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Electrical Characteristics
Characteristic Sym Notes Minimum Typical Maximum Units
Nominal Operating Frequency fc480 MHz
Max Insertion Loss 470 to 490 MHz 2.0 3.0 dB
2dB Bandwidth 20 24.3 MHz
Attenuation (Reference level from 0dB)
fc -100 to fc -45 MHz 40 56
dB
fc +45 to fc +55 MHz 30 56
fc +55 to fc +100 MHz 40 54
Temperature Coefficient of Frequency 36 ppm/k
Source Impedance ZS50 Ω
Load Impedance ZL50 Ω
Footprint Size: 3.8 X 3.8 SM3838-8
Lid Symbolization (Y=Year, WW=week, S=shift) B37//YWWS
SM3838-8 Case
• Hermetically sealed Surface Mount package
• Complies with Directive 2002/95/EC (RoHS)
Absolute Maximum Ratings
Rating Value Units
Maximum Input Power +10 dBm
DC Voltage 3 VDC
Operable Temperature Range -45 to +125 °C
Specification Temperature -40 to +85 °C
Storage Temperature -40 to +85 °C
480 MHz
SAW Filter
SF2423D
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
NOTES:
1. All specifications apply over the operating temperature range with filter soldered to the specified demonstration board unless noted otherwise.
2. Ultimate rejection is dependent on PCB layout.
3. Specifications subject to change without notice.
4. Electrostatic Sensitive Device. Observe precautions for handling.
5. US and international patents may apply.
6. Murata, stylized Murata logo, and Murata N.A., Inc. are registered trademarks of Murata Manufacturing Co., Ltd.
Connection Terminals
Input 2
Output 6
Ground All Others
Electrical Connections
Pb
50Ω50Ω
1
2
345
6
7
8
Input Output
Ground
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Frequency Characteristics
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8-Terminal Ceramic Surface-Mount Case
3.8 X 3.8 mm Nominal Footprint
SM3838-8 Case
TOP VIEW BOTTOM VIEW
Case Dimensions
Dimension mm Inches
Min Nom Max Min Nom Max
A3.6 3.8 4.0 0.142 0.150 0.157
B3.6 3.8 4.0 0.142 0.150 0.157
C1.05 1.20 1.35 0.041 0.047 0.053
D0.95 1.10 1.25 0.037 0.043 0.049
E0.90 1.00 1.10 0.035 0.040 0.043
F0.50 0.60 0.70 0.020 0.024 0.028
G2.39 2.54 2.69 0.090 0.100 0.110
H1.40 1.75 2.05 0.055 0.069 0.080
I0.90 1.00 1.10 0.035 0.040 0.043
Electrical Connections
Connection Terminals
Port 1 Input 2
Port 2 Output 6
Ground All Others
Dot Indicates Pin 1
Materials
Solder Pad Ter-
mination
Au plating 30 - 60 µInches (76.2-152 µM) over 80-200
µInches (203-508 µM) Ni.
Lid Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phospho-
rus) 100-200 µInches Thick
Body Al2O3 Ceramic
Pb Free
A
1
2
3
B
7
6
5
4
C
H7
6
5
4
E
F
G
1
2
3
88
D
B37
YWWS
I
PCB Footprint
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Tape and Reel Specifications
“B “
Nominal Size Quantity Per Reel
Inches millimeters
7 178 500
13 330 3000
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions
Ao 4.25 mm
Bo 4.25 mm
Ko 1.30 mm
Pitch 8.0 mm
W 12.0 mm
See Detail "A"
13.0
20.2
2.0
12.0
100 REF.
"B" REF.
RO.3
(MAX.)
Ko
SECTION A-A
0.3 ± 0.05
SECTION B-B
Bo
2.0 4.0
Ao Pitch
BB
AR0.5
(MAX.)
A
5.5
12.0
1.75
1.5
1.50
PIN #1
USER DIRECTION OF FEED
(TYP.)
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Reflow Profile
