Multilayer Ceramic Chip Capacitors
1 of 3
Creation Date : December 04, 2018 (GMT)
CKCL22X7R1H103M085AA
TDK item description CKCL22X7R1H103MT****
Applications Commercial Grade
Feature 2-Array 2 in 1 Array
Series CKCL22(2012) [EIA 0805]
Status
EOL announced
Discontinue Issue Date : Apr.28, 2018
Last Purchase Order Date : Oct.31, 2018
Last Shipment Date : Mar.31, 2019
Size
Length(L) 2.00mm ±0.15mm
Width(W) 1.25mm ±0.15mm
Thickness(T) 0.85mm ±0.15mm
Terminal Width(C) 0.45mm Nom.
Terminal Spacing(P) 1.00mm Nom.
Recommended Land Pattern (PA) 0.55mm to 0.65mm
Recommended Land Pattern (PB) 0.55mm to 0.65mm
Recommended Land Pattern (PC) 0.40mm to 0.50mm
Recommended Land Pattern (PP) 0.95mm to 1.05mm
Electrical Characteristics
Capacitance 10nF ±20%
Rated Voltage 50VDC
Temperature Characteristic X7R(±15%)
Dissipation Factor (Max.) 3%
Insulation Resistance (Min.) 10000MΩ
Other
Soldering Method Reflow
AEC-Q200 No
Packing Blister (Plastic)Taping [180mm Reel]
Package Quantity 4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
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