TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
features
D
Dual-Input, Single-Output MOSFET Switch
With No Reverse Current Flow (No Parasitic
Diodes)
D
IN1 . . . 250-mΩ, 500-mA N-Channel;
18-µA Supply Current
D
IN2 . . . 1.3-Ω, 100-mA P-Channel;
0.75-µA Supply Current (VAUX Mode)
D
Advanced Switch Control Logic
D
CMOS and TTL Compatible Enable Input
D
Controlled Rise, Fall, and Transition Times
D
2.7 V to 5.5 V Operating Range
D
SOT-23-5 and SOIC-8 Package
D
–40°C to 85°C Ambient Temperature Range
D
2-kV Human Body Model, 750-V Charged
Device Model, 200-V Machine-Model
ESD Protection
typical applications
D
Notebook and Desktop PCs
D
Cell phone, Palmtops, and PDAs
D
Battery Management
description
The TPS2104 and TPS2105 are dual-input, single-output power switches designed to provide uninterrupted
output voltage when transitioning between two independent power supplies. Both devices combine one
n-channel (250 mΩ) and one p-channel (1.3 Ω) MOSFET with a single output. The p-channel MOSFET (IN2)
is used with auxiliary power supplies that deliver lower current for standby modes. The n-channel MOSFET
(IN1) is used with a main power supply that delivers higher current required for normal operation. Low
on-resistance makes the n-channel the ideal path for higher main supply current when power-supply regulation
and system voltage drops are critical. When using the p-channel MOSFET, quiescent current is reduced to
0.75 µA to decrease the demand on the standby power supply. The MOSFETs in the TPS2104 and TPS2105
do not have the parasitic diodes, typically found in discrete MOSFETs, thereby preventing back-flow current
when the switch is off.
DBV PACKAGE
(TOP VIEW)
GND
IN2
IN1
OUT
EN
GND
IN2
IN1
OUT
EN
DBV PACKAGE
(TOP VIEW)
TPS2104
TPS2105
NC – No internal connection
1
2
3
4
8
7
6
5
IN2
GND
EN
NC
OUT
OUT
NC
IN1
D PACKAGE
(TOP VIEW)
D PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
IN2
GND
EN
NC
OUT
OUT
NC
IN1
1
2
3
5
4
1
2
3
5
4
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Figure 1. Typical Dual-Input Single-Output
Application
TPS2104
IN1
IN2
EN
5 V VCC
5 V VAUX
Control Signal Holdup
Capacitor
LOAD
5 V
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Selection Guide, VAUX Power-Distribution Switches
DEVICE ENABLE OPERATING
VOLTAGE RANGE
(V)
MAXIMUM INPUT
CURRENT, IN1
(mA)
MAXIMUM INPUT
CURRENT, IN2
(mA)
AMBIENT TEMPERATURE
RANGE (°C)
TPS2100 EN 2.7 to 4 500 10 –40 to 70
TPS2101 EN 2.7 to 4 500 10 –40 to 70
TPS2102 EN 2.7 to 4 500 100 –40 to 70
TPS2103 EN 2.7 to 4 500 100 –40 to 70
TPS2104 EN 2.7 to 5.5 500 100 –40 to 85
TPS2105 EN 2.7 to 5.5 500 100 –40 to 85
AVAILABLE OPTIONS FOR TPS2104, TPS2105
PACKAGED DEVICES
TADEVICE ENABLE SOT-23-5
(DBV)†SOIC-8
(D)
40
°
C to 85
°
C
TPS2104 EN TSP2104DBV†TPS2104D
–
40°C
to
85°C
TPS2105 EN TPS2105DBV†TPS2105D
Both packages are available left-end taped and reeled. Add an R suffix to the D device type
(e.g., TPS2105DR).
†Add T (e.g., TPS2104DBVT) to indicate tape and reel at order quantity of 250 parts.
Add R (e.g., TPS2104DBVR) to indicate tape and reel at order quantity of 3000 parts.
