B57703M0103A019 - EPCOS - Product.Network

NTC thermistors for

temperature measurement

Probe assemblies

Series/Type: B57703M

Date: January 2018

information contained therein without EPCOS' prior express consent is prohibited.

EPCOS AG is a TDK Group Company.

1) Depends on mounting situation.

Applications

Surface temperature measurement,

e.g. on housings and heat sinks

Features

High accuracy

Easy mounting

Good thermal coupling through metal tag

Thermistor encapsulated in metal-tag case

AWG 30, PTFE-insulated leads of

silver-plated nickel wire or AWG 26

(stranded, 7 x AWG 34), PTFE-insulated

leads of silver-plated copper wire

UL approval (E69802)

Options

Alternative resistance ratings, rated

temperatures, resistance tolerances, lead

lengths and AWG 28 stranded wires

available on request.

Delivery mode

Bulk

Dimensional drawing

Dimensions in mm

Approx. weight 0.8 g

Ordering code Wire length

"l" in mm

B57703M0103A017 115 ±10

B57703M0103A018 200 ±10

B57703M0103A019 500 ±10

B57703M0103G040 45 ±3

B57703M0303G040 45 ±3

B57703M0502G040 45 ±3

General technical data

Climatic category (IEC 60068-1) 55/125/56

Max. power (at 25 °C) P25 150 mW

Resistance tolerance ∆RR/RR±2 %

Rated temperature TR25 °C

Dissipation factor (in air) δth1) approx. 3 mW/K

Thermal cooling time constant (in air) τc1) approx. 50 s

Heat capacity Cth1) approx. 150 mJ/K

Test voltage (t = 1 s) Vtest 1000 V AC

Temperature measurement B57703M

Probe assemblies M703

Page 2 of 12Please read Cautions and warnings and

Important notes at the end of this document.

Electrical specification and ordering codes

R25

Ω

No. of R/T

characteristic

B25/100

Wire

length "l"

in mm

Wire Ordering code

10 k 8016 3988 ±1% 115 ±10 AWG 26 B57703M0103A017

10 k 8016 3988 ±1% 200 ±10 AWG 26 B57703M0103A018

10 k 8016 3988 ±1% 500 ±10 AWG 26 B57703M0103A019

5 k 8016 3988 ±1% 45 ±3 AWG 30 B57703M0502G040

10 k 8016 3988 ±1% 45 ±3 AWG 30 B57703M0103G040

30 k 8018 3964 ±1% 45 ±3 AWG 30 B57703M0303G040

Note: AWG 26 (stranded, 7 x AWG 34), PTFE-insulated wire of silver-plated copper wire.

AWG 30, PTFE-insulated wire of silver-plated nickel wire.

Reliability data

Test Standard Test conditions ∆R25/R25

(typical)

Remarks

Storage in

dry heat

IEC

60068-2-2

Storage at upper

category temperature

T: 125 °C

t: 1000 h

< 1%1) No visible

damage

Storage in damp

heat, steady state

IEC

60068-2-78

Temperature of air: 40 °C

Relative humidity of air: 93%

Duration: 56 days

< 1%1) No visible

damage

Rapid temperature

cycling

IEC

60068-2-14

Lower test temperature: 55 °C

Upper test temperature: 125 °C

Number of cycles: 10

< 0.5%1) No visible

damage

Endurance Pmax: 150 mW

t: 1000 h

< 1%1) No visible

damage

Long-term stability

(empirical value)

Temperature: 70 °C

t: 10000 h

< 2% No visible

damage

1) Except: B57703M0103A017, B57703M0103A018, B57703M0103A019 ∆R25/R25 (typical) < 2%

Note

Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be

ensured that no water enters the NTC thermistors (e.g. through plug terminals).

Avoid dewing and condensation unless thermistor is specified for these conditions.

Temperature measurement B57703M

Probe assemblies M703

Page 3 of 12Please read Cautions and warnings and

Important notes at the end of this document.

