GE
Data Sheet
February 16, 2021
©2015 General Electric Company. All rights reserved.
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
Features
Compliant to RoHS Directive 2011/65/EU and amended
Directive (EU) 2015/863
Compliant to REACH Directive (EC) No 1907/2006
Delivers up to 3A output current
High efficiency 94% at 3.3V full load (VIN = 5.0V)
Small size and low profile:
20.3 mm x 11.4 mm x 7.27 mm
(0.80 in x 0.45 in x 0.286 in)
Low output ripple and noise
High Reliability:
Calculated MTBF = 11.9M hours at 25oC Full-load
Constant switching frequency (300 kHz)
Output voltage programmable from 0.75 Vdc to 3.63Vdc
via external resistor
Line Regulation: 0.4% (typical)
Load Regulation: 0.4% (typical)
Temperature Regulation: 0.4 % (typical)
Remote On/Off
Output overcurrent protection (non-latching)
Wide operating temperature range (-40°C to 85°C)
ANSI/UL* 62368-1 and CAN/ CSA C22.2 No. 62368-1
Recognized, DIN VDE 0868-1/A11:2017 (EN62368-
1:2014/A11:2017)
ISO** 9001 and ISO 14001 certified manufacturing
facilities
Applications
Distributed power architectures
Intermediate bus voltage applications
Telecommunications equipment
Servers and storage applications
Networking equipment
Enterprise Networks
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Description
Austin MiniLynxTM SMT (surface mount technology) power modules are non-isolated dc-dc converters that can deliver up to 3A
of output current with full load efficiency of 94.0% at 3.3V output. These modules provide a precisely regulated output voltage
programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide range of input voltage (VIN = 2.4 5.5Vdc). Their
open-frame construction and small footprint enable designers to develop cost- and space-efficient solutions.
* UL is a registered trademark of Underwriters Laboratories, Inc.
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only,
functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of
the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter
Device
Symbol
Min
Max
Unit
Input Voltage
All
VIN
-0.3
5.8
Vdc
Continuous
Operating Ambient Temperature
All
TA
-40
85
°C
(see Thermal Considerations section)
Storage Temperature
All
Tstg
-55
125
°C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Operating Input Voltage
VO,set ≤ VIN 0.5V
VIN
2.4
5.5
Vdc
Maximum Input Current
All
IIN,max
3.0
Adc
(VIN= VIN, min to VIN, max, IO=IO, max VO,set = 3.3Vdc)
Input No Load Current
VO,set = 0.75Vdc
IIN,No load
10
mA
(VIN = 5.0Vdc, IO = 0, module enabled)
VO,set = 3.3Vdc
IIN,No load
17
mA
Input Stand-by Current
All
IIN,stand-by
0.6
mA
(VIN = 5.0Vdc, module disabled)
Inrush Transient
All
I2t
0.04
A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See Test configuration section)
All
35
mAp-p
Input Ripple Rejection (120Hz)
All
30
dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of a complex
power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system
protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety
Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the
same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 3
Electrical Specifications (continued)
Parameter
Device
Symbol
Min
Typ
Max
Unit
Output Voltage Set-point
All
VO, set
-2.0
VO, set
+2.0
% VO, set
(VIN=IN, min, IO=IO, max, TA=25°C)
Output Voltage
All
VO, set
-3%
+3%
% VO, set
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Adjustment Range
All
VO
0.7525
3.63
Vdc
Selected by an external resistor
Output Regulation
Line (VIN=VIN, min to VIN, max)
All
0.4
% VO, set
Load (IO=IO, min to IO, max)
All
0.4
% VO, set
Temperature (Tref=TA, min to TA, max)