Function Tables
TPS2104 TPS2105
VIN1 VIN2 EN OUT VIN1 VIN2 EN OUT
0 V 0 V XX GND 0 V 0 V XX GND
0 V 5 V L GND 0 V 5 V H GND
5 V 0 V L VIN1 5 V 0 V H VIN1
5 V 5 V L VIN1 5 V 5 V H VIN1
0 V 5 V H VIN2 0 V 5 V L VIN2
5 V 0 V H VIN2 5 V 0 V L VIN2
5 V 5 V H VIN2 5 V 5 V L VIN2
XX = don’t care
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPS2104 functional block diagram
VCC
Select
Charge
Pump
Driver
GND
OUT
SW2
1.3 Ω
SW1
250 mΩ
Pullup
Circuit
Driver
IN1
EN
IN2
Discharge
Circuit
TPS2105 functional block diagram
VCC
Select
Charge
Pump
Driver
GND
OUT
SW2
1.3 Ω
SW1
250 mΩ
Driver
IN1
EN
IN2
Pulldown
Circuit
Discharge
Circuit
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
NO.
DESCRIPTION
NAME TPS2104 TPS2105 I/O
DESCRIPTION
DBV D DBV D
EN 1 3 I Active-high enable for IN1-OUT switch
EN 1 3 I Active-low enable for IN1-OUT switch
GND 2 2 2 2 I Ground
IN1†5 5 5 5 I Main input voltage, NMOS drain (250 mΩ), require 0.22 µF bypass
IN2†3 1 3 1 I Auxilliary input voltage, PMOS drain (1.3 Ω), require 0.22 µF bypass
OUT 47, 8 47, 8 OPower switch output
NC 4, 6 4, 6 No connection
†Unused INx should not be grounded.
detailed description
power switches
n-channel MOSFET
The IN1-OUT n-channel MOSFET power switch has a typical on-resistance of 250 mΩ at 5-V input voltage, and
is configured as a high-side switch.
p-channel MOSFET
The IN2-OUT p-channel MOSFET power switch has a typical on-resistance of 1.3 Ω at 5-V input voltage and
is configured as a high-side switch. When operating, the p-channel MOSFET quiescent current is reduced to
typically 0.75 µA.
charge pump
An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate
of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires
very little supply current.
driver
The driver controls the gate voltage of the IN1-OUT and IN2-OUT power switches. To limit large current surges
and reduce the associated electromagnetic interference (EMI) produced, the drivers incorporate circuitry that
controls the rise times and fall times of the output voltage.
enable
The logic enable will turn on the IN2-OUT power switch when a logic high is present on EN (TPS2104) or logic
low is present on EN (TPS2105). A logic low input on EN (TPS2104) or logic high on EN (TPS2105) restores
bias to the drive and control circuits and turns on the IN1-OUT power switch. The enable input is compatible
with both TTL and CMOS logic levels.
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Input voltage range, VI(IN1) (see Note 1) –0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI(IN2) (see Note 1) –0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI at EN or EN (see Note 1) –0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) –0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO(IN1) 700 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO(IN2) 140 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See dissipation rating table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature range, TJ –40°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . .
Electrostatic discharge (ESD) protection: Human body model 2 kV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Machine model 200 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charged device model 750 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: All voltages are with respect to GND.
DISSIPATION RATING TABLE
PACKAGE TA < 25°C
POWER RATING DERATING F ACTOR
ABOVE TA = 25°CTA = 70°C
POWER RATING TA = 85°C
POWER RATING
DBV 309 mW 3.1 mW/°C170 mW 123 mW
D568 mW 5.7 mW/°C313 mW 227 mW
recommended operating conditions
MIN MAX UNIT
Input voltage, VI(INx) 2.7 5.5 V
Input voltage, VI at EN and EN 0 5.5 V
Continuous output current, IO(IN1) 500 mA
Continuous output current, IO(IN2) 100‡mA
Operating virtual junction temperature, TJ–40 125 °C
‡The device can deliver up to 220 mA at IO(IN2). However, operation at the higher current levels will result in greater voltage drop across the device,
and greater voltage droop when switching between IN1 and IN2.
electrical characteristics over recommended operating junction temperature range,
VI(IN1) = V(IN2) = 5 V, IO = rated current (unless otherwise noted)
power switch
PARAMETER TEST
CONDITIONS†MIN TYP MAX UNIT
IN1 OUT
TJ = 25°C 250
mΩ
rDS( )
On state resistance
IN1
-
OUT
TJ = 125°C 350 435
mΩ
r
DS(on)
On
-
state
resistance
IN2 OUT
TJ = 25°C 1.3
Ω
IN2
-
OUT
TJ = 125°C 1.5 2.4
Ω
†Pulse-testing techniques maintain junction temperature close to ambient termperature; thermal ef fects must be taken into account separately .
