Description
The AMMC-3041 is a monolithic double balanced mixer
designed for commercial communication systems. The
AMMC- 3041 mixer is fabricated using a suspended
metal system to create a unique, broadside-coupled
balun structure (patent pending) to achieve exceptional
bandwidth. The broadband performance of the
AMMC-3041 can be used to advantage by replacing
conventional, narrow band mixers with a single device.
For improved reliability and moisture protection, the die
is passivated at the active areas.
Features
•Wide Frequency Range:
- RF, LO: 18 - 42 GHz
- IF: DC - 5 GHz
•Conversion Loss: 9.5 dB
•High IIP3: +22 dBm
•High Input P-1dB : +16 dBm
•Up or Down Conversion
Applications
•Point-to-Point Radio
•LMDS
•SATCOM
Chip Size Tolerance: ±10 µm (±0.4 mils)
Chip Size Tolerance: 10 µm (±0.4 mils)
Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils)
Pad Dimensions: 75 x 75 µm (3 ± 0.4 mils)
Note: These devices are ESD sensitive. The following precautions are strongly recommended:
Ensure that an ESD approved carrier is used when dice are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices.
AMMC-3041
18 - 42 GHz Double Balanced Mixer
Data Sheet
AMMC-3041 Absolute Maximum Ratings[1]
Symbol Parameters/Conditions Units Min. Max.
TbOperating Backside Temp. °C-55 +140
Tstg Storage Temp. °C-65 +165
Tmax Maximum Assembly °C+300
Temp. (60 sec. max.)
Note:
1. Operation in excess of any one of these conditions may result in
permanent damage to this device.
2
AMMC-3041 RF Specifications[1]
(Zo = 50 Ω, Tb = 25°C, IF = 2 GHz, LO Input Power = +14 dBm, RF Input Power = -20 dBm, except as noted.)
Symbol Parameters Test Conditions Units Minimum Typical Maximum
Lc Conversion Loss[1] Down Conversion 9.5 13
Up Conversion dB 9.0 13
IIP3 Input 3rd Order Intercept Point, fRF = 26 GHz dBm 23
Down Conversion[2] fRF = 38 GHz 22
P-1dB Input Power at 1 dB Conversion Down Conversion dBm 16
Loss Compression Up Conversion dBm 5
ISOLL-R LO - RF Isolation fLO = 26 GHz dB 44
fLO = 38 GHz 29
Notes:
1. 100% on-wafer RF test is done at RF frequency = 18, 22, 32, and 42 GHz.
2. ∆f = 2 MHz, RF Input Power = -10 dBm.
Spurious Mixing Products
fRF = 31 GHz, RF Input Power = -10 dBm,
fLO = 32 GHz, LO Input Power = +14 dBm.
n x LO
m x RF 0 1 2 3 4
0-17.9 - - -
143069--
2-8849 95 -
3--115 88 115
4---115 115
All values are dBc relative to the IF output power level.
3
AMMC-3041 Typical Performance
Zo=50 Ω, Tb = 25°C, IF = 2 GHz, LO Input Power = +14 dBm, RF Input Power = -20 dBm, except as noted.
Figure 6. Isolation, down conversion, LO freq. = RF - IFFigure 5. Input 3rd order intercept point, down conversion, LO
freq. = RF + IF
Figure 4. Output power at 1 dB conversion, loss compression, up
conversion, LO freq. = RF + IF
Figure 3. Output power at 1 dB conversion loss compression,
down conversion, LO freq. = RF + IF
Figure 2. Conversion loss, up conversion, LO freq. = RF - IFFigure 1. Conversion loss, down conversion, LO freq. = RF - IF
RF FREQUENCY (GHz)
CONVERSION LOSS (dB)
20 4222 24 26 28 30 32 34 36 38 40
14
13
12
11
10
9
8
LO = 14 dBm
LO = 15 dBm
LO = 16 dBm
RF FREQUENCY (GHz)
CONVERSION LOSS (dB)
20 4222 24 26 28 30 32 34 36 38 40
14
13
12
11
10
9
8
LO = 14 dBm
LO = 15 dBm
LO = 16 dBm
RF FREQUENCY (GHz)
P1dB (dBm)
18 4020 22 24 26 28 30 32 34 36 38
20
18
16
14
12
10
LO = 14 dBm
LO = 15 dBm
LO = 16 dBm
RF FREQUENCY (GHz)
P1dB (dBm)
18 4020 22 24 26 28 30 32 34 36 38
15
10
5
0
LO = 14 dBm
LO = 15 dBm
LO = 16 dBm
RF FREQUENCY (GHz)
IIP3 (dBm)
18 4020 22 24 26 28 30 32 34 36 38
35
30
25
20
15
10
RF FREQUENCY (GHz)
ISOLATION (dB)
18 4020 22 24 26 28 30 32 34 36 38
60
55
50
45
40
35
30
25
L-R Isolation
L-I Isolation
R-I Isolation
Applications Information
Operation of the AMMC- 3041 is very straightforward.
