1/29
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
CMOS LDO Regulators for Portable Equipments
1ch 200mA
CMOS LDO Regulators
BUTA2WNVX series, BUTA2WHFV series
●Description
BU□□TA2WNVX /HFV series is high-performance FULL CMOS regulator with 200-mA output, which is mounted on
microminiature package SSON004X1216 (1.2 mm 1.6 mm 0.6 mm) &HVSOF5(1.6mm 1.6mm 0.6mm). It has
excellent noise characteristics and load responsiveness c haracteristics de spite its low circuit current consumption of 4 0 µA.
It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.
Microminiature package SSON004X1216 & HVSOF5 with built-in heatsink is adopted fo r the package, which contributes to
the space-saving design of the set.
●Features
1) High-accuracy output voltage of 1% (25 mV on 1.5-V & 1.8-V products）
2) High ripple rejection: 70 dB (Typ., 1 kHz, VOUT1.8 V))
3) Compatible with small ceramic capacitor (CIN=Co=1.0 µF)
4) Low current consumption: 40 µA
5) ON/OFF control of output voltage
6) With built-in overcurrent protection circuit and overheat protection circuit
7) With built-in output discharge circuit
8) Adopting microminiature power package SSON004X1216
●Applications
Battery-powered portable equipment, etc.
●Line up
■ 200 mA BU□□TA2WNVX / HFV series
Product Name 1.5 1.8 2.5 2.6 2.7 2.8 2.85 2.9 3.0 3.1 3.2 3.3 3.4 Package
BU□□TA2WNVX ○ ○ ○ ○ ○○○○○○○○ ○ SSON004X1216
BU□□TA2WHFV ○ ○ ○ ○ ○○○○○○○○ ○ HVSOF5
Model name: BH□□TA2W□□□
a b
Symbol Contents
a
Specification of output voltage
□□ Output voltage (V) □□ Output voltage (V) □□ Output voltage (V)
15 1.5V(Typ.) 28 2.8V(Typ.) 32 3.2V(Typ.)
18 1.8V(Typ.) 2J 2.85V(Typ.) 33 3.3V(Typ.)
25 2.5V(Typ.) 29 2.9V(Typ.) 34 3.4V(Typ.)
26 2.6V(Typ.) 30 3.0V(Typ.) - -
27 2.7V(Typ.) 31 3.1V(Typ.) - -
b Package NVX :SSON004X1216
HFV :HVSOF5
No.11020ECT01
Technical Note
2/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Absolute maximum rating
Parameter Symbol Ratings Unit
Maximum applied power voltage VMAX -0.3 ~ +6.5 V
Power dissipation Pd1 220*1 (SSON004X1216) mW
Pd2 410*2 (HVSOF5)
Maximum junction temperature TjMAX +125 ℃
Operational temperature range Topr -40 ~ +85 ℃
Storage temperature range Tstg -55 ~ +125 ℃
*1 When 1 PCB (70 mm 70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.
Reduced to 2.2 mW/C when used at Ta=25C or higher.
*2 When 1 PCB (70 mm 70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.
Reduced to 4.1 mW/C when used at Ta=25C or higher.
●Recommended operating range (Do not exceed Pd.)
Parameter Symbol Ratings Unit
Input power supply voltage VIN 2.5 ~ 5.5 V
Maximum output current IMAX 200 mA
●Recommended operating conditions
Parameter Symbol Ratings Unit Conditions
Min. Typ. Max.
Input capacitor CIN 0.5*3 1.0 － μF A ceramic capacitor is
recommended.
Output capacitor CO 0.5*3 1.0 － μF A ceramic capacitor is
recommended.
*3 Set the capacity value of the capacitor so that it does not fall below the minimum value, taking temperature characteristics,
DC device characteristics, and change with time into consideration.
Technical Note
3/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Electrical characteristics
(Unless otherwise specified Ta=25℃, VIN=VOUT+1.0 V (VIN=3.5 V on VOUT=1.8-V and1.5-V products),
STBY=1.5 V, CIN=1.0 µF, CO=1.0 µF)
Parameter Symbol Limits Unit Conditions
Min. Typ. Max.
