Transition Socket Specification 2010 Microchip Technology Inc. DS51194S Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-069-0 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS51194S-page 2 2010 Microchip Technology Inc. Transition Socket Specification INTRODUCTION Transition sockets are products that allow header boards (for next generation in-circuit emulators or in-circuit debuggers) or device adapters (for the MPLAB ICE 2000 in-circuit emulator) to interface to sockets on target applications. Typically, header boards or device adapters have connectors that match development cycle device formats, such as DIP or PLCC. However, target sockets will match compact production device formats, such as SOIC, SSOP, QFP, or QFN. The solution is transition sockets. A transition socket is specifically designed to provide compatibility between two differing types of IC package formats. Transition sockets are typically composed of two parts: the adapter socket and the adapter header. The adapter socket is designed to plug into the header board or device adapter on one side, and the adapter header on the other. The adapter header is then soldered down to the target application. WHY SHOULD I USE TRANSITION SOCKETS IN MY PRODUCT DESIGN? There are two very significant advantages to using transition sockets: 1. 2. Shorter product development cycle Reduced expense in the design, layout and prototype testing A typical product design cycle has two important phases: the prototype design phase and the production design phase. Traditionally, these phases were different simply because the prototype used a microcontroller with a different package type. However, with the availability of the transition sockets, the prototype design can be identical to the production design because a transition socket can be used to bridge microcontroller package differences. 2010 Microchip Technology Inc. WHAT TRANSITION SOCKETS ARE CURRENTLY AVAILABLE? Microchip Technology currently offers the transition sockets listed in the "Table of Contents" following this introductory section. Use the on-line Development Tools Selector (DTS) to find the transition sockets available for each header board or for each device adapter. For more on header boards or device adapters, see: * Header Board Specification (DS51292) * MPLAB(R) ICE 2000 Processor Module and Device Adapter Specification (DS51140) * MPLAB(R) ICE 4000 Processor Module and Device Adapter Specification (DS51298) Please see the Microchip web site (www.microchip.com) for the DTS and most current version of all documents. HOW CAN I OBTAIN MAXIMUM BENEFIT FROM THE USE OF TRANSITION SOCKETS? Attention to component placement should be considered to provide adequate clearance for the transition socket interface to the PCB footprint. This is especially true for any tall components such as connector headers, radial components or voltage regulators. Refer to the transition socket mechanical drawings for dimensions. DS51194S-page 3 Transition Socket Specification TRANSITION SOCKET APPLICATIONS - COMMENTS AND SUGGESTIONS GLOSSARY Attention to component placement should be considered in mating the adapter sockets to the SOIC/SSOP headers. DIP - Dual In-line Package The placement of vias around the Surface Mount Technology (SMT) layout area should be examined. Vias immediately adjacent to the end of a SMT pad may inadvertently come into contact with the header leads. Vias should be placed along the center line of the SMT pad to lessen the chance of pin-to-pin shorts while soldering. Care should be taken when soldering some transition sockets to target boards. See the releated section for specific instructions. Terms used in this document: DFN - Dual Flat No lead MQFP - Metric Quad Flat Pack PDIP - Plastic Dual In-line Package PLCC - Plastic Leaded Chip Carrier QFN - Quad Flat No lead QFP - Quad Flat Pack SOIC - Small Outline IC SOT - Small Outline Transistor SSOP - Shrink Small Outline Package TQFP - Thin Quad Flat Pack For information on packaging dimensions, please refer to the Packaging Specification (DS00049). DS51194S-page 4 2010 Microchip Technology Inc. Table of Contents Current Sockets SOIC Transition Socket XLT08SO-1 8-lead DIP to 8-lead SOIC ............................................................................................................................................. 9 XLT08SN-1 8-lead DIP to 8-lead SOIC (Narrow) ............................................................................................................................ 10 XLT14SO-1 14-lead DIP to 14-lead SOIC ....................................................................................................................................... 10 XLT18SO-1 18-lead DIP to 18-lead SOIC ....................................................................................................................................... 11 XLT20SO1-1 20-lead DIP to 20-lead SOIC ....................................................................................................................................... 11 XLT28SO-1 28-lead DIP to 28-lead SOIC ....................................................................................................................................... 12 SSOP Transition Socket XLT14SS-1 14-lead DIP to 14-lead SSOP ...................................................................................................................................... 13 XLT20SS-1 18-lead DIP to 20-lead SSOP ...................................................................................................................................... 14 XLT20SS1-1 20-lead DIP to 20-lead SSOP ...................................................................................................................................... 14 XLT28SS-1 28-lead DIP to 28-lead SSOP ...................................................................................................................................... 15 XLT28SS2-1 28-lead DIP to 28-lead SSOP (PIC16X55/57) ............................................................................................................. 15 PLCC Transition Socket XLT44L2 44-lead PLCC (0.050") ................................................................................................................................................. 