Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called TAIYO YUDEN s official sales channel ). It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. 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Should you have any question or inquiry on this matter, please contact our sales staff. 13 MULTILAYER CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITRS WAVE REFLOW PARTS NUMBER J M K 3 1 6 CERAMIC CAPACITORS Rated voltage Code P A J L E T G U H Q S Series name Code M V W B J 1 0 6 M L T End termination Code K R Rated voltageVDC 2.5 4 6.3 10 16 25 35 50 100 250 630 A Dimensions LxWmm 042 0.4x0.2 063 0.6x0.3 1.0x0.5 105 0.52x1.0 1.6x0.8 107 0.8x1.6 2.0x1.25 212 1.25x2.0 316 3.2x1.6 325 3.2x2.5 432 4.5x3.2 Note : LW reverse typeWK only Type Lmm Standard Wmm Standard 0.60.05 1.00.10 1.60.15/0.05 0.30.05 0.50.10 0.80.15/0.05 212 2.00.15/0.05 1.250.15/0.05 316 3.20.20 1.250.20 325 105 3.20.30 1.00.15/0.05 2.50.30 0.50.15/0.05 107 1.60.20/0 0.80.20/0 212 2.00.20/0 1.250.20/0 316 105 3.20.30 1.60.30 1.00.20/0 0.50.20/0 Note: P.6 Standard external dimensions Temperature characteristics code High dielectric typeExcluding Super low distortion multilayer ceramic capacitorCFCAPTM Applicable Temperature Code Ref. Temp. Capacitance change standard range JIS B 25 85 20 10 EIA X5R 55 85 25 15 B7 EIA X7R 55125 25 15 C6 EIA X6S 55105 25 22 C7 EIA X7S 55125 25 22 LD() EIA X5R 55 85 25 15 BJ JIS F 25 85 20 EIA Y5V 30 85 25 Note : .LD Low distortion high value multilayer ceramic capacitor F EIAinch 01005 0201 0402 0204 0603 0306 0805 0508 1206 1210 1812 Tmm Standard 0.30.05 0.50.10 0.80.15/0.05 0.450.05 0.850.10 1.250.15/0.05 0.850.10 1.60.20 2.50.30 0.50.15/0.05 0.450.05 0.80.20/0 0.850.10 1.250.20/0 1.60.30 0.50.20/0 = Blank space B C End termination Plated High Reliability Application DimensionLxW Series name Multilayer ceramic capacitor Multilayer ceramic capacitor for high frequency LW reverse type multilayer capacitor Dimension tolerance Code Type ALL 063 105 107 Blank space 30/80 2282 Capacitance Tolerance tolerance code 10 K 20 M 10 K 20 M 10 K 20 M 10 K 20 M 10 K 20 M 10 K 20 M 80/20 Z 80/20 Z = Blank space This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 4 13 Temperature compensating type Applicable Code standard JIS CH CH CJ CK UK SL Ref. Temp. C0H JIS EIA JIS EIA JIS CJ C0J CK C0J UJ EIA U2J JIS EIA JIS UK U2K S Capacitance tolerance Code B C D F J K M Z 0120ppm/ 0.25pF C 0250ppm/ 0.25pF C 750120ppm/ 0.25pF 0.5pF 5 C D J 750250ppm/ 0.5pF C +3501000ppm/ 5 J 060ppm/ 25 55125 55125 55125 55125 55125 55125 20 25 20 25 20 25 20 25 20 Series code Super low distortion multilayer ceramic capacitorCFCAPTMonly Code Series code SD Standard Nominal capacitance Code example 0R5 010 100 101 102 103 104 105 106 107 Note : RDecimal point Tolerance code B C D F J K 20 55125 EIA Capacitance tolerance 0.1pF 0.25pF 0.5pF 1pF 5 10 Capacitance change Nominal capacitance 0.5pF 1pF 10pF 100p 1,000pF 10,000pF 0.1F 1.0F 10F 100F Thickness Code C D P T K V W A D F G L N Y M Thicknessmm 0.2 0.2(Temperature compensating of 042type) 0.3 0.45 0.5 0.8 0.85(212type or more) 1.15 1.25 1.6 1.9 2.0 max 2.5 Special code Code Capacitance tolerance 0.1pF 0.25pF 0.5pF 1pF 5 10 20 80/20 CERAMIC CAPACITORS UJ Temperature range Packaging Code F T Special code Standard Packaging 178mm Taping 2mm pitch 178mm Taping 4mm pitch 178mm Taping 4mm pitch, 1000 pcs/reel 325 typeThickness code M 178mm Taping1mm pitch042type only P W Internal code Code Internal code Standard This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 13 5 STANDARD EXTERNAL DIMENSIONS Type( EIA ) CERAMIC CAPACITORS e LW reverse type Dimension [mm] T MK04201005 0.40.02 0.20.02 0.20.02 MK0630201 0.60.03 0.30.03 0.30.03 MK1050402 1.00.05 0.50.05 VK1050402 WK1050204 1.00.05 0.520.05 0.50.05 1.00.05 MK1070603 1.60.10 0.80.10 MR1070603 WK1070306 1.60.10 0.80.10 0.80.10 1.60.10 MK2120805 2.00.10 1.250.10 MR2120805 WK2120508 2.00.10 1.250.15 1.250.10 2.00.15 MK3161206 3.20.15 1.60.15 MR3161206 3.20.15 