All
0.4
% VO, set
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max
Cout = 1μF ceramic//10μFtantalum capacitors)
RMS (5Hz to 20MHz bandwidth)
All
10
15
mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth)
All
25
50
mVpk-pk
External Capacitance
ESR 1 mΩ
All
CO, max
1000
μF
ESR 10 mΩ
All
CO, max
5000
μF
Output Current
All
Io
0
3
Adc
Output Current Limit Inception (Hiccup Mode )
All
IO, lim
220
% Io
(VO= 90% of VO, set)
Output Short-Circuit Current
All
IO, s/c
2
Adc
(VO250mV) ( Hiccup Mode )
Efficiency
VO,set =
0.75Vdc
η
81.5
%
VIN= VIN, nom, TA=25°C
VO, set = 1.2Vdc
η
87.0
%
IO=IO, max , VO= VO,set
VO,set = 1.5Vdc
η
89.0
%
VO,set = 1.8Vdc
η
90.0
%
VO,set = 2.5Vdc
η
93.0
%
VO,set = 3.3Vdc
η
94.0
%
Switching Frequency
All
fsw
300
kHz
Dynamic Load Response
(dIo/dt=2.5A/s; VIN = VIN, nom; TA=25°C)
All
Vpk
250
mV
Load Change from Io= 50% to 100% of Io,max; 1μF
ceramic// 10 μF tantalum
Peak Deviation
Settling Time (Vo<10% peak deviation)
All
ts
50
s
(dIo/dt=2.5A/s; VIN = VIN, nom; TA=25°C)
All
Vpk
250
mV
Load Change from Io= 100% to 50%of Io,max: 1μF
ceramic// 10 μF tantalum
Peak Deviation
Settling Time (Vo<10% peak deviation)
All
ts
50
s
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 4
Electrical Specifications (continued)
Parameter
Device
Symbol
Min
Typ
Max
Unit
Dynamic Load Response
(dIo/dt=2.5A/s; V VIN = VIN, nom; TA=25°C)
All
Vpk
60
mV
Load Change from Io= 50% to 100% of Io,max;
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation)
All
ts
100
s
(dIo/dt=2.5A/s; VIN = VIN, nom; TA=25°C)
All
Vpk
60
mV
Load Change from Io= 100% to 50%of Io,max:
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation)
All
ts
100
s
General Specifications
Parameter
Min
Typ
Max
Unit
Calculated MTBF (IO=IO, max, TA=25°C)
11,965,153
Hours
Weight
2.8 (0.1)
g (oz.)
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 5
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter
Device
Symbol
Min
Typ
Max
Unit
On/Off Signal interface
Device code with Suffix “4” – Positive logic
(On/Off is open collector/drain logic input;
Signal referenced to GND - See feature description section)
Input High Voltage (Module ON)
All
VIH
VIN, max
V
Input High Current
All
IIH
10
μA
Input Low Voltage (Module OFF)
All
VIL
-0.2
0.3
V
Input Low Current
All
IIL
0.2
1
mA
Device Code with no suffix Negative Logic
(On/OFF pin is open collector/drain logic input with
external pull-up resistor; signal referenced to GND)
Input High Voltage (Module OFF)
All
VIH
1.5
VIN,max
Vdc
Input High Current
All
IIH
0.2
1
mA
Input Low Voltage (Module ON)
All
VIL
-0.2
0.3
Vdc
Input low Current
All
IIL
10
μA
Turn-On Delay and Rise Times
(IO=IO, max , VIN = VIN, nom, TA = 25 oC, )
Case 1: On/Off input is set to Logic Low (Module
ON) and then input power is applied (delay from
instant at which VIN =VIN, min until Vo=10% of Vo,set)
All
Tdelay
3.9
msec
Case 2: Input power is applied for at least one second
and then the On/Off input is set to logic Low (delay from
instant at which Von/Off=0.3V until Vo=10% of Vo, set)
All
Tdelay
3.9
msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
All
Trise
4.2
8.5
msec
Output voltage overshoot Startup
1
% VO, set
IO= IO, max; VIN = 3.0 to 5.5Vdc, TA = 25 oC
Remote Sense Range
0.5
Overtemperature Protection
All
Tref
140
°C
(See Thermal Consideration section)
Input Undervoltage Lockout
Turn-on Threshold
All
2.2
V
Turn-off Threshold
All
2.0
V
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 6
Characteristic Curves
The following figures provide typical characteristics for the Austin MiniLynxTM SMT modules at 25ºC.