16 QFP Transition Socket XLT44PT3 44-lead QFP (0.8 mm) ................................................................................................................................................. 18 XLT64PT5, XLT80PT3 64/80-lead QFP (0.5 mm) ............................................................................................................................................ 18 XLT80PT2 80-lead QFP (0.65 mm) ............................................................................................................................................... 19 SOT/DFN/QFN Transition Sockets XLT06SOT 14-lead DIP to 6-lead SOT-23 ..................................................................................................................................... 22 XLT08DFN2 14-lead DIP to 8-lead DFN ........................................................................................................................................... 22 2010 Microchip Technology Inc. DS51194S-page 5 Transition Socket Specification XLT16QFN1, XLT28QFN3, XLT28QFN4, XLT44QFN2, XLT44QFN3, XLT44QFN4, XLT44QFN5 Multi-lead DIP to Multi-lead QFN, Top View ................................................................................................................. 23 Multi-lead DIP to Multi-lead QFN, Side View ................................................................................................................ 23 Multi-lead DIP to Multi-lead QFN Cables ..................................................................................................................... 23 XLT20QFN-1 20-lead DIP Adapter Socket ......................................................................................................................................... 24 20-lead QFN Header (Surface Foot) ............................................................................................................................ 24 XLT20QFN-1 Soldering Suggestions ........................................................................................................................... 25 DS51194S-page 6 2010 Microchip Technology Inc. Transition Socket Specification Discontinued Sockets PDIP Transition Socket XLT28XP (Discontinued) 28-lead DIP 0.300-inch Male to 0.600-inch Female ..................................................................................................... 26 SOIC Transition Socket XLT08SO (Discontinued - see XLT08SO-1 or XLT08SN-1) 8-lead DIP to 0.050-inch Adapter Socket ..................................................................................................................... 27 8-lead SOIC Header .................................................................................................................................................... 27 XLT14SO (Discontinued - see XLT14SO-1) 14-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 28 14-lead SOIC Header .................................................................................................................................................. 28 XLT18SO (Discontinued - see XLT18SO-1) 18-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 28 18-lead SOIC Header ................................................................................................................................................. 28 XLT20SO1 (Discontinued - see XLT20SO1-1) 20-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 29 20-lead SOIC Header ................................................................................................................................................. 29 XLT28SO (Discontinued - see XLT28SO-1) 28-lead DIP to 0.050-inch Adapter Socket ................................................................................................................... 29 28-lead SOIC Header .................................................................................................................................................. 29 SSOP Transition Socket XLT14SS (Discontinued - see XLT14SS-1) 14-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 30 14-lead SSOP Header ................................................................................................................................................. 30 XLT20SS (Discontinued - see XLT20SS-1) 18-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 31 20-lead SSOP Header ................................................................................................................................................. 31 XLT20SS1 (Discontinued - see XLT20SS1-1) 20-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 31 20-lead SSOP Header ................................................................................................................................................. 31 XLT28SS (Discontinued - see XLT28SS-1) XLT28SS2 (Discontinued - see XLT28SS2-1) 28-lead DIP to 0.8 mm Adapter Socket ........................................................................................................................ 32 28-lead SSOP Header ................................................................................................................................................. 32 PLCC Transition Socket XLT68L1, XLT84L1 (Discontinued) 68/84-lead Adapter Socket .......................................................................................................................................... 34 QFP Transition Socket XLT44PT (Discontinued - see XLT44PT3) 44-lead QFP to 0.8 mm Adapter Socket ...................................................................................................................... 35 XLT64PT1 (Discontinued) XLT64PT2 (Discontinued - see XLT64PT5) XLT80PT (Discontinued - see XLT80PT3) 64/80-lead QFP to 0.5 mm Adapter Socket ................................................................................................................. 36 XLT64PT3 (Discontinued - see XLT64PT5) 64-lead QFP to 0.8mm Adapter Socket ....................................................................................................................... 36 XLT64PT4 (Discontinued - see XLT64PT5) 64-lead QFP (0.8 mm) ................................................................................................................................................. 