1.60.15 MK3251210 3.20.30 2.50.20 MR3251210 3.20.30 2.50.20 MK4321812 4.50.40 Note : . LW reverse type, *1.Thickness code 3.20.30 0.20.02 0.30.03 0.50.05 0.50.05 0.30.05 0.450.05 0.80.10 0.80.10 0.50.05 0.450.05 0.850.10 1.250.10 1.250.10 0.850.1 0.850.10 1.150.10 1.250.10 1.60.20 1.60.20 0.850.10 1.150.10 1.90.20 1.9+0.1/-0.2 2.50.20 1.90.20 2.50.20 2.50.20 *1 C D P T C P V W P K A K D G D G L D F N Y M N M M e 0.10.03 0.150.05 0.250.10 0.250.10 0.180.08 0.350.25 0.10.6 0.250.15 0.50.25 0.250.75 0.30.2 0.5+0.35/-0.25 0.250.85 0.60.3 0.30.9 0.90.6 STANDARD QUANTITY Type EIAinch Dimension 042 01005 0.2 063 0201 0.3 105 0402 0.5 0204 107 0603 0306 212 0805 0508 316 325 0.2 0.3 1206 1210 432 1812 Note : .LW Reverse typeWK 0.30 0.45 0.8 0.50 0.45 0.85 1.25 0.85 0.85 1.15 1.25 1.6 0.85 1.15 1.9 2.0 max 2.5 2.5 Code C D P T C P V W P K A V K D G D D F G L D F N Y M M Standard quantitypcs Paper tape Embossed tape 40000 15000 20000 15000 10000 4000 4000 4000 4000 4000 3000 3000 2000 2000 500T1000P 500 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 6 13 PARTS NUMBER Part number 1 Part number 2 SMK325 B7223[]N-T SMK325 B7333[]N-T SMK325 B7473[]N-T Rated voltage [V] Capacitance [F] Capacitance tolerance [] tan [] 22000 p 33000 p 47000 p 1020 1020 1020 2.5 2.5 2.5 Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] X7R 0.1 1020 3.5 Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] 0.47 1 1.5 2.2 0.1 0.22 0.33 0.47 47000 68000 0.1 1020 1020 1020 1020 1020 1020 1020 1020 1020 1020 1020 3.5 3.5 3.5 3.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 Capacitance [F] Capacitance tolerance [] tan [] 0.47 1 1.5 2.2 0.1 0.22 0.33 0.47 47000 68000 0.1 1020 1020 1020 1020 1020 1020 1020 1020 1020 1020 1020 3.5 3.5 3.5 3.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 Capacitance [F] Capacitance tolerance [] tan [] 0.1 0.22 0.47 0.1 0.47 1 0.22 20 20 20 20 20 20 20 5 10 10 5 10 10 10 Capacitance [F] Capacitance tolerance [] tan [] 0.1 0.1 0.22 0.1 0.22 0.47 0.22 0.47 1 20 20 20 20 20 20 20 20 20 5 5 10 5 10 10 10 10 10 Capacitance [F] Capacitance tolerance [] tan [] 0.1 0.22 0.47 1 2.2 1 2.2 4.7 10 20 20 20 20 20 20 20 20 20 5 5 5 10 10 10 10 10 10 Temperature characteristics X7R X7R X7R 630 HALT Rated voltage x 120 120 120 Thickness [mm] *3 1.90.20 1.90.20 1.90.20 Soldering R:Reflow W:Wave R R R Temperature Characteristic B7 : X7R 1.15mm thicknessF Part number 1 Part number 2 HMK325 B7104[]F-T Rated voltage [V] 100 HALT Rated voltage x 200 Thickness [mm] *3 1.150.10 Soldering R:Reflow W:Wave R 432TYPE Temperature Characteristic BJ : B/X5R 2.5mm thicknessM Part number 1 Part number 2 CERAMIC CAPACITORS HMK432 BJ474[]M-T HMK432 BJ105[]M-T HMK432 BJ155[]M-T HMK432 BJ225[]M-T QMK432 BJ104[]M-T QMK432 BJ224[]M-T QMK432 BJ334[]M-T QMK432 BJ474[]M-T SMK432 BJ473[]M-T SMK432 BJ683[]M-T SMK432 BJ104[]M-T Rated voltage [V] 100 250 630 B B B B B B B B B B B X5R*1 *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R p p HALT Rated voltage x 200 200 200 200 150 150 150 150 120 120 120 Thickness*3 [mm] 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 Soldering R:Reflow W:Wave R R R R R R R R R R R Temperature Characteristic B7 : X7R 2.5mm thicknessM Part number 1 Part number 2 HMK432 B7474[]M-T HMK432 B7105[]M-T HMK432 B7155[]M-T HMK432 B7225[]M-T QMK432 B7104[]M-T QMK432 B7224[]M-T QMK432 B7334[]M-T QMK432 B7474[]M-T SMK432 B7473[]M-T SMK432 B7683[]M-T SMK432 B7104[]M-T Rated voltage [V] 100 250 630 Temperature characteristics X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R p p HALT Rated voltage x 200 200 200 200 150 150 150 150 120 120 120 Thickness [mm] *3 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 2.50.20 Soldering R:Reflow W:Wave R R R R R R R R R R R LW Reversal ecoupling Capacitor LWC TM ) 105TYPE Temperature Characteristic BJ : X5R 0.3mm thicknessP Part number 1 Part number 2 TWK105 BJ104MP-F EWK105 BJ224MP-F LWK105 BJ474MP-F JWK105 BJ104MP-F JWK105 BJ474MP-F JWK105 BJ105MP-F AWK105 BJ224MP-F Rated voltage [V] 25 16 