EXB-V8V132JV - Panasonic Electronic Components

Issue No. : 151EXB008057

Date of Issue :

DIGI-KEY CORPORATION Classification : New Changed

:Chip Resistor Array (RoHS Compliance)

:ＥＸＢＶ８Ｖ＊＊＊□Ｖ

: JAPAN, CHINA, MALAYSIA

:Standard electronic equipment

*If you approve this specification, please fill in and sign the below and return 1 copy to us.

Approval No :

Approval Date :

Executed by :

(signature)

Title :

Dept. :

Circuit Components Business Unit Prepared by : Engineering Section

Panasonic Electronic Devices Co., Ltd. Contact Person :

Signature

401 Sadamasa-cho, Name(Print) H.Yabukoshi

Fukui City 910-8502 Japan Title :

Authorized by :

Phone : +81-776-56-8034 Signature

Fax : +81-776-56-3114 Name(Print) T.Watanabe

Title : Manager of Engineering

November 26.2008

Applications

RODUCT SPECIFICATION FOR APPROVA

Product Description

Product Part Number

Country of Origin

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

151-EXB-V8V01NE

Part No.

EXBV8V

9-1

Panasonic Electronic Devices Co.,Ltd.

1. Dimension

L W T A B

Dimension(mm) 3.20 1.60 0.60±0.10 0.60±0.10 0.30±0.15

D P E G

Dimension(mm) (0.30) (0.80) 0.45±0.10 0.45±0.15

2. Power derating curve

100

0120100-40 -20-60 806040 140 160

-55°C70°C

125°C

Ambient Temperature(°C)

Fig. 1

% of rated dissipation

Category temperature range

-55°C to +125°C

3. Ratings

Item Rated Value Explanation

0.063 W / element

When used at ambient temperature over 70 °C,

the rated dissipation should be reduced as

shown in Fig.1

Rated Dissipation

Chip jumper : Rated current 1 A (Resistance is less than 50 mΩ)

Rated voltage

Rated Continuous

Working Voltage

(RCWV)

The rated voltage of each resistor should be calculated from the

equation below, and when the rated voltage exceeds the limiting

element voltage, the limiting element voltage should the maximum

working voltage.

E = P × R Limiting element voltage : 50 V

E: Rated voltage(V), P: Rated dissipation(W), R: Rated resistance(Ω)

(1) (2) (3) (4) (5) (6)

a-a’ sectional plan

a’

8-φD

(1)Substrate (2)Protective

coating

(3)Resistive

element

lumina Resin Ruthenium oxide

(4)Termination

(Inner)

(5)Termination

(Between)

(6) Termination

(Outer)

g or Ag/Pd Ni Plating Sn Plating

+0.20

-0.10 +0.20

-0.10

( ) : Reference

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

151-EXB-V8V01NE

Part No.

EXBV8V

9-2

Panasonic Electronic Devices Co.,Ltd.

Item Rated Value Explanation

Maximum

overload voltage

Voltage should be 2.5 × E. When the voltage exceeds the maximum

overload voltage, the value shown below should be the maximum

overload voltage.

Maximum overload voltage: 100V

Chip jumper: Max. overload current 2A

Resistance

tolerance

Range of rated

resistance for

manufacture

4. Explanation of part number

E X B V 8 V 1 0 2 J V

Thick Film

Resistor Networks

Chip

Resistor

Array

Isolated

Circuit

Rated Resistance Tolerance

Packaging

Number of terminals

R 0 0 0

Chip Jumper

5. Appearance & Construction

Item Specifications Explanation

Appearance &

Construction

1. The resistive element should be covered with protective coating

that do not fade easily. The surface of coating should avoid

unevenness, flaw, pinhole and discoloration.

2. The electrode should be printed uniformly, as shown in the

dimensions. The plating should not fade easily, and should avoid

unevenness, flaw, pinhole, projection and discoloration.

3. The electrode should be connected electrically, mechanically to

resistive element.

4. Substrate should not have chipping, flaw, flash and crack. Details

of appearance criteria shall be as described in attached sheet

Sign Tolerance for resistance

J ±5%

0 Chip Jumper

Part No. V8V

Circuit

1234

8765

Packaging Code

Taping

(5,000pcs/reel) V

Tolerance Resistance range Series

J 1.0 Ω to 1.0 MΩ E-24

0 Less than 50 mΩ -

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

151-EXB-V8V01NE

Part No.

EXBV8V

9-3

Panasonic Electronic Devices Co.,Ltd.