Output voltage VOUT
VOUT
×0.99 VOUT
VOUT
×1.01 V IOUT=10 μA, VOUT≥2.5 V
VOUT
-25 mV VOUT
+25 mV IOUT=10 μA, VOUT<2.5 V
Circuit current IIN - 40 95 μA IOUT=0mA
Circuit current (at STBY) ISTBY - - 1 μA STBY=0 V
Ripple rejection RR 55 70 - dB
VRR=-20 dBv, fRR=1 kHz,
IOUT=10 mA, 1.5 V≤VOUT≤1.8 V
65 VRR=-20 dBv,fRR=1 kHz,
IOUT=10 mA, 2.5 V≤VOUT
Input/Output voltage difference VSAT
- 400 800 mV
2.5 V≤VOUT≤2.6 V
(VIN=0.98*VOUT, IOUT=200 mA)
- 360 720 mV
2.7 V≤VOUT≤2.85 V
(VIN=0.98*VOUT, IOUT=200 mA)
- 330 660 mV
2.9 V≤VOUT≤3.1 V
(VIN=0.98*VOUT,IOUT=200 mA)
- 300 600 mV
3.2 V≤VOUT≤3.4 V
(VIN=0.98*VOUT, IOUT=200 mA)
Line regulation VDL - 2 20 mV
VIN=VOUT+1.0 V to 5.5 V,
IOUT=10 μA
Load regulation VDLO - 10 80 mV
IOUT=0.01 mA to 100 mA
Overcurrent protection detection
current ILMAX 250 400 700 mA
Vo=VOUT*0.8
Output short-circuit current ISHORT 20 70 150 mA Vo=0 V
Output discharge resistance RDSC 20 40 80 Ω VIN=4.0 V, STBY=0 V
Standby pull-down resistance RSTB 500 1000 2000 kΩ
Standby control ON VSTBH 1.5 - 5.5 V
OFF VSTBL -0.3 - 0.3 V
* This product does not have radiation-proof design.
Technical Note
4/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Block diagram, re commended circuit diagram, and pin configuration diagram
BU□□TA2WNVX(SSON004X1216)
PIN No. Symbol Function
1 VOUT Voltage output
2 GND Grounding
3 STBY
ON/OFF control of output voltage
(High: ON, Low: OFF)
4 VIN Power input
BU□□TA2WHFV(HVSOF5)
PIN No. Symbol Function
1 STBY
ON/OFF control of output voltage
(High:ON, Low:OFF)
2 GND Grounding
3 VIN Power input
4 VOUT Voltage output
5 N.C. No Connect
BH□□TA2WNVX
Fig.1 Recommended circuit diagram
Recommended ceramic cap acitor for Cin & Co
Murata Manufacturing Co., Ltd.
GRM188B11A105KA61D
12
43
123
4
5
1
Cin
VIN VIN
GND
STBY
VOUT VOUT
Co
VREF
OCP
STBY Discharge
VSTBY
4/3
2
1/4
3/1
Technical Note
5/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig.4 Stability area characteris tics (Example)
●Input/Output terminal equivalent circuit schematic
1pin (VOUT) 2pin (GND) 3pin (STBY) 4pin (VIN)
VIN
STBY
Fig.２ Input/Output equivalent circuit
●About input/output capacitor
It is recommended to place a capacitor as close as possible to the
pins between the input terminal and GND or between the output
terminal and GND.
The capacitor between the input terminal and GND becomes valid
when source impedance increases or when wiring is long. The
larger the capacity of the output capacitor between the output
terminal and GND is, the better the stability and characteristics in
output load fluctuation become. However, please check the status
of actual implementation. Ceramic capacitors generally have
variation, temperature characteristics, and direct current bias
characteristics and the capacity value also decreases with time
depending on the usage conditions. It is recommended to select a
ceramic capacitor upon inquiring about detailed data of the related
manufacturer.
●About the equivalent series resistance (ESR) of a ceramic capacitor
Capacitors generally have ESR (equivalent series resistance) and it
operates stably in the ESR-IOUT area shown on the right. Since
ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc.
generally have different ESR, please check the ESR of the
capacitor to be used and use it within the stability area range shown
in the right graph for evaluation of the actual application.
VOUT
VIN
Fig.3 Capacity – bias characteristics
Capacity value of ceramic capacitor - DC bias characteristics
(Example)
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
00.511.522.533.54
DC Bias Voltage [V]
Capacitance Change [%]
10-V w ithstand voltage
B1characteristics
GRM188B11A105KA61D
10-V withstand voltage
B ch aracteristics
6.3-V withstand voltage
B characteristics
4-V withstand voltage
X6S characteristics
10-V withstand v o ltage
F characteristics
10-V withstand voltage
F characteristics
0.01
0.1
1
10
100
0 50 100 150 200
IOUT [mA]
ESR [Ω]
Stability area
Unstable area
Technical Note
6/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 5 Output Voltage Fig. 6 Line Regulation
Fig. 14 VOUT vs. Temp
●Reference data BU15TA2WNVX / HFV (Ta=25ºC unless otherwise specifie d.)