37 2010 Microchip Technology Inc. DS51194S-page 7 Transition Socket Specification SOT/DFN/QFN Transition Sockets XLT08DFN (Discontinued - see XLT08DFN2) 8-lead DIP to 0.025-inch Adapter Socket ..................................................................................................................... 39 XLT28QFN (Discontinued - see XLT28QFN4) 28-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 39 XLT28QFN2 (Discontinued - see XLT28QFN3) 18-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 40 XLT44QFN (Discontinued - see XLT44QFN2) 40-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 40 44-lead QFN Header .................................................................................................................................................... 40 DS51194S-page 8 2010 Microchip Technology Inc. Transition Socket Specification CURRENT SOCKETS XLT08SO-1 8-lead DIP to 8-lead SOIC The transition sockets in this section are currently available from Microchip. 10.16mm [0.400"] SOIC TRANSITION SOCKET An SOIC transition socket and associated hardware is shown in Figure 1. 10.16mm [0.400"] FIGURE 1: SOIC TRANSITION SOCKET 7.62mm [0.300"] 2.54mm [0.100"] Cable to Processor Module Top View PDIP Device Adapter Gold Standoffs/ Adapters Adapter Socket SOIC Transition Socket SOIC Header Target/Application Board 13.83mm 0.38mm [0.545" 0.015"] assembled 10.00mm[0.394"] assembled There are two components of the SOIC transition socket:: 1. 2. Adapter socket that connects to the DIP device adapter SOIC header that is to be soldered down to the target application 1.27mm typ. [0.050"] Side View Microchip offers the following SOIC transition sockets: * XLT08SO-1: One 8-lead DIP adapter socket and one 8-lead SOIC header (5.28mm body size) * XLT08SN-1: One 8-lead DIP adapter socket and one 8-lead SOIC header (3.9mm body size) * XLT14SO-1: One 14-lead DIP adapter socket and one 14-lead SOIC header * XLT18SO-1: One 18-lead DIP adapter socket and one 18-lead SOIC header * XLT20SO1-1: One 20-lead DIP adapter socket and one 20-lead SOIC header * XLT28SO-1: One 28-lead DIP adapter socket and one 28-lead SOIC header 8.15mm [0.321"] 7.93mm [0.312"] End View See the drawings in this section for layout dimensions. Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. 2010 Microchip Technology Inc. DS51194S-page 9 Transition Socket Specification XLT08SN-1 XLT14SO-1 8-lead DIP to 8-lead SOIC (Narrow) 14-lead DIP to 14-lead SOIC 18.16mm [0.715"] 10.16mm [0.400"] 10.16mm [0.400"] 7.62mm [0.300"] 7.62mm [0.300"] 10.16mm [0.400"] 2.54mm [0.100"] 2.54mm typ. [0.100"] Top View 13.83mm 0.38mm [0.545" 0.015"] assembled Top View 10.00mm[0.394"] assembled 13.68mm[0.539"] assembled 9.84mm[0.388"] assembled 1.27mm typ. [0.050"] 1.27mm typ. [0.050"] Side View 8.15mm [0.321"] 8.25mm [0.325"] 5.99mm [0.236"] End View Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. DS51194S-page 10 Side View 5.99mm [0.236"] End View Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. 2010 Microchip Technology Inc. Transition Socket Specification XLT18SO-1 XLT20SO1-1 18-lead DIP to 18-lead SOIC 20-lead DIP to 20-lead SOIC 22.86mm [0.900"] 25.40mm [1.000"] 10.16mm [0.400"] 7.62mm [0.300"] 7.62mm [0.300"] [0.400"] 2.54mm typ. [0.100"] 2.54mm typ. [0.100"] Top View Top View 13.95mm .38mm assembled [0.549" 0.015"] 10.11mm .38mm assembled [0.398" 0.015"] 13.92mm 0.381mm [0.548" 0.015"] assembled 0.43mm typ. [0.017"] 0.43mm typ. [0.017"] 1.27mm typ. [0.050"] 1.27mm typ. [0.050"] Side View Side View 8.15mm [0.321"] 8.15mm [0.321"] 12.40mm[0.488"] assembled 9.93mm [0.391"] 9.42mm [0.371"] End View End View Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. 2010 Microchip Technology Inc. DS51194S-page 11 Transition Socket Specification XLT28SO-1 28-lead DIP to 28-lead SOIC 35.56mm [1.400"] 7.62mm [0.300"] 11.25mm [0.443"] 2.54mm typ. [0.100"] 10.16mm [0.400"] Top View 14.29mm .38mm [0.563"0.015"] 10.46mm[0.412] 0.43mm typ. [0.017"] 1.27mm typ. [0.050"] Side View 8.15mm [0.321"] 9.93mm [0.391"] End View Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. DS51194S-page 12 2010 Microchip Technology Inc. Transition Socket Specification SSOP TRANSITION SOCKET An SSOP transition socket and associated hardware is shown in Figure 2. XLT14SS-1 14-lead DIP to 14-lead SSOP 18.16mm [0.715"] FIGURE 2: SSOP TRANSITION SOCKET Cable to Processor Module PDIP Device Adapter 7.62mm [0.300"] 10.16mm [0.400"] Gold Standoffs/ Adapters 2.54mm typ. [0.100"] Adapter Socket SSOP Transition Socket SSOP Header Target/Application Board The SSOP transition sockets are similar to the SOIC transition sockets. There are two parts to the SSOP transition socket: 1. 2. Top View Adapter socket that connects to the DIP device adapter. SSOP header that gets soldered down to the target application. 10.19mm 0.38mm [0.401" 0.015"] assembled 0.65mm typ. Microchip offers the following SSOP transition sockets: * XLT14SS-1: One 14-lead DIP adapter socket and one 14-lead SSOP header * XLT20SS-1: One 18-lead DIP adapter socket and one 20-lead SSOP header * XLT20SS1-1: One 20-lead DIP adapter socket and one 20-lead SSOP header * XLT28SS-1: One 28-lead DIP adapter socket and one 28-lead SSOP header * XLT28SS2-1: One 28-lead DIP adapter socket and one 28-lead SSOP header (PIC16X55/57) See the drawings in this section for layout dimensions and clearances for tall components. 2010 Microchip Technology Inc. 6.35mm 0.38mm [0.250" 0.015"] assembled Side View 7.10mm [0.280"] 5.33mm 0.38mm [0.210" 0.015"] End View Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. DS51194S-page 13 Transition Socket Specification XLT20SS-1 XLT20SS1-1 18-lead DIP to 20-lead SSOP 20-lead DIP to 20-lead SSOP 25.4mm [1"] 22.9mm [0.900"] 7.6mm [0.300"] 7.6mm 10mm [0.300"] [0.394"] 10.2mm [0.402"] Top View Top View 2.5mm Typ. [0.100"] 2.5mm Typ. [0.100"] 8.3mm 0.38mm [0.328"0.015"] 11.9mm [0.469"] assembled 7.6mm 0.38 [0.298"0.015"] 0.65mm pitch typ. [0.026"] 0.65mm pitch typ. [0.026"] Side View Side View 7.6mm [0.300"] 7.6mm [0.300"] Compatible target board land pattern (not to scale) 11.96mm 0.38mm [0.471" 0.015"] assembled Compatible target board land pattern (not to scale) 11.96mm 0.38mm [0.471" 0.015"] assembled A A B B A < 0.235 B > 0.335 A < 0.235 B > 0.335 7mm [0.275"] End View Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. DS51194S-page 14 7mm [0.275"] End View Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. 