As far as there shall be not designation especially, the following test and measurement

shall be operated under normal temperature(15 °C to 35 °C), normal humidity

(25 %RH to 75 %RH), normal atmospheric pressure(86 kPa to 106 kPa).

6. Performance Specification

Specification

Item Resistor Jumper

Test methods

DC resistance

value shall be

within the

specified

tolerance

Less than

50 mΩ

Measuring voltage: refer to JIS-C5201-1

At 20 °C, 65 %RH

Resistance TCR

<10Ω ×10-6 / °C

10Ω to 1MΩ ±200×10-6 / °C

Temperature

coefficient

Chip jumper :

Less than 50 mΩ

Natural resistance change per temperature

degree centigrade.

2 - R1

1×(t2 - t1)

1 : Resistance value at reference

temperature(t

2 : Resistance value at test

temperature(t

2 - t1 = 100 °C, t1 = 25 °C

Overload ±(2 %+0.1 Ω) Less than

50 mΩ

Resistors shall be applied 2.5 times the rated

voltage for 5 seconds.

Maximum over load voltage shall be 100 V.

Intermittent

Overload ±(5 %+0.1 Ω) Less than

50 mΩ

Resistors shall be subjected to 10000 cycles of

2.5 times the rated voltage applied for 1

second with pause of 25 seconds between

tests.

Maximum over load voltage shall be 100 V

Dielectric

Withstanding

No evidence of flashover,

mechanical damage, arcing or

insulation breakdown.

C 100V between substrate and termination

for 1 minute.

Insulation

Resistance

Min. 1,000 MΩ Insulation resistance between substrate and

termination shall be measured at DC 100V.

7. Mechanical characteristic

Specification

Item Resistor Jumper

Test methods

No mechanical damage

Bend strength of

the face plating ±(1 %+0.05 Ω) Less than

50 mΩ

Substrate: Glass epoxy(t = 1.6 mm)

Span: 90 mm

Bending distance: 3 mm (10 seconds)

Solderability

Termination should be covered

uniformly with solder.

(min. 95 % coverage)

Resistors shall be dipped in the melted solder

bath at 235 °C ± 5 °C for 2 s ± 0.5 s. Flux shall

be removed from the surface of termination

with clean organic solvent.

TCR=

+600

−100

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

151-EXB-V8V01NE

Part No.

EXBV8V

9-4

Panasonic Electronic Devices Co.,Ltd.

Specification

Item Resistor Jumper

Test methods

Resistance to

soldering heat ±(1 %+0.05 Ω) Less than

50 mΩ

Resistors shall be dipped in the melted solder

bath at 270 °C ± 5 °C for 10s ± 1s.

Vibration ±(1 %+0.05 Ω) Less than

50 mΩ

Resistors shall be subjected to a single

vibration having as double amplitude of 1.5

mm for 2 hours in each three mutually

perpendicular directions for total 6 hours.

The vibration frequency shall be varied

uniformly 10 Hz to 55 Hz and return to 10 Hz

traversing for 1 minute.

Without distinct deformation in

appearance

Solvent resistance

±(0.5 %+0.05 Ω) Less than

50 mΩ

Solvent solution: Isopropyl alcohol

(1) Dipping 10 hours ± 1 hour, dry in room

condition for 30 min ± 10 min.

(2) Ultrasonic wave washing: 5 min ± 1 min

(0.3 W/cm2,28 kHz)

Dry in room condition for 30 min ±10

min.

8. Environmental Test

Specification

Item Resistor Jumper

Test methods

Low temperature

exposure ±(1 %+0.05 Ω) Less than

50 mΩ

Resistors shall be exposed at -55 °C ± 3 °C for

1000 hours hours

Endurance at upper

category

temperature

±(1 %+0.05 Ω) Less than

50 mΩ

Resistors shall be exposed at +125 °C±3 °C for

1000 hours hours.

Temperature

cycling ±(1 %+0.05 Ω) Less than

50 mΩ

-55 °C ± 3 °C, 30 minutes

↑↓

Nominal temp., 30minutes 25cycles

↑↓

+125 °C ± 3 °C, 30minutes

Humidity

(Steady state) ±(1 %+0.05 Ω) Less than

50 mΩ

Resistors shall be exposed at 60 °C ± 2 °C and

90 % to 95 % relative humidity in a humidity

test chamber for 1000 hours hours.

