIN=3.6V VIN=4.2V 30 20 20 10 10 0 0 0.1 1 10 100 0.1 1000 1 100 1000 Load current[mA] Load current[mA] Figure 33. Efficiency vs Load current PWM/PFM Auto mode Figure 34. Efficiency vs Load current PWM mode 1.2750 1.2750 1.2625 1.2625 VIN=4.2V VIN=3.6V VIN=2.5V Output Voltage[V] Output Voltage[V] 10 1.2500 1.2500 1.2375 1.2375 1.2250 1.2250 0 100 200 300 400 500 600 700 Load current[mA] 0 100 200 300 400 500 600 700 Load current[mA] Figure 35. Load regulation PWM/PFM Auto mode www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 VIN=4.2V VIN=3.6V VIN=2.5V Figure 36. Load regulation PWM mode 12/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series PC Board layout The suggested PCB layout for the BZ6Axx06GM is shown in Figure. Copper ( Unit : mm ) Resist opening 0.3 0.8 1.0 A1 pin Figure 37. Recommended Land Pattern (TOP VIEW) Figure 38. PCB layout (Mount side) Figure 39. PCB layout (solder side) Figure 40. PCB Circuit www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Caution of use 1) Absolute maximum ratings An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) GND voltage The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages up to -0.3 V to be applied to the IC pin. 3) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4) Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5) Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6) Mutual impedance Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance). 7) Thermal shutdown Circuit (TSD Circuit) This model IC has a built-in TSD circuit. This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation in mind. 8) Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, as shown in the figures below, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Ordering Information B Z Part Number 6 A Frequency 6A : 6MHz x x Output voltage 12 : 1.20V 7D : 1.25V 0 6 Output current 06 : 0.65A G M Package GM: BGA-MD - TR Packaging and forming specification TR: Embossed tape and reel Physical Dimension Tape and Reel Information www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet BZ6Axx06GM Series Date Revision 24.Jul.2012 001 Changes New Release www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/16 TSZ02201-0F2F0A100020-1-2 24.Jul.2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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