Fig. 7 Circuit Current IGND
Fig. 8 Circuit Current IGND Fig. 9 STBY Input Current Fig. 10 IOUT - IGND
Fig. 16 IGND vs. Temp (STBY) Fig. 15 IGND vs. Temp
Fig. 11 Load Regulatio n Fig. 13 STBY Threshold
Fig. 12 OCP Threshold
0.0
0.3
0.6
0.9
1.2
1.5
1.8
00.511.522.533.544.555.5
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA Temp=25°C
VIN = STBY
1.45
1.46
1.47
1.48
1.49
1.50
1.51
1.52
1.53
1.54
1.55
1.25 1.35 1.45 1.55 1.65 1.75 1.85 1.95 2.05 2.15 2.25
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp=25°C
VIN = STBY
0
20
40
60
80
100
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
Temp=-40°C
Temp=25°C
Temp=85°C IO=0uA
VIN = STBY
0
20
40
60
80
100
120
140
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
IO=200mA
VIN = STBY
Temp=-40°C
Temp=25°C
Temp=85°C
0
2
4
6
8
10
00.511.522.533.544.555.5
ST BY Voltage (V)
STBY Current (uA)
VIN = STBY
Temp=85°C
Temp=25°C
Temp=-40°C
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
O u tp ut Current (A)
Gnd Current (uA)
VIN = 3.5V
STBY = 1.5V
Temp=85°C
Temp=25°C
Temp=-40°C
1.45
1.46
1.47
1.48
1.49
1.50
1.51
1.52
1.53
1.54
1.55
0 0.05 0.1 0.15 0.2
Output Current (A)
Output Voltage (V)
VIN = 3.5V
STBY = 1.5V
Temp=-40°C
Temp=25°C
Temp=85°C
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0.00 0.10 0.20 0.30 0.40 0.50 0.60
Output Current (A)
Output Voltage (V)
VIN=5.5V
Temp=25°C
STBY = 1.5V
VIN=3.5V
VIN=2.5V
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0 0.5 1 1.5
STBY Voltage (V)
Output Voltage (V)
Temp=85°C
Temp=25°C
Temp=-40°C
1.45
1.46
1.47
1.48
1.49
1.50
1.51
1.52
1.53
1.54
1.55
-40 -15 10 35 60 85
Temp (°C)
Output Voltage (V)
VIN=3.5V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp (°C)
Input Current (uA)
VIN=3.5V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp (°C)
Gnd C u r rent (uA)
VIN=3.5V
STBY=0V
Technical Note
7/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 19 Output Noise Spectral Density
vs. Freq.
●Reference data BU15TA2WNVX /HFV (Ta=25ºC unless otherwise specified.)
Fig. 18 Ripple Rejection vs. VIN
(Iout=10 mA)
Fig. 17 Ripple Rejection vs. Freq.
Fig. 24 Load Response
Current Pulse=10 kHz Fig. 25 Load Respo nse
Current Pulse=10 kHz
Fig. 20 Load Response Fig. 21 Load Response
Fig. 22 Load Response Fig. 23 Load Response
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 3.5V
Io=10mA
Ta = 25℃
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0
10
20
30
40
50
60
70
80
2.5 3.5 4.5 5.5
Input Voltage VIN[V]
Ripple Rejection [dB]
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
f=100kHz
f=10kHz
f=1kHz
f
=0.1kHz
Technical Note
8/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Reference data BU15TA2WNVX / HFV (Ta=25ºC unless otherwise specified.)
Fig. 29 S t artup T ime
Iout = 200 mA Fig. 30 Startup Time (STBY=VIN)
Iout = 0 mA
Fig. 28 Startup Time
Iout = 0 mA
Fig. 32 Discharge Time
Iout = 0 mA Fig. 33 VIN Response
Iout = 10 mA
Fig. 31 Startup Time (STBY=VIN)
Iout = 200mA
Fig. 26 Load Response
Current Pulse=100 kHz Fig. 27 Load Response
Current Pulse=100 kHz
Technical Note
9/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 34 Output Voltage Fig. 35 Line Regulation
Fig. 43 VOUT vs Temp
●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 36 Circuit Current IGND
Fig. 38 STBY Input Current Fig. 39 IOUT - IGND
Fig. 45 IGND vs Temp (STBY)Fig. 44 IGND vs Temp
Fig. 40 Load Regulation Fig. 42 STBY ThresholdFig. 41 OCP Threshold
Fig. 37 Circuit Current IGND
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA Temp=25°C
VIN = STBY
0
20
40
60
80
100
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
Temp=-40°C
Temp=25°C
Temp=85°C IO=0uA
VIN = STBY
0
20
40
60
80
100
120
140
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
IO=200mA
VIN = STBY
Temp=-40°C
Temp=25°C
Temp=85°C
0
2
4
6
8
10
00.511.522.533.544.555.5
STBY Voltage (V)
STBY Current (uA)
VIN = STBY
Temp=85°C
Temp=25°C
Temp=-40°C
1.75
1.76
1.77
1.78
1.79
1.80
1.81
1.82
1.83
1.84
1.85
0 0.05 0.1 0.15 0.2
Output Current (A)
Output Voltage (V)
VIN = 3.5V
STBY = 1.5V
Temp=-40°C
Temp=25°C
Temp=85°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0.00 0.10 0.20 0.30 0.40 0.50 0.60
Output Current (A)
Output Voltage (V)
VIN=5.5V
Temp=25°C
STBY = 1.5V
VIN=3.5V
VIN=2.5V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
Temp=85°C
Temp=25°C
Temp=-40°C
1.75
1.76
1.77
1.78
1.79
1.80
1.81
1.82
1.83
1.84
1.85
-40 -15 10 35 60 85
Temp (°C)
Output Voltage (V)
VIN=3.5V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp (°C)
Input Current (uA)
VIN=3.5V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Tem p (°C)
Gnd Cur re nt (uA)
VIN=3.5V
STBY=0V
1.75
1.76
1.77
1.78
1.79
1.80
1.81
1.82
1.83
1.84
1.85
1.75 1.85 1.95 2.05 2.15 2.25 2.35
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp=25°C
VIN = STBY
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
Output Current (A)
Gnd Current (uA)
VIN = 3.5V
STBY = 1.5V
Temp=85°C
Temp=25°C
Temp=-40°C
Technical Note
10/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 46 Ripple Rejection VS Freq. Fig. 47 Ripple Rejection VS VIN Fig. 48 Output Noise Spectrl
Density VS Freq.