2010 Microchip Technology Inc. Transition Socket Specification XLT28SS-1 XLT28SS2-1 28-lead DIP to 28-lead SSOP 28-lead DIP to 28-lead SSOP (PIC16X55/57) 35.56mm [1.400"] 35.56mm [1.400"] 10.16mm [0.400"] 7.62mm [0.300"] 10.16mm [0.400"] 7.62mm [0.300"] 2.54mm typ. [0.100"] 2.54mm typ. [0.100"] Top View 10.57mm .38mm [0.416"0.015"] Top View 10.57mm .38mm [0.416"0.015"] 1.27mm [0.050"] 1.27mm [0.050"] 0.65mm typ. [0.026"] 0.65mm typ. [0.026"] 10.21mm [0.402"] 10.21mm [0.402"] Side View Side View Recommended target PCB land pattern 5.26mm [0.207"] max. 8.15mm [0.321"] Recommended target PCB land pattern 5.26mm [0.207"] max. 8.15mm [0.321"] 6.35mm .38mm [0.250"0.015"] 6.35mm .38mm [0.250"0.015"] 8.78mm [0.346"] min. 7.77mm [0.306"] End View SF-SO28G-L-01 outline Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. 2010 Microchip Technology Inc. 7.77mm [0.306"] End View 8.78mm [0.346"] min. SF-SO28G-L-01 outline Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. DS51194S-page 15 Transition Socket Specification PLCC TRANSITION SOCKET A PLCC transition socket and associated hardware is shown in Figure 3. FIGURE 3: PLCC TRANSITION SOCKET XLT44L2 44-lead PLCC (0.050") 27.94mm [1.100"] 2.79mmx45 [0.110"] Cable to Processor Module PLCC Device Adapter 27.94mm [1.100"] PLCC Transition Socket 20.32mm [0.800"] Target/Application Board The PLCC transition socket is required for use along with the PLCC device adapters. The DAF18-1 device adapter is equipped with eight socket strips that interface with one of two transition sockets. The DAF18-3 device adapter is equipped with four socket strips that interface with one transition socket. The PLCC transition sockets are designed with a threaded insert in the center of the footprint so that a 4/40 screw can securely fasten the transition socket to the device adapter. TOP VIEW *Caution: Pin 1 on the device adapter side (top of socket) is 180 degrees from pin 1 on the target side (bottom of socket). 1.27mm typ. [0.050"] The PLCC transition sockets are designed to be soldered to the target PCB PLCC surface mount pattern or inserted into a PLCC socket on the target PCB. Note: To avoid solder bridging, do not place vias within 0.025-inch of the PLCC footprint. Also, any vias near the PLCC should be directly on the centerline of the pad. 14.94mm [0.588"] 21.93mm [0.863"] Microchip offers the following PLCC transition sockets: * XLT44L2: One 44-lead PLCC transition socket RECOMMENDED PCB LAYOUT 0.43mm typ. [0.017"] 1.27mm typ. [0.050"] FRONT/SIDE VIEW 0.865" 0.024" 0.050" DS51194S-page 16 0.074" 2010 Microchip Technology Inc. Transition Socket Specification QFP TRANSITION SOCKET QFP (MQFP, TQFP, PQFP) transition sockets and associated hardware are shown below. FIGURE 4: QFP TRANSITION SOCKET Cable to Processor Module QFP Device Adapter QFP Transition Socket Target/Application Board The QFP transition socket is required for use along with the QFP device adapter. The device adapter is equipped with four socket strips that interface with the transition socket. Note: QFP TRANSITION SOCKET SOLDERING TIPS * Use controlled soldering iron tip temperatures between 300C and 325C (570F to 615F) * If possible, use a PACE mini wave soldering iron tip or an equivalent tip design. * Plan to solder one (1 of 4) side first, then the opposite side, then the remaining two sides. * Soldering iron tip movement should be in the direction of the leads (backward and forward), not across the leads; dragging the tip across the leads may cause lead damage. * Use generous amounts of soldering flux to aid in the solder flow action. To avoid solder bridging, do not place vias within 0.025-inch of the QFP footprint. Also, any vias near the QFP should be directly on the centerline of the pad. There are two parts to the QFP transition socket: 1. 2. Adapter socket that connects to the QFP device adapter QFP header that gets soldered down to the target application Microchip offers the following QFP transition sockets: * XLT44PT3: One 44-lead QFP adapter socket and one 44-lead QFP header (0.8 mm) * XLT64PT5: One 64-lead QFP adapter socket and one 64-lead QFP header (0.5 mm) * XLT80PT2: One 80-lead QFP adapter socket and one 80-lead QFP header (0.65 mm) * XLT80PT3: One 80-lead QFP adapter socket and one 80-lead QFP header (0.5 mm) See the drawings in this section for layout dimensions and clearances for tall components. 2010 Microchip Technology Inc. DS51194S-page 17 Transition Socket Specification XLT44PT3 XLT64PT5, XLT80PT3 44-lead QFP (0.8 mm) 64/80-lead QFP (0.5 mm) 0.300 68 1 34 44 QFP PIN 1 51 QFP PIN 1 0.300 1 52 33 1.100 TOP VIEW 11 A TOP VIEW 23 17 12 35 18 22 34 A 1.100 B 0.800 0.018 0.018 0.050 0.050 FRONT/ SIDE VIEW FRONT/ SIDE VIEW 0.352 0.352 0.225 0.225 0.065 0.065 0.80 mm Refer to the "Package Specification" for PCB footprint dimensions (DS00049). UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. 0.50 mm Refer to the "Package Specification" for PCB footprint dimensions (DS00049). A B XLT64PT5 1.250 0.960 XLT80PT3 1.450 1.160 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Drawing shown is for 64-lead. DS51194S-page 18 2010 Microchip Technology Inc. Transition Socket Specification XLT80PT2 TABLE 1: 80-lead QFP (0.65 mm) 84 DVA/DAF INTERFACE SPECIFICATION FOR QFP PACKAGES 64 63 1 Socket Package Style* QFP PIN 1 A DVA/DAF Interface Specification** XLT44PT3 44PT TQFP 44PQ MQFP 44KW PQFP DVA-44PL XLT64PT5 64PT DVA-68PL XLT80PT2 80PF DVA-84PL XLT80PT3 21 * Refer to the "Package Specification" for PCB footprint dimensions (DS00049). ** Refer to the processor module and device adapter specification for interface and dimensions to DVA/DAF (ICE 2000: "MPLAB(R) ICE 2000 Processor Module and Device Adapter Specification" (DS51140); ICE 4000: "MPLAB(R) ICE 4000 Processor Module and Device Adapter Specification" (DS51298)). 43 22 42 A TOP VIEW B 0.018 0.050 FRONT/ SIDE VIEW 0.352 0.225 0.065 0.65mm Refer to the "Package Specification" for PCB footprint dimensions (DS00049). A B 1.450 1.160 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. 