Surface Mount Information (continued)
Lead Free Soldering
The –Z version Austin MiniLynx SMT modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may result
in the failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure. 39.
MSL Rating
The Austin MiniLynxTM SMT modules have a MSL rating of 2a.
Storage and Handling
The Austin MiniLynxTM modules have a MSL rating of 1. The
recommended storage environment and handling procedures
for moisture-sensitive surface mount packages is detailed in J-
STD-033 Rev. A (Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices). Moisture
barrier bags (MBB) with desiccant are required for MSL ratings
of 2 or greater. These sealed packages should not be broken
until time of use. Once the original package is broken, the
floor life of the product at conditions of 30°C and 60%
relative humidity varies according to the MSL rating (see J-
STD-033A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when stored
at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Board Mounted
Power Modules: Soldering and Cleaning Application Note
(AN04-001).