Sep.2000
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Symbol Ratings Units
Junction Temperature Tj-40 to 150 °C
Storage Temperature T stg -40 to 125 °C
Collector-Emitter Voltage (G-E SHORT) VCES 1200 Volts
Gate-Emitter Voltage (C-E SHORT) VGES ±20 Volts
Collector Current (Tc = 25°C) IC200 Amperes
Peak Collector Current (Tj ≤ 150°C) ICM 400* Amperes
Emitter Current** (Tc = 25°C) IE200 Amperes
Peak Emitter Current** IEM 400* Amperes
Maximum Collector Dissipation (Tc = 25°C) Pc1130 Watts
Mounting Torque, M6 Main Terminal – 3.5~4.5 N · m
Mounting Torque, M6 Mounting – 3.5~4.5 N · m
Weight – 400 Grams
Isolation Voltage (Main Terminal to Baseplate, AC 1 min.) Viso 2500 Vrms
* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tj(max) rating.
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current ICES VCE = VCES, VGE = 0V – – 1 mA
Gate Leakage Voltage IGES VGE = VGES, VCE = 0V – – 0.5 µA
Gate-Emitter Threshold Voltage VGE(th) IC = 20mA, VCE = 10V 4.5 6 7.5 Volts
Collector-Emitter Saturation Voltage VCE(sat) IC = 200A, VGE = 15V, Tj = 25°C – 2.9 3.7 Volts
IC = 200A, VGE = 15V, Tj = 125°C – 2.85 – Volts
Total Gate Charge QGVCC = 600V, IC = 200A, VGE = 15V – 750 – nC
Emitter-Collector Voltage* VEC IE = 200A, VGE = 0V – – 3.2 Volts
* Pulse width and repetition rate should be such that the device junction temperature (Tj) does not exceed Tj(max) rating.
Dynamic Electrical Characteristics, TTj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance Cies ––30nF
Output Capacitance Coes VCE = 10V, VGE = 0V – – 10.5 nF
Reverse Transfer Capacitance Cres ––6nF
Resistive Tur n-on Delay Time td(on) VCC = 600V, IC = 200A, – – 200 ns
Load Rise Time trVGE1 = VGE2 = 15V, – – 300 ns
Switch Tur n-off Delay Time td(off) RG = 1.6Ω, Resistive – – 300 ns
Times F all Time tfLoad Switching Operation – – 350 ns
Diode Reverse Recovery Time trr IE = 200A, diE/dt = -400A/µs––300ns
Diode Reverse Recovery Charge Qrr IE = 200A, diE/dt = -400A/µs – 1.1 – µC
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case Rth(j-c)Q Per IGBT 1/2 Module – – 0.11 °C/W
Thermal Resistance, Junction to Case Rth(j-c)D Per FWDi 1/2 Module – – 0.18 °C/W
Contact Thermal Resistance Rth(c-f) Per Module, Ther mal Grease Applied – 0.020 – °C/W
MITSUBISHI IGBT MODULES
CM200DU-24H
HIGH POWER SWITCHING USE
INSULA TED TYPE