TDK MLCC
US Catalog
Version B11
CKD Series
Low ESL Feed Through Type
Type: CKD110JB
CKD310JB
CKD510JB
CKD610JB
CKD61BJB
Issue date: April 2011
REMINDERS
Please read before using this product
SAFETY REMINDERS
TDK MLCC US Catalog Version B11Page 212
REMINDERS
1. If you intend to use aproduct listed in this catalog for apurpose that may cause loss of life or other
damage, you must contact our company’s sales window.
2. We may modify products or discontinue production of aproduct listed in this catalog without prior
notification.
3. We provide “Delivery Specification” that explain precautions for the specifications and safety of each
product listed in this catalog.We strongly recommend that you exchange these delivery specifications
with customers that use one of these products.
4. If you plan to export aproduct listed in this catalog, keep in mind that it may be arestricted item according
to the “Foreign Exchange and Foreign Trade Control Law”.In such cases, it is necessary to acquire export
permission in harmony with this law.
5. Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from
our company.
6. We are not responsible for problems that occur related to the intellectual property rights or other rights of
our company or athird party when you use aproduct listed in this catalog.We do not grant license of
these rights.
7. This catalog only applies to products purchased through our company or one of our company’s official
agencies.This catalog does not apply to products that are purchased through other third parties.
TDK MLCC US Catalog Version B11Page 213
CKD Series
Low ESL Feed Through Type
Type: CKD610JB (C1608), CKD510JB (C2012),
CKD110JB (C3212), CKD310JB (C3216), CKD61BJB (C1608)
• These small low-cost filters are used for meeting EMC
requirements
• Can be used at higher frequencies due to low
parasitic inductance
• Optimized for use as a noise bypass capacitor for
signal and power source circuits
Applications •Decoupling CPU power line
•High speed digital IC/decoupling
•High impedance/high current circuits
•DC to DC converter input/output
smoothing
•Power supply
Features
Shape &
Dimensions
Structure
ECNARAEPPA ECNARAEPPA ERUTCURTSEDISNI ERUTCURTSEDISNI
Part Number
Construction
Series Name
CKD510JB 0J 226 S T XXXX
Rated Voltage (DC) Nominal Capacitance (pF)
Capacitance Tolerance
Packaging Style
Internal Codes
The capacitance is expressed in three
digit codes and in units of pico Farads
(pF). The first and second digits
identify the first and second significant
figures of the capacitance. The third
digit identifies the multiplier. R
designates a decimal point.
Dimensions in mm
LBody Length
WBody Width
TBody Height
CGND Terminal Width
BTerminal Width
Case Code Length Width
CKD610JB 1.60 ±0.10 0.80 ±0.10
CKD510JB 2.00 ±0.20 1.25 ±0.20
CKD110JB 3.20 ±0.20 1.25 ±0.20
CKD310JB 3.20 ±0.20 1.60 ±0.20
CKD61BJB 1.60 ±0.10 0.80 ±0.10
Voltage Code Voltage (DC)
0J 6.3V
1A 10V
1C 16V
1E 25V
1H 50V
Packaging Code Style
TTape & Reel
Tolerance Code Tolerance
S+50/-20%
Capacitance Code Capacitance
0R5 0.5pF
010 1pF
102 1,000pF (1nF)
105 1,000,000pF (1µF)
•Available with operating temperature range of -25ºC to +85ºC and -55ºC to +125ºC. Contact TDK for more information.