10 6.3 4 Temperature characteristics X5R X5R X5R *1 X5R *1 X5R X5R X5R HALT Rated voltage x 150 150 150 150 150 150 150 Thickness [mm] *3 0.30.05 0.30.05 0.30.05 0.30.05 0.30.05 0.30.05 0.30.05 Soldering R:Reflow W:Wave R R R R R R R Temperature Characteristic C6 : X6S , C7 : X7S 0.3mm thicknessP Part number 1 Part number 2 EWK105 C6104MP-F LWK105 C7104MP-F LWK105 C6224MP-F JWK105 C7104MP-F JWK105 C7224MP-F JWK105 C6474MP-F AWK105 C6224MP-F AWK105 C6474MP-F AWK105 C6105MP-F Rated voltage [V] 16 10 6.3 4 Temperature characteristics X6S X7S X6S X7S X7S X6S X6S X6S X6S HALT Rated voltage x 150 150 150 150 150 150 150 150 150 Thickness*3 [mm] 0.30.05 0.30.05 0.30.05 0.30.05 0.30.05 0.30.05 0.30.05 0.30.05 0.30.05 Soldering R:Reflow W:Wave R R R R R R R R R 107TYPE Temperature Characteristic BJ : X5R 0.5mm thicknessV Part number 1 TWK107 BJ104MV-T EWK107 BJ224MV-T EWK107 BJ474MV-T LWK107 BJ105MV-T LWK107 BJ225MV-T JWK107 BJ105MV-T JWK107 BJ225MV-T JWK107 BJ475MV-T AWK107 BJ106MV-T Part number 2 Rated voltage [V] 25 16 10 6.3 4 Temperature characteristics X5R*1 *1 X5R *1 X5R X5R X5R *1 X5R X5R X5R X5R HALT Rated voltage x 150 150 150 150 150 150 150 150 150 Thickness [mm] *3 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 Soldering R:Reflow W:Wave R R R R R R R R R This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 24 13 PARTS NUMBER Temperature Characteristic B7 : X7R , C6 : X6S , C7 : X7S 0.5mm thicknessV Part number 1 Part number 2 TWK107 B7104MV-T EWK107 B7224MV-T EWK107 B7474MV-T JWK107 C7105MV-T AWK107 C7225MV-T AWK107 C6475MV-T PWK107 C6106MV-T Rated voltage [V] Temperature characteristics 25 X7R X7R X7R X7S X7S X6S X6S 16 6.3 4 2.5 Capacitance [F] Capacitance tolerance [] tan [] 0.1 0.22 0.47 1 2.2 4.7 10 20 20 20 20 20 20 20 5 5 5 10 10 10 10 Capacitance tolerance [] tan [] 1020 20 1020 20 20 10 10 10 10 10 Capacitance tolerance [] tan [] 1020 1020 20 20 5 10 10 10 HALT Rated voltage x 150 150 150 150 150 150 150 Thickness [mm] *3 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 Soldering R:Reflow W:Wave R R R R R R R 212TYPE Temperature Characteristic BJ : X5R 0.85mm thicknessD Part number 1 Part number 2 Rated voltage [V] Temperature characteristics X5R X5R X5R X5R X5R 10 6.3 4.7 10 4.7 10 22 HALT Rated voltage x 150 150 150 150 150 Thickness*3 [mm] 0.850.10 0.850.10 0.850.10 0.850.10 0.850.10 Soldering R:Reflow W:Wave R R R R R Temperature Characteristic B7 : X7R , C6 : X6S 0.85mm thicknessD Part number 1 TWK212 B7225[]D-T EWK212 C6475[]D-T LWK212 C6106MD-T AWK212 C6226MD-T Part number 2 Rated voltage [V] 25 16 10 4 Temperature characteristics X7R X6S X6S X6S Capacitance [F] 2.2 4.7 10 22 HALT Rated voltage x 150 150 150 150 Thickness [mm] *3 0.850.10 0.850.10 0.850.10 0.850.10 Soldering R:Reflow W:Wave R R R R CERAMIC CAPACITORS 25 16 TWK212 BJ475[]D-T EWK212 BJ106MD-T LWK212 BJ475[]D-T LWK212 BJ106MD-T JWK212 BJ226MD-T Capacitance [F] This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 13 25 Multilayer Ceramic Capacitors PACKAGING Minimum Quantity Taped package Type(EIA) MK042(01005) MK063(0201) WK105(0204) MK105(0402) VK105(0402) MK107(0603) WK107(0306) MR107(0603) MK212(0805) WK212(0508) MR212(0805) MK316(1206) MR316(1206) MK325(1210) MR325(1210) MK432(1812) Note : LW Reverse type. Thickness mm 0.2 0.3 0.3 0.2 0.3 0.5 0.5 0.45 0.5 0.8 0.45 0.85 1.25 0.85 1.15 1.25 1.6 0.85 1.15 1.9 2.0max. 2.5 2.5 code C, D P, T P C P V W K V A K D G D F G L D F N Y M M Standard quantity [pcs] Paper tape Embossed tape 40000 15000 10000 20000 15000 10000 4000 4000 4000 4000 3000 3000 2000 500T, 1000P 500 Taping material No bottom tape for pressed carrier tape Card board carrier tape Embossed tape Chip filled This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-01 Representative taping dimensions Paper Tape8mm wide Pressed carrier tape 2mm pitch Type(EIA) Chip Cavity 0.37 0.67 MK063(0201) WK105(0204) 0.65 1.15 MK105(0402) *1 C MK105(0402) *1 P Note *1 Thickness, C0.2mm ,P0.3mm. LW Reverse type. Insertion Pitch 2.00.05 