2010 Microchip Technology Inc. DS51194S-page 19 Transition Socket Specification SOT/DFN/QFN TRANSITION SOCKETS FIGURE 8: QFN TWO-PART TRANSITION SOCKET Cable to Processor Module SOT/DFN/QFN transition sockets and associated hardware are shown below. PDIP Device Adapter Gold Standoffs/ Adapters FIGURE 5: SOT TRANSITION SOCKET WITH CABLE QFN Transition Socket Cable to Processor Module Target/Application Board PDIP Device Adapter Two-part transition sockets consist of: Gold Standoffs/ Adapters 1. SOT Transition Socket Cables Target/Application Board FIGURE 6: DFN TRANSITION SOCKET WITH CABLE Cable to Processor Module PDIP Device Adapter Gold Standoffs/ Adapters DFN Transition Socket Cables Target/Application Board FIGURE 7: QFN TRANSITION SOCKET WITH CABLE Cable to Processor Module PDIP Device Adapter Gold Standoffs/ Adapters 2. Adapter socket that connects to the DIP device adapter QFN header that is to be soldered down to the target application Microchip offers the following SOT/DFN/QFN transition sockets: * XLT06SOT: One 14-lead DIP to 6-lead SOT-23 transition socket with cable * XLT08DFN2: One 14-lead DIP to 8-lead DFN transition socket with cable * XLT16QFN1: One 14-lead DIP to 16-lead QFN transition socket with cable * XLT20QFN-1: One 20-lead DIP adapter socket and one 20-lead QFN header * XLT28QFN3: One 18-lead DIP to 28-lead QFN transition socket with cable * XLT28QFN4: One 28-lead DIP to 28-lead QFN transition socket with cable * XLT44QFN2: One 40-lead DIP to 44-lead QFN transition socket with cable * XLT44QFN3: One 28-lead DIP to 44-lead QFN transition socket with cable * XLT44QFN4: One 28-lead DIP to 44-lead QFN transition socket with cable * XLT44QFN5: One 18-lead DIP to 44-lead QFN transition socket with cable See the drawings in this section for layout dimensions. QFN Transition Socket Cables Target/Application Board DS51194S-page 20 2010 Microchip Technology Inc. Transition Socket Specification RECOMMENDED INSTALLATION OF TRANSITION SOCKETS WITH CABLES 3. 4. 5. For transition sockets that use a cable, follow these instructions for installing your transition socket on the target board. Center each cable on the footprint (see below). Tape down each cable to prevent movement. Solder each lead to target pad. Remove tape and clean center cable on target footprint pin 1 PCB Layout Considerations: header pins facing down Make sure you leave enough room on the PCB to accommodate the cable, i.e., space your target pads for each device far enough apart so that the cable from one pad group will not interfere with another pad group. 6-Pin SOT Solder Instructions: 1. 2. 3. 4. Remove protective cable covering from end of cable. Position cables on target board (see below). Tape down to prevent movement. Solder each lead to target pad. Remove tape and clean. 16-Pin QFN Assembly Instructions: 1. 2. 3. 4. Start with cable associated with pin 1. Fold cable up and over, forming a radius. Header pins will now be facing upwards. Mate with the socket on the underside of the transition socket assembly, making sure pin 1 mates with the pin labeled "QFN Pin 1". Fold over and mate the other cables. 28/44-Pin QFN Solder Instructions: 2. 8-Pin DFN Solder Instructions: 1. 2. 3. 4. Prepare leads by trimming narrowest portion to 0.10-inch maximum in length (see below). Position cables on target board (see below). Tape down to prevent movement. Solder each lead to target pad. Remove tape and clean. 3. 4. 5. Remove protective cable jacket from stripped end of cable. Lay out with long cables opposing each other and short cables opposing each other (see below). Place center lead (6th lead for 44-pin, 4th lead for 28-pin) on center target pad to center each cable on the footprint (see below). Tape down each cable to prevent movement. Solder each lead to target pad. Remove tape and clean pin 1 long 1. pin 1 use center lead to center cable on target footprint trim leads pin 1 short header pins facing down long short 8-Pin DFN Assembly Instructions: 1. 2. 3. 4. Start with cable associated with pin 1. Fold cable up and over, forming a radius. Mate with the header on the side of the transition socket assembly, making sure pin 1 mates with the pin labeled "DFN Pin 1". Fold over and mate the other cable. 28/44-Pin QFN Assembly Instructions: 1. 2. 3. 16-Pin QFN Solder Instructions: 1. 2. Remove protective cable jacket from stripped end of cable. Lay out the four cables in a "+" pattern (see below). 2010 Microchip Technology Inc. 4. Start with cable associated with pin 1. Fold cable up and over, forming a radius. Header pins will now be facing upwards. Mate with the socket on the underside of the transition socket assembly, making sure pin 1 mates with the pin labeled "QFN Pin 1". Fold over and mate the other cables. DS51194S-page 21 Transition Socket Specification The recommended target board footprint layout for different pin-counts is shown here. XLT06SOT 14-lead DIP to 6-lead SOT-23 0.80 FIGURE 9: 6-PIN SOT, 8-PIN DFN DVA Pin 1 RECOMMENDED PCB LAYOUT 0.90 50 mils 16 mils TOP VIEW 24 mils 0.30 FIGURE 10: 16-PIN QFN 1.50 SIDE VIEW 24 mils 11 mils 26 mils UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. XLT08DFN2 FIGURE 11: 20-PIN QFN 14-lead DIP to 8-lead DFN DVA Pin 1: Location of 14-lead DIP pin 1 1.35 28 mils 11 mils DVA Pin 1 DFN Pin 1 19 mils 0.30 0.90 FIGURE 12: 28-PIN QFN 2.37 0.24 24 mils TOP VIEW 11 mils 26 mils 0.30 FIGURE 13: 44-PIN QFN 0.09 SIDE VIEW 16 mils 13 mils 26 mils DS51194S-page 22 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. 2010 Microchip Technology Inc. Transition Socket Specification Multi-lead DIP to Multi-lead QFN, Side View XLT16QFN1, XLT28QFN3, XLT28QFN4, XLT44QFN2, XLT44QFN3, XLT44QFN4, XLT44QFN5 0.56 Multi-lead DIP to Multi-lead QFN, Top View XLT16QFN1 - 14L DIP to 16L QFN 1.25 DVA Pin 1 QFN Pin 1 SIDE VIEW UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. 1.15 Multi-lead DIP to Multi-lead QFN Cables 0.85 TOP VIEW XLT28QFN3 - 18L DIP to 28L QFN (Shown) XLT44QFN5 - 18L DIP to 44L QFN TOP VIEW 0.40 2.45 DVA Pin 1 QFN Pin 1 0.40 SIDE VIEW 1.15 BOTTOM VIEW TOP VIEW C XLT28QFN4 - 28L DIP to 28L QFN (Shown) XLT44QFN3 - 28L DIP to 44L QFN XLT44QFN4 - 28L DIP to 44L QFN 2.45 cable XLT16QFN1 QFN Pin 1 DVA Pin 1 1.15 1-4 C 1.30 XLT28QFN3/4 1,2 1.30 3,4 2.00 XLT44QFN2/3 1,2 XLT44QFN4/5 3,4 1.30 2.00 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. TOP VIEW Drawing shown is for 28-lead DIP. XLT44QFN2 - 40L DIP to 44L QFN 2.45 1.15 DIP 1 DVA Pin 1 QFN Pin 1 TOP VIEW UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. 