1www.diodes.com December 2017
Diodes Incorporated
PI3USB32212
Document Number DS40504 Rev 1-2
Features
1:2 mux/demux for USB 3.1 Enhanced SS, USB 3.0 SS, 2.0HS,
and 2.0FS signals
Switches Tx, Rx, and Dx from USB3.0 connector
Suitable for DisplayPort, PCIe Gen1/2/3, SATA 1.5/3/6G, SAS
1.5/3/6G and XAUI applications.
-3dB bandwidth for enhanced superspeed channel: 10.6GHz
Insertion Loss for enhanced superspeed channels @ 5.0 GHz:
-1.5dB
Insertion Loss for superspeed channels @ 2.5 GHz: -0.9dB
Return loss for enhanced superspeed channels @ 5.0 GHz:
-19.6dB
Return Loss for superspeed channels @ 2.5 GHz: -26.4dB
Low Bit-to-Bit Skew, 5ps typ(between '+' and '-' bits)
Low Crosstalk for enhanced superspeed channels: -31.1dB @
5.0 GHz
Low Crosstalk for superspeed channels @2.5GHz: -33.3dB
Low O Isolation for enhanced superspeed channels: -17.4dB
@ 5.0 GHz
Low O Isolation for superspeed channels @ 2.5GHz:
-24.9dB
Insertion Loss for USB − HS: -0.67dB @ 480Mbps
Crosstalk for USB − HS: -33dB @ 480Mbps
O Islation fo USB − HS: -30dB @ 480Mbps
-3dB for USB − HS: 1.4 GHz
VDD Operating Range: 3.3V +/-10%
ESD Tolerance: 2kV HBM
Low channel-to-channel skew, 7ps typ
Packaging (Pb-free & Green):
32 TQFN (ZL) 3mm x 6mm x 0.75mm, 0.4mm pitch
Description
e PI3USB32212 USB3.1, USB3.0 and USB2.0 Combo Switch is
a complete 1:2 switching solution for Enhanced SuperSpeed USB
3.1 signals. PI3USB32122 provides dierential high-speed lanes
for the USB3.1 10Gbps, USB3.0 5Gbps TX and RX lanes as well as
a dierential lane for 480 Mbps USB 2.0 signals.
PI3USB32212 can be used to connect two hosts to a single device
or a single host to two devices.
PI3USB32212 oers excellent signal integrity for high-speed sig-
nals and low power dissipation. Insertion loss is -1.3dB and return
loss is -19dB at 5 GHz (USB3.1). Insertion loss is -0.77dB and re-
turn loss is -27.8db at 2.5GHz (USB3.0).
Application
Routing of USB3.1/3.0/2.0 signals with low signal attenuation be-
tween source and sink. Applicable products include desktop PC,
Notebook PC, Tablet, Docking, Telecom, DTV.
PI3USB32212
USB3.1, USB3.0 and USB2.0 Combo Switch
A product Line of
Diodes Incorporated
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PI3USB32212
A product Line of
Diodes Incorporated
www.diodes.com December 2017
Diodes Incorporated
PI3USB32212
Document Number DS40504 Rev 1-2
Pin Assignment (TQFN-32)
Tx-A
Tx-
Tx+
PD
D+
VDD
Rx+
SEL1
Rx-
Rx-A
Rx+A
Tx+B
GND
Rx-B
Rx+B
Tx-B
D-
1
2
3
4
5
6
7
8
9
10
11
27
26
25
24
23
22
21
20
19
18
17
VDD
D-A
D+A
VDD
D+B
D-B
12
13
14
15
32
31
30
29
GND
OE
GND
16 28
GND
SEL2
GND
GND
GND
GND
Tx+A
PD OE SEL1 SEL2 Function
0 X 0 X PortA is active fox Tx & Rx
0 X 1 X PortB is active fox Tx & Rx
1 X X X Both ports are Hi_Z for Tx & Rx
X 1 X X Both ports are High_Z for D+/D-
1 1 X X All channels are High_Z
X 0 X 0 PortB is active for D+/D-
X 0 X 1 PortA is active for D+/D-
Note:
1. PD & SEL1 are controls for the usb3.1 switch PD supports power down & output disable
2. OE & SEL2 are controls for the usb2.0 switch
3. Bottom metal plate can used as GND
4. VDD at pin8 provides power to both top and bottom die
5. All VDD need to connect to power
Block Diagram
Tx+
Tx
Rx+
Rx
D+
D-
Tx+A
Tx
-A
Rx+A
Rx
-A
Tx+B
Tx-B
Rx+B
Rx-B
-
-
Logic
Control
OE
D+A
D-A
D+B
D- B
SEL1
SEL2
PD
Truth Table
3
PI3USB32212
A product Line of
Diodes Incorporated
www.diodes.com December 2017
Diodes Incorporated
PI3USB32212
Document Number DS40504 Rev 1-2
Pin Description
Pin# Pin Name Signal Type Description