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating junction temperature range,
VI(IN1) = V(IN2) = 5 V, IO = rated current (unless otherwise noted) (continued)
enable input (EN and EN)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH High-level input voltage 2.7 V ≤ VI(INx) ≤ 5.5 V 2 V
VIL Low-level input voltage 2.7 V ≤ VI(INx) ≤ 5.5 V 0.8 V
II
In
p
ut current
TPS2104 EN = 0 V or EN = VI(INx) –0.5 0.5 µA
I
I
Inp
u
t
c
u
rrent
TPS2105 EN = 0 V or EN = VI(INx) –0.5 0.5 µA
supply current
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
EN = H
,
TJ = 25°C 0.75
µA
TPS2104
EN
H,
IN2 selected –40°C ≤TJ ≤125°C 1.5 µ
A
TPS2104
EN = L
,
TJ = 25°C 18
µA
II
Su
pp
ly current
EN
L,
IN1 selected –40°C ≤TJ ≤125°C 35 µ
A
I
I
S
u
ppl
y
c
u
rrent
EN = L, TJ = 25°C 0.75
µA
TPS2105
,
IN2 selected –40°C ≤TJ ≤125°C 1.5 µ
A
TPS2105
EN = H, TJ = 25°C 18
µA
,
IN1 selected –40°C ≤TJ ≤125°C 35 µ
A
switching characteristics, TJ = 25°C, VI(IN1) = VI(IN2) = 5 V (unless otherwise noted)†
PARAMETER TEST CONDITIONS†MIN TYP MAX UNIT
CL = 1 µF, IL = 500 mA 340
IN1-OUT VI(IN2) = 0 CL = 10 µF, IL = 500 mA 340
t
Out
p
ut rise time
()
CL = 1 µF, IL = 100 mA 312
µs
t
r
O
u
tp
u
t
rise
time
CL = 1 µF, IL = 100 mA 3.4 µ
s
IN2-OUT VI(IN1) = 0 CL = 10 µF, IL = 100 mA 34
()
CL = 1 µF, IL = 10 mA 3.5
CL = 1 µF, IL = 500 mA 6
IN1-OUT VI(IN2) = 0 CL = 10 µF, IL = 500 mA 108
tf
Out
p
ut fall time
()
CL = 1 µF, IL = 100 mA 8
µs
t
f
O
u
tp
u
t
fall
time
CL = 1 µF, IL = 100 mA 100 µ
s
IN2-OUT VI(IN1) = 0 CL = 10 µF, IL = 100 mA 990
()
CL = 1 µF, IL = 10 mA 1000
tPLH
Pro
p
agationdelaytime low to highout
p
ut
IN1-OUT VI(IN2) = 0
CL=10µF
IL= 100 mA
55
µs
t
PLH
Propagation
dela
y
time
,
lo
w-
to
-
high
o
u
tp
u
t
IN2-OUT VI(IN1) = 0
C
L =
10
µ
F
,
I
L =
100
mA
1µ
s
tPHL
Pro
p
agationdelaytime high to lowout
p
ut
IN1-OUT VI(IN2) = 0
CL=10µF
IL= 100 mA
1.5
µs
t
PHL
Propagation
dela
y
time
,
high
-
to
-
lo
w
o
u
tp
u
t
IN2-OUT VI(IN1) = 0
C
L =
10
µ
F
,
I
L =
100
mA
50 µ
s
†All timing parameters refer to Figure 2.
