BPX 43
NPN-Silizium-Fototransistor
Silicon NPN Phototransistor
2001-02-21 1
Wesentliche Merkmale
Speziell geeignet für Anwendungen im Bereich
von 450 nm bis 1100 nm
Hohe Linearität
Hermetisch dichte Metallbauform (TO-18) mit
Basisanschluß, geeignet bis 125 °C
Gruppiert lieferbar
Anwendungen
Lichtschranken für Gleich- und
Wechsellichtbetrieb
Industrieelektronik
„Messen/Steuern/Regeln“
Typ
Type Bestellnummer
Ordering Code
BPX 43 Q62702-P16
BPX 43-2/3 Q62702-P3580
BPX 43-3 Q62702-P16-S3
BPX 43-3/4 Q62702-P3581
BPX 43-4 Q62702-P16-S4
BPX 43-4/5 Q62702-P3582
BPX 43-5 Q 62702-P16-S5
Features
Especially suitable for applications from
450 nm to 1100 nm
High linearity
Hermetically sealed metal package (TO-18)
with base connection suitable up to 125 °C
Available in groups
Applications
Photointerrupters
Industrial electronics
For control and drive circuits
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BPX 43
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top; Tstg 40 + 125 °C
Löttemperatur bei Tauchlötung
Lötstelle 2 mm vom Gehäuse,
Lötzeit t 5 s
Dip soldering temperature 2 mm distance
from case bottom, soldering time t 5 s
TS260 °C
Löttemperatur bei Kolbenlötung
Lötstelle 2 mm vom Gehäuse,
Lötzeit t 3 s
Iron soldering temperature 2 mm distance
from case bottom, soldering time t 3 s
TS300 °C
Kollektor-Emitterspannung
Collector-emitter voltage VCE 50 V
Kollektorstrom
Collector current IC50 mA
Kollektorspitzenstrom, τ < 10 µs
Collector surge current ICS 200 mA
Emitter-Basisspannung
Emitter-base voltage VEB 7V
Verlustleistung, TA = 25 °C
Total power dissipation Ptot 220 mW
Wärmewiderstand
Thermal resistance RthJA 450 K/W
BPX 43
2001-02-21 3
Kennwerte (TA = 25 °C, λ = 950 nm)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der max. Fotoempfindlichkeit
Wavelength of max. sensitivity λS max 880 nm
Spektraler Bereich der Fotoempfindlichkeit
S = 10% von Smax
Spectral range of sensitivity
S = 10% of Smax
λ450 1100 nm
Bestrahlungsempfindl iche Fläche
Radiant sensitive area A0.675 mm2
Abmessung der Chipfläche
Dimensions of chip area L × B
L × W1×1mm × mm
Abstand Chipoberfläche zu Gehäuseoberfläche
Distance chip front to case surface H2.4 3.0 mm
Halbwinkel
Half angle ϕ±15 Grad
deg.
Fotostrom der Kollektor-Basis-Fotodiode
Photocurrent of collector-base photodiode
Ee = 0.5 mW/cm2, VCB = 5 V
Ev = 1000 Ix, Normlicht/standard light A,
VCB = 5 V
IPCB
IPCB
11
35 µA
µA
Kapazität
Capacitance
VCE = 0 V, f = 1 MHz, E = 0
VCB = 0 V, f = 1 MHz, E = 0
VEB = 0 V, f = 1 MHz, E = 0
CCE
CCB
CEB
23
39
47
pF
pF
pF
Dunkelstrom
Dark current
VCE = 25 V, E = 0
ICEO 20 (300) nA
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BPX 43
Die Fototransistoren werden nach ihrer Fotoempfindlichkeit gruppiert und mit arabischen Ziffern
gekennzeichnet.
The phototransistors are grouped according to their spectral sensitivity and distinguished by
arabian figures.
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
-2 -3 -4 -5
Fotostrom, λ = 950 nm
Photocurrent
Ee = 0.5 mW/cm2, VCE = 5 V
Ev = 1000 Ix, Normlicht/standard light A,
VCE = 5 V
IPCE
IPCE
0.8 1.6
3.8 1.25 2.5
6.0 2.0 4.0
9.5 3.2
15.0 mA
mA
Anstiegszeit/Abfallzeit
Rise and fall time
IC = 1 mA, VCC = 5 V, RL = 1 k
tr, tf9121518ms
Kollektor-Emitter-Sättigungsspannung
Collector-emitter saturation voltage
IC = IPCEmin1) × 0.3
Ee = 0.5 mW/cm2
VCEsat 200 220 240 260 mV
Stromverstärkung
Current gain
Ee = 0.5 mW/cm2, VCE = 5 V
110 170 270 430
1) IPCEmin ist der minimale Fotostrom der jeweiligen Gruppe.
1) IPCEmin is the min. phot oc urrent of the spe c ifie d group.
IPCE
IPCB
------------
BPX 43
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Relati ve Sp ectral Sensi ti vi ty
Srel = f (λ)
Output Characteristics
IC = f (VCE), IB = Param eter
Photocurrent
IPCE/IPCE25o = f (TA), VCE = 5 V
Photocurrent
IPCE = f (Ee), VCE = 5 V
Output Characteristics
IC = f (VCE), IB = Parameter
Dark Current
ICEO/ICEO25o = f (TA), VCE = 25 V, E = 0
Total Powe r Dissip ation
Ptot = f (TA)
Dark Current
ICEO = f (VCE), E = 0
Collecto r-E mi tter Capacitan ce
CCE = f (VCE), f = 1 MHz, E = 0
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2001-02-21 6
Collector-Base Ca p aci tan ce
CCB = f (VCB), f = 1 MHz, E = 0
Directional Chara cter i sti cs
Srel = f (ϕ)
Emitter-Base Capacitance
CEB = f (VEB), f = 1 MHz, E = 0
BPX 43
2001-02-21 7
Maßzeichnung
Package Outlines
Maße werden wi e fo lgt angegeben: m m (inc h) / Dim ensions are specified as follo w s: m m (inc h).
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The inform at ion describe s the type of component and sha ll not be c ons idered as assur ed characteris tics .
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
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material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critica l component is a co mponent usedin a l ife-support devi ce or system whose failure can re asonably be expec ted
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life sup port device s or syst ems ar e int ended (a ) to b e imp lanted in t he hu man body , or ( b) to supp ort a nd/or main tain
and sust ain human life. If th ey fail , it is rea so nable to assum e th at the health of the user may be endangered.
ø5.6 (0.220)
ø5.3 (0.209)
2.54 (0.100)
spacing
ø4.8 (0.189)
E C B
(2.7 (0.106))
5.1 (0.201)
4.8 (0.189)
14.5 (0.571)
12.5 (0.492)
ø0.45 (0.018)
Radiant
GMOY6019
ø4.6 (0.181)
5.4 (0.213)
6.2 (0.244)
Chip position sensitive area
0.9 (0.035)
1.1 (0.043)
1.1 (0.043)
0.9 (0.035)