1Tx+ I/O Positive dierential USB3.x Tx signal for COM port
2Tx- I/O Negative dierential USB3.x Tx signal for COM port
3GND Ground Ground
4VDD Power 3.3V +/-10% power supply
5Rx+ I/O Positive dierential USB3.x Rx signal for COM port
6Rx- I/O Negative dierential USB3.x Rx signal for COM port
7SEL1 IControl for USB 3.x
8VDD Power 3.3V +/-10% power supply
9SEL2 IControl for USB 2.0
10 D+ I/O Positive dierential USB 2.0 COM port
11 D- I/O Negative dierential USB2.0 COM port
12 GND Ground Ground
13 GND Ground Ground
14 D-B I/O Negative dierential USB2.0 signal for port 1
15 D+B I/O Positive dierential USB2.0 signal for port 1
16 GND Ground Ground
17 D-A I/O Negative dierential USB2.0 signal for port 0
18 D+A I/O Positive dierential USB2.0 signal for port 0
19 OE IControl for USB 2.0
20 GND Ground Ground
21 Rx-B I/O Negative dierential USB 3.x signal for port 0
22 Rx+B I/O Positive dierential USB 3.x signal for port 0
23 Tx-B I/O Negative dierential USB3.x Rx signal for port 0
24 Tx+B I/O Positive dierential USB3.x Tx signal for port 0
25 GND Ground Ground
26 Rx-A I/O Negative dierential USB3.xRx signal for port 1
27 Rx+A I/O Positive dierential USB3.x Rx signal for port 1
28 Tx-A I/O Negative dierential USB3.x Rx signal for port 1
29 Tx+A I/O Positive dierential USB3.x Tx signal for port 1
30 GND Ground Ground
31 VDD Power 3.3V +/-10% power supply
32 PD I Power down and disable USB3.x output
4
PI3USB32212
A product Line of
Diodes Incorporated
www.diodes.com December 2017
Diodes Incorporated
PI3USB32212
Document Number DS40504 Rev 1-2
DC Electrical Characteristics for Switching over Operating Range
(TA = –40°C to +85°C, VDD = 3.3V ±10%)
Parameter Description Test Conditions(1) Min. Typ.(1) Max. Units
V
IH
Input HIGH Voltage Guaranteed HIGH level 0.65*VDD
V
V
IL
Input LOW Voltage Guaranteed LOW level 0.6
V
IK
Clamp Diode Voltage, Dx VDD = Max., IIN = –18mA –0.7 –1.2
I
IH
Input HIGH Current VDD = Max., VIN = VDD ±5
µA
IIL Input LOW Current VDD = Max., VIN = GND ±5
RON_SS On resistance between input to output
for SuperSpeed signals
VDD
= 3.3V, Vinput = 0V to 1V,
IINPUT = 20mA 10 13 Ohm
RON_FS On resistance between input to output
for USB2.0 FS signals (D+/D-)
VDD
= 3.3V, Vinput = 0 to 3.3V,
IINPUT = 20mA 7 9 Ohm
RON_HS On resistance between input to output
for USB2.0 HS signals (D+/D-)
VDD = 3.3V, Vinput = -0.4V to
+0.4V, IINPUT = 20mA 4 6 Ohm
Storage Temperature ..........................................................–65°C to +150°C
Supply Voltage to Ground Potential ....................................–0.5V to +4.0V
DC Input Voltage, USB3 ......................................................... –0.5V to 1.5V
DC Input Voltage, USB2 ......................................................... –0.5V to VDD
DC Output Current .............................................................................120mA
Power Dissipation ................................................................................... 0.5W
ESD ...................................................................................................2KV HBM
Note: Stresses greater than those listed under MAXI-
MUM RATINGS may cause permanent damage to the
device. is is a stress rating only and functional opera-
tion of the device at these or any other conditions above
those indicated in the operational sections of this speci-
cation is not implied. Exposure to absolute maximum rat-
ing conditions for extended periods may aect reliability.
Maximum Ratings
(Above which useful life may be impaired. For user guidelines, not tested.)