Tape Thicknes T1 0.45max. 0.42max. 0.4max. 0.45max. 0.3max. 0.42max. Unitmm Punched carrier tape 2mm pitch Type(EIA) MK105 (0402) VK105 (0402) Chip Cavity Insertion Pitch Tape Thickness 0.65 1.15 2.00.05 0.8max. Unit Punched carrier tape 4mm pitch Type(EIA) Chip Cavity Insertion Pich MK107(0603) WK107(0306) 1.0 1.8 MR107(0603) 4.00.1 MK212(0805) 1.65 2.4 WK212(0508) MK316(1206) 2.0 3.6 NoteTaping size might be different depending on the size of the product. LW Reverse type. Tape Thickness 1.1max. 1.1max. Unitmm This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-01 Embossed tape4mm wide Type(EIA) MK042(01005) Chp Cavity 0.23 0.43 Insertion Pitch 1.00.02 Tape Thickness K 0.5max. T 0.25max. Unitmm Embossed tape8mm wide Type(EIA) WK107(0306) MK212(0805) MR212(0805) MK316(1206) MR316(1206) MK325(1210) MR325(1210) Note LW Reverse type. Chip Cavity 1.0 1.8 1.65 2.4 2.0 3.6 2.8 3.6 Insertion Pitch 4.00.1 Tape Thickness K 1.3max. T 0.250.1 3.4max. 0.6max. Unitmm Embossed tape12mm wide Type(EIA) MK432(1812) Chip Cavity 3.7 4.9 Insertion Pitch 8.00.1 Tape Thickness K 4.0max. T 0.6max. Unitmm Trailer and Leader This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-01 Reel size A 1782.0 B 50min. C 13.00.2 D 21.00.8 4mm wide tape 8mm wide tape 12mm wide tape T 1.5max. 2.5max. 2.5max. W 51.0 101.5 141.5 Unitmm E 2.00.5 R 1.0 Top Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. Bulk Cassette The exchange of individual specification is necessary. Please contact Taiyo Yuden sales channels. Unitmm This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-01 Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and High Reliability Application Multilayer Ceramic Capacitors are noted separately. Multilayer Ceramic Capacitors RELIABILITY DATA 1.Operating Temperature Range Temperature CompensatingClass1 Standard High Frequency Type 55 to 125 Specification Temperature Range B 25 to 85 BJ X5R 55 to 85 B7 X7R 55 to 125 C6 X6S 55 to 105 C7 X7S 55 to 125 LD() X5R 55 to 85 F 25 to 85 F Y5V 30 to 85 Note: LD Low distortion high value multilayer ceramic capacitor Specified Value High Permittivity Class2 2. Storage Conditions Temperature CompensatingClass1 Standard High Frequency Type 55 to 125 Specification Temperature Range B 25 to 85 BJ X5R 55 to 85 B7 X7R 55 to 125 C6 X6S 55 to 105 C7 X7S 55 to 125 LD() X5R 55 to 85 F 25 to 85 F Y5V 30 to 85 Note: LD Low distortion high value multilayer ceramic capacitor Specified Value High Permittivity Class2 3. Rated Voltage Specified Value Temperature CompensatingClass1 Standard 50VDC, 25VDC, 16VDC High Frequency Type High Permittivity Class2 50VDC, 16VDC 50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC 4. Withstanding Voltage Between terminals Specified Value Temperature CompensatingClass1 Standard High Frequency Type No breakdown or damage High Permittivity Class2 Test Methods and Remarks Class 1 Rated voltax3 Applied voltage Duration Charge/discharge current Class 2 Rated voltagex2.5 1 to 5 sec. 50mA max. 5. Insulation Resistance Specified Value Temperature CompensatingClass1 Standard High Frequency Type High Permittivity Class2 Note 1 Test Methods and Remarks Applied voltage Duration Charge/discharge current 10000 M min. C0.047F : 10000 M min. C0.047F : 500MF : Rated voltage : 605 sec. : 50mA max. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 6. Capacitance Tolerance Specified Value Temperature CompensatingClass1 Standard C U SL 0.2pFC5pF 0.2pFC10pF C10pF : 0.25pF : 0.5pF : 5% or 10% High Frequency Type CH RH 0.3pFC2pF C2pF : 0.1pF : 5% BJ, B7, C6, C7, LD() : 10% or 20%, F : 80/20% Note: LD Low distortion high value multilayer ceramic capacitor High Permittivity Class2 Test Methods and Remarks Standard Preconditioning Measuring frequency Measuring voltage Note Bias application Class 1 High Frequency Type None 1Hz10% 0.5 to 5Vrms Class 2 C10F Thermal treatment at 150 1kHz10% 10.2Vrms one C10F for 1hr Note 2 12010Hz 0.50.1rms 7. Q or Dissipation Factor Specified Value Temperature CompensatingClass1 