Endurance at 70 °C ±(3 %+0.1 Ω) Less than

50 mΩ

Resistors shall be exposed at 70 °C ± 2 °C for

1000 hours hours. During this time, the

rated voltage shall be applied intermittently

for 1.5 hours ON, 0.5 hour OFF.

Load life in

humidity ±(3 %+0.1 Ω) Less than

50 mΩ

Resistor shall be exposed at 60 °C ± 2 °C and

90 % to 95 % relative humidity for 1000 hours

hours. During this time, the rated voltage

shall be applied intermittently for 1.5 hours

ON, 0.5 hour OFF.

+48

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

151-EXB-V8V01NE

Part No.

EXBV8V

9-5

Panasonic Electronic Devices Co.,Ltd.

9. Resistance value marking

Express resistance value on resin side with three digits.

(Example)

103 → 10 kΩ The first two digits should be significant figures of

resistance for E-24 series and the third one

denotes number of zeros in ohms.

000 → Chip jumper

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

151-EXB-V8V01NE

Part No.

EXBV8V

9-6

Panasonic Electronic Devices Co.,Ltd.

10. Notice for use

Notice for use

(1)This specification shows the quality and performance of the product in a unit component. Before

adoption, be sure to evaluate and verify the product mounting it in your product.

(2)We take no responsibility for troubles caused by the product usage that is not specified in this

specification.

(3)In traffic transportation equipment (trains, cars, traffic signal equipment, etc.), medical

equipment, aerospace equipment, electric heating appliances, combustion and gas equipment,

rotating equipment, disaster and crime preventive equipment, etc. in cases where it is forecast

that the failure of this product gives serious damage to human life and others, use fail-safe design

and ensure safety by studying the following items to

 Ensure safety as the system by setting protective circuits and protective equipment.

 Ensure safety as the system by setting such redundant circuits as do not cause danger by a

single failure.

(4)When a dogma shall be occurred about safety for this product, be sure to inform us rapidly,

operate your technical examination.

(5) The product is designed to use in general standard applications of general electric equipment

(AV products, household electric appliances, office equipment, information and communication

equipment, etc.); hence, it do not take the use under the following special environments into

consideration.

Accordingly, the use in the following special environments, and such environmental conditions

may affect the performance of the product; prior to use, verify the performance, reliability, etc.

thoroughly.

1) Use in liquids such as water, oil, chemical, and organic solvent.

2) Where the product is close to a heating component, or where an inflammable such as a

polyvinyl chloride wire is arranged close to the product.

3) Where the product is sealed or coated with resin, etc.

4) Where water or a water-soluble detergent is used in cleaning free soldering (Pay particular

attention to soluble flux.)

5) Use in such a place where the product is wetted due to dew condensation.

6) Use in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.

7) Use under direct sunlight, in outdoor or in dusty atmospheres.

8) Use in environment with large static electricity or strong electromagnetic waves.

(6)If transient load (heavy load in a short time) like pulse is expected to be applied, carry out

evaluation and confirmation test with resistors actually mounted on your own board. When the

load of more than rated power is applied under the load condition at steady state, it may impair

performance and/or reliability of resistor. Never exceed the rated power.

When the product shall be used under special condition, be sure to ask us in advance.

(7)Halogen type (chlorine type, bromine type, etc.) or other high-activity flux is not recommended as

the residue may affect performance or reliability of resistors.

(8)When soldering with soldering iron, never touch the body of the chip resistor with a tip of the

soldering iron. When using a soldering iron with a tip at high temperature, solder for a time as

short as possible. (Three seconds or less up to 350 °C)

(9)Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or

tweezers) as it may damage protective firm or the body of resistor and may affect resistor’s

performance.

(10)Reflow soldering method shall apply to this product in principle.

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

151-EXB-V8V01NE

Part No.

EXBV8V

9-7

Panasonic Electronic Devices Co.,Ltd.

11. Storage method

If the product is stored in the following environments and conditions, the performance

and solderability may be badly affected. Avoid the storage in the following environments.

(1) Storage in places full of corrosive gases such as sea breeze, Cl2, H2S, NH3, SO2, and NOX.

(2) Storage in places exposed to direct sunlight.

(3) Storage in places outside the temperature range of 5 °C to 35 °C and humidity range

of 45 %RH to 85 %RH.

(4) Storage over a year after our delivery (This item also applies to the case where the

storage method specified in item (1) to (3) has been followed.).

12. Laws and Regulations

(1) No ODCs or other ozone-depleting substances that are subject to regulation under the

Montreal Protocol are used in our manufacturing processes, including in the manufacture

of this product.