2010 Microchip Technology Inc. DS51194S-page 23 Transition Socket Specification XLT20QFN-1 20-lead QFN Header (Surface Foot) 20-lead DIP Adapter Socket 4.72mm [0.186"] 11.4mm [0.450"] 3.20mm [0.126"] 2 0 1 9 2 1 1 8 1 7 1 5 1 6 1 4 0.80mm typ. 26.6mm [1.049"] 3.20mm [0.126"] 2.5mm [0.100"] 4.72mm [0.186"] 1 3 3 4 6 5 7 8 1 1 1 2 9 1 0 Gnd/index pin Top View 7.6mm [0.300"] 4.00mm [0.157"] Top View 0.50mm typ. [0.020"] Bottom View 20 2.3mm [0.093"] 2.7mm [0.105"] 7.8mm [0.307"] * 4.2mm [0.165"] 3.9mm [0.154"] * 4.00mm [0.157"] 1.2mm [0.047"] * SF-MLF20A-A-02F (included) * Assembled 2 0 1 9 2 1 1 8 1 7 1 5 1 6 1 4 1 3 3 4 6 5 7 8 1 1 1 2 9 1 0 1 2.13mm [0.084"] 2.75mm [0.108"] 3.3mm [0.130"] 2.13mm [0.084"] 2.75mm [0.108"] Side View Bottom View Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. 3.30mm [0.130"] Side View Tolerances: diameters 0.03 mm [0.001"], PCB perimeters 0.13 mm [0.005"], PCB thicknesses 0.18 mm [0.007"], pitches (from true position) 0.08 mm [0.003"], all other tolerances 0.13 mm [0.005"] unless stated otherwise. DS51194S-page 24 2010 Microchip Technology Inc. Transition Socket Specification XLT20QFN-1 Soldering Suggestions This socket is difficult to solder since the device pins are not exposed, but embedded, into the socket's Surface Foot (SF). 1. 2. 3. 4. 5. To start, add tack flux to the target land pattern. Visually align the QFN SF with the target land pattern. Then solder two opposite SF pins to the target lands so that the SF does not move around. Finish soldering the rest of the SF pins. If the SF has a middle ground pin, feed solder through the bottom side of hte target board via holes. This will connect the center QFN SF pin to the target board. Check each solder connection on the QFN SF pins. You are now ready to attach the QFN header to the SF. 2010 Microchip Technology Inc. DS51194S-page 25 Transition Socket Specification DISCONTINUED SOCKETS XLT28XP (Discontinued) 28-lead DIP 0.300-inch Male to 0.600-inch Female The transition sockets in this section are discontinued and may no longer be ordered from Microchip. They are kept in this document as a reference for customers who still have these sockets. PDIP TRANSITION SOCKET 1.400" TOP VIEW 0.700" A PDIP transition socket and associated hardware is shown in Figure 1. FIGURE 1: PDIP TRANSITION SOCKET Cable to Processor Module SIDE VIEW PDIP Device Adapter 0.100" 0.300-inch Male to 0.600-inch Female Adapter Socket (PDIP Transition Socket) 0.600" Gold Standoffs/Adapters FRONT/ REAR VIEW Target/Application Board 0.300" The PDIP transition socket is a 0.300-inch Male to 0.600-inch Female adapter socket. Microchip offers the following PDIP transition socket: * XLT28XP: One 28-lead DIP transition socket and two 28-lead gold standoffs See the drawings in this section for layout dimensions. DS51194S-page 26 2010 Microchip Technology Inc. Transition Socket Specification SOIC TRANSITION SOCKET An SOIC transition socket and associated hardware is shown in Figure 2. XLT08SO (Discontinued - see XLT08SO-1 or XLT08SN-1) 8-lead DIP to 0.050-inch Adapter Socket FIGURE 2: SOIC TRANSITION SOCKET Cable to Processor Module TOP VIEW SIDE VIEW BOTTOM VIEW FRONT/ REAR VIEW PDIP Device Adapter Gold Standoffs/ Adapters Adapter Socket SOIC Transition Socket SOIC Header Target/Application Board 8-lead SOIC Header There are two components of the SOIC transition socket: 1. 2. Adapter socket that connects to the PDIP device adapter SOIC header that is to be soldered down to the target application TOP VIEW F The following SOIC transition sockets have been discontinued: * XLT08SO: One adapter socket and three 8-lead SOIC headers * XLT14SO: One adapter socket and three 14-lead SOIC headers * XLT18SO: One adapter socket and three 18-lead SOIC headers * XLT20SO1: One adapter socket and three 20-lead SOIC headers * XLT28SO: One adapter socket and three 28-lead SOIC headers E FRONT/ REAR VIEW D A G B SIDE VIEW C See the drawings in this section for layout dimensions. Note: The SOIC header is designed for SOIC body width of 0.300-inch. The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths. A B C D E F G 0.060 0.410 0.050 0.075 0.178 0.050 0.050 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. The SOIC header is designed for an SOIC body width of 0.300-inch. The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths. 2010 Microchip Technology Inc. DS51194S-page 27 Transition Socket Specification XLT14SO (Discontinued - see XLT14SO-1) XLT18SO (Discontinued - see XLT18SO-1) 14-lead DIP to 0.050-inch Adapter Socket 18-lead DIP to 0.050-inch Adapter Socket TOP VIEW TOP VIEW SIDE VIEW BOTTOM VIEW FRONT/ REAR VIEW BOTTOM VIEW SIDE VIEW 14-lead SOIC Header TOP VIEW FRONT/ REAR VIEW F 18-lead SOIC Header E FRONT/ REAR VIEW D G A TOP VIEW B SIDE VIEW F E FRONT/ REAR VIEW C D A B C D E F G 0.060 0.410 0.050 0.075 0.178 0.050 0.050 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. A G B SIDE VIEW The SOIC header is designed for an SOIC body width of 0.300-inch. The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths. C A B C D E F G 0.060 0.410 0.050 0.075 0.178 0.050 0.050 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. The SOIC header is designed for an SOIC body width of 0.300-inch. The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths. DS51194S-page 28 2010 Microchip Technology Inc. Transition Socket Specification XLT20SO1 (Discontinued - see XLT20SO1-1) XLT28SO (Discontinued - see XLT28SO-1) 20-lead DIP to 0.050-inch Adapter Socket 28-lead DIP to 0.050-inch Adapter Socket TOP VIEW TOP VIEW BOTTOM VIEW BOTTOM VIEW SIDE VIEW SIDE VIEW FRONT/ REAR VIEW FRONT/ REAR VIEW 20-lead SOIC Header 28-lead SOIC Header TOP VIEW TOP VIEW F F E FRONT/ REAR VIEW E FRONT/ REAR VIEW D D A G A B G B SIDE VIEW SIDE VIEW C C A B C D E F G A B C D E F G 0.060 0.410 0.050 0.075 0.178 0.050 0.050 0.060 0.410 0.050 0.075 0.178 0.050 0.050 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. The SOIC header is designed for an SOIC body width of 0.300-inch. The SOIC header is designed for an SOIC body width of 0.300-inch. The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths. The adapter leads should be cut to fit the 0.150-inch and 0.208-inch SOIC body widths. 2010 Microchip Technology Inc. DS51194S-page 29 Transition Socket Specification SSOP TRANSITION SOCKET An SSOP transition socket and associated hardware is shown in Figure 3. XLT14SS (Discontinued - see XLT14SS-1) 14-lead DIP to 0.8 mm Adapter Socket TOP VIEW FIGURE 3: SSOP TRANSITION SOCKET Cable to Processor Module PDIP Device Adapter BOTTOM VIEW Gold Standoffs/ Adapters Adapter Socket SSOP Header SSOP Transition Socket SIDE VIEW Target/Application Board The SSOP transition sockets are similar to the SOIC transition sockets. There are two parts to the SSOP transition socket: 1. 