TDA5051AT/C1,112 - NXP Semiconductors / Philips Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1997 Sep 19

File under Integrated Circuits, IC11

1999 May 31

INTEGRATED CIRCUITS

TDA5051A

Home automation modem

1999 May 31 2

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

FEATURES

•Full digital carrier generation and shaping

•Modulation/demodulation frequency set by clock

adjustment, from microcontroller or on-chip oscillator

•High clock rate of 6-bit A/D (Digital to Analog) converter

for rejection of aliasing components

•Fully integrated output power stage with overload

protection

•Automatic Gain Control (AGC) at receiver input

•8-bit A/D (Analog to Analog) converter and narrow

digital filtering

•Digital demodulation delivering baseband data

•Easy compliance with EN50065-1 with simple coupling

network

•Few external components for low cost applications

•SO16 plastic package.

APPLICATIONS

•Home appliance control (air conditioning, shutters,

lighting, alarms and so on)

•Energy/heating control

•Amplitude Shift Keying (ASK) data transmission using

the home power network.

GENERAL DESCRIPTION

The TDA5051A is a modem IC, specifically dedicated to

ASK transmission by means of the home power supply

network, at 600 or 1200 baud data rate. It operates from a

single 5 V supply.

QUICK REFERENCE DATA

Notes

1. Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator

frequency.

2. The minimum value can be improved by using an external amplifier, see application diagrams Figs 22 and 23.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VDD supply voltage 4.75 5.0 5.25 V

IDD(tot) total supply current fosc = 8.48 MHz

reception mode −28 38 mA

transmission mode (DATAIN =0) Z

L=30Ω−47 68 mA

power-down mode −19 25 mA

fcr carrier frequency note 1 95 132.5 148.5 kHz

fosc oscillator frequency 6.08 8.48 9.504 MHz

Vo(rms) output carrier signal on CISPR16 load

(RMS value) 120 −122 dBµV

Vi(rms) input signal (RMS value) note 2 82 −122 dBµV

THD total harmonic distortion on CISPR16

load with coupling network −−55 −dB

ZLload impedance 1 30 −Ω

BR baud rate −600 1200 bits/s

Tamb ambient temperature 0 −70 °C

1999 May 31 3

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

ORDERING INFORMATION

BLOCK DIAGRAM

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA5051AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

Fig.1 Block diagram.

handbook, full pagewidth

MGK832

DGND

AGND

VDDA VDDAP

TXOUT

RXIN

APGND

VDDD

311

ROM

DAC clock

filter clock

OSCILLATOR

DATAOUT

OSC2

OSC1

DIGITAL

DEMODULATOR

DIGITAL

BAND-PASS

FILTER

÷2

CONTROL LOGIC

D/A

modulated

carrier

TDA5051A

A/D

TEST1 SCANTEST

U/D

COUNT

PEAK

DETECT

POWER

DRIVE

WITH

PROTECTION

DATAIN

CLKOUT

1999 May 31 4

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

PINNING

SYMBOL PIN DESCRIPTION

DATAIN 1 digital data input (active LOW)

DATAOUT 2 digital data output (active LOW)

VDDD 3 digital supply voltage

CLKOUT 4 clock output

DGND 5 digital ground

SCANTEST 6 test input (LOW in application)

OSC1 7 oscillator input

OSC2 8 oscillator output

APGND 9 analog ground for power ampliﬁer

TXOUT 10 analog signal output

VDDAP 11 analog supply voltage for power

ampliﬁer

AGND 12 analog ground

VDDA 13 analog supply voltage

RXIN 14 analog signal input

PD 15 power-down input (active HIGH)

TEST1 16 test input (HIGH in application) Fig.2 Pin configuration.

handbook, halfpage

TDA5051AT

MGK833

DATAIN

DATAOUT

VDDD

CLKOUT

DGND

SCANTEST

OSC1

OSC2 APGND

TXOUT

VDDAP

AGND

VDDA

RXIN

TEST1

FUNCTIONAL DESCRIPTION

Both transmission and reception stages are controlled

either by the master clock of the microcontroller or by the

on-chip reference oscillator connected to a crystal. This

ensures the accuracy of the transmission carrier and the

exact trimming of the digital filter, thus making the

performance totally independent of application

disturbances such as component spread, temperature,

supply drift and so on.

