This is information on a product in full production.
July 2015 DocID023215 Rev 6 1/10
10
BAL-NRF01D3
50 Ω nominal input / conjugate match balun to nRF51422-QFAA,
nRF24LE1, nRF51822-QFAA/AB, with integrated harmonic filter
Datasheet − production data
Features
•50 Ω nominal input / conjugate match to Nordic
Semiconductor chips nRF24LE1 QFN32,
nRF24AP2-1CH, nRF24AP2-8CH,
nRF51422-QFAA (build code CA/C0),
nRF51822-QFAA (build code CA/C0) and
nRF51822-QFAB (build code AA/A0)
•Low insertion loss
•Low amplitude imbalance
•Low phase imbalance
•Small footprint: < 1.5 mm2
Benefits
•Very low profile: < 595 µm after reflow
•High RF performance
•RF BOM and area reduction
Applications
•2.45 GHz impedance matched balun filter
•Optimized for Nordic's chip set
nRF24LE1/AP2, nRF51422-QFAA (build code
CA/C0), nRF51822-QFAA (build code CA/C0)
and nRF51822-QFAB (build code AA/A0).
Description
STMicroelectronics BAL-NRF01D3 is an
ultraminiature balun. The BAL-NRF01D3
integrates matching network and harmonics filter.
Matching impedance has been customized for the
following Nordic Semiconductor circuits:
nRF24LE1 QFN-32 pins, nRF24AP2-1CH,
nRF24AP2-8CH, nRF51422-QFAA (build code
CA/C0), nRF51822-QFAA (build code CA/C0)
and nRF51822-QFAB (build code AA/A0).
The BAL-NRF01D3 uses STMicroelectronics IPD
technology on non-conductive glass substrate
which optimize RF performance.
The BAL-NRF01D3 has been tested and
approved by Nordic Semiconductor in their
nRF2723 and nRF2752 nRFgo modules.
Figure 1. Pinout diagram (top view)
Lead-free Flip-Chip package
5 bumps
SE
DIFF
DIFF VCC
GND A
B
C
12
3
www.st.com
Characteristics BAL-NRF01D3
2/10 DocID023215 Rev 6
1 Characteristics
Table 1. Absolute maximum rati ng s (limiting values)
Symbol Parameter Value Unit
Min. Typ. Max.
PIN Input Power RFIN 20 dBm
VESD
ESD ratings MIL STD883C
(HBM: C = 100 pF, R = 1.5 k Ω, air discharge) 2000
V
ESD ratings charge device model (JESD22-C101-C) 500
ESD ratings machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH) 200
TOP Operating temperature -40 +105 °C
Table 2. I m pedanc es (Tamb = 25 °C)
Symbol Parameter Value Unit
Min. Typ. Max.
ZOUT Nominal differential output impedance
conjugate match to:
– nRF24LE1/AP2
– nRF51422-QFAA
(build code CA/C0)
– nRF51822-QFAA
(build code CA/C0)
– nRF51822-QFAB
(build code AA/A0)
Ω
ZIN Nominal input impedance 50 Ω
Table 3. RF performan ce (Tamb = 25 ° C)
Symbo l Parameter Test condi ti on Value Unit
Min. Typ. Max.