R/T characteristics

R/T No. 8016 8018

T (°C) B25/100 = 3988 K B25/100 = 3964 K

RT/R25 α(%/K) RT/R25 α(%/K)

55.0 96.3 7.4 82.408 7.0

50.0 67.01 7.2 58.344 6.8

45.0 47.17 6.9 41.775 6.6

40.0 33.65 6.7 30.235 6.4

35.0 24.26 6.4 22.109 6.2

30.0 17.7 6.2 16.327 6.0

25.0 13.04 6.0 12.171 5.8

20.0 9.707 5.8 9.1548 5.6

15.0 7.293 5.6 6.9458 5.4

10.0 5.533 5.5 5.3135 5.3

5.0 4.232 5.3 4.0972 5.1

0.0 3.265 5.1 3.1834 5.0

5.0 2.539 5.0 2.4915 4.8

10.0 1.99 4.8 1.9637 4.7

15.0 1.571 4.7 1.5582 4.6

20.0 1.249 4.5 1.2444 4.4

25.0 1.0000 4.4 1.0000 4.3

30.0 0.8057 4.3 0.80843 4.2

35.0 0.6531 4.1 0.65732 4.1

40.0 0.5327 4.0 0.53743 4.0

45.0 0.4369 3.9 0.44175 3.9

50.0 0.3603 3.8 0.36497 3.8

55.0 0.2986 3.7 0.30303 3.7

60.0 0.2488 3.6 0.2528 3.6

65.0 0.2083 3.5 0.21187 3.5

70.0 0.1752 3.4 0.17836 3.4

75.0 0.1481 3.3 0.15079 3.3

80.0 0.1258 3.2 0.128 3.2

85.0 0.1072 3.2 0.1091 3.2

90.0 0.09177 3.1 0.093342 3.1

95.0 0.07885 3.0 0.080158 3.0

100.0 0.068 2.9 0.069084 2.9

105.0 0.05886 2.9 0.059747 2.9

110.0 0.05112 2.8 0.051845 2.8

115.0 0.04454 2.7 0.045134 2.7

120.0 0.03893 2.6 0.039416 2.7

125.0 0.03417 2.6 0.034527 2.6

130.0 0.03009 2.5 0.030333 2.6

135.0 0.02654 2.5 0.026724 2.5

140.0 0.02348 2.4 0.02361 2.5

145.0 0.02083 2.4 0.020914 2.4

150.0 0.01853 2.3 0.018575 2.3

155.0 0.01653 2.3 0.016538 2.3

Temperature measurement B57703M

Probe assemblies M703

Page 4 of 12Please read Cautions and warnings and

Important notes at the end of this document.

Temperature measurement B57703M

Probe assemblies M703

Page 5 of 12Please read Cautions and warnings and

Important notes at the end of this document.

Cautions and warnings

General

See "Important notes" on page 2.

Storage

Store thermistors only in original packaging. Do not open the package prior to processing.

Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative

humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is

inadmissible.

Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the

packing material may be deformed or components may stick together, causing problems during

mounting.

Avoid contamination of thermistor surface during storage, handling and processing.

Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).

Use the components as soon as possible after opening the original packaging.

Solder thermistors within the time specified after shipment from EPCOS.

For leaded components this is 24 months, for SMD components with nickel barrier termination

12 months, for leadless components this is 12 months, for SMD components with AgPd

termination 6 months.

Handling

NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused

during handling of NTCs.

Do not touch components with bare hands. Gloves are recommended.

Avoid contamination of thermistor surface during handling.

Washing processes may damage the product due to the possible static or cyclic mechanical

loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,

which might lead to reduced reliability or lifetime.

Bending / twisting leads

A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from

the component head or housing. When bending ensure the wire is mechanically relieved at the

component head or housing. The bending radius should be at least 0.75 mm.

Soldering

Use resin-type flux or non-activated flux.

Insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended.

Complete removal of flux is recommended.

Temperature measurement B57703M

Probe assemblies M703

Page 6 of 12Please read Cautions and warnings and

Important notes at the end of this document.

