Advance Data Sheet
May 2000
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
The SMC/SMW Dual-Output Series Surface-Mount Power
Modules use advanced, surface-mount technology and
deliver high-quality, compact, dc-dc conversion at an eco-
nomical price.
Applications
■
Communication equipment
■
Computer equipment
■
Distributed power architectures
Options
■
Negative remote on-off logic
■
Synchronization
■
Tight output voltage regulation
■
Input voltage turn-on adjustment
*
UL
is a registered trademark of Underwriters Laboratories, Inc.
†
CSA
is a registered trademark of Canadian Standards Associa-
tion.
‡
VDE
is a trademark of Verband Deutscher Elektrotechniker e.V.
§This product is intended for integration into end-use equipment.
All the required procedures for CE marking of end-use equip-
ment should be followed. (The CE mark is placed on selected
products.)
Features
■
Low profile: 10 mm x 30.2 mm x 49.5 mm
(0.39 in. x 1.19 in. x 1.95 in.)
■
Wide input voltage range: 18 Vdc to 36 Vdc and
36 Vdc to 75 Vdc
■
Input-to-output isolation: 1500 V
■
Operating case temperature range: –40 °C to
+105 °C
■
Overcurrent protection, unlimited duration
■
Remote on/off
■
Output voltage adjustment: 90% to 105% of V
O, nom
■
Output overvoltage protection
■
Undervoltage lockout
■
UL
*
1950 Recognized,
CSA
†
C22.2 No. 950-95
Certified,
VDE
‡
0805 (EN60950, IEC950) Licensed
■
CE mark meets 73/23/EEC and 93/68/EEC
directives
§
(SMW only)
■
Within FCC Class A radiated limits
Description
The SMC/SMW Dual-Output Series Surface-Mount
Power Modules are low-profile , dc-dc con verters that
operate over an input voltage range of 18 Vdc to
36 Vdc or 36 Vdc to 75 Vdc and provide a precisely
regulated output. The output is isolated from the
input, allowing versatile polarity configurations and
grounding connections. The modules have a maxi-
mum power rating of 10 W and efficiencies up to
80%. Built-in filtering for both input and output mini-
mizes the need for external filtering.
These modules are designed and manufactured to
be gull-winged surf ace-mounted power modules that
are reflowed with other surf ace-mount components in
a typical surface-mount fashion.
2 Tyco Electronics Corp.
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
* Maximum case temperature varies based on power dissipation. See derating curves, Figure 14, for details.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Table 1. Input Specifications
Fusing Considerations
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone
operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal
fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse.
The safety agencies require a normal-b lo w fuse with a maximum r ating of 5 A (see Saf ety Consider ations section).
Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same
type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data for further information.
Parameter Device Symbol Min Typ Max Unit
Input Voltage:
Continuous
Transient (100 ms)
SMC
SMW
SMW
V
I
V
I
V
I, trans
0
0
0
—
—
—
50
80
100
Vdc
Vdc
V
Operating Case Temperature
(See Thermal Considerations section.) All T
C
–40 — 105* °C
Storage Temperature All T
stg
–55 — 120 °C
I/O Isolation Voltage All — — — 1500 Vdc
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage SMC
SMW V
I
V
I
18
36 24
48 36
75 Vdc
Vdc
Maximum Input Current
(V
I
= 0 to V
I, max
; I
O
= I
O, max
)SMC
SMW I
I, max
I
I, max
—
——
—1.2
0.6 A
A
Inrush Transient All I
2
t— — 0.2 A
2
s
Input Reflected-ripple Current
(5 Hz to 20 MHz; 12 µH source imped-
ance; T
A
= 25 °C; see Figure 7.)
All I
I
— 5 — mAp-p
Input Ripple Rejection (100 Hz—120 Hz) All — — 45 — dB
Tyco Electronics Corp. 3
Advance Data Sheet
May 2000 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Electrical Specifications
(continued)
Table 2. Output Specifications
Parameter Device Code
or Suffix Symbol Min Typ Max Unit
Output Voltage Set Point
(V
I
= V
I, nom
; I
O
= I
O, max
; T
A
= 25 °C) AJ
BK
CL
V
O1, set
V
O2, set
V
O1, set
V
O2, set
V
O1, set
V
O2, set
4.75
–4.75
11.40
–11.40
14.25
–14.25
5.0
–5.0
12.0
–12.0
15.0
–15.0
5.25
–5.25
12.60
–12.60
15.75
–15.75
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Output Voltage
(Over all line, load, and temperature
conditions until end of life; see Figure 9.)
