SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DWide Operating Voltage Range of 2 V to 6 V
DOutputs Can Drive Up To 10 LSTTL Loads
DLow Power Consumption, 80-µA Max ICC
DTypical tpd = 14 ns
D±4-mA Output Drive at 5 V
DLow Input Current of 1 µA Max
DInternal Look-Ahead for Fast Counting
DCarry Output for n-Bit Cascading
DSynchronous Counting
DSynchronously Programmable
SN54HC161 ...J OR W PACKAGE
SN74HC161 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
QA
QB
NC
QC
QD
A
B
NC
C
D
SN54HC161 . . . FK PACKAGE
(TOP VIEW)
CLK
CLR
NC
LOAD
ENT RCO
ENP
GND
NC VCC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CLR
CLK
A
B
C
D
ENP
GND
VCC
RCO
QA
QB
QC
QD
ENT
LOAD
NC − No internal connection
description/ordering information
These synchronous, presettable counters feature an internal carry look-ahead for application in high-speed
counting designs. The ’HC161 devices are 4-bit binary counters. Synchronous operation is provided by having
all flip-flops clocked simultaneously so that the outputs change coincident with each other when so instructed
by the count-enable (ENP, ENT) inputs and internal gating. This mode of operation eliminates the output
counting spikes that are normally associated with synchronous (ripple-clock) counters. A buffered clock (CLK)
input triggers the four flip-flops on the rising (positive-going) edge of the clock waveform.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube of 25 SN74HC161N SN74HC161N
Tube of 40 SN74HC161D
SOIC − D Reel of 2500 SN74HC161DR HC161
−40°C to 85°C
SOIC − D
Reel of 250 SN74HC161DT
HC161
−40°C to 85°CSOP − NS Reel of 2000 SN74HC161NSR HC161
Tube of 90 SN74HC161PW
TSSOP − PW Reel of 2000 SN74HC161PWR HC161
TSSOP − PW
Reel of 250 SN74HC161PWT
HC161
CDIP − J Tube of 25 SNJ54HC161J SNJ54HC161J
−55°C to 125°CCFP − W Tube of 150 SNJ54HC161W SNJ54HC161W
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54HC161FK SNJ54HC161FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
$'"! !$& ./0121 && $## # ##'
"&# )#+# #'( && )# $'"! $'"!
$!#- '# #!#&, !&"'# #- && $##(
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
These counters are fully programmable; that is, they can be preset to any number between 0 and 9 or 15. As
presetting is synchronous, setting up a low level at the load input disables the counter and causes the outputs
to agree with the setup data after the next clock pulse, regardless of the levels of the enable inputs.
The clear function for the ’HC161 devices is asynchronous. A low level at the clear (CLR) input sets all four of
the flip-flop outputs low, regardless of the levels of the CLK, load (LOAD), or enable inputs.
The carry look-ahead circuitry provides for cascading counters for n-bit synchronous applications without
additional gating. Instrumental in accomplishing this function are ENP, ENT, and a ripple-carry output (RCO).
Both ENP and ENT must be high to count, and ENT is fed forward to enable RCO. Enabling RCO produces a
high-level pulse while the count is maximum (9 or 15 with QA high). This high-level overflow ripple-carry pulse
can be used to enable successive cascaded stages. Transitions at ENP or ENT are allowed, regardless of the
level of CLK.
These counters feature a fully independent clock circuit. Changes at control inputs (ENP, ENT, or LOAD) that
modify the operating mode have no effect on the contents of the counter until clocking occurs. The function of
the counter (whether enabled, disabled, loading, or counting) is dictated solely by the conditions meeting the
stable setup and hold times.
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram (positive logic)
1
9
10
7
3
15
14
CLR
LOAD
ENT
ENP
CLK
A
RCO
QA
†For simplicity, routing of complementary signals LD and CK is not shown on this overall logic diagram. The uses of these signals are shown
on the logic diagram of the D/T flip-flops.
Pin numbers shown are for the D, J, N, NS, PW, and W packages.