The interface with the power network is made by means of

an LC network (see Fig.18). The device includes a power

output stage that feeds a 120 dBµV (RMS) signal on a

typical 30 Ωload.

To reduce power consumption, the IC is disabled by a

power-down input (pin PD): in this mode, the on-chip

oscillator remains active and the clock continues to be

supplied at pin CLKOUT. For low-power operation in

reception mode, this pin can be dynamically controlled by

the microcontroller, see Section “Power-down mode”.

When the circuit is connected to an external clock

generator (see Fig.6), the clock signal must be applied at

pin OSC1 (pin 7); OSC2 (pin 8) must be left open-circuit.

Fig.7 shows the use of the on-chip clock circuit.

All logic inputs and outputs are compatible with

TTL/CMOS levels, providing an easy connection to a

standard microcontroller I/O port.

The digital part of the IC is fully scan-testable. Two digital

inputs, SCANTEST and TEST1, are used for production

test: these pins must be left open-circuit in functional mode

(correct levels are internally defined by pull-up or

pull-down resistors).

Transmission mode

To provide strict stability with respect to environmental

conditions, the carrier frequency is generated by scanning

the ROM memory under the control of the microcontroller

clock or the reference frequency provided by the on-chip

oscillator. High frequency clocking rejects the aliasing

components to such an extent that they are filtered by the

coupling LC network and do not cause any significant

disturbance. The data modulation is applied through

pin DATAIN and smoothly applied by specific digital circuits

to the carrier (shaping). Harmonic components are limited

in this process, thus avoiding unacceptable disturbance of

the transmission channel (according to CISPR16 and

EN50065-1 recommendations). A −55 dB Total Harmonic

Distortion (TDH) is reached when the typical LC coupling

network (or an equivalent filter) is used.

1999 May 31 5

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

The DAC and the power stage are set in order to provide

a maximum signal level of 122 dBµV (RMS) at the output.

The output of the power stage (TXOUT) must always be

connected to a decoupling capacitor, because of a DC

level of 0.5VDD at this pin, which is present even when the

device is not transmitting. This pin must also be protected

against overvoltage and negative transient signals.

The DC level of TXOUT can be used to bias a unipolar

transient suppressor, as shown in the application diagram;

see Fig.18.

Direct connection to the mains is done through an LC

network for low-cost applications. However, a HF signal

transformer could be used when power-line insulation has

to be performed.

Reception mode

The input signal received by the modem is applied to a

wide range input amplifier with AGC (−6 to +30 dB). This is

basically for noise performance improvement and signal

level adjustment, which ensures a maximum sensitivity of

the ADC. An 8-bit conversion is then performed, followed

by digital band-pass filtering, to meet the CISPR

normalization and to comply with some additional

limitations met in current applications.

CAUTION

In transmission mode, the receiving part of the circuit is

not disabled and the detection of the transmitted signal

is normally performed. In this mode, the gain chosen

before the beginning of the transmission is stored, and

the AGC is internally set to −6dB as long as DATAIN

is LOW. Then, the old gain setting is automatically

restored.

After digital demodulation, the baseband data signal is

made available after pulse shaping.

The signal pin (RXIN) is a high-impedance input which has

to be protected and DC decoupled for the same reasons

as with pin TXOUT. The high sensitivity (82 dBµV) of this

input requires an efficient 50 Hz rejection filter (realized by

the LC coupling network), which also acts as an

anti-aliasing filter for the internal digital processing;

see Fig.18.

Data format

TRANSMISSION MODE

The data input (DATAIN) is active LOW: this means that a

burst is generated on the line (pin TXOUT) when DATAIN

pin is LOW.