AJ
BK
CL
V
O1
V
O2
V
O1
V
O2
V
O1
V
O2
4.5
–4.5
10.80
–10.80
13.50
–13.50
—
—
—
—
—
—
5.5
–5.5
13.20
–13.20
16.50
–16.50
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
Output Regulation
(For line and load see characteristic
curves.)
All — — — — —
Output Ripple and Noise
(Across 2 x 0.47 µF ceramic capacitors;
see Figure 8.):
RMS
Peak-to-peak (5 Hz to 20 MHz)
AJ
BK, CL
AJ
BK, CL
—
—
—
—
—
—
—
—
—
—
—
—
35
50
120
150
mVrms
mVrms
mVp-p
mVp-p
Output Current
(At I
O
< I
O, min
, the modules may exceed
output ripple specifications, but oper ation is
guaranteed.)
AJ
BK
CL
I
O1
, I
O2
I
O1
, I
O2
I
O1
, I
O2
0.1
0.06
0.05
—
—
—
1.0
0.42
0.33
A
A
A
Output Current-limit Inception
(V
O
= 90% V
O, set
)AJ
BK
CL
I
O1
, I
O2
I
O1
, I
O2
I
O1
, I
O2
—
—
—
—
—
—
4.0
2.5
2.5
A
A
A
Output Short-circuit Current
(V
O
= 0.25 V) AJ
BK
CL
I
O1
, I
O2
I
O1
, I
O2
I
O1
, I
O2
—
—
—
—
—
—
6.0
3.5
3.5
A
A
A
Efficiency
(V
I
= V
I, nom
; I
O
= I
O, max
; T
A
= 25 °C; see
Figure 9.)
SMC010xx
SMW010AJ
SMW010BK
SMW010CL
η
η
η
η
TBD
TBD
76
76
77
78
79
79
—
—
—
—
%
%
%
%
Switching Frequency All — — 265 — kHz
4 Tyco Electronics Corp.
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Electrical Specifications
(continued)
Table 2. Output Specifications
(continued)
Table 3. Isolation Specifications
Table 4. General Specifications
Parameter Device Code
or Suffix Symbol Min Typ Max Unit
Dynamic Response
(for duals: I
O1
or I
O2
= I
O, max
;
∆
I
O
/
∆
t = 1A/10 µs; V
I
= V
I, nom
; T
A
= 25 °C):
Load Change from I
O
= 50% to 75% of
I
O, max
:
Peak Deviation
Settling Time
(V
O
< 10% of peak deviation)
Load Change from I
O
= 50% to 25% of
I
O, max
:
Peak Deviation
Settling Time
(V
O
< 10% of peak deviation)
All
All
All
All
—
—
—
—
—
—
—
—
2
1.5
2
1.5
—
—
—
—
%V
O, set
ms
%V
O, set
ms
Parameter Min Typ Max Unit
Isolation Capacitance — 600 — pF
Isolation Resistance 10 — — M
Ω
Parameter Min Typ Max Unit
Calculated MTBF (I
O
= 80% of I
O, max
; T
C
= 40 °C) 4,860,000 hours
Weight — — 30 (1.05) g (oz.)
Tyco Electronics Corp. 5
Advance Data Sheet
May 2000 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Electrical Specifications
(continued)
Table 5. Feature Specifications
Parameter Device Code
or Suffix Symbol Min Typ Max Unit
Remote On/Off Signal Interface (optional):
(V
I
= 0 V to V
I
,
max
; open collector or equivalent
compatible; signal ref erenced to V
I
(–) terminal.
See Figure 10 and Feature Descriptions.):
Positive Logic— If Device Code Suffix “1” Is
Not Specified:
Logic Low—Module Off
Logic High—Module On
Negative Logic— Device Code Suffix “1”:
Logic Low—Module On
Logic High—Module Off
Module Specifications:
On/Off Current—Logic Low
On/Off Voltage:
Logic Low
Logic High (I
on/off
= 0)
Open Collector Switch Specifications:
Leakage Current During Logic High
(V
on/off
= 10 V)
Output Low Voltage During Logic Low
(I
on/off
= 1 mA)
All
All
All
All
All
I
on/off
V
on/off
V
on/off
I
on/off
V
on/off
—
–0.7
—
—
—
—
—
—
—
—
1.0
1.2
10
50
1.2
mA
V
V
µA
V
Turn-on Delay and Rise Times
(At 80% of I
O, max
; T
A
= 25 °C):
Case 1: On/Off Input Is Set for Unit On and
then Input Power Is Applied (delay from
point at which V
I
= V
I, min
until V
O
= 10% of
V
O, nom
).