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
tPLH tPHL
EN or EN
VO
EN or EN
VO
50%
10%
VI
GND
GND
VI90%
50%
90%
10%
VOGND
VI
trtf
Propagation Delay Time, Low-to-High-Level Output Propagation Delay Time, High-to–Low-Level Output
Rise/Fall Time
ton toff
EN or EN
VO
EN or EN
VO
50%
10%
VI
GND
GND
VI
90%
50%
Turnon T ransition Time Turnoff T ransition Time
WAVEFORMS
OUT
CLIO
LOAD CIRCUIT
Figure 2. Test Circuit and Voltage Waveforms
Table of Timing Diagrams†
FIGURE
Propagation Delay and Rise Time With 1-µF Load, IN1 3
Propagation Delay and Rise T ime With 1-µF Load, IN2 4
Propagation Delay and Fall T ime With 1-µF Load, IN1 5
Propagation Delay and Fall T ime With 1-µF Load, IN2 6
†W aveforms shown in Figures 3–6 refer to TPS2104 at TJ = 25°C
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Figure 3. Propagation Delay and Rise Time
With 1-µF Load, IN1 Turnon
EN
(
2 V/div)
t – Time – 200 µs/div
VO
(
2 V/div)
VI(IN1) = 5 V
VI(IN2) = 0 V
CL = 1 µF
RL = 50 Ω
Figure 4. Propagation Delay and Rise Time
With 1-µF Load, IN2 Turnon
EN
(2 V/div)
t – Time – 2 µs/div
VO
(2 V/div)
VI(IN1) = 0 V
VI(IN2) = 5 V
CL = 1 µF
RL = 50 Ω
Figure 5. Propagation Delay and Fall Time
With 1-µF Load, IN1 Turnoff
EN
(2 V/div)
t – Time – 10 µs/div
VO
(2 V/div)
VI(IN1) = 5 V
VI(IN2) = 0 V
CL = 1 µF
RL = 50 Ω
Figure 6. Propagation Delay and Fall Time
With 1-µF Load, IN2 Turnoff
EN
(2 V/div)
t – Time – 50 µs/div
VO
(2 V/div)
VI(IN1) = 0 V
VI(IN2) = 5 V
CL = 1 µF
RL = 50 Ω
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
IN1 Switch Rise T ime vs Output Current 7
IN2 Switch Fall T ime vs Output Current 8
IN1 Switch Fall T ime vs Output Current 9
IN2 Switch Fall T ime vs Output Current 10
Output Voltage Droop vs Output Current When Output Is Switched From IN2 to IN1 11
Inrush Current vs Output Capacitance 12
IN1 Supply Current vs Junction Temperature (IN1 Enabled) 13
IN1 Supply Current vs Junction Temperature (IN1 Disabled) 14
IN2 Supply Current vs Junction Temperature (IN2 Enabled) 15
IN2 Supply Current vs Junction Temperature (IN2 Disabled) 16
IN1-OUT On-State Resistance vs Junction Temperature 17
IN2-OUT On-State Resistance vs Junction Temperature 18
Figure 7
310
280
250
0.01 0.1 1 10
– Rise Time –
340
370
IN1 SWITCH RISE TIME
vs
OUTPUT CURRENT
400
100 1000
CL = 47 µF
CL = 10 µF
CL = 1 µF
IO – Output Current – mA
trsµ
VI(IN1) = 5 V
VI(IN2) = 0 V
TJ = 25°CCL = 100 µF
Figure 8
10
0.1 0 102030405060
100
IN2 SWITCH RISE TIME
vs
OUTPUT CURRENT
1000
70 80 90 100
– Rise Time –
CL = 100 µF
CL = 47 µF
CL = 10 µF
CL = 1 µF
IO – Output Current – mA
trsµ
VI(IN1) = 0 V
VI(IN2) = 5 V
TJ = 25°C
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 9
100
10
1
0.01 0.1 1 10
1000
IN1 SWITCH FALL TIME
vs
OUTPUT CURRENT
10000
100 1000
– Fall Time –
CL = 100 µF
CL = 47 µF
CL = 10 µF
CL = 1 µF
IO – Output Current – mA
tfsµ
VI(IN1) = 5 V
VI(IN2) = 0 V
TJ = 25°C
Figure 10
10
1
0.1
0.01 0.1
100
IN2 SWITCH FALL TIME
vs
OUTPUT CURRENT
1000
1 100
– Output Fall Time – ms
IO – Output Current – mA
tf
VI(IN1) = 0 V
VI(IN2) = 5 V
TJ = 25°C
10
CL = 47 µF
CL = 10 µF
CL = 100 µF
CL = 1 µF
Figure 11
0.4
0.2
0
0.01 0.1
0.6
0.8
1
1 100
– Output Voltage Droop – V
OUTPUT VOLTAGE DROOP
vs
OUTPUT CURRENT WHEN OUTPUT
IS SWITCHED FROM IN2 TO IN1†
VO
CL = 100 µF
CL = 10 µF
CL = 1 µF
CL = 220 µF
IO – Output Current – mA
VI(IN1) = 5 V
VI(IN2) = 5 V
TJ = 25°C
CL = 47 µF
10
Figure 12
2
1
00 100 200 300
Inrush Current – A
2.5
3
INRUSH CURRENT
vs
OUTPUT CAPACITANCE
3.5
400 500
1.5
0.5
Co – Output Capacitance – µF
VI(IN1) = 5 V
VI(IN2) = 0 V
RL = 10 Ω
TJ = 25°C
†If switching from IN1 to IN2, the voltage droop is much smaller. Therefore, the load capacitance should be chosen according to the curves in
Figure 15.
