WED48S8030E
2White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
February, 2002
Rev. 2
INPUT/OUTPUT FUNCTIONAL DESCRIPTION
Symbol Type Signal Polarity Function
CK Input Pulse Positive Edge The system clock input. All of the SDRAM inputs are sampled on the rising edge of the clock.
CKE Input Level Active High Activates the CK signal when high and deactivates the CK signal when low. By deactivating the clock,
CKE low initiates the Power Down mode, Suspend mode, or the Self Refresh mode.
CE# Input Pulse Active Low CE# disable or enable device operation by masking or enabling all inputs except CK, CKE and DQM.
RAS#, CAS#
WE#
Input Pulse Active Low When sampled at the positive rising edge of the clock, CAS#, RAS#, and WE# define the operation to
be executed by the SDRAM.
BA0,BA1 Input Level — Selects which SDRAM bank is to be active.
A0-11,
A10/AP
Input Level — During a Bank Activate command cycle, A0-11 defines the row address (RA0-11) when sampled at the
rising clock edge. During a Read or Write command cycle, A0-7 defines the column address (CA0-7)
when sampled at the rising clock edge. In addition to the row address, A10/AP is used to invoke
Autoprecharge operation at the end of the Burst Read or Write cycle. If A10/AP is high, autoprecharge
is selected and BA0, BA1 defines the bank to be precharged . If A10/AP is low, autoprecharge is
disabled.
During a Precharge command cycle, A10/AP is used in conjunction with BA0, BA1 to control which
bank(s) to precharge. If A10/AP is high, all banks will be precharged regardless of the state of BA0,
BA1. If A10/AP is low, then BA0, BA1 is used to define which bank to precharge.
DQ0-15 Input/
Output
Level — Data Input/Output are multiplexed on the same pins
DQM
Input Pulse Mask
Active High
The Data Input/Output mask places the DQ buffers in a high impedance state when sampled high.
In Read mode, DQM has a latency of two clock cycles and controls the output buffers like an output
enable. In Write mode, DQM has a latency of zero and operates as a word mask by allowing input data
to be written if it is low but blocks the Write operation if DQM is high.
VCC, VSS Supply Power and ground for the input buffers and the core logic.
VCCQ, VSSQ Supply Isolated power and ground for the output buffers to improve noise immunity.
Recommended DC Operating Conditions
(Voltage Referenced to: VSS = 0V, TA = 40°C to +85°C)
Absolute Maximum Ratings
Parameter Symbol Min Typ Max Unit
Supply Voltage VCC 3.0 3.3 3.6 V
Input High Voltage VIH 2.0 3.0 VCC +0.3 V
Input Low Voltage VIL -0.3 — 0.8 V
Output High Voltage (IOH = -2mA) VOH 2.4 — — V
Output Low Voltage (IOL = 2mA) VOL — — 0.4 V
Input Leakage Voltage IIL -10 — 10 µA
Output Leakage Voltage IOL -10 — 10 µA
Capacitance
(TA = 25°C, f = 1MHz, VCC = 3.3V to 3.6V)
Parameter Symbol Min Max Units
Power Supply Voltage VCC -1.0 +4.6 V
Input Voltage VIN -1.0 +4.6 V
Output Voltage VOUT -1.0 +4.6 V
Operating Temperature TOPR -40 +85 °C
Storage Temperature TSTG -55 +125 °C
Power Dissipation PD— 1.0 W
Short Circuit Output Current IOS — 50 mA
Stress greater than those listed under "Absolute Maximum Ratings" may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions greater than those indicated
in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
Parameter Symbol Max Unit
Input Capacitance CI1 4 pF
Input Capacitance (CK, CKE,
RAS#, CAS#, WE#, CE#, DQM)
C12 4 pF
Input/Output Capacitance (DQ) COUT 5 pF