Pin TXOUT is in a high-impedance state as long as the

device is not transmitting. Successive logic 1s are treated

in a Non-Return-to-Zero (NRZ) mode, see pulse shapes in

Figs 8 and 9.

RECEPTION MODE

The data output (pin DATAOUT) is active LOW; this means

that the data output is LOW when a burst is received.

Pin DATAOUT remains LOW as long as a burst is received.

Power-down mode

Power-down input (pin PD) is active HIGH; this means that

the power consumption is minimum when pin PD is HIGH.

Now, all functions are disabled, except clock generation.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is

desirable to take normal precautions appropriate to handling MOS devices.

SYMBOL PARAMETER MIN. MAX. UNIT

VDD supply voltage 4.5 5.5 V

fosc oscillator frequency −12 MHz

Tstg storage temperature −50 +150 °C

Tamb ambient temperature −10 +80 °C

Tjjunction temperature −125 °C

1999 May 31 6

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

CHARACTERISTICS

VDDD =V

DDA =5V±5%; Tamb = 0 to 70 °C; VDDD connected to VDDA; DGND connected to AGND.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

VDD supply voltage 4.75 5 5.25 V

IDD(RX/TX)(tot) total analog + digital

supply current VDD =5V±5%

TX or RX mode −28 38 mA

IDD(PD)(tot) total analog + digital

supply current; VDD =5V±5%;

PD = HIGH

Power-down mode

−19 25 mA

IDD(PAMP) power ampliﬁer supply

current VDD =5V±5%;

ZL=30Ω;

DATAIN = LOW

in transmission mode

−19 30 mA

IDD(PAMP)(max) maximum power ampliﬁer

supply current VDD =5V±5%;

ZL=1Ω;

DATAIN = LOW

in transmission mode

−76 −mA

DATAIN and PD inputs: DATAOUT and CLKOUT outputs

VIH HIGH-level input voltage 0.2VDD + 0.9 −VDD + 0.5 V

VIL LOW-level input voltage −0.5 −0.2VDD −0.1 V

VOH HIGH-level output voltage IOH =−1.6 mA 2.4 −− V

OL LOW-level output voltage IOL = 1.6 mA −−0.45 V

OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit

when using an external clock generator)

VIH HIGH-level input voltage 0.7VDD −VDD + 0.5 V

VIL LOW-level input voltage −0.5 −0.2VDD −0.1 V

VOH HIGH-level output voltage IOH =−1.6 mA 2.4 −− V

OL LOW-level output voltage IOL = 1.6 mA −−0.45 V

Clock

fosc oscillator frequency 6.080 −9.504 MHz

ratio between oscillator

and carrier frequency −64 −

ratio between oscillator

and clock output frequency −2−

Transmission mode

fcr carrier frequency fosc = 8.48 MHz −132.5 −kHz

tsu set-up time of the shaped

burst fosc = 8.48 MHz;

see Fig.8 −170 −µs

hhold time of the shaped

burst fosc = 8.48 MHz;

see Fig.8 −170 −µs

osc

fcr

--------

fosc

fCLKOUT

---------------------

1999 May 31 7

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

tW(DI)(min) minimum pulse width of

DATAIN signal fosc = 8.48 MHz;

see Fig.8 −190 −µs

o(rms) output carrier signal

(RMS value) ZL= CISPR16;

DATAIN = LOW 120 −122 dBµV

Io(max) power ampliﬁer maximum

output current (peak value) ZL=1Ω;

DATAIN = LOW −160 −mA

Zooutput impedance of the

power ampliﬁer −5−Ω

Ooutput DC level at

pin TXOUT

−2.5 −V

THD total harmonic distortion on

CISPR16 load with the

coupling network

(measured on the ﬁrst ten

harmonics)

Vo(rms) = 121 dBµV on

CISPR16 load;

fosc = 8.48 MHz;