M1
G2
G4
3D
4R
1, 2T/1C3
4
13
B
QB
M1
G2
G4
3D
4R
1, 2T/1C3
5
12
C
QC
M1
G2
G4
3D
4R
1, 2T/1C3
6
11
D
QD
M1
G2
G4
3D
4R
1, 2T/1C3
2
LD†
CK†
CK
R
LD
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol, each D/T flip-flop
M1LD (Load)
Q (Output)
G2TE (Toggle Enable)
CK (Clock) G4
3D
4R
1, 2T/1C3
D (Inverted Data)
R (Inverted Reset)
logic diagram, each D/T flip-flop (positive logic)
TG
TG
TG
TG
TG
TG
CK
LD
TE
LD†
LD†
D
R
CK†
CK†
CK†
CK†
Q
†The origins of LD and CK are shown in the logic diagram of the overall device.
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
typical clear, preset, count, and inhibit sequence
The following sequence is illustrated below:
1. Clear outputs to zero (asynchronous)
2. Preset to binary 12
3. Count to 13, 14, 15, 0, 1, and 2
4. Inhibit
Data
Inputs
Data
Outputs
CLR
LOAD
A
B
C
D
CLK
ENP
ENT
RCO
QA
QB
QC
QD
Async
Clear
Sync
Clear Preset
Count Inhibit
12 13 14 15 0 1 2
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC161 SN74HC161
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
V
IH
High-level input voltage VCC = 4.5 V 3.15 3.15 V
VIH
High-level input voltage
VCC = 6 V 4.2 4.2
V
VCC = 2 V 0.5 0.5
V
IL
Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VIL
Low-level input voltage
VCC = 6 V 1.8 1.8
V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
∆t/∆v‡Input transition rise/fall time VCC = 4.5 V 500 500 ns
∆t/∆v‡
Input transition rise/fall time
VCC = 6 V 400 400
ns
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
‡If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced
grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally,
the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HC161 SN74HC161
UNIT
PARAMETER
TEST CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 1.9 1.998 1.9 1.9
I
OH
= −20 µA4.5 V 4.4 4.499 4.4 4.4
V
OH
V
I
= V
IH
or V
IL
IOH = −20 µA
6 V 5.9 5.999 5.9 5.9 V
VOH
VI = VIH or VIL
IOH = −4 mA 4.5 V 3.98 4.3 3.7 3.84
V
IOH = −5.2 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
I
OL
= 20 µA4.5 V 0.001 0.1 0.1 0.1
V
OL
V
I
= V
IH
or V
IL
IOL = 20 µA
6 V 0.001 0.1 0.1 0.1 V
VOL
VI = VIH or VIL
IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
V
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA
Ci2 V to 6 V 3 10 10 10 pF
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
TA = 25°C SN54HC161 SN74HC161
UNIT
V
CC MIN MAX MIN MAX MIN MAX
UNIT
2 V 6 4.2 5
f
clock
Clock frequency 4.5 V 31 21 25 MHz
fclock
Clock frequency
6 V 36 25 29
MHz
2 V 80 120 100
CLK high or low 4.5 V 16 24 20
tw
Pulse duration
CLK high or low
6 V 14 20 17
ns
twPulse duration 2 V 80 120 100 ns
CLR low 4.5 V 16 24 20
CLR low
6 V 14 20 17
2 V 150 225 190
A, B, C, or D 4.5 V 30 45 38
A, B, C, or D
6 V 26 38 32
2 V 135 205 170
LOAD low 4.5 V 27 41 34
tsu
Setup time before CLK↑
LOAD low
6 V 23 35 29
ns
tsu Setup time before CLK↑2 V 170 255 215 ns
ENP, ENT 4.5 V 34 51 43
ENP, ENT
6 V 29 43 37
2 V 125 190 155
CLR inactive 4.5 V 25 38 31
CLR inactive
6 V 21 32 26
2 V 000
t
h
Hold time, all synchronous inputs after CLK↑4.5 V 000ns
th
Hold time, all synchronous inputs after CLK
6 V 000
ns
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC161 SN74HC161
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 6 14 4.2 5
f
max
4.5 V 31 40 21 25 MHz
fmax
6 V 36 44 25 29