●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 49 Load Response
Fig. 51 Load Response Fig. 52 Load Response
Fig. 50 Load Respo nse
Fig. 53 Load Response
Current Pulse=10kHz Fig. 54 Load Response
Current Pulse=10kHz
⇔
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 3.5V
Io=10mA
Ta = 25℃
0
10
20
30
40
50
60
70
80
2.5 3.5 4.5 5.5
Input Voltage VIN[V]
Ripple Rejection [dB]
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
f=100kHz
f=10kHz
f=1kHz
f=0.1kHz
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
Technical Note
11/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Reference data BU18TA2WNVX / HFV (Unless other wise specified, Ta= 25℃)
Fig. 55 Load Response
Current Pulse=100kHz
Fig. 56 Load Response
Current Pulse=100kHz
Fig. 57 Start Up Time
Iout = 0mA Fig. 58 Start Up Time
Iout = 200mA Fig. 59 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 61 Discharge Time
Iout = 0mA Fig. 62 VIN Response
Iout = 10mA
Fig. 60 Start Up Time(STBY=VIN)
Iout = 200mA
⇔
Technical Note
12/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 63 Output Voltage Fig. 64 Line Regulation
Fig. 72 VOUT vs Temp
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0 0.05 0.1 0.15 0.2
O u tp ut Current (A)
Dropout Voltage (V)
VIN=0.98*VOUT
STBY=1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
●Reference data BU25TA2WNVX / HFV (Unless other wise specified, Ta= 25℃)
Fig. 65 Circuit Current IGND
Fig. 67 STBY Input Current Fig. 68 IOUT - IGND
Fig. 74 IGND vs Temp (STBY)Fig. 73 IGND vs Temp
Fig. 69 Load Regulation Fig. 71 STBY ThresholdFig. 70 OCP Threshold
Fig. 66 Dropout Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp.=25°C
VIN=STBY
2.45
2.46
2.47
2.48
2.49
2.50
2.51
2.52
2.53
2.54
2.55
2.4 2.5 2.6 2.7 2.8 2.9 3
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp.=25°C
VIN=STBY
0
20
40
60
80
100
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
Temp.=-40°C
Temp.=25°C
Temp.=85°C IO=0uA
VIN=STBY
0
2
4
6
8
10
00.511.522.533.544.555.5
ST BY Voltage (V)
STBY Current (uA)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
Output Current (A)
Gnd Current (uA)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
0 0.1 0.2 0.3 0.4 0.5 0.6
Output Current (A)
Output Voltage (V)
VIN=5.5V VIN=3.5V
VIN=3.0V
Temp.=25°C
STBY=1.5V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
2.45
2.46
2.47
2.48
2.49
2.50
2.51
2.52
2.53
2.54
2.55
-40 -15 10 35 60 85
Temp. (°C)
Output Voltage (V)
VIN=3.5V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=3.5V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=3.5V
STBY=0V
2.45
2.46
2.47
2.48
2.49
2.50
2.51
2.52
2.53
2.54
2.55
0 0.05 0.1 0.15 0.2
Output Current (A)
Output V oltage (V)
VIN=3.5V
STBY=1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
Technical Note
13/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 75 Ripple Rejection VS Freq. Fig. 76 Rip ple Rejecti on VS VIN Fig. 77 Output Noise Spectrl
Density VS Freq.