Standard High Frequency Type High Permittivity Class2 Note 1 C30pF : Q40020C C30pF : Q1000 CNominal capacitance Refer to detailed specification BJ, B7, C6, C72.5% max., Class 1 High Frequency Type None 1Hz10% 1GHz 0.5 to 5Vrms Standard Test Methods and Remarks Preconditioning Measuring frequey Measuring voltage Note 1 Bias application High Frequency Type Measuring equipment Measuring jig F7% max. Class 2 C10F C10F Thermal treatment at 150 for 1hr Note 2 1Hz10% 12010Hz 10.2Vrms 0.50.1Vrms None : HP4291A : HP16192A 8. Temperature Characteristic Without voltage application Temperature Characteristic ppm/ C : 0 CH, CJ, CK Standard Temperature CompensatingClass1 U : 750 SL High Frequency Type UJ, UK : 350 to 1000 Temperature Characteristic ppm/ C : 0 CH R : 220 RH Specified Value Tolerance ppm/ H : 60 J : 120 K : 250 Tolerance ppm/ H : 60 Capacitance Reference Temperature Range change temperature 10% 20 25 to 85 15% 25 55 to 85 15% 25 55 to 125 22% 25 55 to 105 22% 25 55 to 125 15% 25 55 to 85 30/80% 20 25 to 85 22/82% 25 30 to 85 distortion high value multilayer ceramic capacitor Specification B X5R B7 X7R C6 X6S C7 X7S LD() X5R F F Y5V Note : LD Low BJ High Permittivity Class2 Class 1 Capacitance at 20 and 85 shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. C85C20 x106ppm/ T65 C20xT Test Methods and Remarks Class 2 Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. Step BF X5RX7RX6SX7SY5V 1 Minimum operating temperature 2 20 25 3 Maximum operating temperature This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 CC2 x100% C2 C Capacitance in Step 1 or Step 3 C2 Capacitance in Step 2 9. Deflection Standard Temperature CompensatingClass1 High Frequency Type Specified Value Appearance Cpaitance change : No abnormality : Within0.5 pF : No abnormality : Within 12.5%BJ, B7, C6, C7,LD() Within 30%F Note: LD Low distortion high value multilayer ceramic capacitor Multilayer Ceramic Capacitors 105 Type The other types Glass epoxy-resin substrate 0.8mm 1.6mm 1mm 10 sec. 105 Type thickness, C 0.2mm ,P 0.3mm. 042, 063, Board Thickness Warp Duration : No abnormality : Within 5% or 0.5 pF, whichever is larger. Appearance Capacitance change High Permittivity Class2 Test Methods and Remarks Appearance Capacitance change Capacitance measurement shall be conducted with the board bent 10. Body Strength Specified Value Temperature CompensatingClass1 Standard High Frequency Type High Permittivity Class2 Test Methods and Remarks No mechanical damage. High Frequency Type Applied force : 5N Duration : 10 sec. 11. Adhesive Strength of Terminal Electrodes Specified Value Temperature CompensatingClass1 Standard High Frequency Type No terminal separation or its indication. High Permittivity Class2 Test Methods and Remarks Applied force Duration Multilayer Ceramic Capacitors 042, 063 Type 105 Type or more 2N 5N 305 sec. 12. Solderability Specified Value Temperature CompensatingClass1 Standard High Frequency Type At least 95% of terminal electrode is covered by new solder. High Permittivity Class2 Test Methods and Remarks Solder type Solder temperature Duration Eutectic solder H60A or H63A 2305 Lead-free solder Sn-3.0Ag-0.5Cu 2453 41 sec. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 13. Resistance to Soldering Standard Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormlty : Within 2.5% or 0.25pF, whichever is larger. : Initial value : Initial value between terminals : No abnormality High Frequency Type Appearance Capacitancecange Q Insulation resistance Withstanding voltage : No abnormality : Within 2.5% : Initial value : Initial value between terminals : No abnormality Temperature CompensatingClass1 Specified Value Appearance Capactace change High Permittivity Class2 : No abnormality : Within 7.5%BJ, B7, C6, C7, LD() Within 20%F Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage between terminals: No abnormality Note: LD Low distortion high value multilayer ceramic capacitor Note 1 lss 1 042, 063 Type 105 Type Preconditioning