Case 2: Input Power Is Applied for at Least
One Second, and then the On/Off Input Is
Set to Turn the Module On (delay from point
at which on/off input is toggled until
V
O
= 10% of V
O, nom
).
Output Voltage Rise Time
(time for V
O
to rise from 10% of V
O, nom
to
90% of V
O, nom
)
Output Voltage Ov ershoot
(at 80% of I
O, max
; T
A
= 25 °C)
All
All
All
All
T
delay
T
delay
Trise
—
—
—
—
—
5
1
0.2
—
20
10
5
5
ms
ms
ms
%
Output Voltage Set-point Adjustment Range AJ
BK, CL —
—90
90 —
—110
100 %VO, nom
%VO, nom
Output Overvoltage Protection (clamp) AJ
BK
CL
VO1, clamp
VO2, clamp
VO1, clamp
VO2, clamp
VO1, clamp
VO2, clamp
5.6
–5.6
13.2
–13.2
16.6
–16.6
—
—
—
—
—
—
7.0
–7.0
18.0
–18.0
22.0
–22.0
V
V
V
V
V
V
Undervoltage Lockout SMC
SMW Vuvlo
Vuvlo 11
20 14
27 —
—V
V
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
6 Tyco Electronics Corp.
Characteristic Curves
8-1790(C)
Note: Output 2 has characteristics similar to output 1 when
IO1 = 0.5 A and IO2 varies.
Figure 1. SMx010AJ Typical Load Regulation of
Output1 with Fixed IO2 = 0.5 A at
TC = 25 °C
8-1791(C)
Note: Output 2 has characteristics similar to output 1 when
IO2 = 0.1 A and IO1 varies.
Figure 2. SMx010AJ Typical Cross Regulation,
VO1 vs. IO2 with Fixed IO1 = 0.1 A at
TC = 25 °C
8-1792(C)
Note: Output 2 has characteristics similar to output 1 when
IO2 = 1.0 A and IO1 varies.
Figure 3. SMx010AJ Typical Cross Regulation,
VO1 vs. IO2 with Fixed IO1 = 1.0 A at
TC = 25 °C
8-1793(C)
Note: Output 2 has characteristics similar to output 1 when
IO1 = (0.5 * IO, max) and IO2 varies.
Figure 4. SMx010BK, CL Load Regulation of
Output1 with Fixed IO2 = 0.5 * IO, max at
TC = 25 °C, Normalized VO1 vs. Normalized
Current IO1
0.1 0.2 0.3 0.4 0.5 0.6
4.90
5.05
OUTPUT CURRENT 1, I
O1
(
A
)
5.00
5.10
1.0
0.0
4.95
0.7
5.15
0.8 0.9
V
I
= HIGH LINE
V
I
= LOW LINE
V
I
= NOM LINE
OUTPUT VOLTAGE 1, V
O1
(V)
0.1 0.2 0.6 0.7 0.8 0.9
4.95
5.20
OUTPUT CURRENT 2, I
O2
(
A
)
5.10
5.05
5.15
1.00.0
5.25
5.00
0.4 0.50.3
V
I
= LOW LINE
V
I
= NOM LINE
V
I
= HIGH LINE
OUTPUT VOLTAGE 1, V
O1
(V)
0.1 0.2 0.3 0.5 0.6 0.7
4.75
4.90
OUTPUT CURRENT 2, IO2
(
A
)
4.85
4.95
1.00.0
4.80
0.8 0.9
5.00
0.4
OUTPUT VOLTAGE 1, VO1 (V)
VI = HIGH LINE
VI = NOM LINE
VI = LOW LINE
0.15 0.30 0.45 0.75 0.90
0.990
1.013
NORMALIZED OUTPUT CURRENT
(
I
O1
/I
O1
,
max
)
1.010
1.016
1.0
5
0.0
1.006
1.020
0.60
1.003
1.000
0.996
0.993 V
I
= HIGH LINE
I
O
= I
O
,
max
I
O
= I
O
,
min
V
I
= LOW LINE
V
I
= NOM LINE
NORMALIZED OUTPUT VOLTAGE 1 (V
O1
/V
O1
,
set
)
Advance Data Sheet
May 2000 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Tyco Electronics Corp. 7
Characteristics Curves (continued)
8-1794(C)
Note: Output 2 has characteristics similar to output 1 when
IO2 = IO, min and IO1 varies.
Figure 5. SMx010BK, CL Typical Cross Regulation,
Normalized VO1 vs. Normalized IO2 with
Fixed IO1 = IO, min at TC = 25 °C
8-1795(C)
Note: Output 2 has characteristics similar to output 1 when
IO2 = IO, max and IO1 varies.