●Reference data BU25TA2WNVX / HFV (Unless other wise specified, Ta= 25℃)
Fig. 78 Load Response
Fig. 80 Load Response Fig. 81 Load Respo nse
Fig. 79 Load Respo nse
Fig. 82 Load Response
Current Pulse=10kHz
Fig. 83 Load Response
Current Pulse=10kHz
IOUT=0mA→100m A
IOUT=100m A→0m A
⇔
⇔
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 3.5V
Io=10mA
Ta = 2 5℃
0
10
20
30
40
50
60
70
80
2.5 3.5 4.5 5.5
Input Voltage VIN[V]
Ripple Rejection [dB]
Co=1.0 μF
Cin=none
Iout=10mA
temp=25℃
f=100kHz
f=10kHz
f
=1kHz
f=0.1kHz
0
0.2
0.4
0.6
0.8
1
1.2
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
Technical Note
14/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Reference data BU25TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 84 Load Response
Current Pulse=100kHz
Fig. 85 Load Response
Current Pulse=100kHz
Fig. 86 Start Up Time
Iout = 0mA Fig. 87 Start Up Time
Iout = 200mA Fig. 88 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 90 Discharge Time
Iout = 0mA Fig. 91 VIN Response
Iout = 10mA
Fig. 89 Start Up Time(STBY=VIN)
Iout = 200mA
⇔
⇔
Technical Note
15/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 92 Output Voltage Fig. 93 Line Regulation
Fig. 101 VOUT vs Temp
●Reference data BU28TA2WNVX / HFV (Unless other wise specified, Ta= 25℃)
Fig. 94 Circuit Current IGND
Fig. 96 STBY Input Current Fig. 97 IOUT - IGND
Fig. 103 IGND vs Temp (STBY)Fig. 102 IGND vs Temp
Fig. 98 Load Regulation Fig. 100 STBY ThresholdFig. 99 OCP Threshold
Fig. 95 Dropout Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vin Voltage (V)
Output Voltage (V)
Temp.=25°C
IO=0uA
IO=100uA
IO=50mA
IO=200mA
VIN = STBY
2.75
2.76
2.77
2.78
2.79
2.80
2.81
2.82
2.83
2.84
2.85
2.7 2.8 2.9 3 3.1 3.2
Vin Voltage (V)
Output Voltage (V)
Temp.=25°C
IO=0uA
IO=100uA
IO=50mA
IO=200mA
VIN = STBY
0
20
40
60
80
100
00.511.522.533.544.555.5
Vin Voltage (V)
Gnd Current (uA)
Temp.=-40°C
Temp.=25°C
Temp.=85°C
IO=0uA
VIN = STBY
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0 0.05 0.1 0.15 0.2
Output Current (A)
Dropout Vol tage (V)
VI N=0.98 x V O UT
STB Y = 1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0
2
4
6
8
10
00.511.522.533.544.555.5
STBY Voltage (V)
STBY Current (uA)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
VIN = ST BY
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
O u tp ut Currnt (A)
Gnd Current (uA)
VIN = 3.8V
STBY = 1.5V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
2.75
2.76
2.77
2.78
2.79
2.80
2.81
2.82
2.83
2.84
2.85
0 0.05 0.1 0.15 0.2
Output Currnt (A )
Output Voltage (V)
Temp.=-40°C
Temp.=25°C
Temp.=85°C
VIN = 3.8V
STBY = 1.5V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0 0.1 0.2 0.3 0.4 0.5 0.6
Output Current (A)
Output Voltage (V)
VIN=5.5V
STBY = 1.5V
VIN=3.8V
VIN=3.3V
Temp=25°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
VIN=3.8V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
2.75
2.76
2.77
2.78
2.79
2.80
2.81
2.82
2.83
2.84
2.85
-40 -15 10 35 60 85
Tem p. (°C)
Output Voltage (V)
VIN=3.8V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=3.8V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Tem p. (°C)
Gnd Cur rent (uA)
VIN=3.8V
STBY=0V
Technical Note
16/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 104 Ripple Rejection VS F r eq. Fig. 105 Ripple Rejection VS VIN Fig. 106 Output Noise Spectrl
Density VS Freq.
●Reference data BU28TA2WNVX / HFV (Unless other wise specified, Ta= 25℃)
Fig. 107 Load Response
Fig.109 Load Response Fig. 110 Load Respo nse
Fig. 108 Load Response
Fig. 111 Load Respo nse
Current Pulse=10kHz
Fig. 112 Load Response
Current Pulse=10kHz
⇔
⇔
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 3.8V
Io=10mA
Ta = 25℃
0
10
20
30
40
50
60
70
80
2.8 3.8 4.8
Input Voltage VIN[V]
Ripple Rejection [dB]
f=100kHz
f=10kHz
f=1kHz
f=0.1kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
Technical Note
17/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Reference data BU28TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 113 Load Response
Current Pulse=100kHz
Fig. 114 Load Response
Current Pulse=100kHz
Fig. 115 Start Up Time
Iout = 0mA Fig. 116 Start Up Time
Iout = 200mA Fig. 117 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 119 Discharge Time
Iout = 0mA Fig.120 VIN Response
Iout = 10mA
Fig. 118 Start Up Time(STBY=VIN)
Iout = 200mA
⇔
⇔
Technical Note
18/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 121 Output Voltage Fig. 122 Line Regulation
Fig. 130 VOUT vs Temp
●Reference data BU30TA2WNVX / HFV (Unless other wise specified, Ta= 25℃)
Fig. 123 Circuit Current IGND
Fig. 125 STBY Input Current Fig. 126 IOUT - IGND
Fig. 132 IGND vs Temp (STBY) Fig. 131 IGND vs Temp
Fig. 127 Load Regulation Fig. 129 STBY Threshold Fig.128 OCP Threshold
Fig. 124 Dropout Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vin Voltage (V)
Output Voltage (V)
Temp.=25°C
IO=0uA
IO=100uA
IO=50mA
IO=200mA
VIN=STBY
2.95
2.96
2.97
2.98
2.99
3.00
3.01
3.02
3.03
3.04
3.05
2.9 3 3.1 3.2 3.3 3.4 3.5
Vin Voltage (V)
Output Voltage (V)
Temp.=25°C