DATAIN = LOW

(no modulation);

see Figs 3 and 16

−−55 −dB

B−20dB bandwidth of the shaped

output signal (at −20 dB)

on CISPR16 load with the

coupling network

Vo(rms) = 121 dBµV on

CISPR16 load;

fosc = 8.48 MHz;

DATAIN = 300 Hz;

duty factor = 50%;

see Fig.4

−3000 −Hz

Reception mode

Vi(rms) analog input signal

(RMS value) 82 −122 dBµV

VIDC level at pin RXIN −2.5 −V

ZiRXIN input impedance −50 −kΩ

RAGC AGC range −36 −dB

tc(AGC) AGC time constant fosc = 8.48 MHz;

see Fig.5 −296 −µs

d(dem)(su) demodulation delay set-up

time fosc = 8.48 MHz;

see Fig.15 −350 400 µs

td(dem)(h) demodulation delay hold

time fosc = 8.48 MHz;

see Fig.15 −420 470 µs

Bdet detection bandwidth fosc = 8.48 MHz −3−kHz

BER bit error rate fosc = 8.48 MHz;

600 baud; S/N = 35 dB;

signal 76 dBµV;

see Fig.17

−1−1×10−4

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

1999 May 31 8

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Power-up timing

td(pu)(TX) delay between power-up

and DATAIN in

transmission mode

XTAL = 8.48 MHz;

C1 = C2 = 27 pF;

Rp= 2.2 MΩ; see Fig.10

−1−µs

d(pu)(RX) delay between power-up

and DATAOUT in reception

mode

XTAL = 8.48 MHz;

C1 = C2 = 27 pF;

Rp= 2.2 MΩ;

fRXIN = 132.5 kHz;

120 dBµV sine wave;

see Fig.11

−1−µs

Power-down timing

td(pd)(TX) delay between PD = 0 and

DATAIN in transmission

mode

fosc = 8.48 MHz;

see Fig.12 −10 −µs

d(pd)(RX) delay between PD = 0 and

DATAOUT in reception

mode

fosc = 8.48 MHz;

fRXIN = 132.5 kHz;

120 dBµV sine wave;

see Fig.13

−500 −µs

active(min) minimum active time with

T = 10 ms power-down

period in reception mode

fosc = 8.48 MHz;

fRXIN = 132.5 kHz;

120 dBµV sine wave;

see Fig.14

−1−µs

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Fig.3 Carrier spectrum.

Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBµV (RMS); marker at −5 dBV (RMS) = 115 dBµV (RMS);

the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBµV (RMS).

book, full pagewidth

−100

MGK834

132.5 kHz

Vo(rms)

(dBV)

106

105f (Hz)

1999 May 31 9

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Fig.4 Shaped signal spectrum.

Resolution bandwidth = 100 Hz; B−20dB = 3000 Hz (2 ×1500 Hz).

handbook, full pagewidth

−60

117.5 132.5

dBV

(RMS)

147.5

f (kHz)

−10

MBH664

1500 Hz

20 dB

Fig.5 AGC time constant definition (not to scale).

handbook, full pagewidth

MGK011

VRXIN

V(I)

8.68 dB AGC range

tc(AGC)

(AGC time constant)

+30 dB

−6 dB

GAGC

modulated sine wave 122 dBµV amplitude

1999 May 31 10

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

TIMING

Conﬁguration for clock

Fig.6 External clock.

For parameter description, see Table 1.

handbook, full pagewidth

MGK835

MICRO-

CONTROLLER

CLKOUT

GND

TDA5051A

OSC1

DGND

XTAL

fosc 7

Fig.7 Typical configuration for on-chip clock circuit.