Feed Through MLCC ESL: 10 ~ 15%
Feed Through MLCC ESL: 10 ~ 15%
Standard MLCC ESL: 100%Standard MLCC ESL: 100%
TDK MLCC US Catalog Version B11Page 214
CKD610JB [EIA CC0603]
Capacitance
Range Chart
Capacitance
Range Table CKD610JB [EIA CC0603]
TDK Part Number
(Ordering Code)
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
Rated Current
(Idc max)
DC Resistance
(max)
CKD610JB0J105S 6.3V 1,000,000 +50/-20% 0.80 ±0.10 2,000 mA 12 mΩ
CKD610JB0J225S 6.3V 2,200,000 +50/-20% 0.80 ±0.10 2,000 mA 12 mΩ
CKD610JB0J475S 6.3V 4,700,000 +50/-20% 0.80 ±0.10 2,000 mA 12 mΩ
Capacitance Range Chart
Rated Voltage: 6.3V (0J)
0.80 mm
Standard Thickness
Capacitance
(pF)
Cap
Code
Tolerance 0J
(6.3V)
470,000 474
1,000,000 105
2,200,000 225
4,700,000 475
10,000,000 106
TDK MLCC US Catalog Version B11Page 215
CKD510JB [EIA CC0805]
Capacitance
Range Chart
Capacitance
Range Table CKD510JB [EIA CC0805]
TDK Part Number
(Ordering Code)
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
Rated Current
(Idc max)
DC Resistance
(max)
CKD510JB1H220S 50V 22 +50/-20% 0.85 ±0.15 400 mA 500 mΩ
CKD510JB1H470S 50V 47 +50/-20% 0.85 ±0.15 400 mA 500 mΩ
CKD510JB1H101S 50V 100 +50/-20% 0.85 ±0.15 400 mA 500 mΩ
CKD510JB1H221S 50V 220 +50/-20% 0.85 ±0.15 400 mA 500 mΩ
CKD510JB1H471S 50V 470 +50/-20% 0.85 ±0.15 400 mA 500 mΩ
CKD510JB1H102S 50V 1,000 +50/-20% 0.85 ±0.15 400 mA 500 mΩ
CKD510JB1H222S 50V 2,200 +50/-20% 0.85 ±0.15 400 mA 500 mΩ
CKD510JB1H472S 50V 4,700 +50/-20% 0.85 ±0.15 400 mA 500 mΩ
CKD510JB1E103S 25V 10,000 +50/-20% 0.85 ±0.15 1,000 mA 80 mΩ
CKD510JB1E223S 25V 22,000 +50/-20% 0.85 ±0.15 1,000 mA 80 mΩ
CKD510JB1E473S 25V 47,000 +50/-20% 0.85 ±0.15 1,000 mA 80 mΩ
CKD510JB1E104S 25V 100,000 +50/-20% 0.85 ±0.15 1,000 mA 80 mΩ
CKD510JB1C474S 16V 470,000 +50/-20% 0.85 ±0.15 2,000 mA 30 mΩ
CKD510JB1A105S 10V 1,000,000 +50/-20% 0.85 ±0.15 2,000 mA 12 mΩ
CKD510JB1A225S 10V 2,200,000 +50/-20% 0.85 ±0.15 2,000 mA 12 mΩ
CKD510JB1A475S 10V 4,700,000 +50/-20% 0.85 ±0.15 3,000 mA 12 mΩ
CKD510JB0J106S 6.3V 10,000,000 +50/-20% 0.85 ±0.15 4,000 mA 5 mΩ
CKD510JB0J226S 6.3V 22,000,000 +50/-20% 0.85 ±0.15 4,000 mA 5 mΩ
Capacitance Range Chart
Rated Voltage: 50V (1H), 25V (1E), 16V (1C), 10V (1A), 6.3V (0J)
0.85 mm
Standard Thickness
Capacitance
(pF)
Cap
Code
Tolerance 1H
(50V)
1E
(25V)
1C
(16V)
1A
(10V)
0J
(6.3V)
22 220
47 470
100 101
220 221
470 471
1,000 102
2,200 222
4,700 472
10,000 103
22,000 223
47,000 473
100,000 104
470,000 474
1,000,000 105
2,200,000 225
4,700,000 475
10,000,000 106
22,000,000 226
S: +50/-20%
TDK MLCC US Catalog Version B11Page 216
CKD110JB [EIA CC1205]
Capacitance
Range Chart
Capacitance
Range Table CKD110JB [EIA CC1205]
TDK Part Number
(Ordering Code)
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
Rated Current
(Idc max)
DC Resistance
(max)
CKD110JB1E220S 25V 22 +50/-20% 0.85 ±0.15 200 mA 600 mΩ
CKD110JB1E470S 25V 47 +50/-20% 0.85 ±0.15 200 mA 600 mΩ
CKD110JB1E101S 25V 100 +50/-20% 0.85 ±0.15 200 mA 600 mΩ
CKD110JB1E221S 25V 220 +50/-20% 0.85 ±0.15 200 mA 600 mΩ