Preheating Test Methods and Remarks None Solder temp. Duration Recovery 2705 30.5 sec. 6 to 24 hrs Standard condition Noe 5 042063 Type Preconditioning Preheating 80 to 100, 2 to 5 min. 150 to 200, 2 to 5 min. 150, 1 to 2 min. 150, 1 to 2 min. Solder temp. Duration Recovery Class 2 105, 107, 212 Type 316, 325 Type Thermal treatment at 150 for 1 hr Note 2 80 to 100, 2 to 5 min. 80 to 100, 5 to 10 min. 150 to 200, 2 to 5 min. 150 to 200, 5 to 10 min. 2705 30.5 sec. 242 hrs Standard condition Note 5 14. Temperature Cycle (Thermal Shock Standard Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within 2.5% or 0.25pF, whichever is larger. : Initial value : Initial value between terminals : No abnormality High Frequency Type Appearance Capacitance change Q Insulation resistance Withstanding voltage : No abnormality : Within 0.25pF : Initial value : Initial value between terminals : No abnormality Temperature CompensatingClass1 Specified Value Appearance Capacitance change High Permittivity Class2 : No abnormality : Within 7.5% BJ, B7, C6, C7, LD() Within 20% F Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage between terminals : No abnormality Note: LD Low distortion high value multilayer ceramic capacitor Note 1 Class 1 Preconditioning Test Methods and Remarks 1 cycle Number of cycles Recovery Class 2 Thermal treatment at 150 for 1 hr Note 2 None Step 1 2 3 4 Temperature Minimum operating temperature Normal temperature Maximum operating temperature Normal temperature Timemin. 303 2 to 3 303 2 to 3 5 times 6 to 24 hrs Standard condition Note 5 242 hrs Standard condition Note 5 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 15. Humidity Steady State Appearance Capacitance change Q Standard Temperature CompensatingClass1 Specified Value High Frequency Type Insulation resistance : No abnormality : Within 5% or 0.5pF, whichever is larger. : C10pF : Q20010C 10C30pF : Q2752.5C C30pF:Q350CNominal capacitance : 1000 M min. Appearance Capacitance change Insulation resistance : No abnormality : Within 0.5pF, : 1000 M min. Appearance Capacitance change High Permittivity Class2 : No abnormality : Within 12.5% BJ, B7, C6, C7, LD() Within 30% F Dissipation factor : 5.0% max.BJ, B7, C6, C7, LD() 11.0% max.F Insulation resistance : 50 MF or 1000 M whichever is smaller. Note: LD Low distortion high value multilayer ceramic capacitor Note 1 Class 1 Standard Test Methods and Remarks Preconditioning Temperature Humidity Duration Recovery Class 2 All items Thermal treatment at 150 for 1 hr Note 2 402 90 to 95%RH 50024/0 hrs 242 hrs Standard condition Note 5 High Frequency Type None 402 602 90 to 95%RH 50024/0 hrs 6 to 24 hrs Standard condition Note 5 16. Humidity Loading Appearance Capacitance change Q Standard Insulation resistance Temperature CompensatingClass1 Appearance Capacitance change High Frequency Type Specified Value : No abnormality : Within 7.5% or 0.75pF, whichever is larger. : C30pFQ10010C/3 C30pFQ200 CNominal capacitance : 500 M min. Insulation resistance : No abnormality : C2pFWithin 0.4 pF C2pFWithin 0.75 pF CNominal capacitance : 500 M min. Appearance Capacitance change High Permittivity Class2 Note 1 90 to 95%RH 50024/0 hrs Rated voltage Class 2 All items Voltage treatment Rated voltage are applied for 1 hour at 40 Note 3 402 90 to 95%RH 50024/0 hrs Rated voltage 50mA max. 50mA max. 6 to 24 hrs Standard condition Note 5 242 hrsStandard condition Note 5 Standard Preconditioning Test Methods and Remarks Temperature Humidity Duration Applied voltage Charge/discharge current Recovery : No abnormality : Within 12.5% BJ, B7, C6, C7, LD() Within 30% F Dissipation factor : 5.0% max. BJ, B7, C6, C7, LD() 11.0% max. F Insulation resistance : 25 MF or 500 M, whichever is smaller. Note: LD Low distortion high value multilayer ceramic capacitor Class 1 High Frequency Type None 402 602 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 17. High Temperature Loading Appearance Capacitance change Q Standard Temperature CompensatingClass1 Specified