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 13
17
13
9
–40 –10 20 50
– Supply Current –
21
IN1 SUPPLY CURRENT
vs
JUNCTION TEMPERATURE (IN1 ENABLED)
29
11080 140
ICC Aµ
VI(IN1) = 4 V
VI(IN1) = 2.7 V
TJ – Junction Temperature – °C
VI(IN1) = 5 V
VI(IN1) = 5.5 V
25
VI(IN1) = 3.3 V
Figure 14
0.37
0.31
0.19
–40 –10 20 50
0.43
0.49
IN1 SUPPLY CURRENT
vs
JUNCTION TEMPERATURE (IN1 DISABLED)
0.55
80 110 140
TJ – Junction Temperature – °C
0.25
VI(IN1) = 5.5 V
VI(IN1) = 5 V
VI(IN1) = 4 V
VI(IN1) = 3.3 V
VI(IN1) = 2.7 V
– Supply Current –ICC Aµ
Figure 15
0.47
0.41
0.35
–40 –10 20 50
0.53
0.59
IN2 SUPPLY CURRENT
vs
JUNCTION TEMPERATURE (IN2 ENABLED)
0.65
80 110 140
TJ – Junction Temperature – °C
VI(IN2) = 5.5 V
VI(IN2) = 4 V
VI(IN2) = 3.3 V
VI(IN2) = 2.7 V
VI(IN2) = 5 V
– Supply Current –ICC Aµ
Figure 16
0.21
0.18
0.15
–40 –10 20 50
0.24
0.27
IN2 SUPPLY CURRENT
vs
JUNCTION TEMPERATURE (IN2 DISABLED)
0.3
80 110 140
TJ – Junction Temperature – °C
VI(IN2) = 5.5 V
VI(IN2) = 5 V
VI(IN2) = 4 V
VI(IN2) = 3.3 V
VI(IN2) = 2.7 V
– Supply Current –ICC Aµ
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 17
280
240
200
–40 –10 20 50
– IN1-OUT On-State resistance –
320
IN1-OUT ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
360
80 110 140
ron mΩ
TJ – Junction Temperature – °C
VI(IN1) = 2.7 V
VI(IN1) = 3.3 V
VI(IN1) = 4 V
VI(IN1) = 5 V
VI(IN1) = 5.5 V
Figure 18
1.5
1
0.5
–40 –10 20 50
2
2.5
IN2-OUT ON-STATE RESISTANCE
vs
JUNCTION TEMPERATURE
3
80 110 140
– IN1-OUT On-State resistance –
ron Ω
VI(IN2) = 3.3 V
VI(IN2) = 2.7 V
TJ – Junction Temperature – °C
VI(IN2) = 5.5 V
VI(IN2) = 5 V
VI(IN2) = 4 V
APPLICATION INFORMATION
EN
IN1
IN2
OUT
GND
5 V VAUX
5 V VCC
CardBus or System Controller TPS2104
0.22 µF
0.22 µF1 µF xx µF
5 V
Figure 19. Typical Application
power-supply considerations
A 0.22-µF ceramic bypass capacitor between IN and GND, close to the device is recommended. The output
capacitor should be chosen based on the size of the load during the transition of the switch. A 220-µF capacitor
is recommended for 100-mA loads. Typical output capacitors (xx µF, shown in Figure 19) required for a given
load can be determined from Figure 1 1 which shows the output voltage droop when output is switched from IN2
to IN1. The output voltage droop is insignificant when output is switched from IN1 to IN2. Additionally, bypassing
the output with a 1-µF ceramic capacitor improves the immunity of the device to short-circuit transients.