CKD110JB1E471S 25V 470 +50/-20% 0.85 ±0.15 200 mA 600 mΩ
CKD110JB1E102S 25V 1,000 +50/-20% 0.85 ±0.15 200 mA 600 mΩ
CKD110JB1E222S 25V 2,200 +50/-20% 0.85 ±0.15 200 mA 600 mΩ
CKD110JB1E472S 25V 4,700 +50/-20% 0.85 ±0.15 200 mA 600 mΩ
CKD110JB1E103S 25V 10,000 +50/-20% 0.85 ±0.15 500 mA 300 mΩ
CKD110JB1E223S 25V 22,000 +50/-20% 0.85 ±0.15 500 mA 300 mΩ
CKD110JB1E473S 25V 47,000 +50/-20% 0.85 ±0.15 500 mA 300 mΩ
CKD110JB1E104S 25V 100,000 +50/-20% 0.85 ±0.15 500 mA 300 mΩ
Capacitance Range Chart
Rated Voltage: 25V (1E)
0.85 mm
Standard Thickness
Capacitance
(pF)
Cap
Code
Tolerance 1E
(25V)
22 220
47 470
100 101
220 221
470 471
1,000 102
2,200 222
4,700 472
10,000 103
22,000 223
47,000 473
100,000 104
TDK MLCC US Catalog Version B11Page 217
CKD310JB [EIA CC1206]
Capacitance
Range Chart
Capacitance
Range Table CKD310JB [EIA CC1206]
TDK Part Number
(Ordering Code)
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
Rated Current
(Idc max)
DC Resistance
(max)
CKD310JB1C104S 16V 100,000 +50/-20% 1.30 ±0.15 2,000 mA 40 mΩ
CKD310JB1C224S 16V 220,000 +50/-20% 1.30 ±0.15 2,000 mA 40 mΩ
CKD310JB1C474S 16V 470,000 +50/-20% 1.30 ±0.15 2,000 mA 40 mΩ
CKD310JB1C105S 16V 1,000,000 +50/-20% 1.30 ±0.15 2,000 mA 40 mΩ
CKD310JB0J226S 6.3V 22,000000 +50/-20% 1.30 ±0.15 4,000 mA 12 mΩ
Capacitance Range Chart
Rated Voltage: 16V (1C), 6.3V (0J)
Standard Thickness
1.30 mm
Capacitance
(pF)
Cap
Code
Tolerance 1C
(16V)
0J
(6.3V)
100,000 104
220,000 224
470,000 474
1,000,000 105
22,000,000 226
S: +50/-20%
TDK MLCC US Catalog Version B11Page 218
CKD61BJB [EIA CC0603]
Capacitance
Range Chart
Capacitance
Range Table CKD61BJB [EIA CC0603]
TDK Part Number
(Ordering Code)
Rated
Voltage
Capacitance
(pF)
Capacitance
Tolerance
Thickness
(mm)
Rated Current
(Idc max)
DC Resistance
(max)
CKD61BJB0J474S 6.3V 470,000 +50/-20% 0.60 ±0.10 2,000 mA 30 mΩ
CKD61BJB0J105S 6.3V 1,000,000 +50/-20% 0.60 ±0.10 2,000 mA 30 mΩ
CKD61BJB0J475S 6.3V 22,000000 +50/-20% 0.60 ±0.10 2,000 mA 12 mΩ
Capacitance Range Chart
Rated Voltage: 6.3V (0J)
0.60 mm
Standard Thickness
Capacitance
(pF)
Cap
Code
Tolerance 0J
(6.3V)
100,000 104
470,000 474
1,000,000 105
4,700,000 475
10,000,000 106
TDK MLCC US Catalog Version B11Page 219
General
Specifications CKD Series –Feed Through Type
No. Item Performance Test or Inspection Method
1External
Appearance
No defects which may affect
performance.
Inspect with magnifying glass (3×).
2Insulation
Resistance
10,000MΩor 500MΩ•μF min.,
whichever smaller (As for the capacitors
of rated voltage 16, 10, 6.3V DC,
100MΩ•μF min.).
Apply rated voltage for 60s.
3Direct Current
Resistance
Rdc (1-2)
Rdc is between 5MΩ-600 MΩ
depending on item. See the
Capacitance Range Chart section to
obtain item specific parameters.
Measuring current should be 100mA max.
4Voltage Proof Withstand test voltage without
insulation breakdown or other damage.
2.5 x rated voltage (DC) shall be applied for 1 to 5s.
Charge / discharge current shall not exceed 50mA.