For parameter description, see Table 1.

handbook, full pagewidth

MGK836

MICRO-

CONTROLLER

CLKIN

GND

TDA5051A Rp

CLKOUT

DGND

OSC2

OSC1

XTAL

1/2 fosc 4

1999 May 31 11

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Table 1 Clock oscillator parameters

Table 2 Calculation of parameters depending on the clock frequency

OSCILLATOR

FREQUENCY

fosc

CARRIER FREQUENCY

fcr

CLOCK OUTPUT

FREQUENCY

1⁄2fosc

EXTERNAL COMPONENTS

6.080 to 9.504 MHz 95 to 148.5 kHz 3.040 to 4.752 MHz C1 = C2 = 27 to 47 pF;

Rp= 2.2 to 4.7 MΩ;

XTAL = standard quartz crystal

SYMBOL PARAMETER CONDITIONS UNIT

fosc oscillator frequency with on-chip oscillator: frequency of the crystal

quartz; with external clock: frequency of the

signal applied at OSC1

fCLKOUT clock output frequency 1⁄2fosc Hz

fcr carrier frequency/digital ﬁlter tuning

frequency 1⁄64fosc Hz

tsu set-up time of the shaped burst or s

thhold time of the shaped burst or s

tW(DI)(min) minimum pulse width of DATAIN signal tsu +s

tW(burst)(min) minimum burst time of VO(DC) signal tW(DI)(min) +t

c(AGC) AGC time constant s

tsu(demod) demodulation set-up time (≈max.) s

th(demod) demodulation hold time (≈max.) s

fcr

------ 1472

fosc

-------------

fcr

------ 1472

fosc

-------------

fcr

-----

2514

fosc

-------------

3200

fosc

-------------

3800

fosc

-------------

1999 May 31 12

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Table 3 Relationship between DATAIN and TXOUT

Note

1. X = don’t care.

PD DATAIN TXOUT

(1) high-impedance

0 1 high-impedance (after th)

0 0 active with DC offset

handbook, full pagewidth

MGK837

tW(burst)

tsu

VO(DC)

tW(burst)(min)

TXOUT

tW(DI) tW(DI)(min)

DATAIN

(1) (2) (3)

Fig.8 Relationship between DATAIN and TXOUT (see Table 3).

(1) tW(DI) >t

W(DI)(min).

(2) tW(DI)(min) =t

su +

(3) tW(DI)(min) <t

su; wrong operation.

fcr

-----

Fig.9 Pulse shape characteristics.

handbook, halfpage

MGK010

tW(burst)

tsu th

100%

1999 May 31 13

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Timing diagrams

Fig.10 Timing diagram during power-up in transmission mode.

DATAIN is an edge-sensitive input and must be HIGH before starting a transmission.

handbook, full pagewidth

MGK015

td(pu)(TX)

TXOUT

DATAIN

VDD 90% VDD

CLKOUT

HIGH

NOT DEFINED CLOCK STABLE

Fig.11 Timing diagram during power-up in reception mode.

handbook, full pagewidth

MGK016

td(pu)(RX) td(dem)(h)

RXIN

DATAOUT

VDD 90% VDD

CLKOUT

HIGH

NOT DEFINED

CLOCK STABLE

1999 May 31 14

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Fig.12 Power-down sequence in transmission mode.

handbook, full pagewidth

MGK017

td(pd)(TX)

normal operation wrong operation TXOUT delayed by PD

TXOUT

DATAIN

Fig.13 Power-down sequence in reception mode.

handbook, full pagewidth

MGK018

td(dem)(su) td(pd)(RX) td(pd)(RX)

DATAOUT delayed by PD

DATAOUT

RXIN

Fig.14 Power saving by dynamic control of power-down.

handbook, full pagewidth

MGK845

tactive(min)

IDD(RX)

IDD(PD)

IDD

DATAOUT

RXIN

1999 May 31 15

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

TEST INFORMATION

Fig.15 Test set-up for measuring demodulation delay.

handbook, full pagewidth

30 Ω

1 µF

10 nF

XTAL

DATAIN

DATAOUT

td(dem)(su) td(dem)(h)

DATAOUT

DATAIN

TXOUT/RXIN

OSCILLOSCOPE

TDA5051A

(to be tested)

pulse

generator

300 Hz

50%

TXOUT

RXIN

fosc

110

MGK838

1999 May 31 16

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal.