Mounting

Ensure that no thermo-mechanical stress occurs due to production processes (curing or

overmolding processes) when thermistors are sealed, potted or overmolded or during their

subsequent operation. The maximum temperature of the thermistor must not be exceeded.

Ensure that the materials used (sealing/potting compound and plastic material) are chemically

neutral.

Electrodes/contacts must not be scratched or damaged before/during/after the mounting

process.

Contacts and housing used for assembly with the thermistor must be clean before mounting.

Ensure that adjacent materials are designed for operation at temperatures comparable to the

surface temperature of the thermistor. Be sure that surrounding parts and materials can

withstand the temperature.

Avoid contamination of the thermistor surface during processing.

The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to

an environment with normal atmospheric conditions.

Tensile forces on cables or leads must be avoided during mounting and operation.

Bending or twisting of cables or leads directly on the thermistor body is not permissible.

Avoid using chemical substances as mounting aids. It must be ensured that no water or other

liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based

substances (e.g. soap suds) must not be used as mounting aids for sensors.

The use of no-clean solder products is recommended. In any case mild, non-activated fluxes

should be used. Flux residues after soldering should be minimized.

Operation

Use thermistors only within the specified operating temperature range.

Use thermistors only within the specified power range.

Environmental conditions must not harm the thermistors. Only use the thermistors under

normal atmospheric conditions or within the specified conditions.

Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be

ensured that no water enters the NTC thermistors (e.g. through plug terminals). For

measurement purposes (checking the specified resistance vs. temperature), the component

must not be immersed in water but in suitable liquids (e.g. perfluoropolyethers such as Galden).

Avoid dewing and condensation unless thermistor is specified for these conditions.

Bending or twisting of cables and/or wires is not permissible during operation of the sensor in

the application.

Be sure to provide an appropriate fail-safe function to prevent secondary product damage

caused by malfunction.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.

Display of ordering codes for EPCOS products

The ordering code for one and the same EPCOS product can be represented differently in data

Temperature measurement B57703M

Probe assemblies M703

Page 7 of 12Please read Cautions and warnings and

Important notes at the end of this document.

sheets, data books, other publications, on the EPCOS website, or in order-related documents

such as shipping notes, order confirmations and product labels. The varying representations of

the ordering codes are due to different processes employed and do not affect the

specifications of the respective products. Detailed information can be found on the Internet

under www.epcos.com/orderingcodes

Temperature measurement B57703M

Probe assemblies M703

Page 8 of 12Please read Cautions and warnings and

Important notes at the end of this document.

Symbols and terms

Symbol English German

A Area Fläche

AWG American Wire Gauge Amerikanische Norm für Drahtquerschnitte

B B value B-Wert

B25/100 B value determined by resistance

measurement at 25 °C and 100 °C

B-Wert, ermittelt durch Widerstands-

messungen bei 25 °C und 100 °C

Cth Heat capacitance Wärmekapazität

I Current Strom

N Number (integer) Anzahl (ganzzahliger Wert)

P25 Maximum power at 25 °C Maximale Leistung bei 25 °C

Pdiss Power dissipation Verlustleistung

Pel Electrical power Elektrische Leistung

Pmax Maximum power within stated

temperature range

Maximale Leistung im

angegebenenTemperaturbereich

∆RB/RBResistance tolerance caused by

spread of B value

Widerstandstoleranz, die durch die

Streuung des B-Wertes verursacht wird

Rins Insulation resistance Isolationswiderstand

RPParallel resistance Parallelwiderstand

RRRated resistance Nennwiderstand

∆RR/RRResistance tolerance Widerstandstoleranz

RSSeries resistance Serienwiderstand

RTResistance at temperature T

(e.g. R25 = resistance at 25 °C)

Widerstand bei Temperatur T

(z.B. R25 = Widerstand bei 25 °C)

T Temperature Temperatur

∆TTemperature tolerance Temperaturtoleranz

tTime Zeit

TAAmbient temperature Umgebungstemperatur

Tmax Upper category temperature Obere Grenztemperatur

(Kategorietemperatur)

Tmin Lower category temperature Untere Grenztemperatur

(Kategorietemperatur)

Top Operating temperature Betriebstemperatur

TRRated temperature Nenntemperatur

Tsurf Surface temperature Oberflächentemperatur

V Voltage Spannung

Vins Insulation test voltage Isolationsprüfspannung

Vop Operating voltage Betriebsspannung

Vtest Test voltage Prüfspannung

Temperature measurement B57703M

Probe assemblies M703

Page 9 of 12Please read Cautions and warnings and

Important notes at the end of this document.