Value High Frequency Type Insulation resistance : No abnormality : Within 3% or 0.3pF, whichever is larger. : C10pF Q20010C 10C30pFQ2752.5C C30pF Q350CNominal capacitance : 1000 M min. Appearance Capacitance change Insulation resistance : No abnormality : Within 3% or 0.3pF, whichever is larger. : 1000 M min. Appearance Capacitance change High Permittivity Class2 Note 1 Maximum operating temperature 100048/0 hrs Rated voltagex2 Class 2 BJ, LD(), F C6 B7, C7 Voltage treatmentTwice the rated voltage shall be applied for 1 hour at 85, 105 or 125 Note 3, 4 Maximum operating temperature 100048/0 hrs Rated voltagex2 Note 4 50mA max. 50mA max. Standard Preconditioning Test Methods and Remarks Temperature Duration Applied voltage Charge/discharge current Recovery : No abnormality : Within 12.5% BJ, B7, C6, C7, LD() Within 30% F Dissipation factor : 5.0% max.BJ, B7, C6, C7, LD() 11.0% max.F Insulation resistance : 50 MF or 1000 M, whichever is smaller. Note: LD Low distortion high value multilayer ceramic capacitor Class 1 High Frequency Type None 6 to 24hr Standard condition Note 5 242 hrs Standard condition Note 5 Note: LD Low distortion high value multilayer ceramic capacitor Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail. Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 1500/10 for an hour and kept at room temperature for 242hours. Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 242hours. Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information. Note 5 Standard condition: Temperature: 5 to 35, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 202, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_reli_e-01 High Reliability Application Multilayer Ceramic Capacitors are noted separately. Precautions on the use of Multilayer Ceramic Capacitors PRECAUTIONS 1. Circuit Design Precautions Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. Operating Voltage Verification of Rated voltage 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Precautions Pattern configurations Design of Land-patterns 1. When capacitors are mounted on PCBs, the amount of solder used size of fillet can directly affect the capacitor performance. Therefore, the following items must be carefully considered in the design of land patterns: 1Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. 2When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist. Pattern configurations Capacitor layout on PCBs After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.. For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. Pattern configurations Design of Land-patterns The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. 1Recommended land dimensions for typical chip capacitors Land patterns for PCBs Multilayer Ceramic Capacitors : Recommended land dimensions unit: mm Wave-soldering Type 107 212 316 325 L 1.6 2.0 3.2 3.2 Size W 0.8 1.25 1.6 2.5 A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 Technical considerations Reflow-soldering Type 042 063 105 L 0.4 0.6 1.0 Size W 0.2 0.3 0.5 A 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 B 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 C 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 NoteRecommended land size might be different according 107 212 316 1.6 2.0 3.2 0.8 1.25 1.6 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 to the allowance of the size of the product. 325 3.2 2.5 1.8 to 2.5 1.0 to 1.5 1.8 to 3.2 432 4.5 3.2 2.5 to 3.5 1.5 to 1.8 2.3 to 3.5 LWDC: Recommended land dimensions for reflow-soldering unit: mm Type 105 107 212 L 0.52 0.8 1.25 Size W 1.0 1.6 2.0 A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7 B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5 C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 2Examples of good and bad solder application Items Not eommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded Components near mounted components Horizontal component placement Pattern configurations Capacitor layout on PCBs 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any stresses from board warp or deflection. Items Not recommended Recommended Deflection of board possible mechanical Place the product at a right angle to the direction of the anticipated mechanical stress. 