(1) Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3).

(2) DATAIN = LOW for measuring total harmonic distortion (see spectrum Fig.3).

(3) Tuned for fcr = 132.5 kHz.

(4) The CISPR16 network provides a −6 dB attenuation.

handbook, full pagewidth

MGK839

DATAIN

TDA5051A

POWER

SUPPLY SPECTRUM

ANALYSER

50 Ω

OSC1

OSC2 12, 5, 9

1 13, 3, 11

TXOUT

AGND, DGND, APGND

VDDA, VDDD, VDDAP 5 Ω

5 Ω

50 Ω

10 µF

33 nF 250 nF

250 nF

47 µH

50 µH

33 nF 47 µH

coupling

network(3) CISPR16

network(4)

+5 V

(2)(1)

1999 May 31 17

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Fig.17 Test set-up for measuring Bit Error Rate (BER).

(1) See Fig.16.

handbook, full pagewidth

MGK840

TDA5051A

(to be tested)

COUPLING

NETWORK

(1)

V24/TTL

INTERFACE

DATAOUT

DATAIN

RXIN out

TDA5051A COUPLING

NETWORK

(1)

SPECTRUM

ANALYSER

50 Ω

WHITE

NOISE

GENERATOR

12,

1OSC1 OSC2

OSC1 OSC2

TXOUT in

AGND, DGND, APGND

V24 SERIAL DATA

ANALYSER

PARAMETERS

600 BAUD

PSEUDO RANDOM SEQUENCE:

29−1 BITS LONG

DATAIN

DATAOUT

RXD

TXD

XTAL = 8.48 MHz

out

out ++

1999 May 31 18

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

APPLICATION INFORMATION

Fig.18 Application diagram without power line insulation.

fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.

handbook, full pagewidth

MGK841

250 V (A C)

max T 630 mA

1 mH

68 Ω

(2 W)

47 nF/X2

250 V (A C)

47 µH

low RS

MOV

250 V (A C)

47 nF

(63 V)

47 µH

100 µF

(16 V)

470 µF

(16 V) 7V5

(1.3 W) 1N4006

1N4006

2 µF

250 V (AC)

10 nF

VDDD VDDAP

APGND AGNDDGND

VDDA

RXIN

TXOUT

SA5.0A

1 µF

(16 V)

+5 V

MICRO-

CONTROLLER

7OSC1

XTAL

7.3728 MHz

2.2 MΩOSC2

85912

1311

47 nF

78L05

27 pF27 pF

DATAIN

DATAOUT

CLKOUT TDA5051A

1999 May 31 19

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (fcr = 115.2 kHz; L = 47 µH;

C = 47 nF).

Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the

sampling frequency (1⁄2fosc). Input impedance always higher than 10 Ω within the 95 to 148.5 kHz band.

handbook, full pagewidth

−20

−40

−60

−80

−100

MBH907

gain

(dB)

10210

102

103

103104105f (Hz)

input

impedance

(Ω)

106107

Fig.20 Output voltage as a function of line impedance (with coupling network; L = 47 µH; C = 47 nF).

handbook, halfpage

130

120

110

100

MBH908

110

(dBµV)

Zline (Ω)102

1999 May 31 20

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Fig.21 Application diagram with power line insulation.

fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.

handbook, full pagewidth

MGK842

250 V (AC)

max T 630 mA

1 VA 230 V

6 V

100 Ω

(0.5 W)

100 Ω

22 µH

1 µF

(16 V)

100 nF

(63 V)

NEWPORT

76250

470 nF/X2

250 V (AC)

47 µH

low RS

10 nF

100 µF

(16 V)

470 µF

(16 V)

