Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Micro Xinger
3dB Hybrid Coupler
Description
The 1M703SS Micro Xinger® is a low profile, miniature 3dB hybrid coupler
in an easy to use surface mount package designed for ISM and LMDS
applications. The 1M703SS is designed for balanced amplifiers and signal
distribution and is an ideal solution for the ever-increasing demands of the
wireless industry for smaller printed circuit boards and high performance.
Parts have been subjected to rigorous qualification testing and units are
100% tested. They are manufactured using materials with x and y thermal
expansion coefficients compatible with common substrates such as FR4, G-
10, and polyimide.
ELECTRICAL SPECIFICATIONS**
Frequency Isolation Insertion
Loss VSWR
GHz dB Min dB Max Max:1
3.3 – 3.7 23 0.20 1.19
Amplitude
Balance
Phase
Balance Power Θ
ΘΘ
ΘJC Operating
Temp.
dB Max Degrees Ave. CW
Watts ºC/Watt ºC
Features:
• 3.3 – 3.7 GHz
• Low Loss
• High Isolation
• 90o Quadrature
• Surface Mountable
• Tape And Reel
• New Micro-Package
• 100% Tested
• Lead Free ± 0.20 ± 4 30 52.3 -55 to +85
**Specification based on performance of unit properly installed on microstrip printed circuit
boards with 50 Ω nominal impedance. Specifications subject to change without notice.
Outline Drawing
1M703S Rev A Mechanical Outline
Dimensions are in Inches [Millimeters]
.075
±.008
[1.91
±0.20
]
Side ViewTop View (Near-side) Bottom View (Far-side)
Part Is Symmetric About All Axis
.400
±.010
[10.16
±0.25
]
.200
±.010
[5.08
±0.25
]
Denotes
Array Number
Pin 4
Pin 1 Pin 2
Pin 3
GND
Pin 3
Pin 2
GND
Pin 1
Pin 4
.024
±.004
TYP
[0.61
±0.10
]
.048
±.008
[1.22
±0.20
]
.048
±.008
[1.22
±0.20
]