IO=0uA
IO=100uA
IO=50mA
IO=200mA
VIN=STB
Y
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vin Voltage (V)
Gnd Current (uA)
IO=0uA
Temp.=-40°C
Temp.=25°C
Temp.=85°C VIN=STBY
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0 0.05 0.1 0.15 0.2
Output Current (A)
Dropout Voltage (V)
VIN=0.98*VOUT
STBY=1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0
2
4
6
8
10
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
ST BY Voltage (V)
STBY Current (uA)
Temp.=85°C
Temp.=25°C
Temp.=-40°C
VIN=STBY
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
Output Current (A)
Gnd Current (uA)
Temp.=85°C
Temp.=25°C
Temp=-40°C
2.95
2.96
2.97
2.98
2.99
3.00
3.01
3.02
3.03
3.04
3.05
0 0.05 0.1 0.15 0.2
Output Current (A)
Output Voltage (V)
VIN=4.0V
STBY=1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0 0.1 0.2 0.3 0.4 0.5 0.6
Output Current (A)
Output Voltage (V)
VIN=5.5V VIN=4.0V
VIN=3.5V
Temp.=25°C
STBY=1.5V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
VIN=4.0V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
2.95
2.96
2.97
2.98
2.99
3.00
3.01
3.02
3.03
3.04
3.05
-40 -15 10 35 60 85
Temp. (°C)
Output Voltage (V)
VIN=4.0V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp. (°C)
Input Current (µA)
VIN=4.0V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp. (°C)
Input Current (µA)
VIN=4.0V
STBY=0V
Io=0mA
Technical Note
19/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 133 Ripple Rejectio n VS F r eq. Fig. 134 Ripple Rejection VS VIN Fig. 135 Output Noise Spectrl
Density VS Freq.
●Reference data BU30TA2WNVX / HFV (Unless other wise specified, Ta= 25℃)
Fig. 136 Load Response
Fig. 138 Load Response Fig. 139 Load Response
Fig. 137 Load Response
Fig. 140 Load Response
Current Pulse=10kHz Fig. 141 Load Response
Current Pulse=10kHz
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 4.0V
Io=10mA
Ta = 25 ℃
0
10
20
30
40
50
60
70
80
345
Input Voltage VIN[V]
Ripple Rejection [dB]
f=100kHz
f=10kHz
f=1kHz
f=0.1kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μV/√Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
Technical Note
20/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Reference data BU30TA2WNVX / HFV (Unless other wise specified, Ta= 25℃)
Fig. 142 Load Response
Current Pulse=100kHz Fig. 143 Load Response
Current Pulse=100kHz
Fig. 144 Start Up Time
Iout = 0mA Fig. 145 Start Up Time
Iout = 200mA Fig. 146 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 148 Discharge Time
Iout = 0mA Fig. 149 VIN Response
Iout = 10mA
Fig. 147 Start Up Time(STBY=VIN)
Iout = 200mA
Technical Note
21/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 150 Output Voltage Fig. 151 Line Regulation
Fig. 159 VOUT vs Temp
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 152 Circuit Current IGND
Fig. 154 STBY Input Current Fig. 155 IOUT - IGND
Fig. 161 IGND vs Temp (STBY) Fig. 160 IGND vs Temp
Fig. 156 Load Regulati on Fig. 158 STBY Threshold
Fig. 157 OCP T hreshold
Fig. 153 Dropout Voltage
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
00.511.522.533.544.555.5
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp.=25°C
VIN = STBY
3.25
3.26
3.27
3.28
3.29
3.30
3.31
3.32
3.33
3.34
3.35
3.2 3.3 3.4 3.5 3.6 3.7
Vin Voltage (V)
Output Voltage (V)
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Temp=25°C
VIN = STBY
0
20
40
60
80
100
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vin Voltage (V)
Gnd Current (uA)
Temp.=-40°C
Temp.=25°C
Temp.=85°C IO=0uA
VIN = STBY
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0 0.05 0.1 0.15 0.2
Output Current (A)
Dropout Voltage (V)
VIN=0.98 x VOUT
STBY = 1. 5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0
2
4
6
8
10
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
V
STBY
Voltage (V)
STBY Current (uA)
VIN = STBY
Temp.=85°C
Temp.=25°C
Temp.=-40°C
40
50
60
70
80
90
100
110
120
0 0.05 0.1 0.15 0.2
Output Current (A)
Gnd Current (uA)
VIN = 4.3V
STBY = 1.5V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
3.25
3.26
3.27
3.28
3.29
3.30
3.31
3.32
3.33
3.34
3.35
0 0.05 0.1 0.15 0.2
Output Current (A)
Output Voltage (V)
VIN = 4.3V
STBY = 1.5V
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
0 0.1 0.2 0.3 0.4 0.5 0.6
Output Current (A)
Output Voltage (V)
VIN=5.5V
STBY = 1.5V
Temp=25
℃
VIN=4.3V
VIN=3.8V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
00.511.5
STBY Voltage (V)
Output Voltage (V)
VIN=4.3V
Temp.=85°C
Temp.=25°C
Temp.=-40°C
3.25
3.26
3.27
3.28
3.29
3.30
3.31
3.32
3.33
3.34
3.35
-40 -15 10 35 60 85
Temp. (°C)
Output Voltage (V)
VIN=4.3V
STBY=1.5V
Io=0.1mA
0.00
10.00
20.00
30.00
40.00
50.00
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=4.3V
STBY=1.5V
Io=0mA
-0.100
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0.700
0.800
0.900
1.000
-40 -15 10 35 60 85
Temp. (°C)
Gnd Current (uA)
VIN=4.3V
STBY=0V
Technical Note
22/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 162 Ripple Rejection VS F r eq. Fig. 163 Ripple Rejection VS VIN Fig. 164 Output Noise Spectrl
Density VS Freq.