5Capacitance Within the specified tolerance.
6Dissipation
Factor (D.F.)
10% maximum See No.5 in this table for measuring condition.
7Bending No mechanical damage. Reflow solder the capacitor on P.C. board (shown in
Appendix 2, Appendix 4 or Appendix 6) and bend
1mm.
8Solderability New solder to cover over 75% of
termination.
25% may have pin holes or rough spots
but not concentrated in one spot.
Ceramic surface of “A sections” shall
not be exposed due to melting or
shifting of termination material.
Completely soak both terminations in solder at
235±5ºC for 2±0.5s.
Solder: H63A (JIS Z 3282)
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
12
4
3
RdcⅡ
R mΩmax dcⅡ
Measuring Frequency Measuring Voltage
1kHz±10% 0.5 -5 Vrms
1.0±0.2Vrms
1
20
50 F
R230
45 45
Unit: mm
A section
TDK MLCC US Catalog Version B11Page 220
General
Specifications
No. Item Performance Test or Inspection Method
9Resistance to solder heat Completely soak both terminations in solder at
260±5ºC for 5±1s.
Preheating condition
Temp.: 150±10ºC
Time: 1 to 2min.
Flux: Isopropyl alcohol (JIS K 8839)
Rosin (JIS K 5902) 25% solid solution.
Solder: H63A (JIS Z 3282)
Leave the capacitor in ambient conditions for 24±2h
before measurement.
External
appearance
No mechanical damage.
Capacitance
D.F. (Class 2) Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Voltage
Proof
No insulation breakdown or other
damage.
Resistance
for DC (Rdc)
1.0 Ωmax.
10 Temperature cycle Reflow solder the capacitor on P.C. board (shown in
Appendix 1 or Appendix 3) before testing.
Expose the capacitor in the conditions step1 through
step 4 and repeat 5 times consecutively.
Leave the capacitor in ambient conditions for 24±2h
before measurement.
External
appearance
No mechanical damage.
Capacitance
D.F. (Class 2) Meet the initial spec.
Insulation
Resistance
Meet the initial spec.
Resistance
for DC (Rdc)
1.0 Ωmax.
11 Moisture Resistance (Steady State) Reflow solder the capacitors on P.C. board (shown in
Appendix 1 or Appendix 3) before testing.
Leave at temperature 40±2ºC, 90 to 95%RH for 500
+24,0h.
Leave the capacitor in ambient conditions for 24±2h
before measurement.
External
appearance
No mechanical damage.
Capacitance
D.F. (Class 2) 200% of initial spec. max.
Insulation
Resistance
1,000MΩor 50MΩ•μF min, whichever
smaller. (As for the capacitors of rated
voltage 16, 10, 6.3V DC, 10MΩ•μF
min.)
Resistance
for DC (Rdc)
1.0 Ωmax.
Change from the value
before test
±7.5%
Change from the value
before test
±7.5%
Step Temperature (ºC) Time (min.)
1Min. operating temp. ±330 ±3
220 ±22 – 5
3Max. operating temp. ±230 ±2
420 ±22 - 5
Change from the value
before test
±12.5%
CKD Series –Feed Through Type
TDK MLCC US Catalog Version B11Page 221
General
Specifications
No. Item Performance Test or Inspection Method
12 Life Reflow solder the capacitor on P.C. board (shown in
Appendix 1, Appendix 3 or Appendix 5) before testing.
Voltage shall be applied at maximum operating
temperature ±2ºC for 1,000 +48, 0h.
Applied voltage is 1xRV; however some items may be
tested at higher voltage (1.2x, 1.5x or 2xRV).
Charge/discharge current shall not exceed 50mA.
Leave the capacitor in ambient conditions for 24±2h
before measurement.
Voltage conditioning:
Voltage treats the capacitor under testing temperature
and voltage for 1 hour.
Leave the capacitor in ambient conditions for 24±2h
before measurement.
Use this measurement for initial value.
External
appearance
No mechanical damage.
Capacitance
D.F. (Class 2) 200% of initial spec. max.
Insulation
Resistance
1,000MΩor 50MΩ•μF min., whichever
smaller. (As for the capacitors of rated
voltage 16, 10, 6.3V DC, 10MΩ•μF
min.)
Resistance
for DC (Rdc)
1.0 Ωmax.