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
power supply considerations (continued)
switch transition
The n-channel MOSFET on IN1 uses a charge pump to create the gate-drive voltage, which gives the IN1 switch
a rise time of approximately 0.4 ms. The p-channel MOSFET on IN2 has a simpler drive circuit that allows a
rise time of approximately 4 µs. Because the device has two switches and a single enable pin, these rise times
are seen as transition times, from IN1 to IN2, or IN2 to IN1, by the output. The controlled transition times help
limit the surge currents seen by the power supply during switching.
thermal protection
Thermal protection provided on the IN1 switch prevents damage to the IC when heavy-overload or short-circuit
faults are present for extended periods of time. The increased dissipation causes the junction temperature to
rise to dangerously high levels. The protection circuit senses the junction temperature of the switch and shuts
it off at approximately 145°C (TJ). The switch remains off until the junction temperature has dropped
approximately 10°C. The switch continues to cycle in this manner until the load fault or input power is removed.
undervoltage lockout
An undervoltage lockout function is provided to ensure that the power switch is in the off state at power up.
Whenever the input voltage falls below approximately 2 V, the power switch quickly turns off. This function
facilitates the design of hot-insertion systems that may not have the capability to turn off the power switch before
input power is removed. Upon reinsertion, the power switch will be turned on with a controlled rise time to reduce
EMI and voltage overshoots.
power dissipation and junction temperature
The low on-resistance on the n-channel MOSFET allows small surface-mount packages, such as SOIC, to pass
large currents. The thermal resistances of these packages are high compared to those of power packages; it
is good design practice to check power dissipation and junction temperature. First, find ron at the input voltage
and operating temperature. As an initial estimate, use the highest operating ambient temperature of interest and
read ron from Figure 17 or Figure 18. Next calculate the power dissipation using:
PD
+
ron
I2
Finally, calculate the junction temperature:
TJ
+
PD
R
q
JA
)
TA
Where:
TA = Ambient temperature
RθJA = Thermal resistance
Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees,
repeat the calculation using the calculated value as the new estimate. Two or three iterations are generally
sufficient to obtain a reasonable answer.
ESD protection
All TPS2104 and TPS2105 terminals incorporate ESD-protection circuitry designed to withstand a 2-kV
human-body-model, 750-V CDM, and 200-V machine-model discharge as defined in MIL-STD-883C.
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE
0,10
M
0,20
0,95
0°–8°
0,25
0,35
0,55
Gage Plane
0,15 NOM
4073253-4/E 05/99
2,60
3,00
0,50
0,30
1,50
1,70
45
31
2,80
3,00
0,95
1,45 0,05 MIN
Seating Plane
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC MO-178
TPS2104, TPS2105
VAUX POWER-DISTRIBUTION SWITCHES
SLVS235A – SEPTEMBER 1999 – REVISED APRIL 2000
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
4040047/D 10/96
0.228 (5,80)
0.244 (6,20)
0.069 (1,75) MAX 0.010 (0,25)
0.004 (0,10)
1
14
0.014 (0,35)
0.020 (0,51)
A
0.157 (4,00)
0.150 (3,81)
7
8
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.010 (0,25)
PINS **
0.008 (0,20) NOM
A MIN
A MAX
DIM
Gage Plane
0.189
(4,80)
(5,00)
0.197
8
(8,55)
(8,75)
0.337
14
0.344
(9,80)
16
0.394
(10,00)
0.386
0.004 (0,10)
M
0.010 (0,25)
0.050 (1,27)
0°–8°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPS2104DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2104DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2104DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2104DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2105D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2105DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2105DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2105DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2105DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS2105DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Jun-2008
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS2104DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS2104DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS2105DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS2105DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS2104DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TPS2104DBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TPS2105DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TPS2105DBVT SOT-23 DBV 5 250 182.0 182.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandClocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrolInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityRFID www.ti-rfid.com Telephony www.ti.com/telephonyRF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2008, Texas Instruments Incorporated
