Industrial and Multi-Market
Data Sheet
Revision 1.1, 2011-10-19
Final
ESD3V3XU1U Series
Uni-directional Ultra Low Capacitance ESD / Transient Protection Diode
ESD3V3XU1UL
ESD3V3XU1US
TVS Diode
Transient Voltage Suppressor Diodes
Edition 2011-10-19
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2011 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
ESD3V3XU1U Series
Final Data Sheet 3 Revision 1.1, 2011-10-19
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,
CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™,
MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,
PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™,
SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
Revision History
Page or Item Subjects (major cha nges since previous revision)
Revision 1.1, 2011-10-19 Table3-2; Table3-4; Figure3-4 updated
Revision 1.0 2011.09.07
ESD3V3XU1U Series
Table of Contents
Final Data Sheet 4 Revision 1.1, 2011-10-19
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1 Uni-directional Ultra Low Capacitance ESD / Transient Protection Diode . . . . . . . . . . . . . . . . . . 7
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.2 Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Electrical Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 Typical Characteristics at TA=25°C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.1 PG-TSLP-2-17 (mm) [3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.2 PG-TSSLP-2-1 (mm) [3] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table of Contents
ESD3V3XU1U Series
List of Figures
Final Data Sheet 5 Revision 1.1, 2011-10-19
Figure 2-1 Pin Configuration and Schematic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3-1 Definitions of electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 3-2 Forward current, IF = (VF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 3-3 Reverse current, IR = (VR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 3-4 Reverse voltage characteristic, IR = (VR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 3-5 Reverse current IR = f(TA), VR = 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 3-6 Line capacitance CL = f(VR), f = 1MHz, from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 3-7 IEC61000-4-2 VCL = f(t), 8 kV positive pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 3-8 IEC61000-4-2 VCL = f(t), 8 kV negative pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 3-9 IEC61000-4-2 VCL = f(t), 15 kV positive pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 3-10 IEC61000-4-2 VCL = f(t), 15 kV negative pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 3-11 Clamping voltage VTLP = f(ITLP), from pin 2 to pin 1 Note: [2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 3-12 Clamping voltage VTLP = f(ITLP), from pin 1 to pin 2 Note: [2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 3-13 Forward clamping voltage IPP = f(VFC), from pin 1 to pin 2 according to IEC61000-4-5 (8/20 μs) . 16
Figure 3-14 Reverse clamping voltage IPP = f(VCL), from pin 1 to pin 2 according to IEC61000-4-5 (8/20 μs) . 16
Figure 4-1 Single line, uni-directional ESD / Transient protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 5-1 PG-TSLP-2-17: Package overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 5-2 PG-TSLP-2-17: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 5-3 PG-TSLP-2-17: Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 5-4 PG-TSLP-2-17: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 5-5 PG-TSSLP-2-1: Package overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 5-6 PG-TSSLP-2-1: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 5-7 PG-TSSLP-2-1: Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 5-8 PG-TSSLP-2-1: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
List of Figures
ESD3V3XU1U Series
List of Tables
Final Data Sheet 6 Revision 1.1, 2011-10-19
Table 2-1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 3-1 Maximum Rating at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3-2 DC Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3-3 RF Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3-4 ESD Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
List of Tables
ESD3V3XU1U Series
Uni-directional Ultra Low Capacitance ESD / Transient Protection Diode
Final Data Sheet 7 Revision 1.1, 2011-10-19
1 Uni-directional Ultra Low Capacitance ESD / Transient Protection
Diode
1.1 Features
• ESD / transient protection of high speed data lines exceeding:
– IEC61000-4-2 (ESD): ±20 kV (air / contact)
– IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns)
– IEC61000-4-5 (surge): 3 A (8/20 μs)
• Maximum working voltage: VRWM = 3.3 V
• Ultra low capacitance CL = 0.4 pF (typical)
• Very low clamping voltage: VCL= 8 V at IPP = 16 A (typical) [2]
• Very low dynamic resistance: RDYN = 0.19 (typical) [2]
• Pb-free and halogen-free package (RoHS compliant)
1.2 Application Examples
• USB 3.0, 10/100/1000 Ethernet, Firewire, DVI, HDMI, S-ATA, DisplayPort
• Mobile HDMI Link, MDDI, MIPI, SWP / NFC
2 Product Description
Figure 2-1 Pin Configuration and Schematic Diagram
Table 2-1 Ordering Information
Type Package Configuration Marking code
ESD3V3XU1UL PG-TSLP-2-17 1 line, uni-directional X1
ESD3V3XU1US PG-TSSLP-2-1 1 line, uni-directional K
PG-TS(S)LP -2-Single_Die_diode_P inConf_and_SchematicDiag.vst. vs d
b) Schematic diagrama) Pin configuration
Pin 1 Pin 2
TSSLP -2
Pin 1 Pin 2
TSLP-2
Pin 1
Pin 2
Pin 1 marking
(lasered)
ESD3V3XU1U Series
Characteristics
Final Data Sheet 8 Revision 1.1, 2011-10-19
3 Characteristics
3.1 Electrical Characteristics at TA = 25 °C, unless otherwise specified
Figure 3-1 Definitions of electrical characteristics
Table 3-1 Maximum Rating at TA = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
Min. Typ. Max.
