TBD62304A series TOSHIBA BiCD Integrated Circuit Silicon Monolithic TBD62304APG, TBD62304AFNG, TBD62304AFWG 7-ch low active sink type DMOS transistor array TBD62304A series are DMOS transistor arrays with 7 circuits. Please be careful about thermal conditions during use. TBD62304APG Features * Built-in 7 circuits * High voltage : VOUT = 50 V (max) * High current * Input voltage (output on) : IOUT = 500 mA/ch (max) : -20 V to VCC-3.5 V * Input voltage (output off) : VCC-0.4 V to VCC * Package : PG type FNG type FWG type DIP16-P-300-2.54A DIP16-P-300-2.54A SSOP16-P-225-0.65B P-SOP16-0410-1.27-002 TBD62304AFNG SSOP16-P-225-0.65B Pin Assignment (top view) TBD62304AFWG O1 O2 O3 O4 O5 O6 O7 VCC I1 I2 I3 I4 I5 I6 I7 GND P-SOP16-0410-1.27-002 Weight DIP16-P-300-2.54A :1.13 g (typ.) SSOP16-P-225-0.65B :0.07 g (typ.) P-SOP16-0410-1.27-002 :0.15 g (typ.) Pin connection may be omitted partially or simplified for explanatory purpose. (c)2017 Toshiba Corporation 1 2017-03-24 TBD62304A series Pin Descriptions Pin No. Pin name Function 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 I1 I2 I3 I4 I5 I6 I7 GND VCC O7 O6 O5 O4 O3 O2 O1 Input pin Input pin Input pin Input pin Input pin Input pin Input pin Ground pin Power supply pin Output pin Output pin Output pin Output pin Output pin Output pin Output pin Basic Circuit VCC OUTPUT INPUT Basic circuit may be omitted partially or simplified for explanatory purpose. 2 2017-03-24 TBD62304A series Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Power supply voltage VCC -0.5 to 6.0 V Output voltage VOUT 50 V Output current (per ch) IOUT 500 mA Input voltage VIN -22 to VCC+0.5 (Note4) V Power dissipation 1.47 PG (Note1) FNG (Note2) PD W 0.78 FWG (Note3) 1.25 Operating temperature Topr -40 to 85 C Storage temperature Tstg -55 to 150 C Note1: Standalone. When Ta exceeds 25 C, it is necessary to do the derating with 11.8 mW/C. Note2: On PCB (size: 50 mm x 50 mm x 1.6 mm, Cu area: 40 %, single-side glass epoxy). When Ta exceeds 25 C, it is necessary to do the derating with 6.24 mW/C. Note3: On PCB (compliant with JEDEC 2s2p). When Ta exceeds 25 C, it is necessary to do the derating with 10 mW/C. Note4: Do not exceed 6 V Operating Ranges (Ta = -40 to 85C, unless otherwise specified.) Characteristics Symbol Test conditions Min Typ. Max Unit Power supply voltage VCC 4.5 5.0 5.5 V Output voltage VOUT 50 V 1 circuit ON, Ta = 25 C 0 400 Duty = 10 % 0 400 Duty = 50 % 0 190 0 400 Duty = 10 % 0 300 Duty = 50 % 0 130 0 400 Duty = 10 % 0 390 Duty = 50 % 0 170 -20 VCC-3.5 V VCC-0.4 VCC V tpw = 25 ms 7 circuits ON Ta = 85 C Tj = 120 C PG (Note1) 1 circuit ON, Ta = 25 C Output current (per ch) FNG (Note2) IOUT tpw = 25 ms 7 circuits ON Ta = 85 C Tj = 120 C 1 circuit ON, Ta = 25 C FWG (Note3) tpw = 25 ms 7 circuits ON Ta = 85 C Tj = 120 C Input voltage (Output on) VIN (ON) IOUT = 100 mA or more, VOUT = 2 V Input voltage (Output off) VIN (OFF) IOUT = 100 A or less, VOUT = 2 V mA Note1: Stand alone Note2: On PCB (size: 50 mm x 50 mm x 1.6 mm, Cu area: 40 %, single-side glass epoxy). Note3: On PCB (compliant with JEDEC 2s2p) 3 2017-03-24 TBD62304A series Electrical Characteristics (Ta = 25C, unless otherwise specified.) Characteristics