(2) This product complies with the RoHS Directive (Restriction of the use of certain Hazardous

Substances in electrical and electronic equipment (DIRECTIVE 2002/95/EC)).

(3) All materials used in this product are existing chemical substances recognized under

"lows on examination of chemical substances and regulations of manufacturing and others."

(4) None of the materials used in this product contain the designated incombustible

bromic substances, PBBOs and PBBs.

(5) Please contact us to obtain a notice as to whether this product has passed inspection

under review criteria primarily based on Foreign Exchange and Foreign Trade Control

Laws, and appended table in the Export Control Laws.

13. Production Place

Production Country : Japan

Production Plant : Panasonic Electronic Devices Japan Co.,Ltd.

Production Country : China

Production Plant : Panasonic Electronic Devices (Tianjin) Co., Ltd. (PEDTJ)

Production Country : Malaysia

Production Plant : Panasonic Electronic Devices Malaysia Sdn. Bhd. (PEDMA)

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

151-EXB-V8V01NE

Part No.

EXBV8V

9-8

Panasonic Electronic Devices Co.,Ltd.

14. Tape and Reel Package

14-1. Physical Dimensions

Structure and reel dimensions shall be as shown in the figure below.

Inaccordance with EIAJ ET-7200.

14-2. Carrier Tape Dimensions

Sprocket hole

Chip hole

P0 P2

φD0

Chip resistor array

A B W F E

(mm) 1.95±0.15 3.60±0.20 8.00±0.20 3.50±0.05 1.75±0.10

P1 P2 P0 T φD0

(mm) 4.00±0.10 2.00±0.05 4.00±0.10 0.84±0.05 1.50

14-3. Specification

14-3-1. Taping

(1) When the test shall be operated with the below conditions, peel strength should be 0.049N

to 0.49N, should not have flash and tear after peeling.

(2) Minimum Bending Radius

When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip

and no break of carrier tape. However minimum bending radius shall be tested for 1 times.

+0.10

Peeling Direction

Top Tape

10°

Carrier Tape

Carrier ta

Adhesive ta

e Unit : mm

Min. 60.0

11.4 +/- 1.0

9.0 +/- 1.0

180.0 +0 / -3.0

13.0 +/- 1.0

Min. 60.0

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

151-EXB-V8V01NE

Part No.

EXBV8V

9-9

Panasonic Electronic Devices Co.,Ltd.

(3) Resistance to climate

When resistors shall be exposed at 60 °C ± 2 °C, 90 %RH to 95 %RH for 120 hours, no

defection of chip and no break off carrier tape.

When the top tape shall be peeled, tape should not have flash and tear.

14-3-2. Quantity in Taping: 5,000 pcs. / reel

14-3-3. Tape packaging

(1) Resistor side shall be facing upward.

(2) Chip resistor shall not be sticking to top tape and bottom tape.

(3) Chip resistors shall be easy to take out from carrier tape and chip hole or sprocket hole

shall not have flash and break.

14-4. Outer Packaging

Quantity: 20 reels(Max.100,000 pcs.)

Tape

Marking

(1) When packaging quantity does not reach max quantity, the remaining empty space shall

be buried with buffer material.

(2) When quantity shall be few, alternative packaging methods may used. No problem must

occur during the exportation of the product..

14-5. Marking

At last, production country is displayed in English.

• Side of reel (Marking shall be on one side.)

(1)Part name (2)Part number (3)Quantity (4)Lot number (5)Maker name

(6)Production country

•Packaging box

(1)Customer name (2)Part name (3)Part number (4)Customer part number

(5)Quantity (6)Maker name (7) Production country

Subject

Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION

Spec. No.

Attached Sheet

APPEARANCE QUALITY CRITERIA

1-1

Panasonic Electronic Devices Co.,Ltd.

Item Defect Criteria Appearance Criteria Remark

Resin Chipping

A ≤ W/16

B ≤ C/2

Both side chipping

shall be judged defect

Terminal Chipping

Oblique line show chipping

Through hole terminal chipping

A ≤ 1/2 of radius

B ≤ Top terminal width

D ≥ 1/2 of radius

Through hole’s chipping

area is within 1/4 of

through hole’s area.

Pin Hole

One pin hole /

chip resistor

φ ≤ 0.2 mm

This item is applied to

pin holes which reach

to the resistive

materials

Flash

A ≤ 100 μm