Figure 6. SMx010BK, CL Typical Cross Regulation,
Normalized VO1 vs. Normalized IO2 with
Fixed IO1 = IO, max at TC = 25 °C
Test Configurations
8-203(C)
Note: Input reflected-ripple current is measured with a simulated
source impedance of 12 µH. Capacitor Cs offsets possible
battery impedance. Current is measured at the input of the
module.
Figure 7. Input Reflected-Ripple Test Setup
8-808(C).g
Note: Use four 0.47 µF ceramic capacitors. Scope measurement
should be made using a BNC socket. Position the load
between 50 mm and 75 mm (2 in. and 3 in.) from the module.
Figure 8. Peak-to-Peak Output Noise Measurement
Test Setup
1.020
1.003
0.996
1.010
1.016
1
.
023
1.000
1.007
1.013
0.15 0.45 0.60 0.75 0.90 1.050.0 0.30
NORMALIZED OUTPUT CURRENT 2 (IO2/IO2, max)
VI = NOM LINE
VI = LOW LINE
VI = HIGH LINE
IO = IO, min IO = IO, max
NORMALIZED
OUTPUT VOLTAGE 1 (VO1/VO1, set)
1.000
0.966
0.953
0.980
0.993
1
.
006
0.960
0.973
0.987
0.15 0.45 0.60 0.75 0.90 1.050.0 0.30
NORMALIZED OUTPUT CURRENT 2 (I
O2
/I
O2
,
max
)
NORMALIZED
OUTPUT VOLTAGE 1 (V
O1
/V
O1
,
set
)
V
I
= LOW LINE
V
I
= NOM LINE
V
I
= HIGH LINE
I
O
= I
O
,
max
I
O
= I
O
,
min
TO OSCILLOSCOPE
12 µH
CS 220 µF
IMPEDANCE < 0.1 Ω
@ 20 °C, 100 kHz
VI(+)
VI(–)
BATTERY 33 µF
CURRENT
PROBE
LTEST
V
O1
(+)
V
O2
(+)
0.47 µF
0.47 µF
SCOPE
COPPER STRIP
SCOPE
COM
R
LOAD1
R
LOAD2
0.47 µF
0.47 µF
88 Tyco Electronics Corp.
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Test Configurations (continued)
8-863(C).a
Note: All measurements are taken at the module terminals. When
socketing, place Kelvin connections at module terminals to
avoid measurement errors due to socket contact resistance.
Figure 9. Output Voltage and Efficiency
Measurement Test Setup
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance input source. Highly inductive source
impedances can affect the stability of the power mod-
ule. If the source inductance exceeds 4 µH, a 33 µF
electrolytic capacitor (ESR < 0.7 Ω at 100 kHz)
mounted close to the power module helps ensure
stability of the unit.
Solder Recommendations
Large surface-mount components typically require a
thicker stencil than smaller components to ensure a
reliable solder joint. The SMC/SMW-Series Surface-
Mount Power Modules have been evaluated for solder
joint reliability and shock and vibration requirements
using 170,000 cubic mils (2.8 mm3) of solder. This vol-
ume can be obtained by printing solder 12 mils thick on
the copper pads on overprinting the copper pads
13 mils (0.33 mm) around the pad area with 8 mils of
printed solder. Although this volume is recommended,
tests have been conducted using lower volumes with
successful results. Contact technical support for further
assistance.
Safety Considerations
SMC Modules
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e.,
UL
1950,
CSA
C22.2 No. 950-95, and
VDE
0805
(EN60950, IEC950).
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the
input must meet SELV requirements.
The power module has extra-low v oltage (ELV) outputs
when all inputs are ELV.
The input to these units is to be provided with a maxi-
mum 5 A normal-blow fuse in the ungrounded lead.
SMW Modules
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e.,
UL
1950,
CSA
C22.2 No. 950-95, and
VDE
0805
(EN60950, IEC950).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75 Vdc), for the module's output to be considered
meeting the requirements of safety extra-low voltage
(SELV), all of the following must be true:
■The input source is to be provided with reinforced
insulation from any other hazardous voltages, includ-
ing the ac mains.
■One VI pin and one VO pin are to be grounded, or
both the input and output pins are to be kept floating.
■The input pins of the module are not operator acces-
sible.
■Another SELV reliability test is conducted on the
whole system, as required by the saf ety agencies, on
the combination of supply source and the subject
module to verify that under a single fault, hazardous
voltages do not appear at the module's output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
V
I
(+)
I
I
I
O
SUPPLY
CONTACT
RESISTANCE
CONTACT AND
DISTRIBUTION LOSSES
LOAD
V
I
(–)
V
O1
V
O2
COM
LOAD
η
VOJ COM–[]IOJ
J1=
2
∑
VI+() VI–()–[]II
---------------------------------------------------x100 %=
Tyco Electronics Corp. 9
Advance Data Sheet
May 2000 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Safety Considerations (continued)
SMW Modules (continued)
The power module has extra-low v oltage (ELV) outputs
when all inputs are ELV.