Symbol English German

αTemperature coefficient Temperaturkoeffizient

∆Tolerance, change Toleranz, Änderung

δth Dissipation factor Wärmeleitwert

τcThermal cooling time constant Thermische Abkühlzeitkonstante

τaThermal time constant Thermische Zeitkonstante

Abbreviations / Notes

Symbol English German

Surface-mounted devices Oberflächenmontierbares Bauelement

*To be replaced by a number in ordering

codes, type designations etc.

Platzhalter für Zahl im Bestellnummern-

code oder für die Typenbezeichnung.

+To be replaced by a letter. Platzhalter für einen Buchstaben.

All dimensions are given in mm. Alle Maße sind in mm angegeben.

The commas used in numerical values

denote decimal points.

Verwendete Kommas in Zahlenwerten

bezeichnen Dezimalpunkte.

Temperature measurement B57703M

Probe assemblies M703

Page 10 of 12Please read Cautions and warnings and

Important notes at the end of this document.

Page 11 of 12

Important notes

The following applies to all products named in this publication:

1. Some parts of this publication contain statements about the suitability of our products for

certain areas of application. These statements are based on our knowledge of typical

requirements that are often placed on our products in the areas of application concerned. We

nevertheless expressly point out that such statements cannot be regarded as binding

statements about the suitability of our products for a particular customer application. As a

rule we are either unfamiliar with individual customer applications or less familiar with them than

the customers themselves. For these reasons, it is always ultimately incumbent on the customer

to check and decide whether a product with the properties described in the product specification is

suitable for use in a particular customer application.

2. We also point out that in individual cases, a malfunction of electronic components or failure

before the end of their usual service life cannot be completely ruled out in the current state

of the art, even if they are operated as specified. In customer applications requiring a very high

level of operational safety and especially in customer applications in which the malfunction or

failure of an electronic component could endanger human life or health (e.g. in accident

prevention or life-saving systems), it must therefore be ensured by means of suitable design of the

customer application or other action taken by the customer (e.g. installation of protective circuitry

or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or

failure of an electronic component.

3. The warnings, cautions and product-specific notes must be observed.

4. In order to satisfy certain technical requirements, some of the products described in this

publication may contain substances subject to restrictions in certain jurisdictions (e.g.

because they are classed as hazardous). Useful information on this will be found in our Material

Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more

detailed questions, please contact our sales offices.

5. We constantly strive to improve our products. Consequently, the products described in this

publication may change from time to time. The same is true of the corresponding product

specifications. Please check therefore to what extent product descriptions and specifications

contained in this publication are still applicable before or when you place an order.

We also reserve the right to discontinue production and delivery of products. Consequently,

we cannot guarantee that all products named in this publication will always be available.

The aforementioned does not apply in the case of individual agreements deviating from the

foregoing for customer-specific products.

6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms

and Conditions of Supply.

7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.

The IATF certifications confirm our compliance with requirements regarding the quality

management system in the automotive industry. Referring to customer requirements and

customer specific requirements (“CSR”) TDK always has and will continue to have the policy of

respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of

unilateral requirements, we hereby like to emphasize that only requirements mutually agreed

upon can and will be implemented in our Quality Management System. For clarification

purposes we like to point out that obligations from IATF 16949 shall only become legally binding if

individually agreed upon.

Page 12 of 12

Important notes

8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,

DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK,

MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar,

SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse,

WindCap are trademarks registered or pending in Europe and in other countries. Further

information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.

Release 2018-10