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 165 Load Response
Fig. 167 Load Response Fig. 168 Load Response
Fig. 166 Load Response
Fig. 169 Load Response
Current Pulse=10kHz
Fig. 170 Load Response
Current Pulse=10kHz
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0.1 1 10 100
Frequency f [kHz]
Output Noise Density [μ V/√ Hz]
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0
10
20
30
40
50
60
70
80
3.3 4.3 5.3
Input Voltage VIN[V]
Ripple Rejection [dB]
f=100kHz
f=10kHz
f=1kHz
f=0.1kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
0
10
20
30
40
50
60
70
80
0.1 1 10 100 1000
Frequency (kHz)
Ripple Rejection (dB)
Vin= 4.3V
Io=10mA
Ta = 25℃
Technical Note
23/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 171 Load Response
Current Pulse=100kHz Fig. 172 Load Response
Current Pulse=100kHz
Fig. 173 Start Up Time
Iout = 0mA Fig. 174 Start Up Time
Iout = 200mA Fig. 175 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 177 Discharge Time
Iout = 0mA Fig. 178 VIN Response
Iout = 10mA
Fig. 176 Start Up Time(STBY=VIN)
Iout = 200mA
Technical Note
24/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction i n current capability. T herefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Evaluation Board 1
(Single-side Board) Evaluation Bo ard 2
(Double-side Board)
Layout of Board for
Measurement
(Unit: mm)
IC Implementation Position
Top Layer (Top View) Top Layer (Top View)
Bottom Layer (Top View) Bottom Layer (Top View)
Measurement State With board implemented (Wind speed 0 m/s) With board implemented (Wind speed 0 m/s)
Board Material Glass epoxy resin (Single-side board) Glass epoxy resin (Double-side board)
Board Size 40 mm x 40 mm x 0.8 mm 40 mm x 40 mm x 0.8 mm
Wiring Rate Top layer Metal (GND) wiring rate: Appr ox. 25% Metal (GND) wiring rate: Approx. 25%
Bottom layer Metal (GND) wiring rate: Approx 0% Metal (GND) wiring rate: Approx 25%
Through Hole 0 holes Diameter 0.5 mm 12 holes
Power Dissipation 1100 mW 1250 mW
Thermal Resistance θja=91℃/W θja=80℃/W
40
20
40
20
40 40
20
40 20 40 20
40 20
40
Technical Note
25/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
○SSON004X1216
○HVSOF5
* Please design the margin so that PMAX becomes is than Pd
(PMAXPd) within the usage temperat ure range.
- Standard ROHM board -
Size: 70 mm 70 mm 1.6 mm
Material: Glass epoxy board
0
500
1000
1500
0 25 50 75 100 125
Ta (℃)
Pd (mW)
Evaluation board 2
(Double-side board)
Evaluation board 1
(Singl e-side board)
Standard ROHM board
1250 mW
1100 mW
220 mW
Fig.179 SSON004X1216
Power dissipation heat reduction characteristics
(Reference)
Fig.180 HVSOF5
Power dissipation heat reduction characteristics
(Reference)
* Please design the margin so that PMAX
becomes is than Pd (PMAXPd) within
the usage temperature range.
Pd（W)
Technical Note
26/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●DEVICE TYPE & Mark
a
XX output
voltage package
SSON004X1216 HVSOF5
15 1.5V typ. AA BA
18 1.8V typ. AB BB
25 2.5V typ. AC BD
26 2.6V typ. AD BE
27 2.7V typ. AE BF
28 2.8V typ. AF BG
2J 2.85V typ. AG BH
29 2.9V typ. AH BJ
30 3.0V typ. AJ BK
31 3.1V typ. AK BL
32 3.2V typ. AL BM
33 3.3V typ. AM BN
34 3.4V typ. AN BP
Device type: BUXXTA2WNVX
a
Device type: BUXXTA2WHFV
a
○SSON004X1216 ○HVSOF5
Technical Note
27/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
○SSON004X1216
○HVSOF5
M
a
rk
Lot No.
