BAS16... Silicon Switching Diode * For high-speed switching applications * Pb-free (RoHS compliant) package 1) * Qualified according AEC Q101 BAS16 BAS16W BAS16-02L BAS16-02V BAS16-02W BAS16-03W BAS16S BAS16U $ ! Type BAS16 BAS16-02L* BAS16-02V BAS16-02W BAS16-03W BAS16-07L4* BAS16S BAS16U BAS16W " # , BAS16-07L4 , " , ! ! , ! , Package SOT23 TSLP-2-1 SC79 SCD80 SOD323 TSLP-4-4 SOT363 SC74 SOT323 Configuration single single, leadless single single single parallel pair, leadless parallel triple parallel triple single Marking A6s A6 6 A6 B 6A A6s A6s A6s * Preliminary Data 1Pb-containing package may be available upon special request 1 2007-07-26 BAS16... Maximum Ratings at TA = 25C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 80 Peak reverse voltage VRM 85 Forward current IF Value 250 BAS16-02L, -07L4 200 BAS16-02V, -02W 200 BAS16-03W 250 BAS16S 200 BAS16U 200 BAS16W 250 IFSM A t = 1 s, BAS16/ S/ U/ W/ -03W 4.5 t = 1 s, BAS16-02L/ -02V/ -02W/ -07L4 2.5 t=1s 0.5 Total power dissipation V mA BAS16 Non-repetitive peak surge forward current Unit mW Ptot BAS16, T S 54 C 370 BAS16-02L, -07L4, TS 130 C 250 BAS16-02V, -02W, TS 120 C 250 BAS16-03W, TS 116 C BAS16S, TS 85 C 250 BAS16U, TS 113 C 250 BAS16W, TS 119 C 250 250 Junction temperature Tj Storage temperature Tstg 2 150 C -65 ... 150 2007-07-26 BAS16... Thermal Resistance Parameter Symbol Junction - soldering point 1) RthJS Value Unit K/W BAS16, BAS16S 260 BAS16-02L, -07L4 80 BAS16-02V, -02W 120 BAS16-03W 135 BAS16U 150 BAS16W 125 Electrical Characteristics at TA = 25C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics 85 V Breakdown voltage V(BR) I(BR) = 100 A Reverse current A IR VR = 75 V - - 1 VR = 25 V, TA = 150 C - - 30 VR = 75 V, TA = 150 C - - 50 Forward voltage mV VF IF = 1 mA - - 715 IF = 10 mA - - 855 IF = 50 mA - - 1000 IF = 100 mA - - 1200 IF = 150 mA - - 1250 - - 1.75 Forward recovery voltage Vfr V IF = 10 mA, tP = 20 ns 1For calculation of RthJA please refer to Application Note Thermal Resistance 3 2007-07-26 BAS16... Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Values Unit Parameter min. typ. max. AC Characteristics 2 pF Diode capacitance CT VR = 0 V, f = 1 MHz Reverse recovery time trr - - 4 ns IF = 10 mA, IR = 10 mA, measured at IR = 1mA , RL = 100 Test circuit for reverse recovery time Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns, R i = 50 D.U.T. F Oscillograph Oscillograph: R = 50, tr = 0.35ns, C = 0.05pF EHN00017 4 2007-07-26 BAS16... Reverse current IR = (TA) Forward Voltage VF = (TA) IF = Parameter VR = Parameter 10 5 BAS 16 1.0 EHB00025 nA V VF F = 100 mA 10 4 IR 10 mA 10 3 1 mA 0.5 0.1 mA 70 V 25 V 10 2 10 1 0 25 50 75 100 C 0 150 0 TA 50 100 Forward current IF = (VF) Forward current IF = (T S) TA = 25C BAS16 150 BAS 16 C TA 150 300 EHB00023 F mA mA 200 IF 100 typ 150 max 100 50 50 0 0 0.5 1.0 V 0 0 1.5 15 30 45 60 75 90 105 120 C 150 TS VF 5 2007-07-26 BAS16... Forward current IF = (T S) Forward current IF = (T S) BAS16-02L, -07L4 BAS16-02V, -02W 250 250 mA IF IF mA 150 150 100 100 50 50 0 0 15 30 45 60 75 90 105 120 C 0 0 150 15 30 45 60 75 90 105 120 C TS 150 TS Forward current IF = (T S) Forward current IF = (T S) BAS16-03W BAS16S 250 300 mA mA IF IF 200 150 150 100 100 50 50 0 0 15 30 45 60 75 90 105 120 C 0 0 150 15 30 45 60 75 90 105 