Power Supply Characteristics (TA = –40°C to +85°C)
Parameter Description Test Conditions(1) Min. Typ.(1) Max. Units
ICC Quiescent Power Supply Current VDD = Max., VIN = GND or VDD 500 µA
5
PI3USB32212
A product Line of
Diodes Incorporated
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Diodes Incorporated
PI3USB32212
Document Number DS40504 Rev 1-2
Switching Characteristics (TA= -40º to +85ºC, VDD = 3. 3 V±10 % )
Parameter Description Min. Ty p. Max. Units
Tpd Propagation delay (input pin to output pin) USB3 80 ps
USB-HS 250
t
b-b
Bit-to-bit skew within the same dierential pair 10 ps
t
ch-ch
Channel-to-channel skew 20 ps
T
sw
Switching time between paths (toggling SEL1, SEL2) 2 100 ns
Dynamic Electrical Characteristics over Operating Range (TA = -40º to +85ºC, VDD = 3.3V ±10%)
Parameter Description Test Conditions Min. Ty p. Max. Units
DDXT Dierential Crosstalk on SuperSpeed
Channels
See Fig. 1 for
Measure-
ment Setup
f= 2.5 GHz
f= 4.0 GHz
f= 5.0 GHz
-33.3
-31.9
-31.1 dB
DDOI Dierential OFF Isolation on SuperSpeed
Channels
See Fig. 2 for
Measure-
ment Setup,
f= 2.5 GHz
f= 4.0 GHz
f= 5.0 GHz
-24.9
-18.9
-17.4
DDIL Dierential Insertion Loss on SuperSpeed
Channels
f= 2.5 GHz
f= 4.0 GHz
f= 5.0 GHz
-0.9
-1.3
-1.5
dB
Rloss Dierential Return Loss on SuperSpeed
channels
f= 2.5 GHz
f= 4.0 GHz
f= 5.0 GHz
-26.4
-22.4
-19.6
dB
BW 3db Bandwidth on SuperSpeed channels 10.6 GHz
XTALK-USB2 HS Crosstalk
RL = 50Ω
f= 240 MHz
f= 825 MHz
-35
-25
-39
-28 dB
OIRR-USB2 HS OFF Isolation f= 240 MHz
f= 825 MHz
-29
-20
-32
-23
BW-USB2 HS -3dB Bandwidth RL = 50Ω 1100 1400 MHz
BW-USB2 HS -0.5dB Bandwidth RL = 50Ω 150 400 MHz
IN-USB2 HS Insertion Loss
f= 240 MHz
f= 825 MHz
f= 1.0 GHz
f= 1.125 GHz
0.47
1.8
2.2
2.4
0.67
2.4
2.6
3.0
dB
Note:
1. For Max. or Min. conditions, use appropriate value specied under Electrical Characteristics for the applicable device type.
2. Typical values are at VDD = 3.3V, TA = 25°C ambient and maximum loading.
6
PI3USB32212
A product Line of
Diodes Incorporated
www.diodes.com December 2017
Diodes Incorporated
PI3USB32212
Document Number DS40504 Rev 1-2
Fig 1. Crosstalk Setup
Fig 2. O-isolation setup
+
–
+
–
BALANCED
PORT1
DUT
+
–
50
50
+
–
BALANCED
PORT2
50
50
+
–
+
–
BALANCED
PORT1
BALANCED
PORT2
DUT
+
–
50
50
+
–
+
–
BALANCED
PORT1
BALANCED
PORT2
DUT
Fig 3. Dierential Insertion Loss set up
11
PI3USB32212
A product Line of
Diodes Incorporated
www.diodes.com December 2017
Diodes Incorporated
PI3USB32212
Document Number DS40504 Rev 1-2
R
T
4pF
C
L
V
DD
V
IN
V
OUT
200-ohm
200-ohm
2 * V
DD
Pulse
Generator D.U.T
Test Circuit for Electrical Characteristics(1-5)
Notes:
1. CL = Load capacitance: includes jig and probe capacitance.
2. RT = Termination resistance: should be equal to ZOUT of the Pulse Generator
3. Output 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
4. Output 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
5. All input impulses are supplied by generators having the following characteristics: PRR ≤ MHz, ZO = 50Ω, tR ≤ 2.5ns, tF ≤ 2.5ns.
6. e outputs are measured one at a time with one transition per measurement.
Switching Waveforms
Voltage Waveforms Enable and Disable Times
tPLZ
50% 50%
VDD
VOH
0V
VOL
tPHZ
tPZL
tPZH
Output 1
Output 2
VOL
VOH
SEL
10%
90%
Switch Positions
Test Switch
tPLZ, tPZL (output on B-side) 2 * Vdd
tPHZ, tPZH (output on B-side) GND
Prop Delay Open
Test Circuit for Dynamic Electrical Characteristics
DUT
Agilent PNA-L Network Analyzer
Balanced port 1 Balanced port 2
12
PI3USB32212
A product Line of
Diodes Incorporated
www.diodes.com December 2017
Diodes Incorporated
PI3USB32212
Document Number DS40504 Rev 1-2
Packaging Mechanical: 32-TQFN (ZL)
16-0142
Ordering Information
Ordering Code Package Code Package Description
PI3USB32212ZLEX ZL 32-contact, Very in Quad Flat No-Lead (TQFN) Copper Wire
PI3USB32212ZLEX+DA ZL 32-contact, Very in Quad Flat No-Lead (TQFN) Gold Wire
Notes:
• Thermal characteristics can be found on the company web site at www.diodes.com/design/support/packaging/
• E = Pb-free and Green
• Xsufx=Tape/Reel
For latest package info.
please check: http://www.diodes.com/design/support/packaging/pericom-packaging/packaging-mechanicals-and-thermal-characteristics/
13
PI3USB32212
A product Line of
Diodes Incorporated
www.diodes.com December 2017
Diodes Incorporated
PI3USB32212
Document Number DS40504 Rev 1-2
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT
LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER
THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modications, enhancements, improvements, corrections or other changes without further no-
tice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or
any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer
or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all
the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes
Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal
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Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein
may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the nal and determi-
native format released by Diodes Incorporated.
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of the Chief Executive Ofcer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
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Customers represent that they have all necessary expertise in the safety and regulatory ramications of their life support devices or systems, and acknowledge
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