MHz
2 V 83 215 325 270
RCO 4.5 V 24 43 65 54
CLK
RCO
6 V 20 37 55 46
CLK 2 V 80 205 310 255
t
pd
Any Q 4.5 V 25 41 62 51 ns
tpd
Any Q
6 V 21 35 53 43
ns
2 V 62 195 295 245
ENT RCO 4.5 V 17 39 59 49
ENT
RCO
6 V 14 33 50 42
2 V 105 210 315 265
Any Q 4.5 V 21 42 63 53
tPHL
CLR
Any Q
6 V 18 36 54 45
ns
tPHL CLR 2 V 110 220 330 275 ns
RCO 4.5 V 22 44 66 55
RCO
6 V 19 37 56 47
2 V 38 75 110 95
t
t
Any 4.5 V 8 15 22 19 ns
tt
Any
6 V 6 13 19 16
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load 60 pF
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
VOLTAGE WAVEFORMS
PULSE DURATIONS
th
tsu
50%
50%50% 10%10% 90% 90%
VCC
VCC
0 V
0 V
trtf
Reference
Input
Data
Input
50%
High-Level
Pulse 50%
V
CC
0 V
50% 50%
VCC
0 V
tw
Low-Level
Pulse
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
VC
C
VO
H
VO
L
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VO
H
VO
L
tr
tf
tPHL tPLH
Out-of-Phase
Output
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
Figure 1. Load Circuit and Voltage Waveforms
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
n-bit synchronous counters
This application demonstrates how the look-ahead carry circuit can be used to implement a high-speed n-bit
counter. The ’HC161 devices count in binary. V irtually any count mode (modulo-N, N1-to-N2, N1-to-maximum)
can be used with this fast look-ahead circuit.
The application circuit shown in Figure 2 is not valid for clock frequencies above 18 MHz (at 25°C and
4.5-V VCC). The reason for this is that there is a glitch that is produced on the second stage’s RCO and every
succeeding stage’s RCO. This glitch is common to all HC vendors that Texas Instruments has evaluated, in
addition to the bipolar equivalents (LS, ALS, AS).
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
LOAD
1,5DA
B
C
D
C5/2,3,4+
RCO
3CT=MAX
QA
QB
QC
QD
CLR
[1]
[2]
[3]
[4]
CTR
LSB
ENT
ENP
CLK
LOAD
1,5DA
B
C
D
C5/2,3,4+
RCO
3CT=MAX
QA
QB
QC
QD
CLR
[1]
[2]
[3]
[4]
CTR
ENT
ENP
CLK
LOAD
1,5DA
B
C
D
C5/2,3,4+
RCO
3CT=MAX
QA
QB
QC
QD
CLR
[1]
[2]
[3]
[4]
CTR
ENT
ENP
CLK
LOAD
1,5DA
B
C
D
C5/2,3,4+
RCO
3CT=MAX
QA
QB
QC
QD
CLR
[1]
[2]
[3]
[4]
CTR
ENT
ENP
CLK
To More−Significant Stages
Clear (L)
Count (H)/
Disable (L)
Count (H)/
Disable (L)
Load (L)
Clock
CT=0
M1
G3
G4
CT=0
M1
G3
G4
CT=0
M1
G3
G4
CT=0
M1
G3
G4
Figure 2
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
The glitch on RCO is caused because the propagation delay of the rising edge of QA of the second stage is
shorter than the propagation delay of the falling edge of EN T. RCO is the product of ENT, QA, QB, QC, and QD
(ENT × QA × QB × QC × QD). The resulting glitch is about 7−12 ns in duration. Figure 3 shows the condition in
which the glitch occurs. For simplicity, only two stages are being considered, but the results can be applied to
other stages. QB, QC, and QD of the first and second stage are at logic one, and QA of both stages are at logic
zero (1110 1110) after the first clock pulse. On the rising edge of the second clock pulse, QA and RCO of the
first stage go high. On the rising edge of the third clock pulse, QA and RCO of the first stage return to a low level,
and QA of the second stage goes to a high level. At this time, the glitch on RCO of the second stage appears
because of the race condition inside the chip.