*As for the initial measurement of capacitors on number 9, 10 and 11, leave capacitors at 150 –10, 0°C for 1 hour and
measure the value after leaving capacitors for 24±2h in ambient condition.
Change from the value
before test
±15%
CKD Series –Feed Through Type
TDK MLCC US Catalog Version B11Page 222
General
Specifications
Appendix - 1
P.C. Board for reliability test
Appendix - 2
P.C. Board for bending test
100 mm
Solder Resist Copper
40 mm
100 mm
Solder Resist Copper
40 mm
Case Code Dimensions (mm)
Series JIS EIA a b c d e f
CKD710JB C1005 CC0402 0.7 0.3 0.19 0.6 0.25 0.25
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: 1.6mm
Copper (thickness 0.035mm)
Solder resist
Appendix –1 & 2
a
b b
f
f
e
c
d
CKD Series –Feed Through Type
TDK MLCC US Catalog Version B11Page 223
General
Specifications
Appendix - 3
P.C. Board for reliability test
Appendix - 4
P.C. Board for bending test
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: 1.6mm
Copper (thickness 0.035mm)
Solder resist
a
bb
c
d
c
(Unit: mm)
100 mm
Solder Resist Copper
40 mm
Solder Resist
Copper
100 mm
40 mm
Case Code Dimensions (mm)
Series JIS EIA a b c d e f
CKD610JB C1608 CC0603 1.0 0.6 0.4 0.6 0.4 0.4
Case Code Dimensions (mm)
Series JIS EIA a b c d
CKD610JB C1608 CC0603 0.4 0.5 0.4 2.0
Appendix - 3
Appendix - 4
a
b b
f
f
e
c
d
CKD Series –Feed Through Type
TDK MLCC US Catalog Version B11Page 224
General
Specifications
Appendix - 5
P.C. Board for reliability test
Appendix - 6
P.C. Board for bending test
Material: Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness: 1.6mm
Copper (thickness 0.035mm)
Solder resist
a
bb
f
f
e
c
d
Solder Resist
Copper
100 mm
40 mm
Solder Resist
100 mm
40 mm
Case Code Dimensions (mm)
Series JIS EIA a b c d e f
CKD510JB C2012 CC0805 1.4 0.6 0.5 0.8 0.6 0.65
CKD110JB C3212 CC1205 2.5 0.7 1.4 1.0 0.6 0.7
CKD310JB C3216 CC1206 2.5 1.2 1.4 1.3 0.8 0.9
Appendix –5 & 6
CKD Series –Feed Through Type
TDK MLCC US Catalog Version B11Page 225
Soldering
Information
• Recommended Soldering Land Pattern • Recommended Soldering Profile
Connect to the ground pattern of the
chip mounted side.
Ground
pattern
Back side:
Back side shall be
connected to the
ground pattern of the
chip mounted side.
Please design the
back side ground as
large as possible.
Resist Cu Pattern
Symbol
Series a b c d e
CKD710JB 0.19 0.7 1.3 0.6 0.75
CKD510JB 0.5 1.5 2.6 1.0 2.0
CKD110JB 1.4 2.5 4.5 1.0 2.0
CKD310JB 1.4 2.5 4.5 1.2 2.4
*If through hole is too
big, solder paste may
come into the hole
and make bad
connection with the
ground pattern.
CKD510JB, CKD110JB, CKD310JB
CKD710JB
CKD610JB
Connect to the
ground pattern of the
chip mounted side.
“Through hole” should
be designed as close
to GND terminal as
possible.
Resist Cu Pattern No Pattern
Symbol
Series a b c d e
CKD610JB 0.4 1.2 2.2 0.7 1.4
Reflow Soldering Manual soldering
(Solder iron)
Recommended soldering duration
Temp./
Dura.
Solder
Reflow Soldering
Peak temp
(°C)
Duration
(sec.)
Sn-Pb Solder 230 max. 20 max.
Lead-Free Solder 260 max. 10 max.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Preheating Condition
Soldering
Method Temperature (ºC)
Reflow soldering ∆T ≤ 150
Manual soldering ∆T ≤ 150
Excessive
solder
Higher tensile force
on the chip
capacitor may
cause cracking.
Adequate
solder
Insufficient
solder
Small solder fillet
may cause contact
failure or failure to
hold the chip
capacitor to the
P.C. board.