EFFICIENCY, (%)
70
73
76
79
82
85
88
91
94
0 0.6 1.2 1.8 2.4 3
VIN = 5.0V
VIN = 3.3V
VIN = 2.5V
EFFICIENCY, (%)
73
76
79
82
85
88
91
94
97
0 0.6 1.2 1.8 2.4 3
VIN = 5.0V
VIN = 3.3V
VIN = 2.5V
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT, IO (A)
Figure 1. Converter Efficiency versus Output Current (Vout =
0.75Vdc).
Figure 4. Converter Efficiency versus Output Current (Vout =
1.8Vdc).
EFFICIENCY, (%)
70
73
76
79
82
85
88
91
94
0 0.6 1.2 1.8 2.4 3
VIN = 5.0V
VIN = 3.3V
VIN = 2.5V
EFFICIENCY, (%)
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT, IO (A)
Figure 2. Converter Efficiency versus Output Current (Vout =
1.2Vdc).
Figure 5. Converter Efficiency versus Output Current (Vout =
2.5Vdc).
EFFICIENCY, (%)
72
75
78
81
84
87
90
93
96
0 0.6 1.2 1.8 2.4 3
VIN = 5.0V
VIN = 3.3V
VIN = 2.5V
EFFICIENCY, (%)
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT, IO (A)
Figure 3. Converter Efficiency versus Output Current (Vout =
1.5Vdc).
Figure 6. Converter Efficiency versus Output Current (Vout =
3.3Vdc).
74
77
80
83
86
89
92
95
98
0 0.6 1.2 1.8 2.4 3
VIN = 5.0V
VIN = 4.0V
VIN = 3.3V
75
78
81
84
87
90
93
96
99
0 0.6 1.2 1.8 2.4 3
VIN = 5.5V
VIN = 5.0V
VIN = 4.0V
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 7
Characteristic Curves (continued)
The following figures provide typical characteristics for the Austin MiniLynxTM SMT modules at 25ºC.
INPUT CURRENT, IIN (A)
0
0.5
1
1.5
2
2.5
3
3.5
0 1 2 3 4 5
Io=1.5A
Io=0A
Io=3A
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (100mV/div)
INPUT VOLTAGE, VIN (V)
TIME, t (20 s/div)
Figure 7. Input voltage vs. Input Current
(Vout =2.5Vdc).
Figure 10. Transient Response to Dynamic Load Change from
50% to 100% of full load (Vo = 3.3Vdc).
OUTPUT VOLTAGE
VO (V) (10mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (100mV/div)
TIME, t (1s/div)
TIME, t (20 s/div)
Figure 8. Typical Output Ripple and Noise
(VIN = 5.0V dc, Vo = 0.75Vdc, Io=3A).
Figure 11. Transient Response to Dynamic Load Change from
100% to 50% of full load (Vo = 3.3 Vdc).
OUTPUT VOLTAGE
VO (V) (10mV/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (20mV/div)
TIME, t (1s/div)
TIME, t (100s/div)
Figure 9. Typical Output Ripple and Noise
(VIN = 5.0V dc, Vo = 3.3Vdc, Io=3A).
Figure 12. Transient Response to Dynamic Load Change from
50% to 100% of full load (Vo = 3.3 Vdc, Cext = 2x150 μF
Polymer Capacitors).
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 8
Characteristic Curves (continued)
The following figures provide typical characteristics for the Austin MiniLynxTM SMT modules at 25ºC.
OUTPUT CURRENT, OUTPUTVOLTAGE
IO (A) (2A/div) VO (V) (20mV/div)
INPUT VOLTAG OUTPUT VOLTAGE VIN
(V) (2V/div) VO (V) (1V/div)
TIME, t (100s/div)
TIME, t (2ms/div)
Figure 13. Transient Response to Dynamic Load Change from
100% of 50% full load (Vo = 3.3Vdc, Cext = 2x150 μF Polymer
Capacitors).