The input to these units is to be provided with a maxi-
mum 5 A normal-blow fuse in the ungrounded lead.
Feature Descriptions
Overcurrent Protection
To provide protection in a fault (output overload) condi-
tion, the unit is equipped with internal current-limiting
circuitry and can endure current limiting for an unlim-
ited duration. At the point of current-limit inception, the
unit shifts from voltage control to current control. If the
output voltage is pulled very low during a severe fault,
the current-limit circuit can exhibit either foldback or
tailout characteristics (output-current decrease or
increase). The unit operates normally once the output
current is brought back into its specified range.
Remote On/Off
Two remote on/off options are available. Positive logic
(if device code suffix “1” is not specified) remote on/off
turns the module on during a logic-high voltage on the
remote ON/OFF pin, and off during a logic low. Nega-
tive logic , de vice code suffix “1,” remote on/off turns the
module off during a logic high and on during a logic low
or when the remote ON/OFF pin is shorted to the VI(–)
pin.
To turn the power module on and off, the user must
supply a switch to control the voltage between the
on/off terminal and the VI(–) terminal (Von/off). The
switch may be an open collector or equivalent (see
Figure 10). A logic low is Von/off = –0.7 V to 1.2 V. The
maximum Ion/off during a logic low is 1 mA. The switch
should maintain a logic-low voltage while sinking 1 mA.
During a logic high, the maximum Von/off generated by
the power module is 10 V. The maximum allowable
leakage current of the switch at Von/off = 10 V is 50 µA.
The module has internal capacitance to reduce noise
at the ON/OFF pin. Additional capacitance is not gen-
erally needed and may degrade the start-up character-
istics of the module.
If not using the remote on/off feature, perform one of
the following:
For negative logic, short the ON/OFF pin to VI(–).
For positive logic, leave the ON/OFF pin open (float-
ing).
8-758(C).a
Figure 10. Remote On/Off Implementation
Output V oltage Adjustment
Output voltage set point adjustment allows the user to
increase or decrease the output voltage set point of a
module. This is accomplished by connecting an exter-
nal resistor between the TRIM pin and either the VO(+)
or V O(–) pins. With an external resistor between the
TRIM and VO(+) pins (Radj-down), the output voltage set
point (VO, adj) decreases (see Figure 11). The following
equation determines the required external resistor
v alue to obtain an output voltage change from V O , nom to
VO, adj:
where Radj-down is the resistance value connected
between TRIM and VO(+), and G, H, and L are defined
in the table below.
8-715(C).j
Figure 11. Circuit Configuration to Decrease
Output V oltage
+
Ion/off
–
Von/off
REMOTE
ON/OFF
VI(+)
VI(–)
Radj-down VO adj,L–()G
VO nom,VO adj,–()
--------------------------------------- H–Ω=
VI(+)
VI(–)
VO1(+)
VO2(–)
TRIM
Radj-down
RLOAD1
COM RLOAD2
1010 Tyco Electronics Corp.
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Feature Descriptions (continued)
Output V oltage Adjustment (continued)
With an external resistor connected between the TRIM
and V O(–) pins (Radj-up), the output voltage set point
(VO, adj) increases (see Figure 12). The following equa-
tion determines the required external resistor value to
obtain an output voltage from VO, nom to VO, adj:
where Radj-up is the resistance value connected
between TRIM and VO(–), and the values of G, H, K,
and L are shown in the following table.
Although the AJ output can be trimmed up, with mis-
matched loads, the output voltage on the lightly loaded
output will increase. The output voltage between the
COM pin and both the VO1(+) and VO2(–) pins must be
kept lower than the minimum overvoltage protection
voltage found in the Feature Specifications table. The
BK and CL modules can only be trimmed down.
8-715(C).k
Figure 12. Circuit Configuration to Increase Output
Voltage
The SMC/SMW-Series Surface-Mount Power Modules
have a fixed current-limit set point. Therefore, as the
output voltage is adjusted down, the available output
power is reduced. In addition, the minimum output cur-
rent is a function of the output voltage. As the output
voltage is adjusted do wn, the minim um required output
current can increase (i.e., minim um pow er is constant).
As the output voltage is adjusted up, the output power
should be held constant (maximum load current
decreases).