• Recommended Solder Amount
Maximum amount
Minimum amount
φ0.4～0.6
b
a
d
c
Through hole
e
a
Through hole
Ø0.4-0.6
de
b
c
e
Through hole
Ø0.4-0.6
a
d
b
c
∆T
Preheating
3sec. (As short as possible)
0
300
Temp (ºC)
Temp (ºC)
0
∆T
Soldering Natural
cooling
Preheating
Peak
Temp
Over 60 sec.
Peak Temp time
CKD Series –Feed Through Type
TDK MLCC US Catalog Version B11Page 226
Packaging
Information
• Carrier Tape Configuration
Paper carrier tape
Pitch hole
Top cover tape
Bottom cover tape Plastic carrier tape
Top cover tape
Pitch hole
• Chip Quantity Per Reel and Structure of Reel (Paper & Plastic)
• Peel Back Force (Top Tape)
0~15°
Carrier tape
Top cover tape
Direction & angle of pull
0.05 – 0.7 N
• Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
• The missing of components shall be less than
0.1%
• Components shall not stick to the cover tape.
• The cover tape shall not protrude beyond the
edges of the carrier tape not shall cover the
sprocket holes.
Paper Carrier Tape & Reel Plastic Carrier Tape & Reel
Drawing direction Leader
400mm min.
Bulk
160mm min.
Chips Bulk
160mm min.
Case Code Chip
Thickness
(mm)
Taping
Material
Chip quantity (pcs.)
Series JIS EIA φ178mm (7”)
reel
φ330mm (13”)
reel
CKD710JB C1005 CC0402 0.30
Paper
10,000 50,000
CKD610JB C1608 CC0603 0.80
4,000 10,000
CKD510JB C2012 CC0805 0.85
CKD110JB C3212 CC1205 0.85
CKD310JB C3216 CC1206 1.30 Plastic 2,000
CKD Series –Feed Through Type
TDK MLCC US Catalog Version B11Page 227
Additional
Information
T
Internal electrode Ceramic dielectric
W
L
Terminal electrode
B
B
C
• Shape & Dimensions
TDK Corporation established internal product environmental
assurance standards that include the six hazardous
substances banned by the EU RoHS Directive1enforced on
July 1, 2006 along with additional substances independently
banned by TDK and has successfully completed making
general purpose electronic components conform to the
RoHS Directive2.
No. NAME MATERIAL
(1) Ceramic Dielectric CaZrO3 or BaTiO3
(2) Internal Electrode Nickel (Ni)
(3)
Termination
Copper (Cu)
(4) Nickel (Ni)
(5) Tin (Sn)
• Inside Structure & Material System
Case Code Dimensions (mm)
Series JIS EIA L W T B C
CKD710JB C1005 CC0402 1.00 0.55 0.30 0.17 0.30
CKD610JB C1608 CC0603 1.60 0.80 0.80 0.10 0.40
CKD510JB C2012 CC0805 2.00 1.25 0.85 0.30 0.40
CKD110JB C3212 CC1205 3.20 1.25 0.85 0.40 0.95
CKD310JB C3216 CC1206 3.20 1.60 1.30 0.40 0.95
• Environmental Information
1. Abbreviation for Restriction on Hazardous
Substances, which refers to the regulation EU
Directive 2002/95/EC on hazardous substances by
the European Union (EU) effective from July 1, 2006.
The Directive bans the use of six specific hazardous
substances in electric and electronic devices and
products handled within the EU. The six substances
are lead, mercury, cadmium, hexavalent chromium,
PBB (polybrominated biphenyls), and PBDE
(polybrominated diphenyl ethers).
2. This means that, in conformity with the EU Directive
2002/95/EC, lead, cadmium, mercury, hexavalent
chromium, and specific bromine-based flame
retardants, PBB and PBDE, have not been used,
except for exempted applications.
For REACH (SVHC : 15 substances according to ECHA /
October 2008) : All TDK MLCC do not contain these
15 substances.
For European Directive 2000/53/CE and 2005/673/CE :
Cadmium, Hexavalent Chromium, Mercury, Lead are
not contained in all TDK MLCC.
For European Directive 2003/11/CE : Pentabromodiphenyl-
ether, Octabromodiphenyl-ether are not contained in
all TDK MLCC.
A
B’
B
A’
3
4
5
12
3
4
5
(A-A’) (B-B’)
CKD Series –Feed Through Type