Figure 16. Typical Start-Up with application of Vin
(VIN = 5.0Vdc, Vo = 3.3Vdc, Io = 3A).
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off(V) (2V/div) VO (V) (1V/div)
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off(V) (2V/div) VO (V) (0.5V/div)
TIME, t (2ms/div)
TIME, t (2ms/div)
Figure 14. Typical Start-Up Using Remote On/Off
(VIN = 5.0Vdc, Vo = 3.3Vdc, Io = 3A).
Figure 17 Typical Start-Up Using Remote On/Off with
Prebias (VIN = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias
=1.0Vdc).
ON/OFF VOLTAGE OUTPUT VOLTAGE
VOn/off(V) (2V/div) VO (V) (1V/div)
OUTPUT CURRENT,
IO (A) (5A/div)
TIME, t (2ms/div)
TIME, t (10ms/div)
Figure 15. Typical Start-Up Using Remote On/Off with Low-
ESR external capacitors (7x150uF Polymer)
(VIN = 5.0Vdc, Vo = 3.3Vdc, Io = 3A, Co = 1050F).
Figure 18. Output short circuit Current
(VIN = 5.0Vdc, Vo = 0.75Vdc).
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 9
Characteristic Curves (continued)
The following figures provide thermal derating curves for the Austin MiniLynxTM SMT modules.
OUTPUT CURRENT, Io (A)
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
OUTPUT CURRENT, Io (A)
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
AMBIENT TEMPERATURE, TA OC
AMBIENT TEMPERATURE, TA OC
Figure 19. Derating Output Current versus Local Ambient
Temperature and Airflow (VIN = 5.0, Vo=3.3Vdc).
Figure 22. Derating Output Current versus Local Ambient
Temperature and Airflow (VIN = 3.3dc, Vo=2.5 Vdc).
OUTPUT CURRENT, Io (A)
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
AMBIENT TEMPERATURE, TA OC
Figure 20. Derating Output Current versus Local Ambient
Temperature and Airflow (VIN = 5.0Vdc, Vo=1.8 Vdc).
Figure 23. Derating Output Current versus Local Ambient
Temperature and Airflow (VIN = 3.3dc, Vo=1.2 Vdc).
OUTPUT CURRENT, Io (A)
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
0
0.5
1
1.5
2
2.5
3
3.5
20 30 40 50 60 70 80 90
0 LFM
AMBIENT TEMPERATURE, TA OC
Figure 21. Derating Output Current versus Local Ambient
Temperature and Airflow (VIN = 5.0Vdc, Vo=0.75 Vdc).
Figure 24. Derating Output Current versus Local Ambient
Temperature and Airflow (VIN = 3.3dc, Vo=0.75 Vdc).
Test Configurations
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 10
TO OSCILLOSCOPE
CURRENT PROBE
LTEST
1μH
BATTERY
CS 1000μF
Electrolytic
E.S.R.<0.1
@ 20°C 100kHz
2x100μF
Tantalum
VIN(+)
COM
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 1μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
CIN
Figure 25. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
COM
1uF
.
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
Figure 26. Output Ripple and Noise Test Setup.
VO
COM
VIN(+)
COM
RLOAD
Rcontact
Rdistribution
Rcontact
Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN
VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 27. Output Voltage and Efficiency Test Setup.
=
VO.
IO
VIN.
IIN
x
100
%
Efficiency
Design Considerations
Input Filtering
The Austin MiniLynxTM SMT module should be connected to a
low-impedance source. A highly inductive source can affect
the stability of the module. An input capacitance must be
placed directly adjacent to the input pin of the module, to
minimize input ripple voltage and ensure module stability.
To minimize input voltage ripple, low-ESR polymer and
ceramic capacitors are recommended at the input of the
module. Figure 28 shows the input ripple voltage (mVp-p) for
various outputs with 1x22µF (TDK: C3225X5R0J226V) ceramic
capacitor at the input of the module. Figure 29 shows the
input ripple with 1x47µF (TDK: C3225X5R0J476M) ceramic
capacitor at full load.