Output Overvoltage Protection
The output overvoltage clamp consists of control cir-
cuitry, independent of the primary regulation loop, that
monitors the voltage on the output terminals. This con-
trol loop has a higher voltage set point than the primary
loop (see Feature Specifications table). In a fault condi-
tion, the overvoltage clamp ensures that the output
voltage does not exceed VO, clamp, max. This provides a
redundant voltage-control that reduces the risk of out-
put overvoltage.
Input V oltage T urn-On Adjustment
(Optional)
The input voltage at which the unit turns on can be
adjusted upward to add additional hysteresis between
the points at which the modules turn on and turn off.
This f eature can be useful when the po wer system has
high impedance between the source voltage and the
power unit causing the input to drop as the supply is
turned on. Please consult the factory for application
guidelines and/or a description of how to use this fea-
ture.
Synchronization (Optional)
With external circuitry, the unit is capable of synchroni-
zation from an independent time base with a switching
rate of 256 kHz. Other frequencies may be available;
please consult the factory for application guidelines
and/or a description of the external circuit needed to
use this feature.
Thermal Considerations
The power module operates in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation of the unit.
Heat-dissipating components inside the unit are ther-
mally coupled to the case. Heat is removed by conduc-
tion, convection, and radiation to the surrounding
environment. Proper cooling can be verified by mea-
suring the case temperature. The case temperature
(TC) should be measured at the position indicated in
Figure 13.
GHKL
SMx010AJ 10000 2050 7.5 2.49
SMx010BK 45300 2050 — 2.49
SMx010CL 45300 2050 — 2.49
Radj-up GL
VO adj,L–()K–[]
-----------------------------------------H–
Ω=
VI(+)
VI(–)
VO1(+)
VO2(–)
TRIM
Radj-up
RLOAD1
COM RLOAD2
Advance Data Sheet
May 2000 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Tyco Electronics Corp. 11
Thermal Considerations (continued)
8-1363(C).d
Note: Dimensions are in millimeters and (inches). Pin locations are
for reference only.
Figure 13. SMC and SMW Case Temperature
Measurement Location
Note that the view in Figure 13 is of the surface of the
module. The temperature at this location should not
exceed the maximum case temperature indicated on
the derating curves. The output power of the module
should not exceed the rated power for the module as
listed in the Ordering Information table.
Heat T ransfer Characteristics
Increasing airflow over the module enhances the heat
transfer via convection. Figure 14 shows the maximum
power that can be dissipated by the module without
e xceeding the maximum case temperature v ersus local
ambient temperature (TA) for natural convection
through 3.0 ms–1 (600 ft./min.).
Systems in which these power modules are used typi-
cally generate natural convection airflow rates of
0.25 ms–1 (50 ft./min.) due to other heat-dissipating
components in the system. Therefore, the natural con-
vection condition represents airflow rates of approxi-
mately 0.25 ms–1 (50 ft./min.). Use of Figure 14 is
shown in the following example.
Example
What is the minimum airflow necessary for an
SMW010AJ operating at VI = 48 V, an output current of
±1 A, and a maximum ambient temperature of 84 °C?
Solution:
Given: V I = 48 V, IO = ±1 A (IO, max), TA = 84 °C
Determine PD (Figure 16): PD = 2.50 W
Determine airflow (Figure 14): v = 1 ms–1
(200 ft./min.)
8-1375(C).b
Figure 14. SMC010/SMW010 Forced Convection
Power Derating; Either Orientation
8-1813(C)
Figure 15. SMC010AJ, BK, CL Typical Power
Dissipation vs. Normalized Output
Current at TC = 25 °C
1
25 (0.98)
15
(0.59)
50 60 70 80 90 100 11040 45 55 65 75 85 95 105
0
3.5
1.5
1.0
0.5
2.0
2.5
3.0
MAX AMBIENT TEMPERATURE
,
T
A
(
°C
)
MAXIMUM CASE TEMPERATURE
2.0 ms
–1
(400 ft./min.)
3.0 ms
–1
(600 ft./min.)
1.0 ms
–1
(200 ft./min.)
NATURAL CONVECTION
POWER DISSIPATION, P
D
(W)
0.2 0.6 0.7 0.8 0.9
0.0
2.5
NORMALIZED OUTPUT CURRENT,
I
O1
= I
O2
[(
I
O1
+ I
O2
)
/
(
I
O1
,
max
+ I
O2
,
max
)]
1.5
1.0
2.0
3.5
1.00.1
3.0
0.5
0.4 0.50.3
V
I
= 36 V
V
I
= 24 V
V
I
= 18 V
POWER DISSIPATION, P
D
(W)
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
12 Tyco Electronics Corp.
Thermal Considerations (continued)
Heat T ransfer Characteristics (continued)
8-1817(C)
Figure 16. SMW010AJ, BK, CL Typical Power
Dissipation vs. Normalized Output
Current at TC = 25 °C
Module Derating
The derating curves in Figure 14 were derived by mea-
surements obtained in an experimental apparatus
shown in Figure 17. Note that the module and the
printed-wiring board (PWB) that it is mounted on are
both vertically oriented. The passage has a rectangular
cross section.