ESD (air / contact) discharge1)
1) VESD according to IEC61000-4-2 (R = 330 , C = 150 pF)
VESD ––20kV
Peak pulse current (tp = 8/20 μs)2)
2) IPP according to IEC61000-4-5
IPP ––3A
Operating temperature range TOP -40 – 125 °C
Storage temperature Tstg -65 – 150 °C
Table 3-2 DC Characteristics at TA = 25 °C, unless otherwise specified
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Reverse working voltage VRWM – – 3.3 V Pin 1 to Pin 2
Reverse current IR– 1 50 nA VR = 3.3 V,
from Pin 1 to Pin 2
Reverse breakdown
voltage
VBR –6.5–VIR = 1 mA
from Pin 1 to Pin 2
voltage forced
Diode_C haracteristic_Curve_with _snapback_Uni-directional .vs d
V
F
Forward voltage
I
F
Forward current
V
R
Reverse voltage
I
R
Reverse current
I
RWM
V
RWM
R
DYN
V
FC
V
Trig
I
Trig
I
PP
I
R
I
F
V
F
V
R
I
Hold
V
Hold
R
DYN
R
DYN
Dynamic resistance
-I
PP
V
CL
V
Trig
Triggering reverse voltage
V
Hold
Holding reverse voltage
V
RWM
Reverse working voltage maximum
V
FC
Forward clamping voltage
I
Trig
Triggering reverse current
I
Hold
Holding reverse current
I
RWM
Reverse working current maximum
I
PP
Peak pulse current
V
CL
Clamping voltage
ESD3V3XU1U Series
Characteristics
Final Data Sheet 9 Revision 1.1, 2011-10-19
Table 3-3 RF Characteristics at TA = 25 °C, unless otherwise specified
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Line capacitance CL– 0.4 0.65 pF VR = 0 V, f = 1 MHz
– 0.4 0.65 pF VR = 0 V, f = 1 GHz
Series inductance LS– 0.4 – nH ESD3V3XU1US
– 0.2 – nH ESD3V3XU1UL
Table 3-4 ESD Characteristics at TA = 25 °C, unless otherwise specified
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Trigger voltage1) [2] VTRIG –7.2–VTLP,
from Pin 1 to Pin 2
Reverse clamping
voltage1) [2]
1)Please refer to Application Note AN210. ANSI/ESD STM5.5.1 - Electrostatic Discharge Sensitivity Testing using
Transmission Line Pulse (TLP), tp = 100ns, tr = 0.6 ns, ITLP and VTLP averaging window: t1 = 30 ns to t2 = 60 ns,
extraction of dynamic TLP characteristic between IPP1 = 10 A and IPP2 = 40 A.