Input Ripple Voltage (mVp-p)
0
20
40
60
80
100
120
140
160
0 0.5 1 1.5 2 2.5 3 3.5
3.3Vin
5Vin
Output Voltage (Vdc)
Figure 28. Input ripple voltage for various outputs with 1x22
µF ceramic capacitor at the input (full-load).
Input Ripple Voltage (mVp-p)
0
20
40
60
80
100
120
140
160
0 0.5 1 1.5 2 2.5 3 3.5
3.3Vin
5Vin
Output Voltage (Vdc)
Figure 29. Input ripple voltage for various outputs with 1x47
µF ceramic capacitor at the input (full load).
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 11
Design Considerations (continued)
Output Filtering
The Austin MiniLynxTM SMT module is designed for low output
ripple voltage and will meet the maximum output ripple
specification with 1 µF ceramic and 10 µF tantalum capacitors
at the output of the module. However, additional output
filtering may be required by the system designer for a number
of reasons. First, there may be a need to further reduce the
output ripple and noise of the module. Second, the dynamic
response characteristics may need to be customized to a
particular load step change.
To reduce the output ripple and improve the dynamic
response to a step load change, additional capacitance at the
output can be used. Low ESR polymer and ceramic capacitors
are recommended to improve the dynamic response of the
module. For stable operation of the module, limit the
capacitance to less than the maximum output capacitance as
specified in the electrical specification table.
Safety Considerations
For safety agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards, i.e., UL
ANSI/UL62368-1 and CAN/CSA C22.2 No. 62368-1 Recognized,
DIN VDE 0868-1/A11:2017 (EN62368-1:2014/A11:2017).
For the converter output to be considered meeting the
Requirements of safety extra-low voltage (SELV) or ES1, the
input must meet SELV/ES1 requirements. The power module
has extra-low voltage (ELV) outputs when all inputs are ELV.
The input to these units is to be provided with a fast-acting
fuse with a maximum rating of 6A in the positive input lead.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 12
Feature Description
Remote On/Off
The Austin MiniLynxTM SMT power modules feature an On/Off
pin for remote On/Off operation. Two On/Off logic options
are available in the Austin MiniLynxTM series modules.
Positive Logic On/Off signal, device code suffix “4”, turns the
module ON during a logic High on the On/Off pin and turns
the module OFF during a logic Low. Negative logic On/Off
signal, no device code suffix, turns the module OFF during
logic High on the On/Off pin and turns the module ON during
logic Low.
For positive logic modules, the circuit configuration for using
the On/Off pin is shown in Figure 30. The On/Off pin is an
open collector/drain logic input signal (Von/Off) that is
referenced to ground. During a logic-high (On/Off pin is
pulled high internal to the module) when the transistor Q1 is
in the Off state, the power module is ON. Maximum allowable
leakage current of the transistor when Von/off = VIN,max is
10µA. Applying a logic-low when the transistor Q1 is turned-
On, the power module is OFF. During this state VOn/Off must
be less than 0.3V. When not using positive logic On/off pin,
leave the pin unconnected or tie to VIN.
Q1
R2
R1 Q2
R3
R4
Q3 CSS
GND
VIN+
ON/OFF
PWM Enable
+
_
ON/OFF
V
ION/OFF
MODULE
Figure 30. Circuit configuration for using positive logic
On/OFF.
For negative logic On/Off devices, the circuit configuration is
shown is Figure 31. The On/Off pin is pulled high with an
external pull-up resistor (typical Rpull-up = 5k, +/- 5%). When
transistor Q1 is in the Off state, logic High is applied to the
On/Off pin and the power module is Off. The minimum
On/off voltage for logic High on the On/Off pin is 1.5Vdc. To
turn the module ON, logic Low is applied to the On/Off pin by
turning ON Q1. When not using the negative logic On/Off,
leave the pin unconnected or tie to GND.
Q1
R1
R2
Q2 CSS
GND
PWM Enable
ON/OFF
VIN+
ON/OFF
_
+
V
I
MODULE
pull-up
R
ON/OFF
Figure 31. Circuit configuration for using negative logic
On/OFF.