Symbol Test Circuit Output leakage current Ileak 1 Output voltage VDS (Output ON-resistance) (RON) Input current Consumption current (per ch) 2 Test conditions Min Typ. Max Unit VOUT = 50 V, Ta = 85 C VIN = VCC = 5.5 V 1.0 A IOUT = 350 mA VCC = 5.0 V, VIN = 0 V 0.525 (1.5) 1.14 (3.25) IOUT = 200 mA, VCC = 5.0 V, VIN = 0 V 0.3 (1.5) 0.65 (3.25) IOUT = 100 mA VCC = 5.0 V, VIN = 0 V 0.15 (1.5) 0.325 (3.25) VCC = 5.5 V, VIN = 0 V -10 -100 VCC = 5.5 V, VIN = -20 V -100 -200 V () A IIN(ON) 3 IIN(OFF) 4 VCC = VIN = 5.5 V 1.0 A ICC(ON) 3 VCC = 5.5 V, VIN = 0 V 70 200 A ICC(OFF) 4 VCC = 5.5 V, VIN = VCC 1.0 A VCC = 5.0 V, VOUT = 50 V RL = 125 CL = 15 pF 0.6 0.6 Turn-on delay tON Turn-off delay tOFF 5 4 s 2017-03-24 TBD62304A series Test Circuit 2. VDS (RON) 1. Ileak VCC VCC OUTPUT INPUT VCC VIN OUTPUT INPUT Ileak VOUT VCC IOUT VDS VIN GND GND RON = VDS / IOUT 3. IIN (ON), ICC (ON) 4. IIN (OFF), ICC (OFF) VCC ICC(ON) VCC VCC OUTPUT INPUT IIN(ON) VIN ICC(OFF) VCC GND OUTPUT INPUT IIN(OFF) VIN GND Test circuits may be omitted partially or simplified for explanatory purpose. 5 2017-03-24 TBD62304A series 5. tON, tOFF (Note 1) (Note 2) tf tr Note1: Pulse width 50 s, Duty cycle 10 % Output impedance 50 , tr 5 ns, tf 10 ns, VIH = 5.0 V Note2: CL includes capacitance of the probe and the test board. Test circuits and timing charts may be omitted partially or simplified for explanatory purpose. Precautions for Using This IC does not incorporate built-in protection circuits for excess current or over voltage. Therefore, if the short-circuit between adjacent pins or between outputs, the short-to-power or ground fault has occurred, the current or voltage beyond the absolute maximum rating is impressed, and IC may be destroyed. When designing, please consider enough in power supply line, output line, and GND line. In addition, so as not to continue to flow a current that exceeds the absolute maximum rating of the IC, please insert the appropriate fuse in the power supply line. 6 2017-03-24 TBD62304A series Package Dimensions DIP16-P-300-2.54A Unit: mm Weight: 1.13 g (typ.) SSOP16-P-225-0.65B Unit: mm Weight: 0.07 g (typ.) 7 2017-03-24 TBD62304A series P-SOP16-0410-1.27-002 Unit: mm Weight: 0.15 g (typ.) 8 2017-03-24 TBD62304A series Notes on Contents 1. Pin Connection Pin connection may be simplified for explanatory purpose. 2. Equivalent Circuit Equivalent circuit may be simplified for explanatory purpose. 3. Test Circuit Test circuit may be simplified for explanatory purpose. 4. Timing Chart Timing charts may be simplified for explanatory purposes. IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. (2) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is applied even just once. (3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as from input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is appropriately radiated, in order not to exceed the specified junction temperature (Tj) at any time or under any condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor's power supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 9 2017-03-24 TBD62304A series RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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