VCL –8–VTLP, IPP = 16 A,
from Pin 1 to Pin 2
–11–VTLP,
IPP = 30 A,
from Pin 1 to Pin 2
Forward clamping
voltage1) [2] VFC –6–VTLP, IPP = 16 A,
from Pin 2 to Pin 1
–9–VTLP,
IPP = 30 A,
from Pin 2 to Pin 1
Dynamic resistance1) [2] RDYN –0.19–ΩTLP, Pin 1 to Pin 2
–0.23–ΩTLP, Pin 2 to Pin 1
ESD3V3XU1U Series
Characteristics
Final Data Sheet 10 Revision 1.1, 2011-10-19
3.2 Typical Characteristics at TA=25°C, unless otherwise specified
Figure 3-2 Forward current, IF = (VF)
Figure 3-3 Reverse current, IR = (VR)
10-9
10-8
10-7
10-6
10-5
10-4
10-3
10-2
10-1
100
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
IF [A]
VF [V]
10-12
10-11
10-10
10-9
10-8
10-7
0 1 2 3 4
IR [A]
VR [V]
ESD3V3XU1U Series
Characteristics
Final Data Sheet 11 Revision 1.1, 2011-10-19
Figure 3-4 Reverse voltage characteristic, IR = (VR)
Figure 3-5 Reverse current IR = f(TA), VR = 3.3 V
10-12
10-11
10-10
10-9
10-8
10-7
10-6
10-5
10-4
10-3
0 1 2 3 4 5 6 7
IR [A]
VR [V]
10-9
10-8
10-7
10-6
25 50 75 100 125 150
IR [A]
TA [°C]
ESD3V3XU1U Series
Characteristics
Final Data Sheet 12 Revision 1.1, 2011-10-19
Figure 3-6 Line capacitance CL = f(VR), f = 1MHz, from pin 1 to pin 2
0.2
0.4
0.6
0.8
0 0.5 1 1.5 2 2.5 3 3.5
CL [pF]
VR [V]
ESD3V3XU1U Series
Characteristics
Final Data Sheet 13 Revision 1.1, 2011-10-19
Figure 3-7 IEC61000-4-2 VCL = f(t), 8 kV positive pulse from pin 1 to pin 2
Figure 3-8 IEC61000-4-2 VCL = f(t), 8 kV negative pulse from pin 1 to pin 2
-20
0
20
40
60
80
-100 0 100 200 300 400 500 600 700 800 900
VCL [V]
tp [ns]
Scope: 6 GHz, 20 GS/s
VCL-max-peak = 81 [V]
VCL-30ns-peak = 7 [V]
-80
-60
-40
-20
0
20
-100 0 100 200 300 400 500 600 700 800 900
VCL [V]
tp [ns]
Scope: 6 GHz, 20 GS/s
VCL-max-peak = -72 [V]
VCL-30ns-peak = -3 [V]
ESD3V3XU1U Series
Characteristics
Final Data Sheet 14 Revision 1.1, 2011-10-19
Figure 3-9 IEC61000-4-2 VCL = f(t), 15 kV positive pulse from pin 1 to pin 2
Figure 3-10 IEC61000-4-2 VCL = f(t), 15 kV negative pulse from pin 1 to pin 2
-20
0
20
40
60
80
100
-100 0 100 200 300 400 500 600 700 800 900
VCL [V]
tp [ns]
Scope: 6 GHz, 20 GS/s
VCL-max-peak = 104 [V]
VCL-30ns-peak = 9 [V]
-100
-80
-60
-40
-20
0
20
-100 0 100 200 300 400 500 600 700 800 900
VCL [V]
tp [ns]
Scope: 6 GHz, 20 GS/s
VCL-max-peak = -98 [V]
VCL-30ns-peak = -7 [V]
ESD3V3XU1U Series
Characteristics
Final Data Sheet 15 Revision 1.1, 2011-10-19
Figure 3-11 Clamping voltage VTLP = f(ITLP), from pin 2 to pin 1 Note: [2]
Figure 3-12 Clamping voltage VTLP = f(ITLP), from pin 1 to pin 2 Note: [2]
Note:TLP parameter: Z0 = 50
Ω
, tp = 100 ns, tr = 600 ps, averaging window: t1 = 30 ns to t2 = 60 ns, extraction of
dynamic resistance using least squares fit of TLP charactertistic between IPP1 = 10 A and IPP2 = 40 A. The
equivalent stress level VIEC according IEC 61000-4-2 (R = 330
Ω
, C = 150 pF) is calculated at the broad
peak of the IEC waveform at t = 30 ns with 2 A / kV
0
10
20
30
40
50
0 5 10 15 20
0
5
10
15
20
25
ITLP [A]
Equivalent VIEC [kV]
VTLP [V]
ESD3V3XU1U Series
RDYN
RDYN=0.23Ω
0
10
20
30
40
50
0 5 10 15 20
0
5
10
15
20
25
ITLP [A]
Equivalent VIEC [kV]
VTLP [V]
ESD3V3XU1U Series
RDYN
RDYN=0.19Ω
ESD3V3XU1U Series
Characteristics
Final Data Sheet 16 Revision 1.1, 2011-10-19
Figure 3-13 Forward clamping voltage IPP = f(VFC), from pin 1 to pin 2 accord ing to IEC6 1000-4- 5 (8/2 0 μs)
Figure 3-14 Reverse clamping voltage IPP = f(VCL), from pin 1 to pin 2 ac cor din g to IEC61 000-4 -5 (8 /2 0 μs)
-3
-2.5
-2
-1.5
-1
0 1 2 3 4 5
VFC [V]
IPP [A]
3
4
5
6
7
0 1 2 3 4 5
VCL [V]
IPP [A]
ESD3V3XU1U Series
Application Information
Final Data Sheet 17 Revision 1.1, 2011-10-19
4 Application Information
Figure 4-1 Single line, uni-directional ESD / Transient protection
Application_ESD3V3U1U-02xxx.vsd
ESD3V3XU1U Series
Package Information
Final Data Sheet 18 Revision 1.1, 2011-10-19
5 Package Information
5.1 PG-TSLP-2-17 (mm) [3]
Figure 5-1 PG-TSLP-2-17: Package overview
Figure 5-2 PG-TSLP-2-17: Footprint
Figure 5-3 PG-TSLP-2-17: Packing
Figure 5-4 PG-TSLP-2-17: Marking (example)
TSLP27PO V02
±0.05
0.6
1
2
±0.05
0.65
±0.035
0.25
1)