2. FRONT/ REAR VIEW Adapter socket that connects to the PDIP device adapter. SSOP header that gets soldered down to the target application. 14-lead SSOP Header Note: To keep the leads straight during assembly and shipping, the SSOP headers are shipped with break-away tabs attached to the leads. Please remove the break-away tabs before applying power to the target system. Be careful not to bend the leads prior to soldering to the target application. TOP VIEW Shipped with break-away tabs attached to leads Remove prior to providing power * Top drawing shown with clip-on shrouds installed The following SSOP transition sockets have been discontinued: * XLT14SS: One adapter socket and three 14-lead SSOP headers * XLT20SS: One adapter socket and three 20-lead SSOP headers * XLT20SS1: One adapter socket and three 20-lead SSOP headers * XLT28SS: One adapter socket and three 28-lead SSOP headers * XLT28SS2: One adapter socket and three 28-lead SSOP headers for PIC16C55/57 F FRONT/ REAR VIEW E D G A B SIDE VIEW See the drawings in this section for layout dimensions and clearances for tall components. C A B C D E F G 0.035 0.300 0.023 0.080 0.186 0.043 0.025 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Break-away tabs are to be removed prior to providing power. DS51194S-page 30 2010 Microchip Technology Inc. Transition Socket Specification XLT20SS (Discontinued - see XLT20SS-1) XLT20SS1 (Discontinued - see XLT20SS1-1) 18-lead DIP to 0.8 mm Adapter Socket 20-lead DIP to 0.8 mm Adapter Socket TOP VIEW TOP VIEW BOTTOM VIEW BOTTOM VIEW SIDE VIEW SIDE VIEW FRONT/ REAR VIEW FRONT/ REAR VIEW 20-lead SSOP Header 20-lead SSOP Header TOP VIEW Shipped with break-away tabs attached to leads TOP VIEW Shipped with break-away tabs attached to leads Remove prior to providing power Remove prior to providing power * Top drawing shown with clip-on shrouds installed * Top drawing shown with clip-on shrouds installed F F FRONT/ REAR VIEW FRONT/ REAR VIEW E E D D A A B G G B SIDE VIEW SIDE VIEW C C A B C D E F G A B C D E F G 0.040 0.295 0.026 0.075 0.190 0.047 0.0315 0.040 0.295 0.026 0.075 0.190 0.047 0.0315 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Break-away tabs are to be removed prior to providing power. Break-away tabs are to be removed prior to providing power. 2010 Microchip Technology Inc. DS51194S-page 31 Transition Socket Specification XLT28SS (Discontinued - see XLT28SS-1) XLT28SS2 (Discontinued - see XLT28SS2-1) 28-lead DIP to 0.8 mm Adapter Socket TOP VIEW BOTTOM VIEW SIDE VIEW FRONT/ REAR VIEW 28-lead SSOP Header TOP VIEW Shipped with break-away tabs attached to leads Remove prior to applying power. * Top drawing shown with clip-on shrouds installed F FRONT/ REAR VIEW E D SIDE VIEW G A B C A B C D E F G 0.040 0.295 0.026 0.075 0.190 0.047 0.0315 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Break-away tabs are to be removed prior to applying power. DS51194S-page 32 2010 Microchip Technology Inc. Transition Socket Specification PLCC TRANSITION SOCKET RECOMMENDED PCB LAYOUT A PLCC transition socket and associated hardware is shown in Figure 4. A FIGURE 4: PLCC TRANSITION SOCKET Cable to Processor Module PLCC Device Adapter 0.024 PLCC Transition Socket Target/Application Board The PLCC transition socket is required for use along with the PLCC device adapters. The DAF18-1 device adapter is equipped with eight socket strips that interface with one of two transition sockets. The DAF18-3 device adapter is equipped with four socket strips that interface with one transition socket. The PLCC transition sockets are designed with a threaded insert in the center of the footprint so that a 4/40 screw can securely fasten the transition socket to the device adapter. The PLCC transition sockets are designed to be soldered to the target PCB PLCC surface mount pattern or inserted into a PLCC socket on the target PCB. Note: 0.050 0.074 A 68-lead 1.025 84-lead 1.225 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Drawing shown is for 68-lead. To avoid solder bridging, do not place vias within 0.025-inch of the PLCC footprint. Also, any vias near the PLCC should be directly on the centerline of the pad. The following PLCC transition sockets have been discontinued: * XLT68L1: One 68-lead PLCC transition socket * XLT84L1: One 84-lead PLCC transition socket 2010 Microchip Technology Inc. DS51194S-page 33 Transition Socket Specification XLT68L1, XLT84L1 (Discontinued) 68/84-lead Adapter Socket A Tooling hole with #4-40 threaded insert. B A TOP VIEW A B 68-lead 1.300 0.960 84-lead 1.400 1.160 *Caution: Pin 1 on the device adapter side (top of socket) is 180 degrees from pin 1 on the target side (bottom of socket). 0.018 0.050 0.580 0.850 0.018 0.050 FRONT/ SIDE VIEW UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Drawing shown is for 68-lead. DS51194S-page 34 2010 Microchip Technology Inc. Transition Socket Specification QFP TRANSITION SOCKET QFP (MQFP, TQFP, PQFP) transition sockets and associated hardware are shown below. FIGURE 5: QFP TRANSITION SOCKET Cable to Processor Module QFP Device Adapter QFP Transition Socket Target/Application Board The QFP transition socket is required for use along with the QFP device adapter. The device adapter is equipped with four socket strips that interface with the transition socket. Note: To avoid solder bridging, do not place vias within 0.025-inch of the QFP footprint. Also, any vias near the QFP should be directly on the centerline of the pad. QFP TRANSITION SOCKET SOLDERING TIPS * Before soldering, consider keeping the break-away tabs in place during soldering. * Use controlled soldering iron tip temperatures between 300C and 325C (570F to 615F) * If possible, use a PACE mini wave soldering iron tip or an equivalent tip design. * Plan to solder one (1 of 4) side first, then the opposite side, then the remaining two sides. * Soldering iron tip movement should be in the direction of the leads (backward and forward), not across the leads; dragging the tip across the leads may cause lead damage. * Use generous amounts of soldering flux to aid in the solder flow action. * If the break-away tabs are removed after soldering (using