12345
CLK
ENT1
QB1, QC1, QD1
QA1
RCO1, ENT2
QB2, QC2, QD2
QA2
RCO2 Glitch (7−12 ns)
Figure 3
The glitch causes a problem in the next stage (stage three) if the glitch is still present when the next rising clock
edge appears (clock pulse 4). To ensure that this does not happen, the clock frequency must be less than the
inverse of the sum of the clock-to-RCO propagation delay and the glitch duration (tg). In other words,
fmax = 1/(tpd CLK-to-RCO + tg). For example, at 25°C at 4.5-V VCC, the clock-to-RCO propagation delay is
43 ns and the maximum duration of the glitch is 12 ns. Therefore, the maximum clock frequency that the
cascaded counters can use is 18 MHz. The following tables contain the fclock, tw, and fmax specifications for
applications that use more than two ’HC161 devices cascaded together.
SCLS297D − JANUAR Y 1996 − REVISED SEPTEMBER 2003
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
TA = 25°C SN54HC161 SN74HC161
UNIT
V
CC MIN MAX MIN MAX MIN MAX
UNIT
2 V 3.6 2.5 2.9
f
clock
Clock frequency 4.5 V 18 12 14 MHz
fclock
Clock frequency
6 V 21 14 17
MHz
2 V 140 200 170
t
w
Pulse duration, CLK high or low 4.5 V 28 40 36 ns
tw
Pulse duration, CLK high or low
6 V 24 36 30
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Note 4)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC161 SN74HC161
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN MAX MIN MAX MIN MAX
UNIT
2 V 3.6 2.5 2.9
f
max
4.5 V 18 12 14 MHz
fmax
6 V 21 14 17
MHz
NOTE 4: These limits apply only to applications that use more than two ’HC161 devices cascaded together.
If the ’HC161 devices are used as a single unit, or only two cascaded together, then the maximum clock
frequency that the device can use is not limited because of the glitch. In these situations, the device can be
operated at the maximum specifications.
A glitch can appear on RCO of a single ’HC161 device, depending on the relationship of ENT to CLK. Any
application that uses RCO to drive any input except an ENT of another cascaded ’HC161 device must take this
into consideration.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8407501VEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type 5962-8407501VE
A
SNV54HC161J
5962-8407501VFA ACTIVE CFP W 16 25 TBD A42 N / A for Pkg Type 5962-8407501VF
A
SNV54HC161W
84075012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84075012A
SNJ54HC
161FK
8407501EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8407501EA
SNJ54HC161J
8407501FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8407501FA
SNJ54HC161W
JM38510/66302BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
66302BEA
JM38510/66302BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
66302BFA
M38510/66302BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
66302BEA
M38510/66302BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
66302BFA
SN54HC161J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC161J
SN74HC161D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74HC161DT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161DTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161DTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC161N
SN74HC161N3 OBSOLETE PDIP N 16 TBD Call TI Call TI -40 to 85
SN74HC161NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC161N
SN74HC161NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161PWT ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
SN74HC161PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC161
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54HC161FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84075012A
SNJ54HC
161FK
SNJ54HC161J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8407501EA
SNJ54HC161J
SNJ54HC161W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8407501FA
SNJ54HC161W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 4
OTHER QUALIFIED VERSIONS OF SN54HC161, SN54HC161-SP, SN74HC161 :
•Catalog: SN74HC161, SN54HC161
•Military: SN54HC161
•Space: SN54HC161-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC161DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC161NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HC161PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC161PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC161DR SOIC D 16 2500 333.2 345.9 28.6
SN74HC161NSR SO NS 16 2000 367.0 367.0 38.0
SN74HC161PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74HC161PWT TSSOP PW 16 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