F Frequency range (bandwidth) 2400 2540 MHz
ILInsertion loss in bandwidth 2.25 dB
RLReturn loss in bandwidth 10 dB
φimb Phase imbalance 3 °
Aimb Amplitude imbalance 0.1 dB
2f0 2nd harmonic filtering 4880 MHz 10 dB
3f0 3rd harmonic filtering 7320 MHz 20 dB
DocID023215 Rev 6 3/10
BAL-NRF01D3 Characteristics
1.1 On-board simulations
Figure 2. Transmissi on (Tamb = 25 °C ) Figure 3. Return loss on SE port
(Tamb = 25 °C)
F (GHz)
-0
-5
-10
-15
-20
-25
-30
dB
01 2 345678
2.40 2.44 2.47 2.49 2.50
-5
-7.5
-10
-12.5
-15
2.41 2.42 2.43 2.45 2.46 2.48
F (GHz)
dB
Fi gure 4. Ret ur n l oss on DIFF port
(Tamb = 25 °C ) Figure 5. Amplitude imbalance (Tamb = 25 °C)
-20
-25
-30
-35
-40
-45
F (GHz)
2.40 2.44 2.47 2.49 2.50
2.41 2.42 2.43 2.45 2.46 2.48
dB
0.5
0.3
0.1
0.0
-0.2
-0.4
-0.5
dB
F (GHz)
2.40 2.44 2.47 2.49 2.50
2.41 2.42 2.43 2.45 2.46 2.48
0.4
0.2
-0.1
-0.3
Figure 6. Phase imbalance (Tamb = 25 °C)
10
6
degrees
F (GHz)
2.40 2.44 2.47 2.49 2.50
2.41 2.42 2.43 2.45 2.46 2.48
8
4
0
2
-4
-2
-6
-10
-8
Application information BAL-NRF01D3
4/10 DocID023215 Rev 6
2 Application information
Figure 7. Application schematic (courtesy of Nordic Semiconductor)
Figure 8. nRF2723 application board (courtesy of Nordic Semiconductor)
BAL-NRF01D3
BAL-NRF01D3
DocID023215 Rev 6 5/10
BAL-NRF01 D3 Application information
Figure 9. nRF2752 application board (courtesy of Nordic Semiconductor)
Pack age informa tion BAL-NRF01D3
6/10 DocID023215 Rev 6
3 Package information
•Epoxy meets UL94, V0
•Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 10. Packag e dim ension s (top and side view )
Figure 11. Marking
600 µm219 µm
219 µm 205 µm
SE
GND
VCC
DIFF
DIFF
1000 ± 50 µm
500 µm
1500 ± 50µm
500 µm
433 µm
400 µm
630 µm ± 60
x
y
x
w
z
w
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing
location
yww = datecode
DocID023215 Rev 6 7/10
BAL-NRF01 D3 Packag e information
Figure 12. Flip Chip tape and reel specifications
Note: More information is available in the STMicroelectronics Application notes:
AN2348 Flip-Chip: “Package desc ription and recommendations for use”
AN4111: “BAL-NRF01D3 matched balun with integrated harmonics filter for
Nordic Sem icond uc tor chips with ultralow power transceivers”
Dot identifying Pin A1 location
User direction of unreeling
All dimensions are typical values in mm
4.0
4.0
2.0
8.0
1.75
3.5
Ø 1.55
0.71
1.1
0.22
1.57
ST ST ST
xxz xxz xxz
yww yww yww
Pack age informa tion BAL-NRF01D3
8/10 DocID023215 Rev 6
Fi gur e 13. Footpri nt - 3 m i ls stenci l -non solder
ma sk def ine d Figure 14. Foo tprint - 3 mils stencil - solder
mask defined
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PUHFRPPHQGHG
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6ROGHUVWHQFLORSHQLQJ
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&RSSHUSDGGLDPHWHU
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Fi gur e 15. Footpri nt - 5 m i ls stenci l -non solder
ma sk def ine d Figure 16. Foo tprint - 5 mils stencil - solder
mask defined
GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP
&RSSHUSDGGLDPHWHU
PUHFRPPHQGHG
PPLQLPXP
PPD[LPXP
6ROGHUPDVNRSHQLQJ
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PPLQLPXP
PPD[LPXP
6ROGHUVWHQFLORSHQLQJ
PUHFRPPHQGHG
GHSHQGLQJRQSDVWHLWFDQJRGRZQWRP
&RSSHUSDGGLDPHWHU
PUHFRPPHQGHG
PPLQLPXP
PPD[LPXP
6ROGHUPDVNRSHQLQJ
PUHFRPPHQGHG
PPLQLPXP
6ROGHUVWHQFLORSHQLQJ
PUHFRPPHQGHG
DocID023215 Rev 6 9/10
BAL-NRF01 D3 Ordering information
4 Ordering information
5 Revision history
Table 4. Ordering information
Order code Marking Weight Base Qty Delivery mode
BAL-NRF01D3 SC 1.82 mg 5000 Tape and Reel
Table 5. Document revision history
Date Revision Changes
15-Oct-2012 1 Initial release
13-Nov-2012 2 Added references to nRF51 series. Added Figure 9. Updated y-axis
labels in Figure 2.
04-Mar-2013 3 Updated footprint illustrations in Figure 13, and Figure 14.
06-Aug-2013 4 Added dimensions in Figure 10. Updated marking orientation in
Figure 11 and Figure 12.
13-Jan-2014 5 Updated document title and product references.
07-Jul-2015 6 Updated Table 1.
BAL-NRF01D3
10/10 DocID023215 Rev 6
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