a dental pick or equivalent), any solder bridging between leads can be repaired by simply gently touching the soldering tip to the lead tip. The following QFP transition sockets have been discontinued: * XLT44PT: One 44-lead QFP transition socket, 0.80 mm * XLT64PT1: One 64-lead QFP transition socket, 0.5 mm (PIC16C92X) Note: Pin 1 The XLT64PT1 for the PIC16C92X is not symmetrical. Please note Pin 1 orientation prior to soldering to the target system. CAUTION The 64 and 80-pin QFP headers are very delicate and can be easily damaged! XLT44PT (Discontinued - see XLT44PT3) 44-lead QFP to 0.8 mm Adapter Socket 1 ST92X TOP VIEW 0.90 TOP VIEW 0.90 0.80 * XLT64PT2: One 64-lead QFP transition socket, 0.5 mm (PIC17CXXX) * XLT64PT3: One 64-lead QFP transition socket, 0.8 mm (dsPIC30F) * XLT64PT4: One 64-lead QFP adapter socket and one 64-lead QFP header (0.8 mm) * XLT80PT: One 80-lead QFP transition socket, 0.5 mm FRONT/ SIDE VIEW 0.05 0.300 0.130 0.80 mm 0.365 0.55 0.65 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. 2010 Microchip Technology Inc. DS51194S-page 35 Transition Socket Specification XLT64PT1 (Discontinued) XLT64PT2 (Discontinued - see XLT64PT5) XLT80PT (Discontinued - see XLT80PT3) XLT64PT3 (Discontinued - see XLT64PT5) 64-lead QFP to 0.8mm Adapter Socket 64/80-lead QFP to 0.5 mm Adapter Socket TOP VIEW TOP VIEW 1.05 A Break-Away Tabs 1.05 0.95 0.05 A FRONT/ SIDE VIEW 0.300 B 0.05 FRONT/ SIDE VIEW 0.140 0.330 0.80 mm 0.50 0.100 0.70 0.80 0.5 mm C UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. D A B C D XLT64PT1 XLT64PT2 1.25 0.95 0.400 0.500 XLT80PT 1.45 1.15 0.475 0.575 UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. Drawing shown is for 64-lead. This drawing shown with break-away tabs attached to the leads. Break-away tabs are to be removed prior to applying power. DS51194S-page 36 2010 Microchip Technology Inc. Transition Socket Specification XLT64PT4 (Discontinued - see XLT64PT5) TABLE 1: 64-lead QFP (0.8 mm) 68 DVA/DAF INTERFACE SPECIFICATION FOR QFP PACKAGES 52 1 Socket 51 Package Style* QFP PIN 1 XLT44PT 44PT TQFP 44PQ MQFP 44KW PQFP DVA-44PL XLT64PT1 64PT special - PIC16C923/4, PIC16C925/6 only DVA-68PL2 XLT64PT2 64PT DVA-68PL 80PT DVA-84PL 1.250 TOP VIEW 17 35 18 34 DVA/DAF Interface Specification** XLT64PT3 1.250 XLT64PT4 XLT80PT 0.960 0.018 * 0.050 FRONT/ SIDE VIEW 0.355 0.225 Refer to the "Package Specification" for PCB footprint dimensions (DS00049). ** Refer to the processor module and device adapter specification for interface and dimensions to DVA/DAF (ICE 2000: "MPLAB(R) ICE 2000 Processor Module and Device Adapter Specification" (DS51140); ICE 4000: "MPLAB(R) ICE 4000 Processor Module and Device Adapter Specification" (DS51298)). 0.065 0.80 mm Refer to the "Package Specification" for PCB footprint dimensions (DS00049). UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. 2010 Microchip Technology Inc. DS51194S-page 37 Transition Socket Specification SOT/DFN/QFN TRANSITION SOCKETS SOT/DFN/QFN transition sockets and associated hardware are shown below. RECOMMENDED PCB LAYOUT The recommended target board footprint layout for different pin-counts is shown here. FIGURE 8: 8-PIN DFN FIGURE 6: DFN/QFN TWO-PART TRANSITION SOCKET Cable to Processor Module PDIP Device Adapter 50 mils 16 mils Gold Standoffs/ Adapters 24 mils DFN/QFN Transition Socket FIGURE 9: 28-PIN QFN Target/Application Board FIGURE 7: QFN TRANSITION SOCKET 24 mils 11 mils Cable to Processor Module 26 mils PDIP Device Adapter Gold Standoffs/ Adapters FIGURE 10: 44-PIN QFN QFN Transition Socket Target/Application Board The following SOT/DFN/QFN transition sockets have been discontinued: * XLT08DFN: One 8-lead DFN transition socket. (Replaced by XLT08DFN2.) * XLT28QFN: One 28-lead QFN transition socket. (Replaced by XLT28QFN4.) * XLT28QFN2: One 28-lead QFN transition socket. (Replaced by XLT28QFN3.) * XLT44QFN: One 44-lead QFN two-part transition socket. (Replaced by XLT44QFN2.) 16 mils 13 mils 26 mils See the drawings in this section for layout dimensions. DS51194S-page 38 2010 Microchip Technology Inc. Transition Socket Specification XLT08DFN (Discontinued - see XLT08DFN2) XLT28QFN (Discontinued - see XLT28QFN4) 8-lead DIP to 0.025-inch Adapter Socket 28-lead DIP to 0.025-inch Adapter Socket 400 mils 600 mils 400 mils 1400 mils TOP VIEW TOP VIEW DIP socket DIP socket 425 mils SIDE VIEW 250 mils Solder 480 mils 170 mils 160 mils 62 mils Solder PCB pads PCB pads SIDE VIEW 2010 Microchip Technology Inc. DS51194S-page 39 Transition Socket Specification XLT28QFN2 (Discontinued - see XLT28QFN3) XLT44QFN (Discontinued - see XLT44QFN2) 18-lead DIP to 0.025-inch Adapter Socket 40-lead DIP to 0.025-inch Adapter Socket 0.900 2.058 0.600 0.695 DIP 1 TOP VIEW TOP VIEW SIDE VIEW 0.480 0.730 0.50 SIDE VIEW 0.875 DIP 1 0.026 0.236 Pin 1 of QFN BOTTOM VIEW BOTTOM VIEW UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. 44-lead QFN Header 0.315 0.315 TOP VIEW BOTTOM VIEW SIDE VIEW Solder 0.195 0.026 PCB pads UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. DS51194S-page 40 2010 Microchip Technology Inc. Transition Socket Specification APPENDIX A: A.1 REVISION HISTORY Revision N (February 2006) The following is a list of modifications: 1. 2. 3. A.2 Added Appendix A: Revision History. Removed "Preliminary" from the document's footer. Added notes referring user to the "Packaging Specification" (DS00049) for PCB footprint dimensions in the "Two-Part QFP Sockets" section. Revision P (September 2006) The following is a list of modifications: 1. 2. 3. A.3 Removed "MPLAB ICE 2000/4000" from the name of the document. This document now applies to multiple tools, and the document title was renamed to reflect this. Updated document to reflect support of 4 tools. Updated document to include break-away tab information for XLT64PT1, XLT64PT2 and XLT80PT. Revision Q (July 2008) The following is a list of modifications: 1. A.4 Update for new SOIC, SSOP and QFN sockets. Revision R (July 2009) The following is a list of modifications: 1. A.5 Updated the first paragraph in the "Introduction" section. Revision S (March 2010) The following is a list of modifications: 1. 2. Obsoleted XLT28XP and XLT64PT4 Added XLT44QFN4 and XLT44QFN5. 2010 Microchip Technology Inc. DS51194S-page 41 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 01/05/10 DS51194S-page 42 2010 Microchip Technology Inc.