120 C 150 TS TS 6 2007-07-26 BAS16... Forward current IF = (T S) Forward current IF = (T S) BAS16U BAS16W 250 300 mA mA 200 200 IF IF 175 150 125 150 100 100 75 50 50 25 0 0 15 30 45 60 90 105 120 C 75 0 0 150 15 30 45 60 90 105 120 C 75 TS 150 TS Permissible Puls Load RthJS = (tp) Permissible Pulse Load BAS16 IFmax / I FDC = (t p) BAS16 10 3 10 2 IFmax/IFDC K/W RthJS 10 2 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 0 10 -1 -7 10 10 -6 10 -5 10 -4 10 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 -3 10 -2 s 10 10 0 -7 10 0 tp 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 7 2007-07-26 BAS16... Permissible Puls Load RthJS = (tp) Permissible Pulse Load BAS16-02L, -07L4 IFmax / I FDC = (t p) BAS16-02L, -07L4 10 2 I Fmax/ I FDC 10 2 R thJS K/W 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 0 -6 10 10 -5 10 -4 10 -3 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 -2 10 -1 s 10 10 0 -6 10 1 10 -5 10 -4 10 -3 10 -2 s tp 10 0 -3 10 -2 s 10 0 tp Permissible Puls Load RthJS = (tp) Permissible Pulse Load BAS16-02V, -02W IFmax / I FDC = (t p) BAS16-02V, -02W 10 2 10 3 IFmax/ IFDC RthJS K/W 10 2 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 tp 8 2007-07-26 BAS16... Permissible Puls Load RthJS = (tp) Permissible Pulse Load BAS16-03W IFmax / I FDC = (t p) BAS16-03W 10 10 2 3 I Fmax/ I FDC R thJS K/W 10 2 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 tp s 10 0 10 0 tp Permissible Puls Load RthJS = (tp) Permissible Pulse Load BAS16S IFmax / I FDC = (t p) BAS16S 10 2 10 3 IFmax/ IFDC RthJS K/W 10 2 10 0 -6 10 10 -5 10 -4 10 -3 10 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 1 - -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s tp 9 2007-07-26 BAS16... Permissible Puls Load RthJS = (tp) Permissible Pulse Load BAS16U IFmax / I FDC = (t p) BAS16U 10 10 2 3 I Fmax/ I FDC R thJS K/W 10 2 D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 D=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 10 -5 10 -4 10 -3 10 -2 tp s 10 0 10 0 tp Permissible Puls Load RthJS = (tp) Permissible Pulse Load BAS16W IFmax / I FDC = (t p) BAS16W 10 2 10 3 IFmax/ IFDC RthJS K/W 10 2 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 10 0 -6 10 10 -5 10 -4 10 -3 10 -2 s 10 10 0 -6 10 0 tp 10 -5 10 -4 10 -3 10 -2 s tp 10 2007-07-26 Package SC74 BAS16... Package Outline B 1.1 MAX. 1 2 3 0.35 +0.1 -0.05 Pin 1 marking 0.2 B 6x M A 0.1 MAX. 0.95 0.2 1.9 1.6 0.1 4 10 MAX. 5 2.5 0.1 6 0.25 0.1 0.15 +0.1 -0.06 (0.35) 10 MAX. 2.9 0.2 (2.25) M A Foot Print 2.9 1.9 0.5 0.95 Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Manufacturer 2005, June Date code (Year/Month) Pin 1 marking Laser marking BCW66H Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. 0.2 2.7 8 4 Pin 1 marking 3.15 1.15 11 2007-07-26 Package SC79 BAS16... Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 0.1 0.2 0.05 10MAX. 1.6 0.1 1 0.3 0.05 Cathode marking 10MAX. 1.2 0.1 A 2 0.55 0.04 0.35 1.35 Foot Print 0.35 Marking Layout (Example) 2005, June Date code BAR63-02V Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel o330 mm = 10.000 Pieces/Reel Cathode marking 0.4 0.93 0.2 8 1.96 Reel with 2 mm Pitch 2 1.33 Standard 4 Cathode marking 12 0.66 2007-07-26 Package SCD80 BAS16... Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 0.1 0.2 0.05 10MAX. 1.7 0.1 1 0.3 0.05 Cathode marking 7 1.5 1.3 0.1 A 2 0.7 0.1 0.35 1.45 Foot Print 0.35 Marking Layout (Example) 2005, June Date code BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel o330 mm = 10.000 Pieces/Reel Reel with 2 mm Pitch 2 0.2 2.5 8 1.45 Standard 4 Cathode marking 0.4 0.9 Cathode marking 13 0.7 2007-07-26 BAS16... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 2 0 04 2005 2006 2 0 07 2008 2009 2010 2011 2012 2 0 13 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 14 2007-07-26 Package SOD323 BAS16... Package Outline 0.9 +0.2 -0.1 +0.2 1.25 -0.1 0 0.05 A 1.7 +0.2 -0.1 Cathode marking 0.45 0.15 2.5 0.2 2 1 0.3 +0.1 -0.05 +0.05 0.3 -0.2 0.15 +0.1 -0.06 0.25 M A 0.8 1.7 0.8 Foot Print 0.6 Marking Layout (Example) BAR63-03W Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 0.2 2 2.9 8 4 Cathode marking 0.65 1.35 15 1 2007-07-26 Package SOT23 BAS16... 0.4 +0.1 -0.05 1) 2 0.08...0.1 C 0.95 1.3 0.1 1 2.4 0.15 3 0.1 MAX. 10 MAX. B 1 0.1 10 MAX. 2.9 0.1 0.15 MIN. Package Outline A 5 0...8 1.9 0.2 0.25 M B C M A 1) Lead width can be 0.6 max. in dambar area Foot Print 0.8 0.9 1.3 0.9 0.8 1.2 Marking Layout (Example) Manufacturer EH s 2005, June Date code (YM) Pin 1 BCW66 Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 4 0.2 8 2.13 2.65 0.9 Pin 1 1.15 3.15 16 2007-07-26 Package SOT323 BAS16... Package Outline 0.9 0.1 2 0.2 0.3 +0.1 -0.05 0.1 MAX. 3x 0.1 M 0.1 A 1 2 1.25 0.1 0.1 MIN. 2.1 0.1 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 0.8 1.6 0.6 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) BCR108W Type code Pin 1 Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 17 2007-07-26 Package SOT363 BAS16... Package Outline 2 0.2 0.9 0.1 +0.1 6x 0.2 -0.05 0.1 0.1 MAX. M 0.1 Pin 1 marking 1 2 3 A 1.25 0.1 4 0.1 MIN. 5 2.1 0.1 6 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 1.6 0.9 0.7 0.3 0.65 0.65 Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Manufacturer 2005, June Date code (Year/Month) Pin 1 marking Laser marking BCR108S Type code Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. 0.2 2.3 8 4 Pin 1 marking 1.1 2.15 18 2007-07-26 Package TSLP-2-1 BAS16... Package Outline Top view Bottom view 0.4 +0.1 0.6 0.05 0.05 MAX. 1 1) 1) 0.5 0.035 Cathode marking 0.25 0.035 2 1 1 0.05 0.650.05 2 1) Dimension applies to plated terminal Foot Print 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Copper Solder mask 0.375 0.275 0.35 1 0.3 0.925 0.35 0.45 Stencil apertures Marking Layout (Example) BAS16-02L Type code Cathode marking Laser marking Standard Packing Reel o180 mm = 15.000 Pieces/Reel Reel o330 mm = 50.000 Pieces/Reel (optional) 0.5 1.16 Cathode marking 8 4 0.76 19 2007-07-26 Package TSLP-4-4 BAS16... Package Outline Bottom view 0.8 0.05 4 x 0.25 0.035 1) 0.75 0.05 0.05 MAX. 3 2 4 1 2 3 1 1.2 0.05 0.4 +0.01 4 x 0.35 0.035 1) Top view 4 0.45 0.05 Pin 1 marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.8 0.4 0.38 0.42 1.18 0.4 1.2 0.4 0.38 0.78 0.28 0.3 0.28 0.3 0.22 0.2 Copper Stencil apertures Solder mask Marking Layout (Example) BAR90-07L4 Type code Pin 1 marking Laser marking Standard Packing Reel o180 mm = 15.000 Pieces/Reel 0.5 1.45 8 4 Pin 1 marking 1.05 20 2007-07-26 BAS16... Edition 2006-02-01 Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 21 2007-07-26