1
±0.05
0.05 MAX.
+0.01
0.39-0.03
1) Dimension applies to plated terminal
Cathode
marking
1)
±0.035
0.5
Bottom viewTop view
TSLP-2-7-FP V0
1
0.45
0.275 0.275
0.375
0.925
Copper Solder mask Stencil aperture
s
0.35
1
0.6
0.35
0.3
TSLP-2-7-TP V03
0.76
4
1.16
0.5
Orientation
marking
8
Type code
Cathode marking
12
ESD3V3XU1U Series
Package Information
Final Data Sheet 19 Revision 1.1, 2011-10-19
5.2 PG-TSSLP-2-1 (mm) [3]
Figure 5-5 PG-TSSLP-2-1: Package overview
Figure 5-6 PG-TSSLP-2-1: Footprint
Figure 5-7 PG-TSSLP-2-1: Packing
Figure 5-8 PG-TSSLP-2-1: Marking (example)
TSSLP-2-1,-2-PO V05
±0.035
0.32
1
2
±0.025
0.355
±0.025
0.2
1)
0.62
±0.035
+0.01
0.31-0.02
1) Dimension applies to plated terminal
Cathode
marking
1)
±0.025
0.26
Bottom viewTop view
0.27
0.19
0.19
0.19
Copper Solder maskStencil apertures
0.57
0.24
0.62
0.32
0.24
0.14
TSSLP-2-1,-2-FP V02
Ex
4
Ey
0.35
Cathode
marking
8
ag
TSSLP-2-1,-2-TP V03
Deliveries can be both tape types (no selection possible).
Specification allows identical processing (pick & place) by users.
Ex Ey
Punched Tape
Tape type
Embossed Tape
0.430.73
0.37 0.67
ESD3V3XU1U Series
References
Final Data Sheet 20 Revision 1.1, 2011-10-19
References
[1] On-chip ESD protection for integrated circuits, Albert Z. H. Wang, ISBN:0-7923-7647-1
[2] Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP
Characterization Methodology
[3] Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Package
ESD3V3XU1U Series
Terminology
Final Data Sheet 21 Revision 1.1, 2011-10-19
Terminology
CLLine capacitance
DVI Digital Visual Interface
EFT Electrical Fast Transient
ESD Electrostatic Discharge
HDMI High Definition Multimedia Interface
IEC International Electrotechnical Commission
IPP Peak pulse current
IRReverse current
IRWM Reverse working current maximum
MDDI Mobile Display Digital Interface
MIPI Mobile Industrial Processor Interface
NFC Near Field Communication
PCB Printed Circuit Board
RDYN Dynamic resistance
RoHS Restriction of Hazardous Substances Directive
S-ATA Serial Advanced Technology Attachment
SWP Single Wire Protocol
TAAmbient temperature
TLP Transmission Line Pulse
TOP Operation temperature
tpPulse duration
trPulse rise time
Tstg Storage temperature
USB Universal Serial Bus
VCL Reverse clamping voltage
VESD Electrostatic discharge voltage
VFC Forward Clamping Voltage
VHold Holding Voltage
VIEC Equivalent stress level according IEC61000-4-2 (R = 330 , C = 150 pF)
VRReverse voltage
VRWM Reverse working voltage maximum
VTrig Triggering Voltage
Z0Impedance