VDDD VDDAP VDDA

RXIN

TXOUT

SA5.0A

+5 V

MICRO-

CONTROLLER

7OSC1

XTAL

7.3728 MHz

2.2 MΩOSC2

85912

1311

47 nF

FDB08

78L05

27 pF27 pF

TDA5051A

APGND AGNDDGND

DATAIN

DATAOUT

CLKOUT

MOV

250 V (AC)

1999 May 31 21

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Fig.22 Application diagram without power line insulation, with improved sensitivity (68 dBµV typ.).

fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.

handbook, full pagewidth

MGK843

250 V (A C)

max T 630 mA

1 mH

68 Ω

(2 W)

47 nF/X2

250 V (A C)

47 µH

low RS

MOV

250 V (A C)

47 nF

(63 V)

47 µH

100 µF

(16 V)

470 µF

(16 V) 7V5

(1.3 W) 1N4006

1N4006

2 µF

250 V (AC)

10 nF

VDDD VDDAP

APGND AGNDDGND

VDDA

RXIN

TXOUT

1 µF

(16 V)

+5 V

MICRO-

CONTROLLER

7OSC1

XTAL

7.3728 MHz

2.2 MΩOSC2

85912

1311

47 nF

78L05

27 pF27 pF

DATAIN

DATAOUT

CLKOUT TDA5051A

SA5.0A

1 kΩ33

kΩ

150

kΩ

10 nF

BC547B

1999 May 31 22

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Fig.23 Application diagram with power line insulation, with improved sensitivity (68 dBµV typ.).

fcr = 115.2 kHz for a XTAL = 7.3728 MHz standard crystal.

handbook, full pagewidth

MGK844

250 V (A C)

max T 630 mA

1 V A 230 V

6 V

100 Ω

(0.5 W)

100 µF

(16 V)

470 µF

(16 V)

VDDD VDDAP VDDA

+5 V

MICRO-

CONTROLLER

7OSC1

XTAL

7.3728 MHz

2.2 MΩOSC2

85912

1311

47 nF

FDB08

78L05

27 pF27 pF

TDA5051A

APGND AGNDDGND

DATAIN

DATAOUT

CLKOUT

MOV

250 V (A C)

10 nF

RXIN

TXOUT

SA5.0A

1 kΩ33

kΩ

150

kΩ

10 nF

BC547B

100 Ω

22 µH

1 µF

(16 V)

100 nF

(63 V)

NEWPORT

76250

470 nF/X2

250 V (A C)

47 µH

low RS

1999 May 31 23

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

PACKAGE OUTLINE

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

2.65 0.30

0.10 2.45

2.25 0.49

0.36 0.32

0.23 10.5

10.1 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1

0.4

SOT162-1

detail X

0.25

075E03 MS-013AA

pin 1 index

0.10 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.41

0.40 0.30

0.29 0.050

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

vMA

(A )

0 5 10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

95-01-24

97-05-22

1999 May 31 24

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable

for surface mount ICs, or for printed-circuit boards with

high population densities. In these situations reflow

soldering is often used.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

1999 May 31 25

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

Suitability of surface mount IC packages for wave and reﬂow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PACKAGE SOLDERING METHOD

WAVE REFLOW(1)

BGA, SQFP not suitable suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2) suitable

PLCC(3), SO, SOJ suitable suitable

LQFP, QFP, TQFP not recommended(3)(4) suitable

SSOP, TSSOP, VSO not recommended(5) suitable

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1999 May 31 26

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

NOTES

1999 May 31 27

Philips Semiconductors Product speciﬁcation

Home automation modem TDA5051A

NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999 65

Philips Semiconductors – a worldwide company

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Tel. +31 40 27 82785, Fax. +31 40 27 88399

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Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

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Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

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TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

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Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 62 5344, Fax.+381 11 63 5777

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,

5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

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Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

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Tel. +1 800 234 7381, Fax. +1 800 943 0087

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Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

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Tel. +60 3 750 5214, Fax. +60 3 757 4880

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Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Printed in The Netherlands 295002/25/02/pp28 Date of release: 1999 May 31 Document order number: 9397 750 05035