8-1126(C).d
Note: Dimensions are in millimeters and (inches).
Figure 17. Experimental Test Setup
Surface-Mount Power Module Solder
Reflow Recommendation
The SMC/SMW-Series surface-mount power modules
are constructed with SMT (surface-mount technology)
components and assembly guidelines. Such large
mass/low thermal resistance devices heat up slower
than typical SMT components. It is recommended that
the customer review data sheets in order to customize
the solder reflow profile for application board assembly.
It is recommended that a reflow profile m ust be char ac-
terized for the module on the application board assem-
bly. The solder paste type, component, and board
thermal sensitivity must be considered in order to form
the desired fused solder fillet. The power module leads
are plated with tin (Sn) solder to prevent corrosion and
ensure good solderability. Typically, the eutectic solder
melts at 183 °C , wets the land, and subsequently wic ks
the device lead. Sufficient time must be allocated to
fuse the plating on the lead and ensure a reliable sol-
der joint.
There are several types of SMT reflow technologies
currently used in the industry. These surface-mount
power modules can be adequately soldered using nat-
ural convection, IR (radiant infrared), convection/IR, or
forced convection technologies. The surface-mount
power module solder reflow profile is established by
accurately measuring the module gull-wing lead sur-
face temperature.
0.2 0.4 0.6 0.8 1.0
0.0
2.5
1.5
1.0
2.0
0.0
3
.
0
0.5
NORMALIZED OUTPUT CURRENT,
IO1 = IO2 [(IO1 + IO2)/(IO1, max + IO2, max)]
VI = 36 V
VI = 48 V
VI = 60 V
POWER DISSIPATION, P D (W)
VI = 75 V
AIR VELOCITY
AND AMBIENT
TEMPERATURE
MEASURED
BELOW THE
MODULE
AIRFLOW
13 (0.5)
FACING PWB
MODULE
76 (3.0)
PWB
Tyco Electronics Corp. 13
Advance Data Sheet
May 2000 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Surface-Mount Power Module Solder Reflow Recommendation (continued)
The maximum oven temperature and conveyor speed should prevent the lead temperature from exceeding the
maximum thermal profile limits as shown in Figure 18. The lead temperature during a typical reflow profile is sho wn
in Figure 19. Failure to observe these maximum lead temperatures and duration may result in permanent damage
to the power module.
Relative temper atures of the module gull-wing leads vary according to many factors , including surrounding compo-
nents, internal paths, and connecting paths. Typically, pin 1 is a good choice for a conservativ e measurement since
it is usually connected to heavy paths for current conduction which also tend to heat the lead faster. These vari-
ables make it difficult to compare various types of surface-mount modules; however, based upon a sampling, the
unit has been found to be more robust during temperature profiles compared with other SMT modules availab le in
the industry at the time of this publication.
8-2275(C)
Figure 18. Maximum Thermal Profile Limits
8-2274(C).a
Figure 19. Typical Reflow Soldering Profile
4 C/s MAX
90 s MAX
6 MINUTES MAX
230 C MAX
(PEAK)
183 C
150 C
120 C
TIME (s)
GULL-WING LEAD
TEMPERATURE ( C)
2:30 5:00 7:30 10:00
MELTING POINT
(60/40 SOLDER)
250
200
150
100
50
TIME
(
min.
)
GULL-WING LEAD
TEMPERATURE ( C)
14 Tyco Electronics Corp.
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Packaging Information
Vacuum Formed Trays
The SMC/SMW -Series surf ace-mount power modules are deliv ered in plastic v acuum f ormed tra ys (see Figure 20)
that allow automated placement of the modules via a surface-mount pick and place machine.
8-2263(C)
Note: Dimensions are in millimeters and (inches).
Figure 20. Vacuum Formed Tray
Specifications:
■Material: PVC (ESD protected)
■Capacity: 24 pieces/tray
■Weight: 90 g (3.2 oz.)