Overcurrent Protection
To provide protection in a fault (output overload) condition,
the unit is equipped with internal current-limiting circuitry and
can endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought back
into its specified range. The typical average output current
during hiccup is 2A.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
module operation is disabled. The module will begin to
operate at an input voltage above the undervoltage lockout
turn-on threshold.
Overtemperature Protection
To provide over temperature protection in a fault
condition, the unit relies upon the thermal protection
feature of the controller IC. The unit will shutdown if the
thermal reference point Tref, exceeds 140oC (typical), but
the thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating. The
module will automatically restart after it cools down.
Output Voltage Programming
The output voltage of the Austin MiniLynxTM SMT can be
programmed to any voltage from 0.75 Vdc to 3.63 Vdc by
connecting a single resistor (shown as Rtrim in Figure 32)
between the TRIM and GND pins of the module. Without an
external resistor between TRIM pin and the ground, the
output voltage of the module is 0.7525 Vdc. To calculate the
value of the resistor Rtrim for a particular output voltage Vo,
use the following equation:
=5110
7525.0
21070
Vo
Rtrim
Feature Descriptions (continued)
Output Voltage Programming (continued)
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 13
For example, to program the output voltage of the Austin
MiniLynxTM module to 1.8 Vdc, Rtrim is calculated is follows:
=5110
7525.08.1
21070
Rtrim
= kRtrim 004.15
V
O
(+)
TRIM
GND
R
trim
LOAD
V
IN
(+)
ON/OFF
Figure 32. Circuit configuration to program output voltage
using an external resistor.
Table 1 provides Rtrim values required for some common
output voltages.
Table 1
VO, set (V)
Rtrim (KΩ)
0.7525
Open
1.2
41.973
1.5
23.077
1.8
15.004
2.5
6.947
3.3
3.160
Using 1% tolerance trim resistor, set point tolerance of ±2%
is achieved as specified in the electrical specification. The
POL Programming Tool, available at
www.gecriticalpower.com under the Design Tools section,
helps determine the required external trim resistor needed
for a specific output voltage.
Voltage Margining
Output voltage margining can be implemented in the Austin
MiniLynxTM modules by connecting a resistor, Rmargin-up, from
the Trim pin to the ground pin for margining-up the output
voltage and by connecting a resistor, Rmargin-down, from the Trim
pin to the Output pin for margining-down. Figure 33 shows
the circuit configuration for output voltage margining. The
POL Programming Tool, available at www.gecriticalpower.com
under the Design Tools section, also calculates the values of
Rmargin-up and Rmargin-down for a specific output voltage and %
margin. Please consult your local GE technical representative
for additional details.
Vo
Austin Lynx or
Lynx II Series
GND
Trim
Q1
Rtrim
Rmargin-up
Q2
Rmargin-down
Figure 33. Circuit Configuration for margining Output
voltage.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 14
Thermal Considerations
Power modules operate in a variety of thermal environments;
however, sufficient cooling should always be provided to help
ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability. The thermal data presented
here is based on physical measurements taken in a wind
tunnel. The test set-up is shown in Figure 35. Note that the
airflow is parallel to the long axis of the module as shown in
figure 34. The derating data applies to airflow in either
direction of the module’s long axis.
Air Flow
Tref
Figure 34. Tref Temperature measurement location.
The thermal reference point, Tref used in the specifications is
shown in Figure 34. For reliable operation this temperature
should not exceed 115oC.
The output power of the module should not exceed the rated
power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal aspects
including maximum device temperatures.
Figure 35. Thermal Test Set-up.
Air
flow
x
Power Module
Wind Tunnel
PWBs
5.97_
(0.235)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 15
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
Co-planarity (max): 0.102 [0.004]
BOTTOM VIEW SIDE VIEW
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 16
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
PIN
FUNCTION
1
On/Off
2
VIN
3
GND
4
Trim
5
VOUT
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 17
Packaging Details
The Austin MiniLynxTM SMT version is supplied in tape & reel as standard. Modules are shipped in quantities of 400 modules per reel.
