SRDA05-4R2 Low Capacitance Surface Mount TVS for High-Speed Data Interfaces The SRDA05-4 transient voltage suppressor is designed to protect equipment attached to high speed communication lines from ESD, EFT, and lightning. Features: SO-8 LOW CAPACITANCE VOLTAGE SUPPRESSOR 500 WATTS PEAK POWER 6 VOLTS * SO-8 Package * Peak Power - 500 Watts 8 x 20 S * ESD Rating: * http://onsemi.com IEC 61000-4-2 (ESD) 15 kV (air) 8 kV (contact) IEC 61000-4-4 (EFT) 40 A (5/50 ns) IEC 61000-4-5 (lightning) 23 (8/20 s) UL Flammability Rating of 94V-0 PIN CONFIGURATION AND SCHEMATIC Typical Applications: * High Speed Communication Line Protection I/O 1 1 MAXIMUM RATINGS Rating Peak Power Dissipation 8 x 20 S @ TA = 25C (Note 1) Junction and Storage Temperature Range Lead Solder Temperature - Maximum 10 Seconds Duration Symbol Value Unit Ppk 500 W TJ, Tstg -55 to +150 C TL 260 C 8 REF 2 REF 1 2 7 I/O 4 REF 1 3 6 I/O 3 I/O 2 4 5 REF 2 8 1 SO-8 CASE 751 PLASTIC 1. Non-repetitive current pulse 8 x 20 S exponential decay waveform MARKING DIAGRAM SRDA5 LYWW SRDA5= Device Code L = Location Code Y = Year WW = Work Week ORDERING INFORMATION Device Package Shipping SRDA05-4R2 SO-8 2500/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2004 March, 2004 - Rev. 3 1 Publication Order Number: SRDA05-4R2/D SRDA05-4R2 ELECTRICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit VBR 6.0 - - V Reverse Leakage Current @ VRWN = 5.0 Volts IR N/A - 10 A Maximum Clamping Voltage @ IPP = 1.0 A, 8 x 20 S VC N/A - 9.8 V Maximum Clamping Voltage @ IPP = 10 A, 8 x 20 S VC N/A - 12 V Between I/O Pins and Ground @ VR = 0 Volts, 1.0 MHz Capacitance - 10 15 pF Between I/O Pins @ VR = 0 Volts, 1.0 MHz Capacitance - 5 8 pF Reverse Breakdown Voltage @ It = 1.0 mA ELECTRICAL CHARACTERISTICS I (TA = 25C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Parameter Symbol IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR IT VBR IF VC VBR VRWM IR VF IT Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current IPP Maximum Temperature Coefficient of VBR IF Forward Current VF Forward Voltage @ IF ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK Uni-Directional TVS http://onsemi.com 2 V SRDA05-4R2 9 8 8 7 IR, REVERSE LEAKAGE (A) VZ, REVERSE BREAKDOWN (V) TYPICAL CHARACTERISTICS 7 6 5 4 3 2 1 0 -100 -50 0 50 100 T, TEMPERATURE (C) 150 6 5 4 3 2 1 0 -100 200 VC, CLAMPING VOLTAGE (V) % OF PEAK PULSE CURRENT 70 60 HALF VALUE IRSM/2 @ 20 s 50 40 30 tP 20 10 0 0 20 40 200 35 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 s 80 150 100 Figure 2. Reverse Leakage versus Temperature PEAK VALUE IRSM @ 8 s tr 90 50 T, TEMPERATURE (C) Figure 1. Reverse Breakdown versus Temperature 100 0 -50 60 30 25 20 15 10 5 0 80 0 10 20 30 40 50 60 70 80 IPP, PEAK PULSE CURRENT (A) t, TIME (s) Figure 3. 8 x 20 s Pulse Waveform Figure 4. Clamping Voltage versus Peak Pulse Current http://onsemi.com 3 90 SRDA05-4R2 PACKAGE DIMENSIONS SO-8 CASE 751-07 ISSUE AB NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDAARD IS 751-07 -X- A 8 5 0.25 (0.010) S B 1 M Y M 4 K -Y- G C N DIM A B C D G H J K M N S X 45 SEATING PLANE -Z- 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0 8 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 8 0.010 0.020 0.228 0.244 SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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