216 (8.50)
19
(0.75)
213 (8.37)
212 (8.33)
184 (7.25)
137 (5.40)
90 (3.55)
43 (1.70)
12 (0.48)
4 (0.16)
0.00
1 1 1 1 1 1
848116547 3 (0.11)
LS
13
(0.51)
381 (15.00)
165 (6.50)
378 (14.89)
0.00
1 1 1 1 1 1
1 1 1 1 1 1
1 1 1 1 1 1
45 (1.78)
105 (4.14)
225 (8.86)
285 (11.22)
345 (13.58)
Tyco Electronics Corp. 15
Advance Data Sheet
May 2000 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Outline Diagram
Dimensions are in millimeters and (inches). See next page for pin descriptions.
Tolerances: x.x ± 0.5 mm (0.020 in.); x.xx ± 0.4 mm (0.015 in.).
T op View
Side Views
Bottom View
8-1507(C).e
Lucent
PATENT PENDING
MADE IN USA
SMW010CL
DC-DC Power Module
IN:DC 36-75V, 0.6A OUT1:DC 15V,0.33A
1
49.5 (1.95)
30.23
(1.19)
MAX OUT2:DC –15V,0.33A
TUV Rheinland
VDE
1.8
(
0.07
)
0.30 ± 0.1
(0.012 ± 0.004)
0.25
(0.010)
9.7
(0.38)
2.0
(0.08)
NO-SLIDE MECHANICAL
RETAINING PINS,
2 PLACES
1.75
(0.069)
38.51 (1.52)
33.50 (1.32)
13.49 (0.53)
35.3
(1.39)
2.5
(0.10)
3.51 (0.138)
43.48 (1.71)
12.07
(0.475)
47.78
(1.881)
8.48 (0.33)
1.27
(0.050)
DIA
16 Tyco Electronics Corp.
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Recommended Hole Pattern
Component-side footprint. Dimensions are in millimeters and (inches).
Tolerances: x.x ± 0.5 mm (0.020 in.); x.xx ± 0.4 mm (0.015 in.).
CAUTION: Care must be taken to ensure the board in the periphery of the footprint is flat.
8-1507(C).e
* The recommended solder paste volume is 2.8 cubic mm (170,000 cubic mils/pin). See Design Considerations section.
†N/C may be used for internal module connections and should not be connected by the customer.
Pin Function Pin Function
1VO1(+) 12 VI(+)
2 COM 11 VI(–)
3VO2(–) 10 N/C†
4 TRIM 9 SYNC (optional)
5 N/C†8 ON/OFF
6 N/C†7 TURN-ON ADJUSTMENT (optional)
3.02
(0.119)
30.0 (1.18)
3.3
(0.13)
1.6
(0.063)
SLOT
4.1
(0.16)
5.0
(0.197)
2.8
(0.11)
FOOTPRINT
PERIPHERY
13.11
(0.516)
36.8
(1.45)
31.2
(1.23)
1.6 (0.063) DIA PILOT HOLE,
REQUIRED FOR GUIDE PIN,
1 PLACE
PIN 1 PAD*
43.0 (1.693)
10.0
(0.39)
35.0 (1.38)
40.0 (1.57)
Tyco Electronics Corp. 17
Advance Data Sheet
May 2000 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Ordering Information
Table 6. Device Codes
* SMC codes are available upon request only. Contact the factory for minimum order size and availability.
Optional features may be ordered using the device code suffixes shown below. The feature suffixes are listed
numerically in descending order. Please contact your Tyco Electronics’ Account Manager or Field Application Engi-
neer for pricing and availability.
Table 7. Device Options
Input V oltage Output V oltages Output Power Device Code Comcode
24 V 5 V, –5 V 10 W SMC010AJ* TBD
24 V 12 V, –12 V 10 W SMC010BK* TBD
24 V 15 V, –15 V 10 W SMC010CL* TBD
48 V 5 V, –5 V 10 W SMW010AJ 108611047
48 V 12 V, –12 V 10 W SMW010BK 108729781
48 V 15 V, –15 V 10 W SMW010CL 108560954
Option Device Code Suffix
Negative logic remote on/off 1
18 Tyco Electronics Corp.
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Notes
Tyco Electronics Corp. 19
Advance Data Sheet
May 2000 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Notes
Advance Data Sheet
May 2000
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Inputs, 10 W
SMC/SMW Dual-Output Series Surface-Mount Power Modules:
Printed on
Recycled Paper
Tyco Electronics Power Systems, Inc.
3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819 FAX: +1-888-315-5182
(Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900
http://power.tycoeleectronics.com
Tyco Electronics Corportation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
No rights under any patent accompany the sale of any such product(s) or information.
© 2001 Tyco Electronics Corporation, Harrisburg, PA. All International Rights Reserved.
Printed in U.S.A.
May 2000
DS00-002EPS
