1
AN33012UA
Evaluation Board Manual
Panasonic Corporation
Automotive & Industrial Systems Company
Semiconductor Business Division
2
GND
VCC
SW1
Channel 1 Enable control switch
Upper side (hi gh):
DCDC Channel 1 ON
Lower side (low ):
DCDC Channel 1 OFF
JP1
RT resistor setting jumper
DCDC Channel 2 output
pin
SYNC input ter minal
(external clock
input)
SW2
Channel 2 Enable control switch
Upper side (hi gh):
DCDC Channel 2 ON
Lower side (low):
DCDC Channel 2 OFF
DCDC Channel 1 output
pin
SW3
TL_CTRL control switch
JP2
If you connect this jumper
switch, the FLAG pin will
be connected to
VREG(4.9V) via a 200kΩ-
register.
Pin 5-8 can short together
1
45
8
G
Pin 1-3 can short
together
SD
JG
7K2
1
45
8
G
SD
JG
7K2
Pin5-8 can short together
Pin1-3 can short together
*)About FET and SBD,
It becomes the selection parts
that assume maximum
output current = 2A or more.
AN33012UA Evaluation board (front side)
3
Compensation RC
for Channel 1
Feed back resistor
for Channel 1
Compensation RC
for Channel 2
Feed back resistor
for Channel 2
AN33012UA Evaluation board (back side)
This is a two layer circuit board. The back side is shown below. (The front side is shown on the previous page.)
4
AN33012UA Evaluation board (schematic)
VREG
VREF
（BGR）
TSD
UVLO
SS1
ERAMP
OCP
CSS1
CVREG
COUT1
OSC
FB1 COMP1 SGND PGND
HSD1
RS1
VCC
VREG
PWM
PRIDRV
17 1
CNT
SS2
ERAMP
OCP
CSS2
FB2
COMP2
HSD2
RS2
VCC_S2
SST
PWM
PRIDRV
Timer
Latch
FLAG Ext.CLK
SYNC
RT
113
15
2
3
4
20
16
6
75
21
18
19
22
23
24
12
CVCC1~3
5.0V
5.0V L1
RFLAG
Vcc
OUTBUF_EN1
10
14
CTL
Pull-up CT
EN1 EN2
89
CCT
PLL
RRS1
RRS2
TL
11
TL_CTRL
COUT2
L2
OUTBUF_EN2
SST
OVP
SCP
OVP
SCP
VINT OVP
（VCC)
VCC_S1
RRT1
RRT3
RRT2
NMOS1
JPRT
123
FET1
D1
RC1_1 CC1_1
CC1_2
CC1_3
RC1_2
RC1_5
RC1_6 RC1_4
RC1_3
RC2_1
RC2_2
CC2_1
CC2_2
CC2_3 RC2_3
RC2_4 RC2_6
RC2_5
FET2
D2
JPFLAG 1
2
The block diagram of the board is shown below.
5
AN33012UA Evaluation board (components)
Compensation & Feedback ResistorPanasonicR=30kJIS1608[EIA0603]ERA3AEB303VRC1_4,RC2_4
JIS1608_[EIA0603]
JIS1608_[EIA0603]
JIS1608_[EIA0603]
JIS1608_[EIA0603]
JIS1608_[EIA0603]
JIS1608_[EIA0603]
3.8(L) x 2.4(W)
8.3(L) x 8.3(W)
JIS322_[EIA1210]
JIS5750[EIA2220]
JIS1608_[EIA0603]
JIS1608_[EIA0603]
JIS1608_[EIA0603]
JIS1608_[EIA0603]
Size
Compensation CapacitorMurata470pFGCM1882C1H471JA01JCC1_3,CC2_3
OCP Sense ResistorPanasonicR=11mERJ8BWFR011VRRS1,RRS2 OSC Setting ResistorPanasonicR=130kERA3AEB134VRRT1 PanasonicR=0ERJ3GEY0R00VRMOS1-2 Pull-up ResistorPanasonicR=200kERA3AEB204VRFLAG
Compensation & Feedback ResistorPanasonicR=1.5kERA3AEB152VRC1_2,RC2_2
Compensation & Feedback ResistorPanasonicR=0ERJ3GEY0R00V
RC1_3,RC2_3,
RC1_6,RC2_6
Compensation & Feedback ResistorPanasonicR=7.5kERA3AEB752V
RC1_1,RC2_1,
RC1_5,RC2_5
Schottky DiodePanasonic—DB24416D1,D2 2ch DC-DC ControllerPanasonic—AN33012UAIC1 InductorSUMIDA10µH CDRH8D43-100NCL1,L2 PMOSFETSANYO—ECH8305LX1,LX2 Output CapacitorTAIYO YUDEN22µF TMK325C7226MM-TCOUT1,COUT2
Input CapacitorTDK22µF CKG57NX7R1H226MTCVCC1,CVCC2,CVCC3
VREG CapacitorMurata1uFGCM188R71C105KA49JCVREG
Setting CapacitorMurata0.1uFGCM188R11C104KA01JCCT,CSS1,CSS2,CTL
Compensation CapacitorMurata27pFGCM1882C1H270JA01JCC1_2,CC2_2 Compensation CapacitorMurata2.2nFGCM1882C1H222JA01JCC1_1,CC2_1 DescriptionMakerValuePart NameBoard Component Name
The BOM of this board is shown below.
Table 1 : compo nent on the evaluation b oard (reference)
Note: The specifications of the BOM are reference values. Other components might be mounted depending on target values of output voltage, frequency, etc.
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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