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Precautions Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2. Maintenance and inspection of mounting machines shall be conducted periodically. Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. Technical considerations Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. 1The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. 2The pressure of nozzle shall be adjusted between 1 and 3 N static loads. 3To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 Items Not recommended Recommended Single-sided mounting Double-sided mounting 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. 1Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f. The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. 2The recommended amount of adhesives is as follows; After capacitors are bonded Amount adhesive Recommended condition Figure 212/316 case sizes as examples a 0.3mm min b 100 to 120m c Adhesives shall not contact land 4. Soldering Precautions Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; 1Flux used shall be less than or equal to 0.1 wt% in Cl equivalent of halogenated content. Flux having a strong acidity content shall not be applied. 2When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. 3When water-soluble flux is used, special care shall be taken to properly clean the boards. Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. Technical considerations Selection of Flux 1-1. When too much halogenated substanceChlorine, etc. content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used. Soldering Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130. Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 Reflow soldering Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering Caution The ideal condition is to have solder massfilletcontrolled to 1/2 to 1/3 of the thickness of a capacitor. Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. Wave soldering Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering Caution Wave soldering must not be applied to capacitors designated as for reflow soldering only. Hand soldering Recommended conditions for eutectic Recommended condition for Pb-free soldering soldering 316type or less T T150 325type or more T T130 Caution Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. The soldering iron shall not directly touch capacitors. 5. Cleaning Precautions Technical considerations Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning. e.g. to remove soldering flux or other materials from the production process. 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. 1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical properties especially insulation resistance. 2. Inappropriate cleaning conditions insufficient or excessive cleaning may adversely affect the performance of the capacitors. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; Ultrasonic output : 20 W/ or less Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 6. Resin coating and mold Precautions 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. Precautions Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. 1If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. 2Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Precautions Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature : Below 30 Humidity : Below 70% RH The ambient temperature must be kept below 40. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150 for 1hour. Technical considerations If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the capacitors. RCR-2335BSafety Application Guide for fixed ceramic capacitors for use in electronic equipmentis published by JEITA. Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01