All Dimensions are in millimeters and (in inches).
Reel Dimensions
Outside diameter: 330.2 mm (13.00)
Inside diameter: 177.8 mm (7.00”)
Tape Width: 44.0 mm (1.73”)
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 18
Surface Mount Information
Pick and Place
The Austin MiniLynxTM SMT modules use an open frame
construction and are designed for a fully automated assembly
process. The modules are fitted with a label designed to
provide a large surface area for pick and placing. The label
meets all the requirements for surface mount processing, as
well as safety standards and is able to withstand maximum
reflow temperature. The label also carries product
information such as product code, serial number and location
of manufacture.
Figure 36. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style, vacuum
pressure and pick & placement speed should be considered to
optimize this process. The minimum recommended nozzle
diameter for reliable operation is 3mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 8 mm max.
Tin Lead Soldering
The Austin MiniLynxTM SMT power modules are lead free
modules and can be soldered either in a lead-free solder
process or a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in order
to customize the solder reflow profile for each application
board assembly. The following instructions must be observed
when soldering these units. Failure to observe these
instructions may result in the failure of or cause damage to
the modules, and can adversely affect long-term reliability.
The Austin MiniLynxTM SMT power modules are lead free
modules and can be soldered either in a lead-free solder
process or a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in order
to customize the solder reflow profile for each application
board assembly. The following instructions must be observed
when soldering these units. Failure to observe these
instructions may result in the failure of or cause damage to
the modules, and can adversely affect long-term reliability.
REFLOW TEMP (C)
REFLOW TIME (S)
Figure 37. Reflow Profile for Tin/Lead (Sn/Pb) process.
MAX TEMP SOLDER (C)
Figure 38. Time Limit Curve Above 205oC Reflow for Tin Lead
(Sn/Pb) process.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
February 16, 2021
©2015 General Electric Company. All rights reserved.
Page 19
Surface Mount Information (continued)
Lead Free Soldering
The Z version Austin MiniLynx SMT modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may result
in the failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure. 39.
MSL Rating
The Austin MiniLynxTM SMT modules have a MSL rating of 2a.
Storage and Handling
The Austin MiniLynxTM modules have a MSL rating of 1. The
recommended storage environment and handling procedures
for moisture-sensitive surface mount packages is detailed in J-
STD-033 Rev. A (Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices). Moisture
barrier bags (MBB) with desiccant are required for MSL ratings
of 2 or greater. These sealed packages should not be broken
until time of use. Once the original package is broken, the
floor life of the product at conditions of 30°C and 60%
relative humidity varies according to the MSL rating (see J-
STD-033A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when stored
at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Board Mounted
Power Modules: Soldering and Cleaning Application Note
(AN04-001).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 39. Recommended linear reflow profile using
Sn/Ag/Cu solder.
GE
Data Sheet
Austin MiniLynxTM: SMT Non-Isolated DC-DC Power Modules
2.4Vdc 5.5Vdc input; 0.75Vdc to 3.63Vdc output; 3A Output Current
Contact Us
For more information, call us at
USA/Canada:
+1 877 546 3243, or +1 972 244 9288
Asia-Pacific:
+86-21-53899666
Europe, Middle-East and Africa:
+49.89.878067-280
Go.ABB/Industrial
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or
information.
February 16, 2021
©2015 General Electric Company. All International rights reserved.
Version 1_2
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 2. Device Codes
Device Code
Input
Voltage Range
Output
Voltage
Output
Current
Efficiency
3.3V@ 3A
On/Off
Logic
Connector
Type
Comcodes
AXH003A0X-SRZ
2.4 5.5Vdc
0.75 3.63Vdc
3 A
94.0 %
Negative
SMT
CC109101301
AXH003A0X4-SRZ
2.4 5.5Vdc
0.75 3.63Vdc
3 A
94.0 %
Positive
SMT
109100014
-Z refers to RoHS-compliant codes