Mark
Lot No.
Technical Note
28/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Notes for use
・About absolute maximum rating
Breakage may occur when absolute maximum ratings such as applied voltage and operating temperature range are
exceeded. Short mode or open mode cannot be specified at occurrence of a break, so please prepare physical safety
measures (e.g., fuse) if such special mode in which the absolute maximum rating is exceeded can be assumed.
・About GND potential
Please be sure that the potential of the GND terminal is the lowest in any operating condition.
・About thermal design
Please provide thermal design with sufficient margin, taking power dissipation (Pd) in actual usage conditions into
consideration.
・About short between pins and misattachment
Please be careful regar ding the IC direction and misalignment at attachment onto a pr inted circuit board. Misattachment
may cause a break of IC. Short caused by foreign matter between outputs, output and power supply, or GNDs may also
lead to a break.
・About operation in a strong electromagnetic field
Please note that usage in a strong electromagnetic fie ld may cause malfunction.
・About common impedance
Please give due consideration to wiring of the power source and GND by reducing com mon-mode ripple or making ri pple
as small as possible (e.g., making the wiring as thick and short as possible, or reducing ripple by LC), etc.
・About STBY terminal voltage
Set STBY terminal voltage to 0.3 V or less to put each channel into a standby state and to 1.5 V or more to put each
channel into an operating state. Do not fix STBY terminal voltage to 0.3 V or more and 1.5 V or less or do not lengthen
the transition time. This may cause malfunction or fai lure. When shorting the VIN terminal and ST BY terminal for usage,
the status will be “STBY=VIN＝LOW” at turning the power OFF, and discharge of the VOUT terminal cannot operate,
which means voltage may remain for a certain time in the VOUT terminal. Since turning the power ON again in this state
may cause overshoot, turn the power ON for use after the VOUT terminal is completely discharged.
・About overcurrent protection circuit
Output has a built-in overcurrent protection circuit, which prevents IC break at load short. Note that this protection circuit
is effective for prevention of breaks due to unexpected accidents. Please avoid usage by which the protection circuit
operates continuously.
・About thermal shutdown
Output is OFF when the thermal circuit operates since a temperature protection circuit is built in to prevent thermal
breakdown. However, it recovers when the temperat ure returns to a certain temperature. The thermal circuit operates at
emergency such as overheating of IC. Since it is prepared to prevent IC breakdown, please do not use it in a state in
which protection works.
●About reverse current
For applications on which reverse current is assumed to flow int o IC,
it is recommended to prepare a path to let the current out by putting
a bypass diode between the VIN-VOUT terminals.
●About testing on a set board
When connecting a capacitor to a terminal with low impedance for testing on a set board, please be sure to discharge for
each process since IC may be stressed. As a countermeasure agai nst static electricit y, prepare groundi ng in the assembly
process and take sufficient care in transportation and storage. In additi on, when connecting a capacitor to a jig in a testing
process, please do so after turning the power OFF and remove it after turning the power OFF.
Fig.181 Example of bypass diode connection
Reverse current
VIN
GND
STBY
OUT
Technical Note
29/29
BUTA2WNVX series, BUTA2WHFV series
www.rohm.com 2011.01 - Rev.C
© 2011 ROHM Co., Ltd. All rights reserved.
●Ordering part number
B U 1 5 T A 2 W N V X - T R
Part No. Output voltage Lineup Shutdown Swich
W : Includes
switch
Package
NVX : SSON004X1216
HFV : HVSOF5
Packaging and for ming specificat ion
TR: Embossed tape and reel
15: 1.5V
18: 1.8V
25: 2.5V
26: 2.6V
27: 2.7V
28: 2.8V
2J: 2.85V
29: 2.9V
30: 3.0V
31: 3.1V
32: 3.2V
33: 3.3V
34: 3.4V
(Unit : mm)
SSON004X1216
S
0.08 S
3
4
21
1PIN MARK
1.2±0.1
0.65±0.1
0.75±0.1
1.6±0.1
0.2±0.1
0.8±0.1
0.6MAX
(0.12)
0.02+0.03
-
0.02
0.2 +0.05
-
0.04
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
5000pcs
TR
()
Direction of feed
Reel 1pin
(Unit : mm)
HVSOF5
S
0.08
M
0.1 S
4
321
5
(0.05)
1.6±0.05
1.0±0.05
1.6±0.05
1.2±0.05
(MAX 1.28 include BURR)
45
321
(0.8)
(0.91)
(0.3)
(0.41)
0.2MAX
0.13±0.05
0.22±0.05
0.6MAX
0.5
0.02 +0.03
–0.02
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