The RF, LO, and IF ports can be connected directly to
50 Ω circuits. None of the three ports should have a
DC voltage applied to them. If DC voltages are present,
a blocking capacitor should be used.
Some enhancement in Conversion Loss may be
obtained by reflectively terminating the LO and RF
signals at the IF port. This is easily done by connecting
a 20- mil long bond wire from the IF output pad on
the MMIC to a shunt, off-chip 0.5 pF chip capacitor as
indicated in Figure 7.
For up conversion applications, the input signal is nor-
mally applied to the IF port, the local oscillator
connected to the LO port, and the up-converted
output signal taken from the RF port.
Assembly Techniques
The backside of the AMMC- 3041 chip is RF ground. For
microstripline applications, the chip should be attached
directly to the ground plane (e.g., circuit carrier) using
electrically conductive epoxy[1].
For best performance, the topside of the MMIC should
be brought up to the same height as the circuit sur-
rounding it. This can be accomplished by mounting a
gold plated metal shim (same length and width as the
MMIC) under the chip, which is of the correct thickness
to make the chip and adjacent circuit coplanar.
The amount of epoxy used for chip and or shim attach-
ment should be just enough to provide a thin fillet
around the bottom perimeter of the chip or shim. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment.
For use on coplanar circuits, the chip can be mounted
directly on the topside ground plane of the circuit.
The location of the RF, LO, and IF bond pads is shown in
Figure 8. Note that all I/O ports are in a Ground-Signal-
Ground configuration. The IF port is located near the
middle of the die, which allows this connection to be
made from either side of the chip for maximum layout
flexibility.
RF connections should be kept as short as reasonable
to minimize performance degradation due to series in-
ductance. A single bond wire is sufficient for all signal
connections. However, doublebonding with 0.7 mil gold
wire or the use of gold mesh[2] is recommended for best
performance, especially near the high end of the fre-
quency range.
Thermosonic wedge bonding is the preferred method
for wire attachment to the bond pads. Gold mesh can
be attached using a 2 mil round tracking tool and a tool
force of approximately 22 grams with an ultrasonic
power of roughly 55 dB for a duration of 76 ± 8 mS.
Aguided wedge at an ultrasonic power level of 64 dB
can be used for the 0.7 mil wire. The recommended
wire bond stage temperature is 150 ± 2°C.
Caution should be taken to not exceed the Absolute
Maximum Rating for assembly temperature and time.
The chip is 100 µm thick and should be handled with
care. This MMIC has exposed air bridges on the top
surface and should be handled by the edges or with a
custom collet (do not pick up die with vacuum on die
center.)
This MMIC is also static sensitive and ESD handling pre-
cautions should be taken.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824.
4
Figure 7. AMMC-3041 schematic diagram
Ordering Information:
AMMC-3041-W10 = 10 devices per tray
AMMC-3041-W50 = 50 devices per tray
Figure 8. AMMC-3041 bonding pad locations
Dimensions are in microns.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
5989-3933EN March 29, 2007
RF
IF
LO
IF
0.5 pF
20 mil
bondwire
440
750
518
LO
RF
IF
0
045 540 960
10505400
IF
